BD5413EFV Datasheet by Rohm Semiconductor

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Technical Note I 4 ’F122 RoHS .................................
1/14
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© 2010 ROHM Co., Ltd. All rights reserved.
Middle Power Class-D Speaker Amplifiers
Analog Input / BTL Output
Class-D Speaker Amplifier
BD5413EFV
Description
BD5413EFV is a 5W + 5W stereo class-D power amplifier specifically developed for low power consumption and low heat
generation applications like powered speakers. BD5413EFV employs the state-of-the-art BCD (Bipolar, CMOS and DMOS)
process technology to eliminate a turn-on resistance in the output power stage and an internal loss due to a wiring
resistance as much as possible, achieving a high performance of 80% (4W + 4W output with a load resistance of 8). In
addition, BD5413EFV employs a compact power package which dissipates heat via the rear to achieve low power
consumption and low heat generation so that the need for connecting an external heat radiator can be eliminated up to a
total output of 12.8W. This product meets the needs for compact, thin sound generation systems and powerful, high-quality
sound reproduction.
Features
1) Small output noise voltage capable of achieving a high S/N set
Input conversion noise voltage = 2.8μVrms
A bipolar differential is used for input amplifier to eliminate 1/f noise.
2) Support of power supply voltage ranging from 6V to 10.5V
A supply voltage range is supported that matches an AC adaptor or battery cell driven set.
When a set is battery driven, its operating time can be extended by means of a high performance class-D amplifier.
3) Support of low current consumption mode
A circuit current in shut-down mode is 1μA or less.
4) Built-in soft muting function for reducing pop at shut-down ON or OFF
When a signal is present, its smooth envelope waveform is realized owing to this function.
In addition, when no signal is present, pop generation is eliminated.
A transit time can be adjusted easily through the use of an external capacitor.
5) Realization of high efficiency and low heat generation
Efficiency = 80% (4W+4W (Vcc=9V, RL=8) output can be made without using an external heat radiator.)
A compact power package HTSSOP-B24 (7.8mm x 7.6mm) is employed.
6) Built-in function for reducing pop generation at disconnection from the outlet
7) Support of function for sampling frequency selection
An internal PWM sampling frequency can be selected from three frequencies (200kHz, 250kHz and 300kHz).
Countermeasures against interference (beat noise) due to a switching power source can be taken as needed.
8) Realization of high reliability
Countermeasures against short-circuits due to output terminals shorted to VCC or ground can be taken
(support of automatic recovery).
A temperature protection circuit is incorporated (support of automatic recovery).
9) Support of ERROR pin
ERROR output takes place as a warning which indicates an error.
(short-circuits due to output terminals shorted to VCC or ground, or IC high temperature abnormality).
No.10075EBT01
Technical Note
2/14
BD5413EFV
www.rohm.com 2010.05 - Rev.B
© 2010 ROHM Co., Ltd. All rights reserved.
Absolute maximum ratings
A circuit must be designed and evaluated not to exceed absolute maximum rating in any cases and even momentarily, to
prevent reduction in functional performances and thermal destruction of a semiconductor product and secure useful life and
reliability.
The following values assume Ta =25. For latest values, refer to delivery specifications.
Parameter Symbol Ratings Unit Conditions
Supply voltage VCC +15 V Pin 3, 5, 10, 12, 16, 21 (Note 1,2)
Power dissipation Pd 1.1 W(Note 3)
2.8 W (Note 4)
Input voltage for signal pin VIN -0.2 to Vcc+0.2 V Pin 23, 24 (Note 1)
Input voltage for control pin VCONT -0.2 to Vcc+0.2 V Pin 14, 15 (Note 1)
Operating temperature range Topr -40 to +85
Storage temperature range Tstg -55 to +150
Maximum junction temperature Tjmax +150
(Note 1) A voltage that can be applied with reference to GND (pins 1, 7, 8, 13, 18 and 19)
(Note 2) Pd and Tjmax=150 must not be exceeded.
(Note 3) 70mm × 70mm × 1.6mm FR4 One-sided glass epoxy board (Back copper foil 0%) installed.
If used under Ta=25 or higher, reduce 8.8 mW for increase of every 1. The board is provided with thermal via.
(Note 4) 70mm × 70mm × 1.6mm FR4 Both-sided glass epoxy board (Back copper foil 100%) installed.
If used under Ta=25 or higher, reduce 22.4 mW for increase of every 1. The board is provided with thermal via.
Operating conditions
The temperature (Ta) is 25. For the latest temperature, refer to the delivery specifications.
Parameter Symbol Ratings Unit Conditions
Supply voltage VCC +6 to +10.5 V Pin 3, 5, 10, 12, 16, 21
Load resistance RL 6 to 16 (Note 5)
(Note 5) This value must not exceed Pd.
Electrical characteristics
Unless otherwise stated, Ta=25, Vcc=9V, fIN=1kHz, Rg=0, RL=8, SDX="H" and FC="M (OPEN)"
are assumed. For the latest values, refer to the delivery specifications.
Parameter Symbol Limits Unit Conditions
Whole circuit
Circuit current 1 (sampling mode) ICC1 12 mA No signal, no load
Circuit current 2 (mute mode) ICC2 1µA SDX = “L”
Control
Input voltage with SDX pin set to "H" VIHSDX 2.5 to 9 VSampling state
Input voltage with SDX pin set to "L" VILSDX 0 to 0.5 VShut-down state
Input voltage with FC pin set to "H" VIHFC 8.2 to 9 VSetting of Fs=300kHz
Input voltage with FC pin set to "M" VIMFC 3.8 to 5.2 VSetting of Fs=250kHz
Input voltage with FC pin set to "L" VILFC 0 to 0.8 VSetting of Fs=200kHz
Audio output
Voltage gain GV30 dB PO = 1W
Maximum output power 1 (Note 6) PO1 4 W THD+N = 10%, RL = 8
Maximum output power 2 (Note 6) PO2 5 W THD+N = 10%, RL = 6
Total harmonic distortion ratio (Note 6) THD 0.2 % PO = 1W, BW=20Hz to 20kHz
Crosstalk CT 65 dB PO = 1W, Rg = 0, BW = IHF-A
Output noise voltage (sampling mode) VNO 90 µVrms Rg = 0, BW = IHF-A
Residual noise voltage (mute mode) VNOM 1µVrms Rg = 0, BW = IHF-A, MUTEX = “L”
Internal sampling clock frequency FS
200
kHz FC = L
FC = M(OPEN)
FC = H
250
300
(Note 6) The rated values of items above indicate average performances of the device, which largely depend on circuit layouts, components,
and power supplies. The reference values are those applicable to the device and components directly installed on a board specified by us.
Power Power
Technical Note
3/14
BD5413EFV
www.rohm.com 2010.05 - Rev.B
© 2010 ROHM Co., Ltd. All rights reserved.
Electrical characteristic curves (Ta=25) (Reference data)
(1) Under Stereo Operation (RL=8)
Fig. 1 THD+N - Output Powe
r
Fig. 2 THD+N - Frequency
Fig. 3 Voltage Gain - Frequency Fig. 4 Crosstalk - Frequency
Fig. 5 Crosstalk - Output Powe
r
Fig. 6 Output Power - Supply Voltage
0.01
0.1
1
10
100
0.001 0.01 0.1 1 10
OUTPUT POWER (W)
THD+N (%)
Vcc=9V
RL=8Ω
BW=20~20kHz
100Hz
1kHz
6kHz
0.01
0.1
1
10
100
10 100 1000 10000 100000
FREQUENCY (Hz)
THD+N (%)
Vcc=9V
RL=8Ω
Po=1W
BW=20~20kHz
-100
-80
-60
-40
-20
0
10 100 1000 10000 100000
FREQUENCY (Hz)
CROSSTALK (dB)
Vcc=9V
RL=8Ω
Po=1W
BW=20~20kHz
0
5
10
15
20
25
30
35
40
10 100 1000 10000 100000
FREQUENCY (Hz)
VOLTAGE GAIN (dB)
Vcc=9V
RL=8Ω
Po=1W
L=33µH
C=0.47µF
Cg=0.1µF
0
2
4
6
8
10
12
14
456789101112
VCC (V)
OUTPUT POWER (W)
RL=8Ω
fin=1kHz
THD=10%
THD=1%
-100
-80
-60
-40
-20
0
0.001 0.01 0.1 1 10
OUTPUT POWER (W)
CROSSTALK (dB)
Vcc=12V
RL=8Ω
fin=1kHz
BW=20~20kHz
Technical Note
4/14
BD5413EFV
www.rohm.com 2010.05 - Rev.B
© 2010 ROHM Co., Ltd. All rights reserved.
Electrical characteristic curves (Reference data) – Continued
Fig. 7 Efficiency - Output Power Fig. 8 Efficiency - Output Power
Fig. 9 Efficiency - Output Power Fig. 10 Current Consumption - Output Power
-150
-130
-110
-90
-70
-50
-30
-10
10 100 1000 10000 100000
FREQUENCY (Hz)
NOISE FFT (dBV)
Vcc=9V
RL=8Ω
Gain=29.6dB
0
10
20
30
40
50
4681012
VCC(V)
ICC(mA)
Sampling
ShutDown
RL=8Ω
No signal No signal
Fig. 11 50 Current Consumption - Supply Voltage Fig. 12 Output Noise Voltage FFT
0
10
20
30
40
50
60
70
80
90
100
0246
OUTPUT POWER (W/ch)
EFFICIENCY (%)
Vcc=6V
RL=8Ω
fin=1kHz
0
10
20
30
40
50
60
70
80
90
100
0246
OUTPUT POWER (W/ch)
EFFICIENCY (%)
Vcc=9V
RL=8Ω
fin=1kHz
0
10
20
30
40
50
60
70
80
90
100
0246
OUTPUT POWER (W/ch)
EFFICIENCY (%)
Vcc=10.5V
RL=8Ω
fin=1kHz
0
1
2
051015
TOTAL OUTPUT POWER (W)
ICC (A)
RL=8Ω
fin=1kHz
Vcc=6V
Vcc=9V Vcc=10.5
V
Technical Note
5/14
BD5413EFV
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© 2010 ROHM Co., Ltd. All rights reserved.
Electrical characteristic curves (Reference data) – Continued
SDX
Pin14
TS
Pin22
5V/div
2V/div
2V/div
200msec/div
Vcc=9V
RL=8Ω
Po=500mW
fin=100Hz
SDX
Pin14
TS
Pin22
Speaker
Output
5V/div
2V/div
2V/div
200msec/div
Vcc=9V
RL=8Ω
Po=500mW
fin=100Hz
Speaker
Output
Fig. 13 Waveform at Soft Mute Reset Fig. 14 Waveform at Soft Mute
VCCA
FIL
Pin2
Speaker
Output
5V/div
2V/div
20msec/div
Vcc=9V
RL=8Ω
Po=500mW
fin=1kHz
Fig. 15 Waveform at Instantaneous Power
Interruption (20msec/div)
Technical Note
6/14
BD5413EFV
www.rohm.com 2010.05 - Rev.B
© 2010 ROHM Co., Ltd. All rights reserved.
0
2
4
6
8
10
4681012
VCC (V)
OUTPUT POWER (W)
RL=16Ω
fin=1kHz
THD=10%
Electrical characteristic curves (Reference data) – Continued
(2) Under Stereo Operation (RL=16 )
Fig. 16 Output Power - Supply Voltage Fig. 17 Efficiency - Output Power
Fig. 18 Efficiency - Output Power Fig. 19 Efficiency - Output Power
0
0.5
1
1.5
2
02468
ICC(A)
TOTAL OUTPUT POWER (W)
RL=16Ω
fin=1kHz
Vcc=6V
Vcc=9V Vcc=10.5V
Fig. 20 Current Consumption - Output Power
0
10
20
30
40
50
60
70
80
90
100
024
OUTPUT POWER (W/ch)
EFFICIENCY (%)
Vcc=6V
RL=16Ω
fin=1kHz
0
10
20
30
40
50
60
70
80
90
100
0246
OUTPUT POWER (W/ch)
EFFICIENCY (%)
Vcc=6V
RL=8Ω
fin=1kHz
0
10
20
30
40
50
60
70
80
90
100
024
OUTPUT POWER (W/ch)
EFFICIENCY (%)
Vcc=9V
RL=16Ω
fin=1kHz
0
10
20
30
40
50
60
70
80
90
100
024
OUTPUT POWER (W/ch)
EFFICIENCY (%)
Vcc=10.5V
RL=16Ω
fin=1kHz
Technical Note
7/14
BD5413EFV
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© 2010 ROHM Co., Ltd. All rights reserved.
Electrical characteristic curves (Reference data) – Continued
(3) Under Stereo Operation (RL=6)
Fig. 21 Output Power - Supply Voltage Fig. 22 Efficiency - Output Power
Fig. 23 Efficiency - Output Power Fig. 24 Efficiency - Output Power
Fig. 25 Current Consumption - Output Power
0
2
4
6
8
10
12
14
4681012
VCC (V)
OUTPUT POWER (W)
R
L=6Ω
fin=1kHz
THD=10%
0
10
20
30
40
50
60
70
80
90
100
0246
OUTPUT POWER (W/ch)
EFFICIENCY (%)
Vcc=6V
RL=6Ω
fin=1kHz
0
10
20
30
40
50
60
70
80
90
100
0246
OUTPUT POWER (W/ch)
EFFICIENCY (%)
Vcc=9V
RL=6Ω
fin=1kHz
0
10
20
30
40
50
60
70
80
90
100
0246
OUTPUT POWER (W/ch)
EFFICIENCY (%)
Vcc=10.5V
RL=6Ω
fin=1kHz
0
1
2
051015
TOTAL OUTPUT POWER (W)
ICC (A)
RL=6Ω
fin=1kHz
Vcc=6V
Vcc=9V
Vcc=10.5
V
LL TT LL TT T ULILIULILIULILIULIU Wflflflflflflflflflflfl
Technical Note
8/14
BD5413EFV
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© 2010 ROHM Co., Ltd. All rights reserved.
D5413EFV
Type
Lot No.
Pin Assignment Diagram Top View
1
2
3
4
5
6
7
8
9
10
11
12
FIL
PWM1
15
13
24
23
22
21
20
19
18
17
16
14
Protections & Logic
Power - off Detector
Output Short Protection
High Temperature Protection
PWM2
Soft
Shutdown
Sampling
Frequency
Control
N.C.
DRIVER
1P
DRIVER
1N
ERROR Shutdown
Control
DRIVER
2P
DRIVER
2N
GNDA
FIL
VCCA
TEST
VCCP1P
OUT1P
GNDP1
GNDP1
OUT1N
VCCP1N
ERR
VCCD
IN1
IN2
TS
VCCP 2P
OUT 2P
GNDP 2
GNDP2
OUT2N
VCCP 2N
FC
SDX
GNDD
Fig. 26 Pin Assignment
Outer Dimensions and Inscriptions
Fig. 27 Outer Dimensions and Inscriptions of the HTSSOP-B24 Package
(Maximum size including burr: 6.15) (5.0)
@
Technical Note
9/14
BD5413EFV
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© 2010 ROHM Co., Ltd. All rights reserved.
Pin configuration (Pin Voltage: Typical Value)
No. Symbol Pin voltage Pin description Internal equalizing circuit
24
23 IN1
IN2 1/2VCC
ch1: Analog signal input pin
ch2: Analog signal input pin
Input an audio signal via a capacitor.
3
23/24
1
20k
5 VCCP1P Vcc ch1: Positive power system power supply pin 5
6
10
9
7 , 8
7 , 8
6 OUT1P Vcc to 0V ch1: Positive PWM signal output pin
Make connection to the output LPF.
7, 8 GNDP1 0V ch1: Power GND pin
9 OUT1N Vcc to 0V ch1: Negative PWM signal output pin
Make connection to the output LPF.
10 VCCP1N Vcc ch1: Negative power system power supply pin
11 ERROR H: 5V
L: 0V
Error output pin
Pin for notifying an operation error
H: Error
L: Normal operation
12
13
100
11
300k
ON /OFF
12 VCCD VCC Control power supply pin
13 GNDD 0V Control GND pin
14 SDX -
Shut-down control pin
H: Shut-down OFF
L: Shut-down ON
12
13
14
225k
175k
Fur hi- 0 AW .0 M O
Technical Note
10/14
BD5413EFV
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© 2010 ROHM Co., Ltd. All rights reserved.
Pin configuration - Continued
No. Symbol Pin voltage Pin description Internal equalizing circuit
4 TEST VCC Do not use the TEST pin.
Keep this pin open or connect it to VCC for
regular use.
22 TS 0 to 4V
Shut-down ON/OFF
Constant setting pin
Connect a capacitor.
12
22
13
100
16 VCCP2N Vcc ch2: Negative power system power supply pin
18 , 19
16
17
21
20
18 , 19
17 OUT2N Vcc to 0V ch2: Negative PWM signal output pin
Make connection to the output LPF.
18,
19 GNDP2 0V ch2: Power GND pin
20 OUT2P Vcc to 0V ch2: Positive PWM signal output pin
Make connection to the output LPF.
21 VCCP2P Vcc ch2: Positive power system power supply pin
3 VCCA Vcc Analog system power supply pin
2 FILA 1/2VCC Analog signal system bias pin
Connect a capacitor.
3
1
2
1 GNDA 0V Analog signal system GND pin
1 a; Em}: m1££é$i{f m
Technical Note
11/14
BD5413EFV
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© 2010 ROHM Co., Ltd. All rights reserved.
Application Circuit Diagram
(1)Application Circuit Diagram with a Load of 8Ω for Stereo Operation
Vcc=6V to 10.5V
1
2
3
4
5
6
7
8
9
10
11
12
FIL
PWM1
15
13
24
23
22
21
20
19
18
17
16
14
Protections & Logic
Power-off Detector
Output Short Protection
High Temperature Protection
PWM2
Soft
Shutdown
Sampling
Frequency
Control
DRIVER
1P
DRIVER
1N
ERROR Shutdown
Control
DRIVER
2P
DRIVER
2N
VCC
GNDA
ERROR OUTPUT
VCC GNDD
SHUTDOWN
INPUT
ch-2
GNDD
47µ
10µ
300kHz
0.1µ
0.1µ
250kHz
200kHz
+0.1µ
GNDP1
0.1µ
10µ
33µH
33µH
0.1µ
0.1µ
0.47µ
+
0.1µ
GNDP2
0.1µ
10µ 33µH
33µH
0.1µ
0.1µ
0.47µ
SP ch1
8Ω)
SP ch2
8Ω)
INPUT
ch-1
2.2µ
0.47µ
0.47µ
VCCP2
VCCP1
C2
C1
C3
C4C5
L1
C6
C7
C8
L2
C9
TEST
C10
C19
C18
C17
C16 C12 L4
C15
C14
C13
L3
C11
Fig.28 Circuit Diagram with a Load of 8 for Stereo Operation
Technical Note
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BD5413EFV
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© 2010 ROHM Co., Ltd. All rights reserved.
(2)BOMs of Boards for Stereo Operation
Table 1 BOMs of Boards with Loads of 8, 6 and 16 for Stereo Operation
No. Item Part Number Vendor
Configuration
Value Rated
voltage Tolerance Temperature
characteristics Quantity Reference
mm inch
1 IC BD5413EFV ROHM HTSSOP-B24 - - - - 1 IC1
2 C GRM32EB31A476KE20 MURATA 3225 1210 47µF 10V ±10% ±10% 1 C1
3 C GRM21BB31C106KE15 MURATA 2012 0805 10µF 16V ±10% ±10% 1 C2
4 C GRM188B11C104KA01 MURATA 1608 0603 0.1µF 16V ±10% ±10% 6 C3, C4, C9, C10, C11, C16
5 C GRM188B30J225KE18 MURATA 1608 0603 2.2µF 6.3V ±10% ±10% 1 C17
6 C GRM188B11C474KA87 MURATA 1608 0603 0.47µF 16V ±10% ±10% 2 C18, C19
7 C EMZA350ADA100ME61G CHEM1-00N 5.3×5.3 10µF 35V ±20% +20%, -25% 2 C5, C12
BOM of Board with a Load Resistance of 8
No. Item Part Number Vendor
Configuration
Value Rated
voltage Tolerance Temperature
characteristics Quantity Reference
mm inch
8 C GRM188B11C104KA01 MURATA 1608 0603 0.1µF 16V ±10% ±10% 4 C6, C8, C13, C15
9 C GRM188B11C474KA87 MURATA 1608 0603 0.47µF 16V ±10% ±10% 2 C7, C14
No. Item Part Number Vendor
Configuration
Value Tolerance DC
Resistance Rated
DC Current Quantity Reference
mm
10 L TSL0808RA-330K1R4-PF TDK Ф8.58.3 33µH ±10% 92mmax 1.4A max 4 L1, L2, L3, L4
BOM of Board with a Load Resistance of 6
No. Item Part Number Vendor
Configuration
Value Rated
voltage Tolerance Temperature
characteristics Quantity Reference
mm inch
8 C GRM188B11C474KA87 MURATA 1608 0603 0.47µF 16V ±10% ±10% 4 C6, C8, C13, C15
9 C GRM188B11C474KA87 MURATA 1608 0603 0.47µF 16V ±10% ±10% 2 C7, C14
No. Item Part Number Vendor
Configuration
Value Tolerance DC
Resistance Rated
DC Current Quantity Reference
mm
10 L TSL0808RA-220K1R7-PF TDK Ф8.58.3 22µH ±10% 70mmax 1.7A max 4 L1, L2, L3, L4
BOM of Board with a Load Resistance of 16
No. Item Part Number Vendor
Configuration
Value Rated
voltage Tolerance Temperature
characteristics Quantity Reference
mm inch
8 C GRM188B11C104KA01 MURATA 1608 0603 0.01µF 16V ±10% ±10% 4 C6, C8, C13, C15
9 C GRM188B11C224KA01 MURATA 1608 0603 0.22µF 16V ±10% ±10% 2 C7, C14
No. Item Part Number Vendor
Configuration
Value Tolerance DC
Resistance Rated
DC Current Quantity Reference
mm
10 L TSL0808RA-680K1R0-PF TDK Ф8.58.3 68µH ±10% 160mmax 1A max 4 L1, L2, L3, L4
Technical Note
13/14
BD5413EFV
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© 2010 ROHM Co., Ltd. All rights reserved.
Notes for use
1. About absolute maximum ratings
If an applied voltage or an operating temperature exceeds an absolute maximum rating, it may cause destruction of a
device. A result of destruction, whether it is short mode or open mode, is not predictable. Therefore, provide a physical
safety measure such as fuse, against a special mode that may violate conditions of absolute maximum ratings.
2. About power supply line
As return of current regenerated by back EMF of output coil happens, take steps such as putting capacitor between
power supply and GND as a electric pathway for the regenerated current. Be sure that there is no problem with each
property such as emptied capacity at lower temperature regarding electrolytic capacitor to decide capacity value. If the
connected power supply does not have sufficient current absorption capacity, regenerative current will cause the voltage
on the power supply line to rise, which combined with the product and its peripheral circuitry may exceed the absolute
maximum ratings. It is recommended to implement a physical safety measure such as the insertion of a voltage clamp
diode between the power supply and GND pins.
3. Potential of GND (1, 7, 8, 13, 18 and 19 pins)
Potential of the GND terminal must be the lowest under any operating conditions.
4. About thermal design
Perform thermal design with sufficient margins, in consideration of maximum power dissipation Pd under actual operating
conditions. This product has an exposed frame on the back of the package, and it is assumed that the frame is used with
measures to improve efficiency of heat dissipation. In addition to front surface of board, provide a heat dissipation pattern
as widely as possible on the back also.
A class-D power amplifier has heat dissipation efficiency far higher than that of conventional analog power amplifier and
generates less heat. However, extra attention must be paid in thermal design so that a power dissipation Pdiss should not
exceed the maximum power dissipation Pd.
Maximum power dissipation
W
θ
PoPd ja
Ta-Tjmax
Tjmax: Maximum temperature junction = 150[]
Ta: Operating ambient temperature []
θja: Package thermal resistance [/W]
Po: Output power [W]
η: Efficiency
Power dissipation
WPP Odiss
1-
1
η
5. About operations in strong electric field
Note that the device may malfunction in a strong electric field.
6. Thermal shutdown (TSD) circuit
This product is provided with a built-in thermal shutdown circuit. When the thermal shutdown circuit operates, the output
transistors are placed under open status. The thermal shutdown circuit is primarily intended to shut down the IC avoiding
thermal runaway under abnormal conditions with a chip temperature exceeding Tjmax = 150, and is not intended to
protect and secure an electrical appliance. Accordingly, do not use this circuit function to protect a customer's electrical
appliance.
7. About shorting between pins and installation failure
Be careful about direction and displacement of an IC when installing it onto the board. Faulty installation may destroy the
IC when the device is energized. In addition, a foreign matter getting in between IC pins, pins and power supply, and
pins and GND may cause shorting and destruction of the IC.
8. About power-on or power-off sequence
Set the SDX pin (pin 14) to “L” level before initiating the power-on sequence. Similarly, set the SDX pin (pin 14) to “L”
level before initiating the power-off sequence. If such a setting is made, pop reduction is achieved at power-on or power-
off sequence. In addition, note that all power supply pins shall be made active or inactive at the same time.
9. About error output pin (pin 11)
When a high temperature protection function or VCC/GND shorting protection function is activated, an error flag is output
via an error output pin. Because the error output pin is primarily intended to indicate the state of BD5413EFV and is
available only to protect BD5413EFV, it cannot be used for any other purposes.
10. About TEST pin (pin 4)
Do not use the TEST pin. Keep this pin open or connect it to VCC for regular use.
BD,
Technical Note
14/14
BD5413EFV
www.rohm.com 2010.05 - Rev.B
© 2010 ROHM Co., Ltd. All rights reserved.
Ordering part number
B D 5 4 1 3 E F V -E 2
Part No
BD. Part No.
5413 Package
EFV:HTSSOP-B24 Packaging and forming specification
E2: Embossed tape and reel
(Unit : mm)
HTSSOP-B24
0.65
1.0MAX
0.85±0.05
0.08±0.05
0.24 +0.05
-
0.04 0.08
M
S
0.08
1.0±0.2
0.53±0.15
0.17 +0.05
-
0.03
4°
+
6°
4°
S
24 13
112
0.325
(3.4)
(5.0)
7.8±0.1
7.6±0.2
5.6±0.1
(MAX 8.15 include BURR)
1PIN MARK
Order quantity needs to be multiple of the minimum quantity.
<Tape and Reel information>
Embossed carrier tape (with dry pack)Tape
Quantity
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
2000pcs
E2
()
Direction of feed
Reel 1pin
Datasheet
Datasheet
Datasheet
Notice - GE Rev.002
© 2014 ROHM Co., Ltd. All rights reserved.
Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN USA EU CHINA
CLASS CLASS CLASSb CLASS
CLASS CLASS
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Datasheet
Datasheet
Datasheet
Notice - GE Rev.002
© 2014 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
DatasheetDatasheet
Notice – WE Rev.001
© 2014 ROHM Co., Ltd. All rights reserved.
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccur acy or errors of or
concerning such information.

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