WP7113VRCBC/A Datasheet by Kingbright

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© 2017 Kingbright. All Rights Reserved. Spec No: DSAK5139 / 1101028050 Rev No: V.3B Date: 08/19/2017 Page 1 / 5
DESCRIPTIONS
The source color devices are made with InGaN Light
Emitting Diode
Electrostatic discharge and power surge could
damage the LEDs
It is recommended to use a wrist band or
anti-electrostatic glove when handling the LEDs
All devices, equipments and machineries must be
electrically grounded
FEATURES
Low power consumption
Popular T-1 3/4 diameter package
General purpose leads
Reliable and rugged
Long life - solid state reliability
Available on tape and reel
RoHS compliant
APPLICATIONS
Status indicator
Illuminator
Signage applications
Decorative and entertainment lighting
Commercial and residential architectural lighting
ATTENTION
Observe precautions for handling
electrostatic discharge sensitive devices
PACKAGE DIMENSIONS
SELECTION GUIDE
Notes:
1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 of the optical peak value.
2. Luminous intensity / luminous flux: +/-15%.
3. Luminous intensity value is traceable to CIE127-2007 standards.
Part Number Emitting Color
(Material) Lens Type
Iv (mcd) @ 20mA [2] Viewing Angle [1]
Min. Typ. 2θ1/2
WP7113VRCBC/A Water Clear
Cyan (InGaN) 3800 7900 20°
WP7113VRCBC/A
T-1 3/4 (5mm) Solid State Lamp
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.25(0.01") unless otherwise noted.
3. Lead spacing is measured where the leads emerge from the package.
4. The specifications, characteristics and technical data described in the datasheet are subject to change
without prior notice.
Kl'ngbrl'ght
© 2017 Kingbright. All Rights Reserved. Spec No: DSAK5139 / 1101028050 Rev No: V.3B Date: 08/19/2017 Page 2 / 5
Parameter Symbol Value Unit
Power Dissipation PD 120 mW
Reverse Voltage VR 5 V
Junction Temperature Tj 100 °C
Operating Temperature Top -40 to +85 °C
Storage Temperature Tstg -40 to +85 °C
DC Forward Current IF 30 mA
Peak Forward Current IFM [1] 100 mA
Electrostatic Discharge Threshold (HBM) - 250 V
Lead Solder Temperature [2] 260°C For 3 Seconds
Lead Solder Temperature [3] 260°C For 5 Seconds
ABSOLUTE MAXIMUM RATINGS at TA=25°C
ELECTRICAL / OPTICAL CHARACTERISTICS at TA=25°C
Notes:
1. Measurement tolerance of the chromaticity coordinates is ± 0.02.
2. Forward voltage: ±0.1V.
3. Excess driving current and / or operating temperature higher than recommended conditions may result in severe light degradation or premature failure.
WP7113VRCBC/A
Parameter Symbol Emitting Color
Value
Unit
Typ. Max.
Chromaticity Coordinates x
IF = 20mA x [1] Cyan 0.19 - -
Chromaticity Coordinates y
IF = 20mA y [1] Cyan 0.37 - -
Capacitance C Cyan 100 - pF
Forward Voltage IF = 20mA VF [2] Cyan 3.3 4.0 V
Reverse Current (VR = 5V) IR Cyan - 50 uA
Notes:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
2. 2mm below package base.
3. 5mm below package base.
4. Relative humidity levels maintained between 40% and 60% in production area are recommended to avoid the build-up of static electricity – Ref JEDEC/JESD625-A and JEDEC/J-STD-033.
Kl'ngbrl'ght
© 2017 Kingbright. All Rights Reserved. Spec No: DSAK5139 / 1101028050 Rev No: V.3B Date: 08/19/2017 Page 3 / 5
0.5 0.50.0
-90°
-75°
-60°
-45°
-30°
-15°
75°
60°
45°
30°
15°
90°
1.0 1.0
T
a
= 25 °C
TECHNICAL DATA
SPATIAL DISTRIBUTION
0
10
20
30
40
50
2.0 2.4 2.8 3.2 3.6 4.0
T
a
= 25 °C
Forward voltage (V)
Forward current (mA)
0.0
0.5
1.0
1.5
2.0
2.5
0 1020304050
T
a
= 25 °C
Forward current (mA)
Luminous intensity normalised
at 20mA
0
10
20
30
40
50
-40-20 0 20406080100
Ambient temperature (°C)
Permissible forward current (mA)
0.0
0.5
1.0
1.5
2.0
2.5
-40-200 20406080100
Ambient temperature (°C)
Luminous intensity normalised
at T
a
= 25 °C
CYAN
Forward Current vs.
Forward Voltage
Luminous Intensity vs.
Forward Current
Forward Current Derating Curve Luminous Intensity vs.
Ambient Temperature
WP7113VRCBC/A
CIE CHROMATICITY DIAGRAM
Notes:
Shipment may contain more than one chromaticity regions.
Orders for single chromaticity region are generally not accepted.
Measurement tolerance of the chromaticity coordinates is ±0.02.
x y x y
CA1
0.2016 0.5221
CB1
0.1894 0.4206
0.1973 0.4868 0.1856 0.3897
0.2152 0.4744 0.2032 0.3794
0.2195 0.5089 0.2070 0.4097
CA2
0.1973 0.4868
CB2
0.1856 0.3897
0.1933 0.4530 0.1821 0.3601
0.2110 0.4413 0.1996 0.3505
0.2152 0.4744 0.2032 0.3794
CA3
0.1933 0.4530
CB3
0.1821 0.3601
0.1894 0.4206 0.1786 0.3318
0.2070 0.4097 0.1961 0.3228
0.2110 0.4413 0.1996 0.3505
CA
CB
0.3
0.4
0.5
0.6
0.1 0.2 0.3 0.4
x
y
CA1
CA2
CA3
CB1
CB2
CB3
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© 2017 Kingbright. All Rights Reserved. Spec No: DSAK5139 / 1101028050 Rev No: V.3B Date: 08/19/2017 Page 4 / 5
WP7113VRCBC/A
RECOMMENDED WAVE SOLDERING PROFILE
Notes:
1. Recommend pre-heat temperature of 105°C or less (as measured with a thermocouple
attached to the LED pins) prior to immersion in the solder wave with a maximum solder bath
temperature of 260°C
2. Peak wave soldering temperature between 245°C ~ 255°Cfor 3 sec (5 sec max).
3. Do not apply stress to the epoxy resin while the temperature is above 85°C.
4. Fixtures should not incur stress on the component when mounting and during soldering process.
5. SAC 305 solder alloy is recommended.
6. No more than one wave soldering pass.
PACKING & LABEL SPECIFICATIONS
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© 2017 Kingbright. All Rights Reserved. Spec No: DSAK5139 / 1101028050 Rev No: V.3B Date: 08/19/2017 Page 5 / 5
PRECAUTIONARY NOTES
1. The information included in this document reflects representative usage scenarios and is intended for technical reference only.
2. The part number, type, and specifications mentioned in this document are subject to future change and improvement without notice. Before production usage customer should refer to
the latest datasheet for the updated specifications.
3. When using the products referenced in this document, please make sure the product is being operated within the environmental and electrical limits specified in the datasheet. If
customer usage exceeds the specified limits, Kingbright will not be responsible for any subsequent issues.
4. The information in this document applies to typical usage in consumer electronics applications. If customer's application has special reliability requirements or have life-threatening
liabilities, such as automotive or medical usage, please consult with Kingbright representative for further assistance.
5. The contents and information of this document may not be reproduced or re-transmitted without permission by Kingbright.
6. All design applications should refer to Kingbright application notes available at http://www.KingbrightUSA.com/ApplicationNotes
PRECAUTIONS
Storage conditions
1. Avoid continued exposure to the condensing moisture environment and keep the product away from rapid transitions in ambient
temperature.
2. LEDs should be stored with temperature 30°C and relative humidity < 60%.
3. Product in the original sealed package is recommended to be assembled within 72 hours of opening.
Product in opened package for more than a week should be baked for 30 (+10/-0) hours at 85 ~ 100°C.
LED Mounting Method
1. The lead pitch of the LED must match the
pitch of the mounting holes on the PCB
during component placement.
Lead-forming may be required to insure
the lead pitch matches the hole pitch.
Refer to the figure below for proper lead
forming procedures.
Note 1-3: Do not route PCB trace in the contact area between the
leadframe and the PCB to prevent short-circuits.
"
"
Correct mounting method " x " Incorrect mounting method
2. When soldering wires to the LED, each wire joint should be separately insulated with heat-shrink tube to prevent short-circuit contact.
Do not bundle both wires in one heat shrink tube to avoid pinching the LED leads. Pinching stress on the LED leads may damage the
internal structures and cause failure.
3. Use stand-offs (Fig.1) or spacers (Fig.2) to securely position the LED above the PCB.
4. Maintain a minimum of 3mm clearance between the base of the LED lens and the first lead
bend (Fig. 3 ,Fig. 4).
5. During lead forming, use tools or jigs to hold the leads securely so that the bending force
will not be transmitted to the LED lens and its internal structures. Do not perform lead
forming once the component has been mounted onto the PCB. (Fig. 5 )
Lead Forming Procedures
1. Do not bend the leads more than twice. (Fig. 6 )
2. During soldering, component covers and holders should leave
clearance to avoid placing damaging stress on the LED during
soldering. (Fig. 7)
3. The tip of the soldering iron should never touch the lens epoxy.
4. Through-hole LEDs are incompatible with reflow soldering.
5. If the LED will undergo multiple soldering passes or face other
processes where the part may be subjected to intense heat,
please check with Kingbright for compatibility.
WP7113VRCBC/A