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B32686S Series Datasheet by EPCOS - TDK Electronics

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@TDK
Film Capacitors
Metallized Polypropylene Film Capacitors (MFP)
Series/Type: B32686S
Date: June 2018
© EPCOS AG 2018. Reproduction, publication and dissemination of this publication, enclosures hereto and the
information contained therein without EPCOS' prior express consent is prohibited.
EPCOS AG is a TDK Group Company.
@TDK
Typical applications
Snubbering
Filtering
IGBT
Climatic
Max. operating temperature: 110 °C
Climatic category (IEC 60068-1:2013): 55/100/56
Construction
Dielectric: polypropylene (PP)
Film metallized on one side and
metal foils internally connected in series
Plastic case, epoxy resin sealing (UL 94 V-0)
Features
Very high pulse strength
High current
Highest possible contact reliability
RoHS-compatible
Terminals
Strap terminals, tinned copper (max. torque 10 Nm)
Marking
Manufacturer's logo, ordering code, style (MFP)
rated capaitance (coded), cap. tolerance (code letter),
rated DC voltage, date of manufacture (coded)
Delivery mode: Bulk (untaped)
Metallized polypropylene film capacitors (MFP) B32686S
Snubber
Page2of22Please read Cautions and warnings and
Important notes at the end of this document.
2810.5 2310.5 10.2 min. R3101 1411 KMKO785¢E @TDK IEI 151 6710.5 1010.3 KMKU7B7-I-E MFP 24.5105 19510.5 6.2mm. 14min. 0310.05 R3101 3510.4 0310.05 a— 4» 3 r .1 1 * ‘ 1 ‘ 1 'fi 1 N . 1 1 .c 1 ‘ 1 1 1 4% + w L w 3171 KMKU756-S-E 3:1 3810.5 3 2510-2 +I ”2 m o 1 1’1 1 1 1 s 1 1 1 1 1 L w 2810.5 2210.5 <—> 12 mm. *4, 1310.3 910.4 R310.1 T fir ‘ N. 1 ‘3 m KMKmarer
Dimensional drawings
T1 (code no. 561) T2 (code no. 562)
T3 (code no. 563) T4 (code no. 564)
B32686S
Snubber
Page3of22Please read Cautions and warnings and
Important notes at the end of this document.
@TDK MFP 30:05 3 23:03 23:05 ._. ,. ._. 5 \ m o 1 1:- 1 1 1 I 1 1 1 0550.05 ‘ \ +<7 .="" \="" ,="" w="" 24105="1" 2010.5="" 1="" 1010.5="" ‘="" 12:05="" _,_‘="" r3.3:0.1="" 020.4="" 011="" w="" \="" kmk‘="" m-s-e="" j.="" ~_="" \="" ‘3="" "’2="" in="" kmku7897h7e="">
Dimensional drawings (continued)
T5 (code no. 565) T6 (code no. 566)
Overview of available types
Type B32686S
VR(V DC) 1000 1250 1600 2000
VRMS (V AC) 400 450 450 500
CR(nF)
22
33
47
68
100
120
150
220
270
330
390
470
560
680
B32686S
Snubber
Page4of22Please read Cautions and warnings and
Important notes at the end of this document.
Ella — @TDK MFP
Ordering codes and packing units
VR
VDC
VRMS
f1kHz
VAC
CR
nF
Max. dimensions
w×h×l
mm
IRMS
100 kHz
A
ESR
100 kHz
mΩ
Ordering code
(composition see
below)
Ter-
minal
pcs./
MOQ
MOQ = Minimum Order Quantity, consisting of 4 packing units.
Further E series and intermediate capacitance values on request.
Composition of ordering code
+ = Capacitance tolerance code:
K=±10%
J= ±5%
1000 400 68 12.0 ×22.5 ×42.0 4.0 20 B32686S0683+563 T3 224
68 12.0 ×22.5 ×42.0 4.0 20 B32686S0683+564 T4 384
100 12.0 ×22.5 ×42.0 4.5 15 B32686S0104+563 T3 224
100 12.0 ×22.5 ×42.0 4.5 15 B32686S0104+564 T4 384
120 12.0 ×22.5 ×42.0 4.5 13 B32686S0124+563 T3 224
120 12.0 ×22.5 ×42.0 4.5 13 B32686S0124+564 T4 384
150 14.0 ×25.0 ×42.0 5.5 10 B32686S0154+563 T3 192
150 14.0 ×25.0 ×42.0 5.5 10 B32686S0154+564 T4 288
150 14.0 ×25.0 ×42.0 5.5 10 B32686S0154+565 T5 288
220 16.0 ×28.5 ×42.0 7.0 7 B32686S0224+563 T3 160
220 16.0 ×28.5 ×42.0 7.0 7 B32686S0224+564 T4 192
220 16.0 ×28.5 ×42.0 7.0 7 B32686S0224+565 T5 192
270 18.0 ×32.5 ×42.0 7.5 7 B32686S0274+563 T3 144
270 18.0 ×32.5 ×42.0 7.5 7 B32686S0274+564 T4 128
270 18.0 ×32.5 ×42.0 7.5 7 B32686S0274+565 T5 128
330 20.0 ×39.5 ×42.0 8.5 5 B32686S0334+561 T1 96
330 20.0 ×39.5 ×42.0 8.5 5 B32686S0334+562 T2 96
330 20.0 ×39.5 ×42.0 8.5 5 B32686S0334+563 T3 104
330 20.0 ×39.5 ×42.0 8.5 5 B32686S0334+564 T4 96
330 20.0 ×39.5 ×42.0 8.5 5 B32686S0334+565 T5 96
330 20.0 ×39.5 ×42.0 8.5 5 B32686S0334+566 T6 96
390 20.0 ×39.5 ×42.0 9.0 5 B32686S0394+561 T1 96
390 20.0 ×39.5 ×42.0 9.0 5 B32686S0394+562 T2 96
390 20.0 ×39.5 ×42.0 9.0 5 B32686S0394+563 T3 104
390 20.0 ×39.5 ×42.0 9.0 5 B32686S0394+564 T4 96
390 20.0 ×39.5 ×42.0 9.0 5 B32686S0394+565 T5 96
390 20.0 ×39.5 ×42.0 9.0 5 B32686S0394+566 T6 96
470 28.0 ×37.0 ×42.0 10.0 3 B32686S0474+561 T1 108
470 28.0 ×37.0 ×42.0 10.0 3 B32686S0474+562 T2 108
470 28.0 ×37.0 ×42.0 10.0 3 B32686S0474+563 T3 72
470 28.0 ×37.0 ×42.0 10.0 3 B32686S0474+566 T6 108
B32686S
Snubber
Page5of22Please read Cautions and warnings and
Important notes at the end of this document.
@TDK
Ordering codes and packing units
VR
VDC
VRMS
f1kHz
VAC
CR
nF
Max. dimensions
w×h×l
mm
IRMS
100 kHz
A
ESR
100 kHz
mΩ
Ordering code
(composition see
below)
Ter-
minal
pcs./
MOQ
MOQ = Minimum Order Quantity, consisting of 4 packing units.
Further E series and intermediate capacitance values on request.
Composition of ordering code
+ = Capacitance tolerance code:
K=±10%
J= ±5%
1000 400 560 28.0 ×37.0 ×42.0 11.0 3 B32686S0564+561 T1 108
560 28.0 ×37.0 ×42.0 11.0 3 B32686S0564+562 T2 108
560 28.0 ×37.0 ×42.0 11.0 3 B32686S0564+563 T3 72
560 28.0 ×37.0 ×42.0 11.0 3 B32686S0564+566 T6 108
680 30.0 ×45.0 ×42.0 12.0 3 B32686S0684+561 T1 48
680 30.0 ×45.0 ×42.0 12.0 3 B32686S0684+562 T2 48
680 30.0 ×45.0 ×42.0 12.0 3 B32686S0684+563 T3 72
680 30.0 ×45.0 ×42.0 12.0 3 B32686S0684+566 T6 48
1250 450 68 12.0 ×22.5 ×42.0 4.5 20 B32686S7683+563 T3 224
68 12.0 ×22.5 ×42.0 4.5 20 B32686S7683+564 T4 384
100 14.0 ×25.0 ×42.0 5.0 15 B32686S7104+563 T3 192
100 14.0 ×25.0 ×42.0 5.0 15 B32686S7104+564 T4 288
100 14.0 ×25.0 ×42.0 5.0 15 B32686S7104+565 T5 288
120 14.0 ×25.0 ×42.0 5.5 13 B32686S7124+563 T3 192
120 14.0 ×25.0 ×42.0 5.5 13 B32686S7124+564 T4 288
120 14.0 ×25.0 ×42.0 5.5 13 B32686S7124+565 T5 288
150 16.0 ×28.5 ×42.0 6.5 10 B32686S7154+563 T3 160
150 16.0 ×28.5 ×42.0 6.5 10 B32686S7154+564 T4 192
150 16.0 ×28.5 ×42.0 6.5 10 B32686S7154+565 T5 192
220 18.0 ×32.5 ×42.0 8.5 7 B32686S7224+563 T3 144
220 18.0 ×32.5 ×42.0 8.5 7 B32686S7224+564 T4 128
220 18.0 ×32.5 ×42.0 8.5 7 B32686S7224+565 T5 128
270 20.0 ×39.5 ×42.0 9.0 7 B32686S7274+561 T1 96
270 20.0 ×39.5 ×42.0 9.0 7 B32686S7274+562 T2 96
270 20.0 ×39.5 ×42.0 9.0 7 B32686S7274+563 T3 104
270 20.0 ×39.5 ×42.0 9.0 7 B32686S7274+564 T4 96
270 20.0 ×39.5 ×42.0 9.0 7 B32686S7274+565 T5 96
270 20.0 ×39.5 ×42.0 9.0 7 B32686S7274+566 T6 96
330 28.0 ×37.0 ×42.0 10.0 5 B32686S7334+561 T1 108
330 28.0 ×37.0 ×42.0 10.0 5 B32686S7334+562 T2 108
330 28.0 ×37.0 ×42.0 10.0 5 B32686S7334+563 T3 72
330 28.0 ×37.0 ×42.0 10.0 5 B32686S7334+566 T6 108
B32686S
Snubber
Page6of22Please read Cautions and warnings and
Important notes at the end of this document.
Ella — @TDK MFP
Ordering codes and packing units
VR
VDC
VRMS
f1kHz
VAC
CR
nF
Max. dimensions
w×h×l
mm
IRMS
100 kHz
A
ESR
100 kHz
mΩ
Ordering code
(composition see
below)
Ter-
minal
pcs./
MOQ
MOQ = Minimum Order Quantity, consisting of 4 packing units.
Further E series and intermediate capacitance values on request.
Composition of ordering code
+ = Capacitance tolerance code:
K=±10%
J= ±5%
1250 450 390 28.0 ×37.0 ×42.0 11.0 5 B32686S7394+561 T1 108
390 28.0 ×37.0 ×42.0 11.0 5 B32686S7394+562 T2 108
390 28.0 ×37.0 ×42.0 11.0 5 B32686S7394+563 T3 72
390 28.0 ×37.0 ×42.0 11.0 5 B32686S7394+566 T6 108
470 30.0 ×45.0 ×42.0 12.0 5 B32686S7474+561 T1 48
470 30.0 ×45.0 ×42.0 12.0 5 B32686S7474+562 T2 48
470 30.0 ×45.0 ×42.0 12.0 5 B32686S7474+563 T3 72
470 30.0 ×45.0 ×42.0 12.0 5 B32686S7474+566 T6 48
1600 450 47 12.0 ×22.5 ×42.0 5.0 30 B32686S1473+563 T3 224
47 12.0 ×22.5 ×42.0 5.0 30 B32686S1473+564 T4 384
68 14.0 ×25.0 ×42.0 6.0 20 B32686S1683+563 T3 192
68 14.0 ×25.0 ×42.0 6.0 20 B32686S1683+564 T4 288
68 14.0 ×25.0 ×42.0 6.0 20 B32686S1683+565 T5 288
100 18.0 ×32.5 ×42.0 7.0 15 B32686S1104+563 T3 144
100 18.0 ×32.5 ×42.0 7.0 15 B32686S1104+564 T4 128
100 18.0 ×32.5 ×42.0 7.0 15 B32686S1104+565 T5 128
120 18.0 ×32.5 ×42.0 7.5 13 B32686S1124+563 T3 144
120 18.0 ×32.5 ×42.0 7.5 13 B32686S1124+564 T4 128
120 18.0 ×32.5 ×42.0 7.5 13 B32686S1124+565 T5 128
150 20.0 ×39.5 ×42.0 8.5 10 B32686S1154+561 T1 96
150 20.0 ×39.5 ×42.0 8.5 10 B32686S1154+562 T2 96
150 20.0 ×39.5 ×42.0 8.5 10 B32686S1154+563 T3 104
150 20.0 ×39.5 ×42.0 8.5 10 B32686S1154+564 T4 96
150 20.0 ×39.5 ×42.0 8.5 10 B32686S1154+565 T5 96
150 20.0 ×39.5 ×42.0 8.5 10 B32686S1154+566 T6 96
220 28.0 ×37.0 ×42.0 10.5 7 B32686S1224+561 T1 108
220 28.0 ×37.0 ×42.0 10.5 7 B32686S1224+562 T2 108
220 28.0 ×37.0 ×42.0 10.5 7 B32686S1224+563 T3 72
220 28.0 ×37.0 ×42.0 10.5 7 B32686S1224+566 T6 108
B32686S
Snubber
Page7of22Please read Cautions and warnings and
Important notes at the end of this document.
@TDK
Ordering codes and packing units
VR
VDC
VRMS
f1kHz
VAC
CR
nF
Max. dimensions
w×h×l
mm
IRMS
100 kHz
A
ESR
100 kHz
mΩ
Ordering code
(composition see
below)
Ter-
minal
pcs./
MOQ
MOQ = Minimum Order Quantity, consisting of 4 packing units.
Further E series and intermediate capacitance values on request.
Composition of ordering code
+ = Capacitance tolerance code:
K=±10%
J= ±5%
1600 450 270 30.0 ×45.0 ×42.0 11.5 7 B32686S1274+561 T1 48
270 30.0 ×45.0 ×42.0 11.5 7 B32686S1274+562 T2 48
270 30.0 ×45.0 ×42.0 11.5 7 B32686S1274+563 T3 72
270 30.0 ×45.0 ×42.0 11.5 7 B32686S1274+566 T6 48
2000 500 22 12.0 ×22.5 ×42.0 4.0 70 B32686S2223+563 T3 224
22 12.0 ×22.5 ×42.0 4.0 70 B32686S2223+564 T4 384
33 14.0 ×25.0 ×42.0 5.0 50 B32686S2333+563 T3 192
33 14.0 ×25.0 ×42.0 5.0 50 B32686S2333+564 T4 288
33 14.0 ×25.0 ×42.0 5.0 50 B32686S2333+565 T5 288
47 16.0 ×28.5 ×42.0 6.0 30 B32686S2473+563 T3 160
47 16.0 ×28.5 ×42.0 6.0 30 B32686S2473+564 T4 192
47 16.0 ×28.5 ×42.0 6.0 30 B32686S2473+565 T5 192
68 18.0 ×32.5 ×42.0 7.5 20 B32686S2683+563 T3 144
68 18.0 ×32.5 ×42.0 7.5 20 B32686S2683+564 T4 128
68 18.0 ×32.5 ×42.0 7.5 20 B32686S2683+565 T5 128
100 20.0 ×39.5 ×42.0 8.5 15 B32686S2104+561 T1 96
100 20.0 ×39.5 ×42.0 8.5 15 B32686S2104+562 T2 96
100 20.0 ×39.5 ×42.0 8.5 15 B32686S2104+563 T3 104
100 20.0 ×39.5 ×42.0 8.5 15 B32686S2104+564 T4 96
100 20.0 ×39.5 ×42.0 8.5 15 B32686S2104+565 T5 96
100 20.0 ×39.5 ×42.0 8.5 15 B32686S2104+566 T6 96
120 28.0 ×37.0 ×42.0 9.0 13 B32686S2124+561 T1 96
120 28.0 ×37.0 ×42.0 9.0 13 B32686S2124+562 T2 96
120 28.0 ×37.0 ×42.0 9.0 13 B32686S2124+563 T3 104
120 28.0 ×37.0 ×42.0 9.0 13 B32686S2124+566 T6 96
150 28.0 ×37.0 ×42.0 10.0 10 B32686S2154+561 T1 108
150 28.0 ×37.0 ×42.0 10.0 10 B32686S2154+562 T2 108
150 28.0 ×37.0 ×42.0 10.0 10 B32686S2154+563 T3 72
150 28.0 ×37.0 ×42.0 10.0 10 B32686S2154+566 T6 108
B32686S
Snubber
Page8of22Please read Cautions and warnings and
Important notes at the end of this document.
Ella — @TDK MFP
Technical data
Operating temperature range Max. operating temperature Top,max
Upper category temperature Tmax
Lower category temperature Tmin
Rated temperature TR
+110 °C
+100 °C
55 °C
+85 °C
Dissipation factor tan δat 20 °C
(upper limit values)
1.0 10-3 (at 10 kHz)
3.0 10-3 (at 10 kHz)
Insulation resistance Rins
or time constant τ=C
RRins
at 20 °C, rel. humidity 65%
(minimum as-delivered values)
CR0.33 μF CR> 0.33 μF
100 GΩ30000 s
DC test voltage 2.0 VR,2s
Category voltage VC
(continuous operation with
VDC or VAC atf1 kHz)
Top (°C) DC voltage derating AC voltage derating
Top 85 VC=V
RVC,RMS=VRMS
85<Top100 VC=V
R(165Top)/80 VC,RMS=VRMS (165Top)/80
Operating voltage Vop for
short operating periods
(VDC or VAC at f 1 kHz)
Top (°C) DC voltage
(max. hours)
AC voltage
(max. hours)
Top 85 Vop = 1.25 VC(2000 h) Vop = 1.0 VC,RMS (2000 h)
85<Top100 Vop = 1.25 VC(1000 h) Vop = 1.0 VC,RMS (1000 h)
Damp heat test
Limit values after damp heat
test
56 days/40 °C/93% relative humidity
Capacitance change ΔC/C2%
Dissipation factor change Δtan δ≤1.0 10-3 (at 10 kHz)
Insulation resistance Rins
or time constant τ=C
RRins
50% of minimum
as-delivered values
Reliability:
Failure rate λ1 fit (110-9 /h) at 0.5 VR,40°C
Service life tSL 200 000 h at 1.0 VR,85°C
For conversion to other operating conditions and temperatures,
refer to chapter "Quality, 2 Reliability".
Failure criteria:
Total failure Short circuit or open circuit
Failure due to variation
of parameters
Capacitance change ΔC/C> 10%
Dissipation factor tan δ4upper limit value
Insulation resistance Rins
or time constant τ=C
RRins
< 1500 MΩ(CR0.33 μF)
<500s(C
R>0.33 μF)
B32686S
Snubber
Page9of22Please read Cautions and warnings and
Important notes at the end of this document.
N 104 m9 B326865 1o3 5 KMK‘ uAs-B @TDK
Pulse handling capability
"dV/dt" represents the maximum permissible voltage change per unit of time for non-sinusoidal
voltages, expressed in V/μs.
"k0" represents the maximum permissible pulse characteristic of the waveform applied to the
capacitor, expressed in V2/μs.
Note:
The values of dV/dt and k0provided below must not be exceeded in order to avoid damaging the
capacitor.
dV/dt and k0values
VR(V DC) VRMS (V AC) dV/dt in V/μs k0in V2/μs
1000 400 2 000 4 000 000
1250 450 2 800 7 000 000
1600 450 3 500 11 000 000
2000 500 4 500 18 000 000
Impedance Z versus frequency f
(typical values)
B32686S
Snubber
Page 10 of 22Please read Cautions and warnings and
Important notes at the end of this document.
Ella — 1°00 KMKwOSrE V AC VRMS B326865/1000 V DC 100 50 10 1o3 104 105 Hz 106 1000 KMKIDH-A V AC VRMS BSZGBGSM 600 V DC 100 50 1O 103 10" 105 Hz 106 VRMS VRMS @TDK MFP 1000 KMKIOVo-Q V AC B326868/1250 V DC 100 1o 103 104 105 Hz 106 4.1 1000 KMKwoua-E V AC 8326865/1000 V DC 100 50 10 103 we“ 105 Hz 106
Permissible AC voltage VRMS versus frequency f (for sinusoidal waveforms, TA90 °C)
For TA>90 °C, please refer to "General technical information", section 3.2.3.
1000 V DC/400 V AC 1250 V DC/450 V AC
1600 V DC/450 V AC 2000 V DC/500 V AC
B32686S
Snubber
Page 11 of 22Please read Cautions and warnings and
Important notes at the end of this document.
@TDK
Mounting guidelines
1 Soldering
1.1 Solderability of leads
The solderability of terminal leads is tested to IEC 60068-2-20:2008, test Ta, method 1.
Before a solderability test is carried out, terminals are subjected to accelerated ageing (to
IEC 60068-2-2:2007, test Ba: 4 h exposure to dry heat at 155 °C). Since the ageing temperature
is far higher than the upper category temperature of the capacitors, the terminal wires should be
cut off from the capacitor before the ageing procedure to prevent the solderability being impaired
by the products of any capacitor decomposition that might occur.
Solder bath temperature 235 ±5°C
Soldering time 2.0 ±0.5 s
Immersion depth 2.0 +0/0.5 mm from capacitor body or seating plane
Evaluation criteria:
Visual inspection Wetting of wire surface by new solder 90%,
free-flowing solder
1.2 Resistance to soldering heat
Resistance to soldering heat is tested to IEC 60068-2-20:2008, test Tb, method 1.
Conditions:
Series Solder bath temperature Soldering time
MKT boxed (except 2.5 ×6.5 ×7.2 mm)
coated
uncoated (lead spacing >10 mm)
260 ±5°C 10 ±1s
MFP
MKP (lead spacing >7.5 mm)
MKT boxed (case 2.5 ×6.5 ×7.2 mm) 5±1s
MKP
MKT
(lead spacing 7.5 mm)
uncoated (lead spacing 10 mm)
insulated (B32559)
<4 s
recommended soldering
profile for MKT uncoated
(lead spacing 10 mm) and
insulated (B32559)
B32686S
Snubber
Page 12 of 22Please read Cautions and warnings and
Important notes at the end of this document.
@TDK — '6' W MFP KMsz-v 300 ‘ C ‘/ 260 C, 4 s 250 200 \ 150 100 4.4 50 0 50 100 150 200 s 250
Immersion depth 2.0 +0/0.5 mm from capacitor body or seating plane
Shield Heat-absorbing board, (1.5 ±0.5) mm thick, between
capacitor body and liquid solder
Evaluation criteria:
Visual inspection No visible damage
ΔC/C0
2% for MKT/MKP/MFP
5% for EMI suppression capacitors
tan δAs specified in sectional specification
1.3 General notes on soldering
Permissible heat exposure loads on film capacitors are primarily characterized by the upper cate-
gory temperature Tmax. Long exposure to temperatures above this type-related temperature limit
can lead to changes in the plastic dielectric and thus change irreversibly a capacitor's electrical
characteristics. For short exposures (as in practical soldering processes) the heat load (and thus
the possible effects on a capacitor) will also depend on other factors like:
Pre-heating temperature and time
Forced cooling immediately after soldering
Terminal characteristics:
diameter, length, thermal resistance, special configurations (e.g. crimping)
Height of capacitor above solder bath
Shadowing by neighboring components
Additional heating due to heat dissipation by neighboring components
Use of solder-resist coatings
B32686S
Snubber
Page 13 of 22Please read Cautions and warnings and
Important notes at the end of this document.
@TDK MFP Tempfra‘ure Tola‘ contact < 10="" s="" cc="" +=""><7 250+5="" ,="" 77777777777="" 7="" 7="" maximum="" solder="" '="" 1emperalure="" wave="" soldeving="" profi‘e="" ts="" ’="" ~="" i="" \="" t="" p="" \="" x="" \="" capacxtor="" body="" ,="" \lemperamre="" is="" \="" \="" x="" x="" i="" z="" ’="" prerheating="" 7="" time="" 0="">< 150="" 5="" ts:="" capacitor="" body="" maxwmum="" ‘emperalure="" at="" wave="" soldering="" tp:="" capacitor="" body="" maxwmum="" ‘emperalure="" at="" pve-heatmg="" kmkwas-a-e="" body="" iemperaluve="" sensor="" posnion="" ‘="" l4"="" kmkmarer="">
The overheating associated with some of these factors can usually be reduced by suitable coun-
termeasures. For example, if a pre-heating step cannot be avoided, an additional or reinforced
cooling process may possibly have to be included.
EPCOS recommendations
As a reference, the recommended wave soldering profile for our film capacitors is as follows:
B32686S
Snubber
Page 14 of 22Please read Cautions and warnings and
Important notes at the end of this document.
Ella — @TDK MFP
Body temperature should follow the description below:
MKP capacitor
During pre-heating: Tp110 °C
During soldering: Ts120 °C, ts45 s
MKT capacitor
During pre-heating: Tp125 °C
During soldering: Ts160 °C, ts45 s
When SMD components are used together with leaded ones, the film capacitors should not pass
into the SMD adhesive curing oven. The leaded components should be assembled after the SMD
curing step.
Leaded film capacitors are not suitable for reflow soldering.
In order to ensure proper conditions for manual or selective soldering, the body temperature of
the capacitor (Ts) must be 120 °C.
One recommended condition for manual soldering is that the tip of the soldering iron should
be <360 °C and the soldering contact time should be no longer than 3 seconds.
For uncoated MKT capacitors with lead spacings 10 mm (B32560/B32561) the following mea-
sures are recommended:
pre-heating to not more than 110 °C in the preheater phase
rapid cooling after soldering
Please refer to EPCOS Film Capacitor Data Book in case more details are needed.
B32686S
Snubber
Page 15 of 22Please read Cautions and warnings and
Important notes at the end of this document.
@TDK MFP
Cautions and warnings
Do not exceed the upper category temperature (UCT).
Do not apply any mechanical stress to the capacitor terminals.
Avoid any compressive, tensile or flexural stress.
Do not move the capacitor after it has been soldered to the PC board.
Do not pick up the PC board by the soldered capacitor.
Do not place the capacitor on a PC board whose PTH hole spacing differs from the specified
lead spacing.
Do not exceed the specified time or temperature limits during soldering.
Avoid external energy inputs, such as fire or electricity.
Avoid overload of the capacitors.
Consult us if application is with severe temperature and humidity condition.
There are no serviceable or repairable parts inside the capacitor. Opening the capacitor or
any attempts to open or repair the capacitor will void the warranty and liability of EPCOS.
Please note that the standards referred to in this publication may have been revised in the
meantime.
The table below summarizes the safety instructions that must always be observed. A detailed de-
scription can be found in the relevant sections of the chapters "General technical information" and
"Mounting guidelines".
Topic Safety information Reference chapter
"General technical
information"
Storage
conditions
Make sure that capacitors are stored within the specified
range of time, temperature and humidity conditions.
4.5
"Storage conditions"
Flammability Avoid external energy, such as fire or electricity (passive
flammability), avoid overload of the capacitors (active
flammability) and consider the flammability of materials.
5.3
"Flammability"
Resistance to
vibration
Do not exceed the tested ability to withstand vibration.
The capacitors are tested to IEC 60068-2-6:2007.
EPCOS offers film capacitors specially designed for
operation under more severe vibration regimes such as
those found in automotive applications. Consult our
catalog "Film Capacitors for Automotive Electronics".
5.2
"Resistance to
vibration"
Topic Safety information Reference chapter
"Mounting guidelines"
Soldering Do not exceed the specified time or temperature limits
during soldering.
1 "Soldering"
Cleaning Use only suitable solvents for cleaning capacitors. 2 "Cleaning"
B32686S
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Important notes at the end of this document.
Ella — @TDK MFP
Topic Safety information Reference chapter
"Mounting guidelines"
Embedding of
capacitors in
finished
assemblies
When embedding finished circuit assemblies in plastic
resins, chemical and thermal influences must be taken
into account.
Caution: Consult us first, if you also wish to embed other
uncoated component types!
3 "Embedding of
capacitors in finished
assemblies"
Display of ordering codes for EPCOS products
The ordering code for one and the same product can be represented differently in data sheets,
data books, other publications and the website of EPCOS, or in order-related documents such as
shipping notes, order confirmations and product labels. The varying representations of the or-
dering codes are due to different processes employed and do not affect the specifications
of the respective products. Detailed information can be found on the Internet under
www.epcos.com/orderingcodes.
B32686S
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Page 17 of 22Please read Cautions and warnings and
Important notes at the end of this document.
@TDK
Symbols and terms
Symbol English German
αHeat transfer coefficient Wärmeübergangszahl
αCTemperature coefficient of capacitance Temperaturkoeffizient der Kapazität
ACapacitor surface area Kondensatoroberfläche
βCHumidity coefficient of capacitance Feuchtekoeffizient der Kapazität
CCapacitance Kapazität
CRRated capacitance Nennkapazität
ΔCAbsolute capacitance change Absolute Kapazitätsänderung
ΔC/C Relative capacitance change (relative
deviation of actual value)
Relative Kapazitätsänderung (relative
Abweichung vom Ist-Wert)
ΔC/CRCapacitance tolerance (relative deviation
from rated capacitance)
Kapazitätstoleranz (relative Abweichung
vom Nennwert)
dt Time differential Differentielle Zeit
ΔtTime interval Zeitintervall
ΔTAbsolute temperature change
(self-heating)
Absolute Temperaturänderung
(Selbsterwärmung)
Δtan δAbsolute change of dissipation factor Absolute Änderung des Verlustfaktors
ΔVAbsolute voltage change Absolute Spannungsänderung
dV/dt Time differential of voltage function (rate
of voltage rise)
Differentielle Spannungsänderung
(Spannungsflankensteilheit)
ΔV/ΔtVoltage change per time interval Spannungsänderung pro Zeitintervall
EActivation energy for diffusion Aktivierungsenergie zur Diffusion
ESL Self-inductance Eigeninduktivität
ESR Equivalent series resistance Ersatz-Serienwiderstand
fFrequency Frequenz
f1Frequency limit for reducing permissible
AC voltage due to thermal limits
Grenzfrequenz für thermisch bedingte
Reduzierung der zulässigen
Wechselspannung
f2Frequency limit for reducing permissible
AC voltage due to current limit
Grenzfrequenz für strombedingte
Reduzierung der zulässigen
Wechselspannung
frResonant frequency Resonanzfrequenz
FDThermal acceleration factor for diffusion Therm. Beschleunigungsfaktor zur
Diffusion
FTDerating factor Deratingfaktor
iCurrent (peak) Stromspitze
ICCategory current (max. continuous
current)
Kategoriestrom (max. Dauerstrom)
B32686S
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Page 18 of 22Please read Cautions and warnings and
Important notes at the end of this document.
Ella — @TDK MFP
Symbol English German
IRMS (Sinusoidal) alternating current,
root-mean-square value
(Sinusförmiger) Wechselstrom
izCapacitance drift Inkonstanz der Kapazität
k0Pulse characteristic Impulskennwert
LSSeries inductance Serieninduktivität
λFailure rate Ausfallrate
λ0Constant failure rate during useful
service life
Konstante Ausfallrate in der
Nutzungsphase
λtest Failure rate, determined by tests Experimentell ermittelte Ausfallrate
Pdiss Dissipated power Abgegebene Verlustleistung
Pgen Generated power Erzeugte Verlustleistung
QHeat energy Wärmeenergie
ρDensity of water vapor in air Dichte von Wasserdampf in Luft
RUniversal molar constant for gases Allg. Molarkonstante für Gas
ROhmic resistance of discharge circuit Ohmscher Widerstand des
Entladekreises
RiInternal resistance Innenwiderstand
Rins Insulation resistance Isolationswiderstand
RPParallel resistance Parallelwiderstand
RSSeries resistance Serienwiderstand
Sseverity (humidity test) Schärfegrad (Feuchtetest)
tTime Zeit
TTemperature Temperatur
τTime constant Zeitkonstante
tan δDissipation factor Verlustfaktor
tan δDDielectric component of dissipation
factor
Dielektrischer Anteil des Verlustfaktors
tan δPParallel component of dissipation factor Parallelanteil des Verlfustfaktors
tan δSSeries component of dissipation factor Serienanteil des Verlustfaktors
TATemperature of the air surrounding the
component
Temperatur der Luft, die das Bauteil
umgibt
Tmax Upper category temperature Obere Kategorietemperatur
Tmin Lower category temperature Untere Kategorietemperatur
tOL Operating life at operating temperature
and voltage
Betriebszeit bei Betriebstemperatur und
-spannung
Top Operating temperature, TA+ΔT Beriebstemperatur, TA+ΔT
TRRated temperature Nenntemperatur
Tref Reference temperature Referenztemperatur
tSL Reference service life Referenz-Lebensdauer
B32686S
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Important notes at the end of this document.
@TDK
Symbol English German
VAC AC voltage Wechselspannung
VCCategory voltage Kategoriespannung
VC,RMS Category AC voltage (Sinusförmige)
Kategorie-Wechselspannung
VCD Corona-discharge onset voltage Teilentlade-Einsatzspannung
Vch Charging voltage Ladespannung
VDC DC voltage Gleichspannung
VFB Fly-back capacitor voltage Spannung (Flyback)
ViInput voltage Eingangsspannung
VoOutput voltage Ausgangssspannung
Vop Operating voltage Betriebsspannung
VpPeak pulse voltage Impuls-Spitzenspannung
Vpp Peak-to-peak voltage Impedance Spannungshub
VRRated voltage Nennspannung
RAmplitude of rated AC voltage Amplitude der Nenn-Wechselspannung
VRMS (Sinusoidal) alternating voltage,
root-mean-square value
(Sinusförmige) Wechselspannung
VSC S-correction voltage Spannung bei Anwendung "S-correction"
Vsn Snubber capacitor voltage Spannung bei Anwendung
"Beschaltung"
ZImpedance Scheinwiderstand
Lead spacing Rastermaß
B32686S
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Page 20 of 22Please read Cautions and warnings and
Important notes at the end of this document.
@TDK
The following applies to all products named in this publication:
1. Some parts of this publication contain statements about the suitability of our products for
certain areas of application. These statements are based on our knowledge of typical re-
quirements that are often placed on our products in the areas of application concerned. We
nevertheless expressly point out that such statements cannot be regarded as binding
statements about the suitability of our products for a particular customer application.
As a rule, EPCOS is either unfamiliar with individual customer applications or less familiar
with them than the customers themselves. For these reasons, it is always ultimately incum-
bent on the customer to check and decide whether an EPCOS product with the properties de-
scribed in the product specification is suitable for use in a particular customer application.
2. We also point out that in individual cases, a malfunction of electronic components or
failure before the end of their usual service life cannot be completely ruled out in the
current state of the art, even if they are operated as specified. In customer applications
requiring a very high level of operational safety and especially in customer applications in
which the malfunction or failure of an electronic component could endanger human life or
health (e.g. in accident prevention or lifesaving systems), it must therefore be ensured by
means of suitable design of the customer application or other action taken by the customer
(e.g. installation of protective circuitry or redundancy) that no injury or damage is sustained by
third parties in the event of malfunction or failure of an electronic component.
3. The warnings, cautions and product-specific notes must be observed.
4. In order to satisfy certain technical requirements, some of the products described in this
publication may contain substances subject to restrictions in certain jurisdictions (e.g.
because they are classed as hazardous). Useful information on this will be found in our Ma-
terial Data Sheets on the Internet (www.epcos.com/material). Should you have any more de-
tailed questions, please contact our sales offices.
5. We constantly strive to improve our products. Consequently, the products described in this
publication may change from time to time. The same is true of the corresponding product
specifications. Please check therefore to what extent product descriptions and specifications
contained in this publication are still applicable before or when you place an order. We also
reserve the right to discontinue production and delivery of products. Consequently, we
cannot guarantee that all products named in this publication will always be available. The
aforementioned does not apply in the case of individual agreements deviating from the fore-
going for customer-specific products.
6. Unless otherwise agreed in individual contracts, all orders are subject to the current ver-
sion of the "General Terms of Delivery for Products and Services in the Electrical In-
dustry" published by the German Electrical and Electronics Industry Association
(ZVEI).
Important notes
Page 21 of 22
@TDK
7. Our manufacturing sites serving the automotive business apply the IATF 16949
standard. The IATF certifications confirm our compliance with requirements regarding the
quality management system in the automotive industry. Referring to customer requirements
and customer specific requirements (“CSR”) TDK always has and will continue to have the
policy of respecting individual agreements. Even if IATF 16949 may appear to support the
acceptance of unilateral requirements, we hereby like to emphasize that only requirements
mutually agreed upon can and will be implemented in our Quality Management System.
For clarification purposes we like to point out that obligations from IATF 16949 shall only
become legally binding if individually agreed upon.
8. The trade names EPCOS, CeraCharge, CeraDiode, CeraLink, CeraPad, CeraPlas, CSMP,
CTVS, DeltaCap, DigiSiMic, ExoCore, FilterCap, FormFit, LeaXield, MiniBlue, MiniCell, MKD,
MKK, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, PowerHap, PQSine,
PQvar, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV,
ThermoFuse, WindCap are trademarks registered or pending in Europe and in other coun-
tries. Further information will be found on the Internet at www.epcos.com/trademarks.
Release 2018-06
Important notes
Page 22 of 22

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