MAX3030E-33E Datasheet by Analog Devices Inc./Maxim Integrated

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[VI/JXI/VI 33333333 MAXIM .EEEEEEEE , 33333333 MAXIM .EEEEEEEE lM/JXIIVI
General Description
The MAX3030E–MAX3033E family of quad RS-422
transmitters send digital data transmission signals over
twisted-pair balanced lines in accordance with TIA/EIA-
422-B and ITU-T V.11 standards. All transmitter outputs
are protected to ±15kV using the Human Body Model.
The MAX3030E–MAX3033E are available with either a
2Mbps or 20Mbps guaranteed baud rate. The 2Mbps
baud rate transmitters feature slew-rate-limiting to mini-
mize EMI and reduce reflections caused by improperly
terminated cables.
The 20Mbps baud rate transmitters feature low-static
current consumption (ICC < 100µA), making them ideal
for battery-powered and power-conscious applications.
They have a maximum propagation delay of 16ns and a
part-to-part skew less than 5ns, making these devices
ideal for driving parallel data. The MAX3030E–
MAX3033E feature hot-swap capability that eliminates
false transitions on the data cable during power-up or
hot insertion.
The MAX3030E–MAX3033E are low-power, ESD-pro-
tected, pin-compatible upgrades to the industry-stan-
dard 26LS31 and SN75174. They are available in
space-saving 16-pin TSSOP and SO packages.
Applications
Telecom Backplanes
V.11/X.21 Interface
Industrial PLCs
Motor Control
Features
Meet TIA/EIA-422-B (RS-422) and ITU-T V.11
Recommendation
±15kV ESD Protection on Tx Outputs
Hot-Swap Functionality
Guaranteed 20Mbps Data Rate (MAX3030E,
MAX3032E)
Slew-Rate-Controlled 2Mbps Data Rate
(MAX3031E, MAX3033E)
Available in 16-Pin TSSOP and Narrow SO
Packages
Low-Power Design (<330µW, VCC = 3.3V Static)
+3.3V Operation
Industry-Standard Pinout
Thermal Shutdown
MAX3030E–MAX3033E
±15kV ESD-Protected, 3.3V Quad
RS-422 Transmitters
________________________________________________________________ Maxim Integrated Products 1
Ordering Information
19-2671; Rev 0; 10/02
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
PART TEMP RANGE PIN-PACKAGE
MAX3030ECSE 0°C to +70°C 16 SO (Narrow)
MAX3030ECUE 0°C to +70°C 16 TSSOP
MAX3030EESE -40°C to +85°C 16 SO (Narrow)
MAX3030EEUE -40°C to +85°C 16 TSSOP
MAX3031ECSE 0°C to +70°C 16 SO (Narrow)
MAX3031ECUE 0°C to +70°C 16 TSSOP
MAX3031EESE -40°C to +85°C 16 SO (Narrow)
MAX3031EEUE -40°C to +85°C 16 TSSOP
MAX3032ECSE 0°C to +70°C 16 SO (Narrow)
MAX3032ECUE 0°C to +70°C 16 TSSOP
MAX3032EESE -40°C to +85°C 16 SO (Narrow)
MAX3032EEUE -40°C to +85°C 16 TSSOP
MAX3033ECSE 0°C to +70°C 16 SO (Narrow)
MAX3033ECUE 0°C to +70°C 16 TSSOP
MAX3033EESE -40°C to +85°C 16 SO (Narrow)
MAX3033EEUE -40°C to +85°C 16 TSSOP
16
15
14
13
12
11
10
9
1
2
3
4
5
6
7
8
DI1 VCC
DI4
DO4+
DO4-
DO3-
DO3+
DI3
TOP VIEW
MAX3030E/
MAX3031E
TSSOP/SO
DO1+
DO1-
DO2+
EN
DO2-
DI2
GND
EN
16
15
14
13
12
11
10
9
1
2
3
4
5
6
7
8
DI1 VCC
DI4
DO4+
DO4-
DO3-
DO3+
DI3
MAX3032E/
MAX3033E
TSSOP/SO
DO1+
DO1-
DO2+
EN1&2
DO2-
DI2
GND
EN3&4
Pin Configurations
[MAXI/VI
MAX3030E–MAX3033E
±15kV ESD-Protected, 3.3V Quad
RS-422 Transmitters
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
DC ELECTRICAL CHARACTERISTICS
(3V VCC 3.6V, TA= TMIN to TMAX, unless otherwise noted. Typical values are at VCC = +3.3V and TA= +25°C.) (Note 1)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
(All Voltages Are Referenced to Device Ground, Unless
Otherwise Noted)
VCC ........................................................................................+6V
EN1&2, EN3&4, EN, EN............................................-0.3V to +6V
DI_ ............................................................................-0.3V to +6V
DO_+, DO_- (normal condition) .................-0.3V to (VCC + 0.3V)
DO_+, DO_- (power-off or three-state condition).....-0.3V to +6V
Driver Output Current per Pin.........................................±150mA
Continuous Power Dissipation (TA= +70°C)
16-Pin SO (derate 8.70mW/°C above +70°C)..............696mW
16-Pin TSSOP (derate 9.40mW/°C above +70°C) .......755mW
Operating Temperature Ranges
MAX303_EC_ ......................................................0°C to +70°C
MAX303_EE_ ...................................................-40°C to +85°C
Junction Temperature......................................................+150°C
Storage Temperature Range .............................-65°C to +160°C
Lead Temperature (soldering, 10s) .................................+300°C
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
DRIVER OUTPUT: DO_+, DO_-
VOD1 RL = 100, Figure 1 2.0
VOD2 RL = , Figure 1 3.6
Differential Driver Output
VOD3 RL = 3.9k (for compliance with V.11),
Figure 1 3.6
V
Change in Differential Output
Voltage VOD RL = 100 (Note 2) -0.4 +0.4 V
Driver Common-Mode Output
Voltage VOC RL = 100, Figure 1 3 V
Change in Common-Mode
Voltage VOC RL = 100 (Note 2) -0.4 +0.4 V
Three-State Leakage Current IOZ VOUT = VCC or GND, driver disabled ±10 µA
Output Leakage Current IOFF VCC = 0V, VOUT = 3V or 6V 20 µA
Driver Output Short-Circuit
Current ISC VOUT = 0V, VIN = VCC or GND
(Note 3) -150 mA
INPUTS: EN, EN, EN1&2, EN3&4
Input High Voltage VIH 2.0 V
Input Low Voltage VIL 0.4 V
Input Current ILEAK ±2 µA
Hot-Swap Driver Input Current IHOTSWAP EN, EN, EN1&2, EN3&4 (Note 4) ±200 µA
SUPPLY CURRENT
Supply Current ICC No load 100 µA
THERMAL PROTECTION
Thermal-Shutdown Threshold TSH 160 °C
Thermal-Shutdown Hysteresis 10 °C
ESD Protection DO_ Human Body Model ±15 kV
[VIAXIIVI
MAX3030E–MAX3033E
±15kV ESD-Protected, 3.3V Quad
RS-422 Transmitters
_______________________________________________________________________________________ 3
SWITCHING CHARACTERISTICS—MAX3030E, MAX3032E
(3V VCC 3.6V, TA= TMIN to TMAX, unless otherwise noted. Typical values are at VCC = +3.3V and TA= +25°C.)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Driver Propagation Delay
Low to High tDPLH
Driver Propagation Delay
High to Low tDPHL
RL = 100, CL = 50pF, Figures 2, 3 8 16 ns
Differential Transition Time, Low
to High tR
Differential Transition Time, High
to Low tF
RL = 100, CL = 50pF (10% to 90%),
Figures 2, 3 10 ns
Differential Skew (Same Channel)
|tDPLH - tDPHL|tSK1
Skew Driver to Driver
(Same Device) tSK2
RL = 100, CL = 50pF, VCC = 3.3V ±2 ns
Skew Part to Part tSK3 RL = 100, CL = 50pF, VCC = 3.3V,
TMAX = +5°C5ns
Maximum Data Rate 20 Mbps
Driver Enable to Output High tDZH S2 closed, RL = 500, CL = 50pF,
Figures 4, 5 50 ns
Driver Enable to Output Low tDZL S1 closed, RL = 500, CL = 50pF,
Figures 4, 5 50 ns
Driver Disable Time from Low tDLZ S1 closed, RL = 500, CL = 50pF,
Figures 4, 5 50 ns
Driver Disable Time from High tDHZ S2 closed, RL = 500, CL = 50pF,
Figures 4, 5 50 ns
SWITCHING CHARACTERISTICSMAX3031E, MAX3033E
(3V VCC 3.6V, TA= TMIN to TMAX, unless otherwise noted. Typical values are at VCC = +3.3V and TA= +25°C.)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Driver Propagation Delay
Low to High tDPLH
Driver Propagation Delay
High to Low tDPHL
RL = 100, CL = 50pF, Figures 2, 3 40 70 ns
Differential Transition Time,
Low to High tR
Differential Transition Time,
High to Low tF
RL = 100, CL = 50pF (10% to 90%),
Figures 2, 3 15 50 ns
Differential Skew (Same Channel)
|tDPLH - tDPHL|tSK1
Skew Driver to Driver
(Same Device) tSK2
RL = 100, CL = 50pF, VCC = 3.3V ±10 ns
[MAXI/III
MAX3030E–MAX3033E
±15kV ESD-Protected, 3.3V Quad
RS-422 Transmitters
4 _______________________________________________________________________________________
SWITCHING CHARACTERISTICSMAX3031E, MAX3033E (continued)
(3V VCC 3.6V, TA= TMIN to TMAX, unless otherwise noted. Typical values are at VCC = +3.3V and TA= +25°C.)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Skew Part to Part tSK3 RL = 100, CL = 50pF, VCC = 3.3V,
TMAX = +5°C18 ns
Maximum Data Rate 2 Mbps
Driver Enable to Output High tDZH S2 closed, RL = 500, CL = 50pF,
Figures 4, 5 100 ns
Driver Enable to Output Low tDZL S1 closed, RL = 500, CL = 50pF,
Figures 4, 5 100 ns
Driver Disable Time from Low tDLZ S1 closed, RL = 500, CL = 50pF,
Figures 4, 5 150 ns
Driver Disable Time from High tDHZ S2 closed, RL = 500, CL = 50pF,
Figures 4, 5 150 ns
Note 1: All currents into the device are positive; all currents out of the device are negative. All voltages are referenced to device
ground, unless otherwise noted.
Note 2: VOD and VOC are the changes in VOD and VOC, respectively, when DI changes state.
Note 3: Only one output shorted at a time.
Note 4: This input current is for the hot-swap enable (EN_, EN, EN) inputs and is present until the first transition only. After the first
transition, the input reverts to a standard high-impedance CMOS input with input current ILEAK.
DIFFERENTIAL OUTPUT VOLTAGE
vs. OUTPUT CURRENT
MAX3030E toc01
OUTPUT CURRENT (mA)
DIFFERENTIAL OUTPUT VOLTAGE (V)
906030
1
2
3
4
0
0 120
TA = 0°C
TA = +25°C
TA = +85°C
OUTPUT CURRENT
vs. TRANSMITTER OUTPUT LOW VOLTAGE
MAX3030E toc02
OUTPUT LOW VOLTAGE (V)
OUTPUT CURRENT (mA)
321
50
100
150
200
0
04
OUTPUT CURRENT
vs. TRANSMITTER OUTPUT HIGH VOLTAGE
MAX3030E toc03
OUTPUT HIGH VOLTAGE (V)
OUTPUT CURRENT (mA)
321
25
50
75
100
125
150
0
04
Typical Operating Characteristics
(VCC = +3.3V and TA= +25°C, unless otherwise noted.)
[MAXI/VI PK 4 if 7 7 7 / r I / aWV / J i \ J :/ «7v
MAX3030E–MAX3033E
±15kV ESD-Protected, 3.3V Quad
RS-422 Transmitters
_______________________________________________________________________________________ 5
SUPPLY CURRENT
vs. SUPPLY VOLTAGE
MAX3030E toc04
SUPPLY VOLTAGE (V)
SUPPLY CURRENT (µA)
321
20
40
60
80
100
0
04
DRIVERS ENABLED
TA = +85°C
TA = +25°C
TA = 0°C
MAX3030E/MAX3032E
SUPPLY CURRENT vs. DATA RATE
MAX3030E toc05
DATA RATE (bps)
SUPPLY CURRENT (mA)
10M1M100k10k1k
5
10
15
20
25
30
0
0.1k 100M
NO RESISTIVE LOAD, CL = 200pF,
ALL FOUR
TRANSMITTERS
SWITCHING
MAX3031E/MAX3033E
SUPPLY CURRENT vs. DATA RATE
MAX3030E toc06
DATA RATE (bps)
SUPPLY CURRENT (mA)
1M100k10k1k
0.5
1.0
1.5
2.0
2.5
0
0.1k 10M
NO RESISTIVE LOAD, CL = 200pF,
ALL FOUR
TRANSMITTERS
SWITCHING
MAX3030E/MAX3032E
SUPPLY CURRENT vs. DATA RATE
MAX3030E toc07
DATA RATE (bps)
SUPPLY CURRENT (mA)
10M1M100k10k1k
90
100
110
120
130
80
0.1k 100M
ALL FOUR TRANSMITTERS
LOADED AND SWITCHING
RL = 100, CL = 200pF
MAX3031E/MAX3033E
SUPPLY CURRENT vs. DATA RATE
MAX3030E toc08
DATA RATE (bps)
SUPPLY CURRENT (mA)
1M100k10k1k
91
94
97
100
88
0.1k 10M
ALL FOUR TRANSMITTERS
LOADED AND SWITCHING
RL = 100, CL = 200pF
MAX3030E
DRIVER PROPAGATION DELAY
(LOW TO HIGH)
MAX3030E toc09
10ns/div
DIFFERENTIA
L
OUTPUT
2V/div
DI_
1V/div
MAX3030E
DRIVER PROPAGATION DELAY
(HIGH TO LOW)
MAX3030E toc10
10ns/div
DIFFERENTIAL
OUTPUT
2V/div
DI_
1V/div
MAX3031E
DRIVER PROPAGATION DELAY
(LOW TO HIGH)
MAX3030E toc11
20ns/div
DIFFERENTIAL
OUTPUT
2V/div
DI_
1V/div
MAX3031E
DRIVER PROPAGATION DELAY
(HIGH TO LOW)
MAX3030E toc12
20ns/div
DIFFERENTIA
L
OUTPUT
2V/div
DI_
1V/div
Typical Operating Characteristics (continued)
(VCC = +3.3V and TA= +25°C, unless otherwise noted.)
[VI/JXIIVI
MAX3030E–MAX3033E
±15kV ESD-Protected, 3.3V Quad
RS-422 Transmitters
6 _______________________________________________________________________________________
Pin Description
ENABLE RESPONSE TIME
MAX3030E toc13
20ns/div
ENABLE
1V/div
DIFFERENTIAL
OUTPUT
2V/div
MAX3033E EYE DIAGRAM
MAX3030E toc14
100ns/div
DO_+
1V/div
DO_-
1V/div
Typical Operating Characteristics (continued)
(VCC = +3.3V and TA= +25°C, unless otherwise noted.)
PIN
MAX3030E/
MAX3031E
MAX3032E/
MAX3033E
NAME FUNCTION
1, 7, 9, 15 1, 7, 9, 15 DI1, DI2,
DI3, DI4
Transmitter Inputs. When the corresponding transmitter is enabled, a low on DI_ forces
the noninverting output low and inverting output high. Similarly, a high on DI_ forces
noninverting output high and inverting output low.
2, 6, 10, 14 2, 6, 10, 14 DO1+, DO2+,
DO3+, DO4+ Noninverting RS-422 Outputs
3, 5, 11, 13 3, 5, 11, 13 DO1-, DO2-,
DO3-, DO4- Inverting RS-422 Outputs
4EN
Transmitter Enable Input: Active HIGH. Drive EN HIGH to enable all transmitters. When
EN is HIGH, drive EN LOW to disable (three-state) all the transmitters. The transmitter
outputs are high impedance when disabled. EN is hot-swap protected (see the Hot
Swap section).
8 8 GND Ground
12 EN
Transmitter Enable Input: Active LOW. Drive EN LOW to enable all transmitters. When
EN is LOW, drive EN HIGH to disable all the transmitters. The transmitter outputs are
high impedance when disabled. EN is hot-swap protected (see the Hot Swap section).
4 EN1&2
Transmitter Enable Input for Channels 1 and 2. Drive EN1&2 HIGH to enable the
corresponding transmitters. Drive EN1&2 LOW to disable the corresponding
transmitters. The transmitter outputs are high impedance when disabled. EN1&2 is hot-
swap protected (see the Hot Swap section).
12 EN3&4
Transmitter Enable Input for Channels 3 and 4. Drive EN3&4 HIGH to enable the
corresponding transmitters. Drive EN3&4 LOW to disable the corresponding
transmitters. The transmitter outputs are high impedance when disabled. EN3&4 is hot-
swap protected (see the Hot Swap section).
16 16 VCC Positive Supply; +3V VCC +3.6V. Bypass VCC to GND with a 0.1µF capacitor.
MAX3030E–MAX3033E
±15kV ESD-Protected, 3.3V Quad
RS-422 Transmitters
_______________________________________________________________________________________ 7
Test Circuits and Timing Diagrams
DI_ VOD RLCL
CL
CL
DO_+
DO_-
Figure 2. Differential Driver Propagation Delay and Transition
Time Test Circuit
VOC
VOD
DI_+
DI_-
RL
2
RL
2
Figure 1. Differential Driver DC Test Circuit
OUTPUT
UNDER TEST CL
RL
VCC
S1
S2
ENABLE SIGNAL IS ONE OF THE POSSIBLE
ENABLE CONFIGURATIONS (SEE TRUTH TABLE).
Figure 4. Driver Enable/Disable Delays Test Circuit
DI
3V
0V
DO_-
DO_+
VO
0V
-VO
VO
1.5V 1.5V
tDPLH tDPHL
1/2 VO
10%
tR
90% 90%
1/2 VO
10%
tF
VDIFF = V (DO_+) - V (DO_-)
VDIFF
tSKEW = |tDPLH - tDPHL|
Figure 3. Differential Driver Propagation Delay and Transition
Waveform
OUTPUT NORMALLY LOW
OUTPUT NORMALLY HIGH
3V
0V
VOL
0V
1.5V 1.5V
1.5V
1.5V
EN
VOH
tDZL
tDZH
tDLZ
tDHZ
VOL + 0.3V
VOH - 0.3V
ENABLE SIGNAL IS ONE OF THE POSSIBLE
ENABLE CONFIGURATIONS (SEE TRUTH TABLE).
Figure 5. Driver Enable/Disable Waveform
DI
VCC
GND
A
A
DO_-
DO_+
Figure 6. Short-Circuit Measurements
[MAXI/III
MAX3030E–MAX3033E
Detailed Description
The MAX3030EMAX3033E are high-speed quad RS-
422 transmitters designed for digital data transmission
over balanced lines. They are designed to meet the
requirements of TIA/EIA-422-B and ITU-T V.11. The
MAX3030EMAX3033E are available in two pinouts to
be compatible with both the 26LS31 and SN75174
industry-standard devices. Both are offered in 20Mbps
and 2Mbps baud rate. All versions feature a low-static
current consumption (ICC < 100µA) that makes them
ideal for battery-powered and power-conscious appli-
cations. The 20Mbps version has a maximum propaga-
tion delay of 16ns and a part-to-part skew less than
5ns, allowing these devices to drive parallel data. The
2Mbps version is slew-rate-limited to reduce EMI and
reduce reflections caused by improperly terminated
cables.
Outputs have enhanced ESD protection providing
±15kV tolerance. All parts feature hot-swap capability
that eliminates false transitions on the data cable dur-
ing power-up or hot insertion.
±15kV ESD Protection
As with all Maxim devices, ESD-protection structures
are incorporated on all pins to protect against electro-
static discharges encountered during handling and
assembly. The driver outputs and receiver inputs have
extra protection against static electricity. Maxims engi-
neers developed state-of-the-art structures to protect
these pins against ESD of ±15kV without damage. The
ESD structures withstand high ESD in all states: normal
operation and power-down. After an ESD event, the
MAX3030EMAX3033E keep working without latchup.
ESD protection can be tested in various ways; the
transmitter outputs of this product family are character-
ized for protection to ±15kV using the Human Body
Model. Other ESD test methodologies include
IEC10004-2 Contact Discharge and IEC1000-4-2 Air-
Gap Discharge (formerly IEC801-2).
ESD Test Conditions
ESD performance depends on a variety of conditions.
Contact Maxim for a reliability report that documents
test setup, test methodology, and test results.
Human Body Model
Figure 8 shows the Human Body Model, and Figure 9
shows the current waveform it generates when dis-
charged into low impedance. This model consists of a
100pF capacitor charged to the ESD voltage of interest,
which is then discharged into the test device through a
1.5kresistor.
±15kV ESD-Protected, 3.3V Quad
RS-422 Transmitters
8 _______________________________________________________________________________________
DI
VCC
GND
A
A
DO_-
DO_+
Figure 7. Power-Off Measurements
Test Circuits and
Timing Diagrams (continued)
CHARGE-CURRENT-
LIMIT RESISTOR
DISCHARGE
RESISTANCE
STORAGE
CAPACITOR
Cs
100pF
RC
1M
RD
1.5k
HIGH-
VOLTAGE
DC
SOURCE
DEVICE
UNDER
TEST
Figure 8. Human Body ESD Test Model
IP 100%
90%
36.8%
tRL TIME
tDL
CURRENT WAVEFORM
PEAK-TO-PEAK RINGING
(NOT DRAWN TO SCALE)
Ir
10%
0
0
AMPS
Figure 9. Human Body Current Waveform
[MAXI/III
Machine Model
The Machine Model for ESD tests all pins using a
200pF storage capacitor and zero discharge resis-
tance. Its objective is to emulate the stress caused by
contact that occurs with handling and assembly during
manufacturing. Of course, all pins require this protec-
tion during manufacturing, not just inputs and outputs.
Therefore, after PC board assembly, the Machine
Model is less relevant to I/O ports.
Hot Swap
When circuit boards are plugged into a hot back-
plane, there can be disturbances to the differential sig-
nal levels that could be detected by receivers
connected to the transmission line. This erroneous data
could cause data errors to an RS-422 system. To avoid
this, the MAX3030EMAX3033E have hot-swap capa-
ble inputs.
When a circuit board is plugged into a hot backplane,
there is an interval during which the processor is going
through its power-up sequence. During this time, the
processors output drivers are high impedance and are
unable to drive the enable inputs of the MAX3030E
MAX3033E (EN, EN, EN_) to defined logic levels.
Leakage currents from these high-impedance drivers,
of as much as 10µA, could cause the enable inputs of
the MAX3030EMAX3033E to drift high or low.
Additionally, parasitic capacitance of the circuit board
could cause capacitive coupling of the enable inputs to
either GND or VCC. These factors could cause the
enable inputs of the MAX3030EMAX3033E to drift to
levels that may enable the transmitter outputs. To avoid
this problem, the hot-swap input provides a method of
holding the enable inputs of the MAX3030EMAX3033E
in the disabled state as VCC ramps up. This hot-swap
input is able to overcome the leakage currents and par-
asitic capacitances that can pull the enable inputs to
the enabled state.
Hot-Swap Input Circuitry
In the MAX3030EMAX3033E, the enable inputs feature
hot-swap capability. At the input there are two NMOS
devices, M1 and M2 (Figure 10). When VCC is ramping
up from zero, an internal 6µs timer turns on M2 and sets
the SR latch, which also turns on M1. Transistors M2, a
2mA current sink, and M1, a 100µA current sink, pull EN
to GND through a 5.6kresistor. M2 is designed to pull
the EN input to the disabled state against an external
parasitic capacitance of up to 100pF that is trying to
enable the EN input. After 6µs, the timer turns M2 off and
M1 remains on, holding the EN input low against three-
state output leakages that might enable EN. M1 remains
on until an external source overcomes the required input
current. At this time the SR latch resets and M1 turns off.
When M1 turns off, EN reverts to a standard, high-
impedance CMOS input. Whenever VCC drops below
1V, the hot-swap input is reset. The EN1&2 and EN3&4
input structures are identical to the EN input. For the EN
input, there is a complementary circuit employing two
PMOS devices pulling the EN input to VCC.
Hot-Swap Line Transient
The circuit of Figure 11 shows a typical offset termina-
tion used to guarantee a greater than 200mV offset
when a line is not driven. The 50pF capacitor repre-
MAX3030E–MAX3033E
±15kV ESD-Protected, 3.3V Quad
RS-422 Transmitters
_______________________________________________________________________________________ 9
EN DE
(HOT SWAP)
5.6k
TIMER
TIMER
VCC
6µs
M2M1
2mA
100µA
Figure 10. Simplified Structure of the Driver Enable Pin (EN)
VCC
DI_
(VCC OR GND)
3.3V
DO_+
DO_-
50pF0.1k
1k
1k
Figure 11. Differential Power-Up Glitch (Hot Swap)
[MAXI/III
MAX3030E–MAX3033E
sents the minimum parasitic capacitance that would
exist in a typical application. In most cases, more
capacitance exists in the system and reduces the mag-
nitude of the glitch. During a hot-swap event when the
driver is connected to the line and is powered up, the
driver must not cause the differential signal to drop
below 200mV (Figures 12 and 13).
Operation of Enable Pins
The MAX3030EMAX3033E family has two enable-func-
tional versions.
The MAX3030E/MAX3031E are compatible with
26LS31, where the two enable signals control all four
transmitters (global enable).
The MAX3032E/MAX3033E are compatible with the
SN75174. EN1&2 controls transmitters 1 and 2, and EN
3&4 controls transmitters 3 and 4 (dual enable).
Typical Applications
The MAX3030EMAX3033E offer optimum performance
when used with the MAX3094E/MAX3096 3.3V quad
differential line receivers. Figure 14 shows a typical RS-
422 connection for transmitting and receiving data.
±15kV ESD-Protected, 3.3V Quad
RS-422 Transmitters
10 ______________________________________________________________________________________
4µs/div
DO_+
DO_+ - DO_-
DO_-
VCC
1V/div
Figure 12. Differential Power-Up Glitch (0.1V/µs)
1.0µs/div
DO_+
DO_+ - DO_-
DO_-
VCC
1V/div
Figure 13. Differential Power-Up Glitch (1V/µs)
EN EN TX1 TX2 TX3 TX4 MODE
0 0 Active Active Active Active All transmitters active
0 1 High-Z High-Z High-Z High-Z All transmitters disabled
1 0 Active Active Active Active All transmitters active
1 1 Active Active Active Active All transmitters active
Table 1. MAX3030E/MAX3031E Transmitter Controls
EN1&2 EN3&4 TX1 TX2 TX3 TX4 MODE
0 0 High-Z High-Z High-Z High-Z All transmitters disabled
0 1 High-Z High-Z Active Active Tx 3 and 4 active
1 0 Active Active High-Z High-Z Tx 1 and 2 active
1 1 Active Active Active Active All transmitters active
Table 2. MAX3032E/MAX3033E Transmitter Controls
lVI/JXI Bflé “>rffi “Ya? *TU?’ [MAXI/III
MAX3030E–MAX3033E
±15kV ESD-Protected, 3.3V Quad
RS-422 Transmitters
______________________________________________________________________________________ 11
MAX3030E/MAX3031E MAX3094
RT
D1 R1 R1OUT
DI1
RT
D2 R2 R2OUT
DI2
RT
D3 R3 R3OUT
DI3
RT
D4 R4 R4OUT
DI4
EN
EN
G
G
VCC GND VCC GND
Figure 14. Typical Connection of a Quad Transmitter and Quad Receiver as a Pair
Q 23;? DDD D DD DD DD DD DD HY 2135f 9 M DDD D DD [MAXI/III
MAX3030E–MAX3033E
±15kV ESD-Protected, 3.3V Quad
RS-422 Transmitters
12 ______________________________________________________________________________________
MAX3030E/MAX3031E
DO1+
DO1-
DI1
EN
DO2+
DO2-
DI2
DO3+
DO3-
DI3
DO4+
DO4-
DI4
EN
VCC GND
Figure 15. MAX3030E/MAX3031E Functional Diagram
MAX3032E/MAX3033E
DO1+
DO1-
DI1
EN1&2
EN3&4
DO2+
DO2-
DI2
DO3+
DO3-
DI3
DO4+
DO4-
DI4
VCC GND
Figure 16. MAX3032E/MAX3033E Functional Diagram
Chip Information
TRANSISTOR COUNT: 1050
PROCESS: BiCMOS
TOP VIEW a“ 4H, JI FRONT VIEW 1M7 ‘l L SIDE VIEW NDYES: I. In: no NOT INCLUDE >4an rusn. 2. >4an msH 0R PROYRUSIONS NOT to EXCEED 0.15mm (.oos"). 3. LEADS m a: comm»: wImm (Lulmm (.um"). 4. CONYROLLING DIMENSION: MILLIMEIERS. 5. MEEYS JEDEC usmz. s. N = NUMBER or PINS. fig DALLAS immumul lVI/JXIlI/I HZ [VIAXIIVI
MAX3030E–MAX3033E
±15kV ESD-Protected, 3.3V Quad
RS-422 Transmitters
______________________________________________________________________________________ 13
SOICN .EPS
PACKAGE OUTLINE, .150" SOIC
1
1
21-0041 B
REV.DOCUMENT CONTROL NO.APPROVAL
PROPRIETARY INFORMATION
TITLE:
TOP VIEW
FRONT VIEW
MAX
0.010
0.069
0.019
0.157
0.010
INCHES
0.150
0.007
E
C
DIM
0.014
0.004
B
A1
MIN
0.053A
0.19
3.80 4.00
0.25
MILLIMETERS
0.10
0.35
1.35
MIN
0.49
0.25
MAX
1.75
0.050
0.016L0.40 1.27
0.3940.386D
D
MINDIM
D
INCHES
MAX
9.80 10.00
MILLIMETERS
MIN MAX
16 AC
0.337 0.344 AB8.758.55 14
0.189 0.197 AA5.004.80 8
N MS012
N
SIDE VIEW
H 0.2440.228 5.80 6.20
e 0.050 BSC 1.27 BSC
C
HE
eBA1
A
D
0-8
L
1
VARIATIONS:
Package Information
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,
go to www.maxim-ic.com/packages.)
CDMMEIN DIMENSIDNS MILLIM YERS INCHES a} A i H A. has [195 a]: 0:17 H“ z N SEE VARIATIDNS SEE VARIATIDNS n a we \ m ms \.177 a ma m nas use H sea \ 555 245 \ 25a L N 3:: 11mm A nsn \ am man page ( m mmm m mmm U’ E‘ U’ E‘ 1—*—x , fi_ k4 \ \ REA m: nm E n E mm “mm“: Mum N mmms mm: b MIN MAX. MIN MAX‘ DES m M?" 14 I] 6% 5m 19] am PARTING ‘ M? 16 11 4.9a 5.1!) 193 am 7 —[ y w 20 n m 790 303 311 L / d a At 23 u m m m m m m: Magi—14L pm A LEAD—[ml "mm 1 WWW: n m : nu w mun: am a w W m mmmm w m mm mm m m: ‘ a mum umsm me Ebaénkukéé [MAXI/III 4 MEEYS 4:112: uunm: MEHSE 5:: JEDEE vmmuns TABLE .mmmwmm 'N' REFER: m mm or LEADS m: mu up: HUS! u: wwm A spmnzu zuuz m1: rmmch mu: 1: nmm Ev wu mama. muss DNE FLANE IS w: swwa PLANE, ”5““ “”TL‘NE' “5”" ”W“ “m” mm [-c-n, m: mm PLANE Is u w: swzcmzn mgr/ms: rm [-c-n m m: mum mtwnamuumm (v ‘/ F 1 Warm wmcwzn MAXIM
MAX3030E–MAX3033E
±15kV ESD-Protected, 3.3V Quad
RS-422 Transmitters
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
14 ____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600
© 2002 Maxim Integrated Products Printed USA is a registered trademark of Maxim Integrated Products.
Package Information (continued)
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,
go to www.maxim-ic.com/packages.)
TSSOP4.40mm.EPS

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