BD88420GUL-E2 Taping Spec Datasheet by Rohm Semiconductor

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ROHm W v No. Item Materials 1 Die Silicon 2 Cu Posl Cu 3 Mold Compound Epoxy Resin 4 Ext. Ierminal Sn73A970.5Cu Solder 5 Mold Compound Polyamide-lmide Resin 6 Marking Laser Marking
Package Information : VCSP50L2 BD88420GUL
1. Package Information
  Package Name VCSP50L2
     Outline Dimension Drowing No. EX917-5033
     Package Weight [mg] 4.3
     MSL Level(Note 1)      MSL1
     Note 1 : The MSL Level are determined based on the JEDEC J-STD-020D.
2. Pacakage Structure
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© 2016 ROHM Co., Ltd. All rights reserved 2016/9/16 - Rev.001
o|o olo 0,0 0,0 0'0 0'0 Pocket Quadranls Direction of feed —, Reel Fig.1 Quadrant Assignments for PIN 1 Orientation in Tape E2 : PlNl is placed to the top left corner. TR: P|N1 is placed to the top right corner. TL: PlNl is placed to the lower left E1 : P|N1 is placed to the lower right. Peelback 165 to 180° Peelback speed r 300:10mm/min\ :fi 3
VCSP50L2 BD88420GUL                           Package Information
3. Packing Specification
3.1 Packing form, Quantity, PIN1 Orientation and Weight
Packing Form Tape&Reel
Packing Quantity [pcs/Reel] 3,000
PIN 1 Orientation E2
3.2 Use material
Item Material
Embossed carrier tape PS (antistatic)
Cover tape PET+PE (antistatic)
Reel PS (antistatic)
Unit box Cardboard
Shipping box Cardboard
3.3 Leader specification
No component pockets are 100 pockets ( 400 mm) or more.
3.4 Trailer specification
No component pockets are 40 pockets ( 160 mm) or more. Tape is free from reel.
3.5 Peelback strength
Cover tape peelback strength is 0.2 N to 0.7 N.
Fig.2 Test method
3.6 Missing ICs
(1) No consecutive dropouts.
(2) A maximun 0.1 % of specified number of products in each packing may be missing.
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© 2016 ROHM Co., Ltd. All rights reserved 2016/9/16 - Rev.001
751 m Al % Symbol Dimension Tolerance A1 2.41 10.1 B1 2.41 10.1 C (060) C1 (0.25) D0 (51.5 +0.1 -0 D1 d7 0.5 10.1 E 1.75 10.1 F 3.5 10.1 K' 0.85 10.1 P0 4.0 10.1 P1 4.0 10.1 P2 2.0 10.1 T 0.3 10.05 W 8.0 10.3 (mm)
VCSP50L2 BD88420GUL                           Package Information
3.7 Tape and Reel Specification
3.7.1 Tape Dimension
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© 2016 ROHM Co., Ltd. All rights reserved 2016/9/16 - Rev.001
Dxreclmn offeed m wz Symbol Dimension Tolerance A ¢ 180 +0 -1.5 B 60 MIN C d) 13.0 :02 D $20.2 MIN E 1.5 MIN W1 9.0 +1.0 -0 W2 1 1.4 11.0 (mm)
VCSP50L2 BD88420GUL                           Package Information
3.7.2 Reel Dimension
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© 2016 ROHM Co., Ltd. All rights reserved 2016/9/16 - Rev.001
Joint tape Label Unit box Symbol Dimension 2 X 183 Y 57 ' "if z 132 (mm) Label Reel Unit box Shipping box Symbol Dimension X 255 Y 190 Z Z 193 (mm) “Ronny 154a /Y /-- Shipping Box Packing slip Oul going inspection stamp Product No. \ Quantity (Only unit box) LO‘ number ' Marking lol number \‘ Pb free mark lnlernal Product No. Label example
VCSP50L2 BD88420GUL                           Package Information
3.8 Packing Method
4 reels or less per unit box.
3.9 Packing Style
4 unit boxes or less per shipping box.
3.10 Label Specification
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© 2016 ROHM Co., Ltd. All rights reserved 2016/9/16 - Rev.001
SD b3 ‘ a) Symbol Reference Value 6 0.50 b3 0.25 SD 0.25 SE 025 (mm) SE
VCSP50L2 BD88420GUL                           Package Information
4. Footprint dimensions
In actual design, please optimize in accordance with the situation of your board
design and soldering condition.
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© 2016 ROHM Co., Ltd. All rights reserved 2016/9/16 - Rev.001
1 Production lot number Production monmly code - The Iasi figure of produciion year code
VCSP50L2 BD88420GUL                           Package Information
5. Marking Specification
6. Storage conditions
6.1. Storage environment
Recommended storage conditions
         Min.   Max.     Unit
Temperature 5 30 °C
Humidity   40  70     % RH
6.2. Storage period
         Min.   Max.     Unit
Storage period  - 1    year
6.3. Specified storage period until soldering
This package dose not require additional drying treatment as long as the moisture condition
at the mounting process is within our recommended mounting condition.
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© 2016 ROHM Co., Ltd. All rights reserved 2016/9/16 - Rev.001
Package sullauc lcmpclaluvc 250's MAX Preheating temperature : 130°C to 190°C 2551 Soldering Icmpcvaluvc ,\ Preheating zone : 1205ec MAX Prehea‘lng ’ |empelalme / / 1 m A‘Clsen: fl Soldering temperature : 220"C to 230"C Soldering zone : 605ec MAX We (Notice) Prehealmg . , mm 'W Maximum Sitimes soldering zone . , Snidenng zone
VCSP50L2 BD88420GUL                           Package Information
7. Soldering conditions
7.1. Recommended temperature profile for reflow
7.2. About mounting with Sn-Pb solder paste
Mounting Sn-Pb solder paste is not reccommended because it has a possibility of reducing reliability
to connect with Sn-3.0Ag-0.5Cu solder balls.
7.3. The wave soldering mehod is not supported.
7.4. Partial heat supply method (by soldering iron) is not supported.
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© 2016 ROHM Co., Ltd. All rights reserved 2016/9/16 - Rev.001
ER There rs a UnderfiH resm evemy at each lour srdes There rs We Undemu resin alone or lwu srdes Underflll Support Board
VCSP50L2 BD88420GUL                           Package Information
8. Precautions
8.1. Caution for handling
Silicon substrate surface is exposing to the side of this package.
Therefore, please pay careful attention to chip and crack, and handle without touching the side of package.
8.2. Regarding the underfill material
In some case, the underfill material is applied in order to reinforce the solder junction of package.
Since there is a case that solder joint reliability may deteriorate according to the resin material
or coating condition, please evaluate it sufficiently for its application.
In term of the coating condition, it is preferable that there is an enough material beyond the each
four sides of package.
8.3. Mounting on Flexible film
Since film bending stress may occur open failture of solder junction,
usage of support board or under fill is recommended.
8.4. Regarding the jisso form
When it is used under the special conditions such as embedded PCB, please evaluate it sufficiently for
its application.
8.5. Regarding the solder terminal
Due to the solder terminal of this package is formed by screen printing method, there may be void observed
inside of terminal. Although the void after mounting may not affect solder joint reliability or strength,
the size of the void may be increased depending on board and mounting condition, thus ROHM hereby
states that the void after mounting will not be guaranteed.
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© 2016 ROHM Co., Ltd. All rights reserved 2016/9/16 - Rev.001
© 201 ROHM Co., Ltd. All rights reserved.
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Therefore, in order to prevent personal injury or fire arising from failure, please take safety
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Examples of application circuits, circuit constants and any other information contained herein are
provided only to illustrate the standard usage and operations of the Products. The peripheral
conditions must be taken into account when designing circuits for mass production.
The technical information specified herein is intended only to show the typical functions of and
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The Products are intended for use in general electronic equipment (i.e. AV/OA devices, communi-
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