MLCC Standard Catalog Datasheet by Taiyo Yuden

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TAIYD YUDEN 2012
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Notice for TAIYO YUDEN products 
Please read this notice before using the TAIYO YUDEN products.
REMINDERS
Product information in this catalog is as of October 2011. All of the contents specified herein are subject to change
without notice due to technical improvements, etc. Therefore, please check for the latest information carefully be-
fore practical application or usage of the Products.
Please note that Taiyo Yuden Co., Ltd. shall not be responsible for any defects in products or equipment incorpo-
rating such products, which are caused under the conditions other than those specified in this catalog or individual
specification.
Please contact Taiyo Yuden Co., Ltd. for further details of product specifications as the individual specification is
available.
Please conduct validation and verification of products in actual condition of mounting and operating environment
before commercial shipment of the equipment.
All electronic components or functional modules listed in this catalog are developed, designed and intended for
use in general electronics equipment.(for AV, office automation, household, office supply, information service,
telecommunications, (such as mobile phone or PC) etc.). Before incorporating the components or devices into any
equipment in the field such as transportation,( automotive control, train control, ship control), transportation signal,
disaster prevention, medical, public information network (telephone exchange, base station) etc. which may have
direct influence to harm or injure a human body, please contact Taiyo Yuden Co., Ltd. for more detail in advance.
Do not incorporate the products into any equipment in fields such as aerospace, aviation, nuclear control, subma-
rine system, military, etc. where higher safety and reliability are especially required.
In addition, even electronic components or functional modules that are used for the general electronic equipment,
if the equipment or the electric circuit require high safety or reliability function or performances, a sufficient reliabil-
ity evaluation check for safety shall be performed before commercial shipment and moreover, due consideration to
install a protective circuit is strongly recommended at customer's design stage.
The contents of this catalog are applicable to the products which are purchased from our sales offices or distribu-
tors (so called TAIYO YUDENs official sales channel).
It is only applicable to the products purchased from any of TAIYO YUDEN s official sales channel.
Please note that Taiyo Yuden Co., Ltd. shall have no responsibility for any controversies or disputes that may oc-
cur in connection with a third party's intellectual property rights and other related rights arising from your usage of
products in this catalog. Taiyo Yuden Co., Ltd. grants no license for such rights.
Caution for export
Certain items in this catalog may require specific procedures for export according to Foreign Exchange and For-
eign Trade Control Law of Japan, U.S. Export Administration Regulations, and other applicable regulations.
Should you have any question or inquiry on this matter, please contact our sales staff.
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mlcc02_e-01
FEATURES
PART NUMBER
STANDARD EXTERNAL DIMENSIONS/STANDARD QUANTITY
AVAILABLE CAPACITANCE RANGE
APPLICATIONS
This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
◦Improved higher density mounting.
◦Monolithic structure provides higher reliability.
A wide range of capacitance values available in standard case sizes.
◦General electronic equipment
◦Communication equipment
cellular phone, wireless applications, etc.
STANDARD MULTILAYER CERAMIC CAPACITORS
TEMPERATURE COMPENSATING TYPE
Rated voltage
VDC
E 16
T 25
U 50
Thicknessmm
C,D 0.2
T 0.3
V, W 0.5
Special code
Standard
Internal code
Standard
Blank space
Nominal capacitancepF
example
0R5 0.5
010 1
100 10
Rdecimal point
Dimension tolerance
Standard
Blank space
Series name
MMultilayer ceramic
capacitor
End termination
K Plated
Capacitance
tolerance
C±0.25pF
D±0.5pF
F±1pF
J±5%
K±10%
Packaging
Fφ178mm Taping
2mm pitch
Wφ178mm Taping
1mm pitch, 042 Type
REFLOW
Temperature characteristicsppm/
C0 CHCJCK
Tolerance
H±60
J±120
K±250
R220 RH
S330 SHSJSK
T470 TJTK
U750 UJUK
SL3501000
□=Tolerance
Cap
pF
Type 042 063 105
CCUCUSL RST
VDC 16V 50V 25V 50V
3-digit
0.5 0R5
1 010
1.5 1R5
2 020
3 030
4 040
5 050
6 060
7 070
8 080
9 090
10 100
12 120
15 150
18 180
22 220
27 270
33 330
39 390
47 470
56 560
68 680
82 820
100 101
120 121
150 151
180 181
220 221
270 271
330 331
390 391
470 471
560 561
680 681
820 821
1000 102
Note: Letters in the table indicate thickness.
D
T
C
T
V
V
WW
W
V
U M K 1 0 5 C H 1 0 1 J V F
❶ ❷ ❸ ❽ ❾ ❿ ⓫ ⓬
Dimension
Type inchL×Wmm
042010050.4×0.2
063 02010.6×0.3
105 04021.0×0.5
Type Dimension [mm] Standard quantity [pcs]
L W T e Paper tape Embossed tape
MK042
01005 inch0.4±0.02 0.2±0.02 0.2±0.02 C,D 0.1±0.03 40000
MK063
0201 inch0.6±0.03 0.3±0.03 0.3±0.03 T 0.15±0.05 15000
MK105
0402 inch1.0±0.05 0.5±0.05 0.5±0.05 V,W 0.25±0.10 10000
TAIYD YUDEN 2012
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CAPACITORS
mlcc02_e-01
REPRESENTATIVE PART NUMBERS
This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
042TYPE
063TYPE
Class1 C characteristic
Class1 C characteristic
Class1 U characteristic
Rated
voltage Part number 1 Part number 2 Temp.
char.
Capacitance
pF
Capacitance
tolerance
QThickness
mm
Soldering
R:Reflow
W:Wave
HALT Internal
code
P/N 1
Note
% Rated
voltage
16V EMK042 CK0R5CD CK 0.5 ±0.25pF 410 0.2±0.02 R 200%
EMK042 CK010CD CK 1 ±0.25pF 420 0.2±0.02 R 200%
EMK042 CK1R5CD CK 1.5 ±0.25pF 430 0.2±0.02 R 200%
EMK042 CK020CD CK 2 ±0.25pF 440 0.2±0.02 R 200%
EMK042 CJ030CD CJ 3 ±0.25pF 460 0.2±0.02 R 200%
EMK042 CH040CD CH 4 ±0.25pF 480 0.2±0.02 R 200%
EMK042 CH050CD CH 5 ±0.25pF 500 0.2±0.02 R 200%
EMK042 CH060DD CH 6 ±0.5pF 520 0.2±0.02 R 200%
EMK042 CH070DD CH 7 ±0.5pF 540 0.2±0.02 R 200%
EMK042 CH080DD CH 8 ±0.5pF 560 0.2±0.02 R 200%
EMK042 CH090DD CH 9 ±0.5pF 580 0.2±0.02 R 200%
EMK042 CH100DD CH 10±0.5pF 600 0.2±0.02 R 200%
EMK042 CH120JD CH 12±5% 640 0.2±0.02 R 200%
EMK042 CH150JD CH 15±5% 700 0.2±0.02 R 200%
EMK042 CH180JC CH 18±5% 760 0.2±0.02 R 200%
EMK042 CH220JC CH 22±5% 840 0.2±0.02 R 200%
EMK042 CH270JC CH 27±5% 940 0.2±0.02 R 200%
EMK042 CH330JC CH 33±5% 1000 0.2±0.02 R 200%
EMK042 CH390JC CH 39±5% 1000 0.2±0.02 R 200%
EMK042 CH470JC CH 47±5% 1000 0.2±0.02 R 200%
EMK042 CH560JC CH 56±5% 1000 0.2±0.02 R 200%
EMK042 CH680JC CH 68±5% 1000 0.2±0.02 R 200%
EMK042 CH820JC CH 82±5% 1000 0.2±0.02 R 200%
EMK042 CH101JC CH 100 ±5% 1000 0.2±0.02 R 200%
Note: Please contact Taiyo Yuden sales channels about items (capacitance and tolerance) other than listed above.
Rated
voltage Part number 1 Part number 2 Temp.
char.
Capacitance
pF
Capacitance
tolerance
QThickness
mm
Soldering
R:Reflow
W:Wave
HALT Internal
code
P/N 1
Note
% Rated
voltage
50V UMK063 CK0R5CT CK 0.5 ±0.25pF 410 0.3±0.03 R 200%
UMK063 CK010CT CK 1 ±0.25pF 420 0.3±0.03 R 200%
UMK063 CK1R5CT CK 1.5 ±0.25pF 430 0.3±0.03 R 200%
UMK063 CK020CT CK 2 ±0.25pF 440 0.3±0.03 R 200%
UMK063 CJ030CT CJ 3 ±0.25pF 460 0.3±0.03 R 200%
UMK063 CH040CT CH 4 ±0.25pF 480 0.3±0.03 R 200%
UMK063 CH050CT CH 5 ±0.25pF 500 0.3±0.03 R 200%
UMK063 CH060DT CH 6 ±0.5pF 520 0.3±0.03 R 200%
UMK063 CH070DT CH 7 ±0.5pF 540 0.3±0.03 R 200%
UMK063 CH080DT CH 8 ±0.5pF 560 0.3±0.03 R 200%
UMK063 CH090DT CH 9 ±0.5pF 580 0.3±0.03 R 200%
UMK063 CH100DT CH 10±0.5pF 600 0.3±0.03 R 200%
UMK063 CH120JT CH 12±5% 640 0.3±0.03 R 200%
UMK063 CH150JT CH 15±5% 700 0.3±0.03 R 200%
UMK063 CH180JT CH 18±5% 760 0.3±0.03 R 200%
UMK063 CH220JT CH 22±5% 840 0.3±0.03 R 200%
UMK063 CH270JT CH 27±5% 940 0.3±0.03 R 200%
UMK063 CH330JT CH 33±5% 1000 0.3±0.03 R 200%
UMK063 CH390JT CH 39±5% 1000 0.3±0.03 R 200%
UMK063 CH470JT CH 47±5% 1000 0.3±0.03 R 200%
UMK063 CH560JT CH 56±5% 1000 0.3±0.03 R 200%
UMK063 CH680JT CH 68±5% 1000 0.3±0.03 R 200%
UMK063 CH820JT CH 82±5% 1000 0.3±0.03 R 200%
UMK063 CH101JT CH 100 ±5% 1000 0.3±0.03 R 200%
Note: Please contact Taiyo Yuden sales channels about items (capacitance and tolerance) other than listed above.
Rated
voltage Part number 1 Part number 2 Temp.
char.
Capacitance
pF
Capacitance
tolerance
QThickness
mm
Soldering
R:Reflow
W:Wave
HALT Internal
code
P/N 1
Note
% Rated
voltage
25V TMK063 UK0R5CT UK 0.5 ±0.25pF 410 0.3±0.03 R 200%
MK063 UK010CT UK 1 ±0.25pF 420 0.3±0.03 R 200%
MK063 UK1R5CT UK 1.5 ±0.25pF 430 0.3±0.03 R 200%
MK063 UK020CT UK 2 ±0.25pF 440 0.3±0.03 R 200%
MK063 UK030CT UK 3 ±0.25pF 460 0.3±0.03 R 200%
TMK063 UJ040CT UJ 4 ±0.25pF 480 0.3±0.03 R 200%
TMK063 UJ050CT UJ 5 ±0.25pF 500 0.3±0.03 R 200%
TMK063 UJ060DT UJ 6 ±0.5pF 520 0.3±0.03 R 200%
TMK063 UJ070DT UJ 7 ±0.5pF 540 0.3±0.03 R 200%
TMK063 UJ080DT UJ 8 ±0.5pF 560 0.3±0.03 R 200%
TMK063 UJ090DT UJ 9 ±0.5pF 580 0.3±0.03 R 200%
TMK063 UJ100DT UJ 10±0.5pF 600 0.3±0.03 R 200%
TMK063 UJ120JT UJ 12±5% 640 0.3±0.03 R 200%
TMK063 UJ150JT UJ 15±5% 700 0.3±0.03 R 200%
Note: Please contact Taiyo Yuden sales channels about items (capacitance and tolerance) other than listed above.
TAIYD YUDEN 2012
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mlcc02_e-01
REPRESENTATIVE PART NUMBERS
This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
105TYPE
Class1 C characteristic
Class1 U characteristic
Rated
voltage Part number 1 Part number 2 Temp.
char.
Capacitance
pF
Capacitance
tolerance
QThickness
mm
Soldering
R:Reflow
W:Wave
HALT Internal
code
P/N 1
Note
% Rated
voltage
50V UMK105 CK0R5CV CK 0.5 ±0.25pF 410 0.5±0.05 R 200%
UMK105 CK010CV CK 1 ±0.25pF 420 0.5±0.05 R 200%
UMK105 CK1R5CV CK 1.5 ±0.25pF 430 0.5±0.05 R 200%
UMK105 CK020CV CK 2 ±0.25pF 440 0.5±0.05 R 200%
UMK105 CJ030CV CJ 3 ±0.25pF 460 0.5±0.05 R 200%
UMK105 CH040CV CH 4 ±0.25pF 480 0.5±0.05 R 200%
UMK105 CH050CV CH 5 ±0.25pF 500 0.5±0.05 R 200%
UMK105 CH060DV CH 6 ±0.5pF 520 0.5±0.05 R 200%
UMK105 CH070DV CH 7 ±0.5pF 540 0.5±0.05 R 200%
UMK105 CH080DV CH 8 ±0.5pF 560 0.5±0.05 R 200%
UMK105 CH090DV CH 9 ±0.5pF 580 0.5±0.05 R 200%
UMK105 CH100DV CH 10±0.5pF 600 0.5±0.05 R 200%
UMK105 CH120JV CH 12±5% 640 0.5±0.05 R 200%
UMK105 CH150JV CH 15±5% 700 0.5±0.05 R 200%
UMK105 CH180JV CH 18±5% 760 0.5±0.05 R 200%
UMK105 CH220JV CH 22±5% 840 0.5±0.05 R 200%
UMK105 CH270JV CH 27±5% 940 0.5±0.05 R 200%
UMK105 CH330JV CH 33±5% 1000 0.5±0.05 R 200%
UMK105 CH390JV CH 39±5% 1000 0.5±0.05 R 200%
UMK105 CH470JV CH 47±5% 1000 0.5±0.05 R 200%
UMK105 CH560JV CH 56±5% 1000 0.5±0.05 R 200%
UMK105 CH680JV CH 68±5% 1000 0.5±0.05 R 200%
UMK105 CH820JV CH 82±5% 1000 0.5±0.05 R 200%
UMK105 CH101JV CH 100 ±5% 1000 0.5±0.05 R 200%
UMK105 CH121JV CH 120 ±5% 1000 0.5±0.05 R 200%
UMK105 CH151JV CH 150 ±5% 1000 0.5±0.05 R 200%
UMK105 CH181JV CH 180 ±5% 1000 0.5±0.05 R 200%
UMK105 CH221JV CH 220 ±5% 1000 0.5±0.05 R 200%
UMK105 CH271JV CH 270 ±5% 1000 0.5±0.05 R 200%
UMK105 CH331JV CH 330 ±5% 1000 0.5±0.05 R 200%
Note: Please contact Taiyo Yuden sales channels about items (capacitance and tolerance) other than listed above.
Rated
voltage Part number 1 Part number 2 Temp.
char.
Capacitance
pF
Capacitance
tolerance
QThickness
mm
Soldering
R:Reflow
W:Wave
HALT Internal
code
P/N 1
Note
% Rated
voltage
50V UMK105 UK0R5CV UK 0.5 ±0.25pF 410 0.5±0.05 R 200%
UMK105 UK010CV UK 1 ±0.25pF 420 0.5±0.05 R 200%
UMK105 UK1R5CV UK 1.5 ±0.25pF 430 0.5±0.05 R 200%
UMK105 UK020CV UK 2 ±0.25pF 440 0.5±0.05 R 200%
UMK105 UK030CV UK 3 ±0.25pF 460 0.5±0.05 R 200%
UMK105 UJ040CV UJ 4 ±0.25pF 480 0.5±0.05 R 200%
UMK105 UJ050CV UJ 5 ±0.25pF 500 0.5±0.05 R 200%
UMK105 UJ060DV UJ 6 ±0.5pF 520 0.5±0.05 R 200%
UMK105 UJ070DV UJ 7 ±0.5pF 540 0.5±0.05 R 200%
UMK105 UJ080DV UJ 8 ±0.5pF 560 0.5±0.05 R 200%
UMK105 UJ090DV UJ 9 ±0.5pF 580 0.5±0.05 R 200%
UMK105 UJ100DV UJ 10±0.5pF 600 0.5±0.05 R 200%
UMK105 UJ120JV UJ 12±5% 640 0.5±0.05 R 200%
UMK105 UJ150JV UJ 15±5% 700 0.5±0.05 R 200%
UMK105 UJ180JV UJ 18±5% 760 0.5±0.05 R 200%
UMK105 UJ220JV UJ 22±5% 840 0.5±0.05 R 200%
UMK105 UJ270JV UJ 27±5% 940 0.5±0.05 R 200%
UMK105 UJ330JV UJ 33±5% 1000 0.5±0.05 R 200%
UMK105 UJ390JV UJ 39±5% 1000 0.5±0.05 R 200%
UMK105 UJ470JV UJ 47±5% 1000 0.5±0.05 R 200%
UMK105 UJ560JV UJ 56±5% 1000 0.5±0.05 R 200%
UMK105 UJ680JV UJ 68±5% 1000 0.5±0.05 R 200%
UMK105 UJ820JV UJ 82±5% 1000 0.5±0.05 R 200%
UMK105 UJ101JV UJ 100 ±5% 1000 0.5±0.05 R 200%
UMK105 UJ121JV UJ 120 ±5% 1000 0.5±0.05 R 200%
UMK105 UJ151JV UJ 150 ±5% 1000 0.5±0.05 R 200%
UMK105 UJ181JV UJ 180 ±5% 1000 0.5±0.05 R 200%
UMK105 UJ221JV UJ 220 ±5% 1000 0.5±0.05 R 200%
UMK105 UJ271JV UJ 270 ±5% 1000 0.5±0.05 R 200%
UMK105 UJ331JV UJ 330 ±5% 1000 0.5±0.05 R 200%
Note: Please contact Taiyo Yuden sales channels about items (capacitance and tolerance) other than listed above.
TAIYD YUDEN 2012
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CAPACITORS
mlcc02_e-01
REPRESENTATIVE PART NUMBERS
This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
Class1 SL characteristic
Class1 RH characteristic
Class1 S characteristic
Class1 T characteristic
Rated
voltage Part number 1 Part number 2 Temp.
char.
Capacitance
pF
Capacitance
tolerance
QThickness
mm
Soldering
R:Reflow
W:Wave
HALT Internal
code
P/N 1
Note
% Rated
voltage
50V UMK105 SL121JV SL 120 ±5% 1000 0.5±0.05 R 200%
UMK105 SL151JV SL 150 ±5% 1000 0.5±0.05 R 200%
UMK105 SL181JV SL 180 ±5% 1000 0.5±0.05 R 200%
UMK105 SL221JV SL 220 ±5% 1000 0.5±0.05 R 200%
UMK105 SL271JV SL 270 ±5% 1000 0.5±0.05 R 200%
UMK105 SL331JV SL 330 ±5% 1000 0.5±0.05 R 200%
Note: Please contact Taiyo Yuden sales channels about items (capacitance and tolerance) other than listed above.
Rated
voltage Part number 1 Part number 2 Temp.
char.
Capacitance
pF
Capacitance
tolerance
QThickness
mm
Soldering
R:Reflow
W:Wave
HALT Internal
code
P/N 1
Note
% Rated
voltage
50V UMK105 RH5R6JW RH 5.6 ±5% 512 0.5±0.05 R 200%
UMK105 RH6R8JW RH 6.8 ±5% 536 0.5±0.05 R 200%
UMK105 RH8R2JW RH 8.2 ±5% 564 0.5±0.05 R 200%
UMK105 RH100JW RH 10±5% 600 0.5±0.05 R 200%
UMK105 RH120JW RH 12±5% 640 0.5±0.05 R 200%
UMK105 RH150JW RH 15±5% 700 0.5±0.05 R 200%
UMK105 RH180JW RH 18±5% 760 0.5±0.05 R 200%
UMK105 RH200JW RH 20±5% 800 0.5±0.05 R 200%
Note: Please contact Taiyo Yuden sales channels about items (capacitance and tolerance) other than listed above.
Rated
voltage Part number 1 Part number 2 Temp.
char.
Capacitance
pF
Capacitance
tolerance
QThickness
mm
Soldering
R:Reflow
W:Wave
HALT Internal
code
P/N 1
Note
% Rated
voltage
50V UMK105 SK0R5BW SK 0.5 ±0.1pF 410 0.5±0.05 R 200%
UMK105 SK010BW SK 1 ±0.1pF 420 0.5±0.05 R 200%
UMK105 SK1R2BW SK 1.2 ±0.1pF 424 0.5±0.05 R 200%
UMK105 SK1R5BW SK 1.5 ±0.1pF 430 0.5±0.05 R 200%
UMK105 SK1R8BW SK 1.8 ±0.1pF 436 0.5±0.05 R 200%
UMK105 SK2R2JW SK 2.2 ±5% 444 0.5±0.05 R 200%
UMK105 SK2R7JW SK 2.7 ±5% 454 0.5±0.05 R 200%
UMK105 SJ3R3JW SJ 3.3 ±5% 466 0.5±0.05 R 200%
UMK105 SJ3R9JW SJ 3.9 ±5% 478 0.5±0.05 R 200%
UMK105 SH4R7JW SH 4.7 ±5% 494 0.5±0.05 R 200%
UMK105 SH5R6JW SH 5.6 ±5% 512 0.5±0.05 R 200%
UMK105 SH6R8JW SH 6.8 ±5% 536 0.5±0.05 R 200%
UMK105 SH8R2JW SH 8.2 ±5% 564 0.5±0.05 R 200%
UMK105 SH100JW SH 10±5% 600 0.5±0.05 R 200%
UMK105 SH120JW SH 12±5% 640 0.5±0.05 R 200%
UMK105 SH150JW SH 15±5% 700 0.5±0.05 R 200%
UMK105 SH180JW SH 18±5% 760 0.5±0.05 R 200%
UMK105 SH200JW SH 20±5% 800 0.5±0.05 R 200%
Note: Please contact Taiyo Yuden sales channels about items (capacitance and tolerance) other than listed above.
Rated
voltage Part number 1 Part number 2 Temp.
char.
Capacitance
pF
Capacitance
tolerance
QThickness
mm
Soldering
R:Reflow
W:Wave
HALT Internal
code
P/N 1
Note
% Rated
voltage
50V UMK105 TK0R5BW TK 0.5 ±0.1pF 410 0.5±0.05 R 200%
UMK105 TK010BW TK 1 ±0.1pF 420 0.5±0.05 R 200%
UMK105 TK1R2BW TK 1.2 ±0.1pF 424 0.5±0.05 R 200%
UMK105 TK1R5BW TK 1.5 ±0.1pF 430 0.5±0.05 R 200%
UMK105 TK1R8BW TK 1.8 ±0.1pF 436 0.5±0.05 R 200%
UMK105 TK2R2JW TK 2.2 ±5% 444 0.5±0.05 R 200%
UMK105 TK2R7JW TK 2.7 ±5% 454 0.5±0.05 R 200%
UMK105 TK3R3JW TK 3.3 ±5% 466 0.5±0.05 R 200%
UMK105 TK3R9JW TK 3.9 ±5% 478 0.5±0.05 R 200%
UMK105 TJ4R7JW TJ 4.7 ±5% 494 0.5±0.05 R 200%
UMK105 TJ5R6JW TJ 5.6 ±5% 512 0.5±0.05 R 200%
UMK105 TJ6R8JW TJ 6.8 ±5% 536 0.5±0.05 R 200%
UMK105 TJ8R2JW TJ 8.2 ±5% 564 0.5±0.05 R 200%
UMK105 TJ100JW TJ 10±5% 600 0.5±0.05 R 200%
UMK105 TJ120JW TJ 12±5% 640 0.5±0.05 R 200%
UMK105 TJ150JW TJ 15±5% 700 0.5±0.05 R 200%
UMK105 TJ180JW TJ 18±5% 760 0.5±0.05 R 200%
UMK105 TJ200JW TJ 20±5% 800 0.5±0.05 R 200%
Note: Please contact Taiyo Yuden sales channels about items (capacitance and tolerance) other than listed above.
Top Iape OOOOO — cm DEE fl 3%: E fip: ‘ F 25:50: “HIM ‘ Q? swam m sta‘ \TP 95/ ,gfl / f5 352065 ”:5: , zazans 50:0‘ TAIYD YUDEN 2012
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mlcc_pack-P1 mlcc_pack_e-01
PACKAGING
This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
Taped package
Minimum Quantity
Taping material
No bottom tape for pressed carrier tape
Representative taping dimensions
 ◦Paper Tape8mm wide
 Pressed carrier tape 2mm pitch
T1
0.1/−0
Paper tape
Embossed tape Type Chip Cavity Insertion Pitch Tape Thickness
A B F T
MK107
WK107 1.0 1.8
4.0±0.1
1.1max.
2K110 1.15 1.55 1.0max.
MK212
WK212 1.65 2.4 1.1max.4K212
2K212
MK316 2.0 3.6
Type Chip Cavity Insertion Pitch Tape Thickness
A B F T
2K096 0.72 1.02
52.0±0.05
0.6max.
MK105
VK105 0.65 1.15 0.8max.
0.1/−0
Punched carrier tape 4mm pitch
NoteTaping size might be different depending on the size of the product.
Punched carrier tape 2mm pitch
Chip filled
Type
Thickness Standard quantity [pcs]
mm code Paper tape Embossed
tape
MK042
0.2 C,D 40000
MK063 0.3 P,T 15000
2K096 0.3 P
100000.45 K
WK105 0.3 P
MK105
0.2 C 20000
0.3 P 15000
0.5 V, W 10000
VK105 0.5 W
MK107
WK107
0.45 K 4000
0.5 V 4000
0.8 A
4000
2K110
0.5 V
0.6 B
0.8 A
MK212
WK212
0.45 K
0.85 D
1.25 G 3000
4K212 0.85 D
4000 2K212 0.85 D
MK316
0.85 D
1.15 F
3000
1.25 G
1.6 L
2000
MK325
0.85 D
1.15 F
1.9 N
2.0max Y
2.5 M
500T, 1000P
MK432 2.5 M 500
Unitmm
Unitmm
Unitmm
Type Chip Cavity
Insertion Pitch
Tape Thickness
A B T1
MK063 0.37 0.67
2.0±0.05
0.45max. 0.42max.2K096 0.65 1.02
WK105
0.65 1.15MK105*1C0.4max. 0.3max.
MK105*1P0.45max. 0.42max.
*1 Thickness, C0.2mmP0.3mm
B‘ank unmon Cm: cavmy H‘ank Damon 59mm m _ , ‘ \ / 5% am? — Swank-2| m ‘ 5 fifim \mm Top Covev live 1, o~20‘ / —.fi Emu mac Sheer 5mm 1.2:: 7: Cnnnenmg Pun Linn:an W \ffi TI PMS :vs TAIYD YUDEN 2012
1
2
mlcc_pack-P2
mlcc_pack_e-01
PACKAGING
This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
Embossed tape8mm wide
Embossed tape12mm wide
Type Chip Cavity
Insertion Pitch
Tape Thickness
A B F K T
WK107 1.0 1.8
4.0±0.1
1.3max 0.25±0.1
MK212 1.65 2.4
3.4max. 0.6max.MK316 2.0 3.6
MK325 2.8 3.6
Trailer and Leader
Trailer 160mm min.
Leader 400mm min.
100mm or more
Reel size
Top Tape Strength
The top tape requires a peel-off force of 0.1 to 0.7N in the direction of the arrow
as illustrated below.
The exchange of individual specification is necessary.
Please contact Taiyo Yuden sales channels.
0.1/−0
0.1/−0
2.0±0.1
F
360/0.2
110±0.7
12±0.1
0.2/0
0/0.2
12.0±0.1
8.8±0.1
6.8±0.1
1.00/0.1 2.00/0.1 1.50.1/0
Unitmm
Bulk Cassette
1.0±0.02
0.8±0.04 0.9±0.05
1.8±0.02
4.0±0.05
2.0±0.04
Embossed tape4mm wide
Type Chip Cavity
Insertion Pitch
Tape Thickness
A B F K T
MK042 0.23 0.43 1.0±0.02 0.5max. 0.25max.
A B C
φ178±2.0 φ50min.
φ13.0±0.2
D E R
φ21.0±0.8 2.0±0.5
1.0
t W
4mm wide tape 1.5max.
5±1.0
8mm wide tape 2.5max.
10±1.5
12mm wide tape 2.5max.
14±1.5
Unitmm
Unitmm
Unitmm
Type Chip Cavity
Insertion Pitch
Tape Thickness
A B F K T
MK432 3.7 4.9 8.0±0.1 4.0max. 0.6max.
Unitmm
E
W
C
RDB
t
A
E
W
C
RDB
t
A
TAIYD YUDEN 2012
1
2
mlcc_reli-R1 mlcc_reli_e-01
RELIABILITY DATA
This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
7. Q or Dissipation Factor
Specified
Value
Temperature Compensating
Class 1
Standard C30 pFQ40020CC30 pFQ1000 CNominal capacitance
High Frequency Type Refer to detailed specification
High PermittivityClass 2 Note 1 BJ, B7, C6,C72.5 max., F7 max.
Test Methods and Remarks
High Frequency Type
Measuring equipment: HP4291A
Measuring jig: HP16192A
Class 1 Class 2
Standard High Frequency Type C10μF C10μF
Preconditioning None Thermal treatment at 150 for 1hr Note 2
Measuring frequency 1Hz±101GHz 1Hz±10120±10Hz
Measuring voltage Note 1 0.5 to 5Vrms 1±0.2Vrms 0.5±0.1Vrms
Bias application None
6. Capacitance Tolerance
Specified
Value
Temperature Compensating
Class 1
Standard C
U
0.5pFC5pF±0.25pF
0.5pF<C10pF±0.5pF
C10pF±5%  
RH
S
T
0.5pFC2pF±0.1pF
C2pF±5%
High Frequency Type CH
RH
0.5pFC2pF±0.1pF
C2pF±5%
High Permittivity Class 2BJ, B7, C6,C7±10 or ±20, F2080
Test Methods and Remarks
Class 1 Class 2
Standard High Frequency Type C10μF C10μF
Preconditioning None Thermal treatment at 150 for 1hr Note 2
Measuring frequency 1Hz±101Hz±10120±10Hz
Measuring voltage Note 1 0.5 to 5Vrms 1±0.2Vrms 0.5±0.1Vrms
Bias application None
5. Insulation Resistance
Specified
Value
Temperature Compensating
Class 1
Standard 10000 MΩ min.
High Frequency Type
High Permittivity Class 2 Note 1C0.047μF : 10000 MΩ min.
C0.047μF : 500MΩμF
Test Methods and Remarks
Applied voltage: Rated voltage
Duration: 60±5 sec.
Charge/discharge current: 50mA max.
4. Withstanding VoltageBetween terminals
Specified
Value
Temperature Compensating
Class 1
Standard
No breakdown or damage
High Frequency Type
High PermittivityClass 2
Test Methods and Remarks
Class 1 Class 2
Applied voltage Rated voltage×3 Rated voltage×2.5
Duration 1 to 5 sec.
Charge/discharge current 50mA max.
3. Rated Voltage
Specified
Value
Temperature Compensating
Class 1
Standard 50VDC, 25VDC, 16VDC
High Frequency Type 50VDC, 16VDC
High Permittivity Class 250VDC, 35VDC, 25VDC, 16VDC, 10VDC, 6.3VDC, 4VDC
2. Storage Conditions
Specified
Value
Temperature Compensating
Class 1
Standard 55 to 125
High Frequency Type
High Permittivity Class 2
Specification Temperature Range
BJ B25 to 85
X5R 55 to 85
B7 X7R 55 to 125
C6 X6S 55 to 105
C7 X7S 55 to 125
FF25 to 85
Y5V 30 to 85
1.Operating Temperature Range
Specified
Value
Temperature Compensating
Class 1
Standard 55 to 125
High Frequency Type
High Permittivity Class 2
Specification Temperature Range
BJ B25 to 85
X5R 55 to 85
B7 X7R 55 to 125
C6 X6S 55 to 105
C7 X7S 55 to 125
FF25 to 85
Y5V 30 to 85
Multilayer Ceramic Capacitors
Super Low Distortion Multilayer Ceramic Capacitors and Medium-High
Voltage Multilayer Ceramic Capacitors are noted separately.
2n ., w 45+2 n+2 (um mm) no 5 Pressmg JIK I:I Dyes: mg a s - Chm JON!) TAIYD YUDEN 2012
1
2
mlcc_reli-R2
mlcc_reli_e-01
RELIABILITY DATA
This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
8. Temperature CharacteristicWithout voltage application
Specified
Value
Temperature Compensating
Class 1
Standard
Temperature Characteristic ppm/Tolerance
C 0 CH, CJ, CK
H±60
J±120
K±250
R 220 RH
S 330 SH, SJ, SK
T 470 TJ, TK
U 750 UJ, UK
SL 350 to 1000
High Frequency Type
High Permittivity Class 2
Specification Capacitance change Reference temperature Temperature Range
BJ B±1020℃ -25 to 85
X5R ±1525℃ -55 to 85
B7 X7R ±1525℃ -55 to 125
C6 X6S ±2225℃ -55 to 105
C7 X7S ±2225℃ -55 to 125
FF30/8020℃ -25 to 85
Y5V 22/8225℃ -30 to 85
Test Methods and Remarks
Class 1
Capacitance at 20 and 85 shall be measured in thermal equilibrium, and the temperature characteristic shall be calculated from the following equation.
C85C20 × 106
ppm/℃)
C20×T           △T65
Class 2
Capacitance at each step shall be measured in thermal equilibrium, and the temperature characteristic shall be calculated from the following equation.
CC2 ×100(%
C2
C Capacitance in Step 1 or Step 3
C2 Capacitance in Step 2
Step BF X5RX7RX6SX7SY5V
1 Minimum operating temperature
2 2025
3 Maximum operating temperature
9. Deflection
Specified
Value
Temperature Compensating
Class 1
Standard Appearance : No abnormality
Capacitance change : Within ±5% or ±0.5 pF, whichever is larger.
High Frequency Type Appearance : No abnormality
Capacitance change : Within±0.5 pF
High Permittivity Class 2Appearance : No abnormality
Capacitance change : Within ±12.5%BJ, B7, C6, C7, Within ±30%F
Test Methods and Remarks
Multilayer Ceramic Capacitors
Board Thickness Warp Duration
042063 Type glass epoxy-resin substrate 0.8mm 1mm 10 sec.
The other types 1.6mm
Array Type
Board Thickness Warp Duration
096110212 Type glass epoxy-resin substrate 1.6mm 1mm 10 sec.
Board Warp
Capacitance measurement shall
be conducted with the board bent
10. Body Strength
Specified
Value
Temperature Compensating
Class 1
Standard
High Frequency Type No mechanical damage.
High Permittivity Class 2) —
Test Methods and Remarks
High Frequency Type
Applied force: 5N
Duration: 10 sec.
A
A
A
11. Adhesive Strength of Terminal Electrodes
Specified
Value
Temperature Compensating
Class 1
Standard
No terminal separation or its indication.High Frequency Type
High Permittivity Class 2
Test Methods and Remarks
Multilayer Ceramic Capacitors Array Type
Applied force Duration
042063 Type 2N 30±5 sec.
105 Type or more 5N
Applied force Duration
096 Type 2N 30±5 sec.
110212 Type 5N
12. Solderability
Specified
Value
Temperature Compensating
Class 1
Standard
At least 95% of terminal electrode is covered by new solder.High Frequency Type
High Permittivity Class 2
Test Methods and Remarks
Solder type Solder temperature Duration
Eutectic solder H60A or H63A 230±54±1 sec.
Lead-free solder Sn-3.0Ag0.5Cu 245±3
TAIYD YUDEN 2012
1
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mlcc_reli-R3 mlcc_reli_e-01
RELIABILITY DATA
This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
13. Resistance to Soldering
Specified
Value
Temperature Compensating
Class 1
Standard
Appearance: No abnormality
Capacitance change: Within ±2.5% or ±0.25pF, whichever is larger.
Q: Initial value
Insulation resistance: Initial value
Withstanding voltage between terminals: No abnormality
High Frequency Type
Appearance: No abnormality
Capacitance change: Within ±2.5%
Q: Initial value
Insulation resistance: Initial value
Withstanding voltage between terminals: No abnormality
High Permittivity Class 2 Note 1
Appearance: No abnormality
Capacitance change: Within ±7.5% BJ, B7, C6, C7
Within ±20% F
Dissipation factor: Initial value
Insulation resistance: Initial value
Withstanding voltage between terminals: No abnormality
Test Methods and Remarks
Class 1
042, 063 Type 105 Type
Array096, 110 Type
Preconditioning None
Preheating 150, 1 to 2 min. 80 to 100, 2 to 5 min.
150 to 200, 2 to 5 min.
Solder temp. 270±5
Duration 3±0.5 sec.
Recovery 6 to 24 hrs Standard condition Note 5  
Class 2
042063 Type 105, 107, 212 Type
Array096, 110,212 Type 316, 325 Type
Preconditioning Thermal treatment at 150 for 1 hr Note 2
Preheating 150, 1 to 2 min. 80 to 100, 2 to 5 min.
150 to 200, 2 to 5 min.
80 to 100, 5 to 10 min.
150 to 200, 5 to 10 min.
Solder temp. 270±5
Duration 3±0.5 sec.
Recovery 24±2 hrs Standard condition Note 5
14. Temperature Cycle (Thermal Shock
Specified
Value
Temperature Compensating
Class 1
Standard
Appearance: No abnormality
Capacitance change: Within ±2.5% or ±0.25pF, whichever is larger.
Q: Initial value
Insulation resistance: Initial value
Withstanding voltage between terminals: No abnormality
High Frequency Type
Appearance: No abnormality
Capacitance change: Within ±0.25pF
Q: Initial value
Insulation resistance: Initial value
Withstanding voltage between terminals: No abnormality
High Permittivity Class 2 Note 1
Appearance: No abnormality
Capacitance change: Within ±7.5% BJ, B7, C6, C7
Within ±20% F
Dissipation factor: Initial value
Insulation resistance: Initial value
Withstanding voltage between terminals: No abnormality
Test Methods and Remarks
Class 1 Class 2
Preconditioning None Thermal treatment at 150 for 1 hr Note 2
1 cycle
Step Temperature(℃Timemin.
1 Lowest operating temperature 0/3 30±3
2 Normal temperature 2 to 3
3 Highest operating temperature 0/3 30±3
4 Normal temperature 2 to 3
Number of cycles 5 times
Recovery 6 to 24 hrs Standard condition Note 5 24±2 hrs Standard condition Note 5
15. Humidity Steady State
Specified
Value
Temperature Compensating
Class 1
Standard
Appearance: No abnormality
Capacitance change: Within ±5% or ±0.5pF, whichever is larger.
Q C10pF Q20010C 
10C30pF Q2752.5C
C30pF Q350 CNominal capacitance
Insulation resistance: 1000 MΩ min.
High Frequency Type
Appearance: No abnormality
Capacitance change: Within ±0.5pF,
Insulation resistance: 1000 MΩ min.
High Permittivity Class 2 Note 1
Appearance: No abnormality
Capacitance change: Within ±12.5%BJ, B7, C6, C7
Within ±30%F
Dissipation factor 5.0% max. BJ, B7, C6, C7
11.0% max.F
Insulation resistance: 50 MΩμF or 1000 MΩ whichever is smaller.
Test Methods and Remarks
Class 1
Standard High Frequency Type
Preconditioning None
Temperature 40±260±2
Humidity 90 to 95RH
Duration 50024/0 hrs
Recovery 6 to 24 hrs Standard condition Note 5  
Class 2
All items
Preconditioning Thermal treatment at 150 for 1 hr Note 2
Temperature 40±2
Humidity 90 to 95RH
Duration 50024/0 hrs
Recovery 24±2 hrs Standard condition Note 5
TAIYD YUDEN 2012
1
2
mlcc_reli-R4
mlcc_reli_e-01
RELIABILITY DATA
This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
16. Humidity Loading
Specified
Value
Temperature Compensating
Class 1
Standard
Appearance: No abnormality
Capacitance change: Within ±7.5% or ±0.75pF, whichever is larger.
Q C30pFQ10010C/3
C30pFQ200 CNominal capacitance
Insulation resistance: 500 MΩ min.
High Frequency Type
Appearance: No abnormality
Capacitance change: C2pFWithin ±0.4 pF
C2pFWithin ±0.75 pF CNominal capacitance
Insulation resistance: 500 MΩ min.
High Permittivity Class 2 Note 1
Appearance: No abnormality
Capacitance change: Within ±12.5% BJ, B7, C6, C7
Within ±30%F
Dissipation factor 5.0% max. BJ, B7, C6, C7
11.0% max.F
Insulation resistance: 25 MΩ
μF or 500 MΩ, whichever is smaller.
Test Methods and Remarks
Class 1
Standard High Frequency Type
Preconditioning None
Temperature 40±260±2
Humidity 90 to 95RH
Duration 50024/0 hrs
Applied voltage Rated voltage
Charge/discharge current 50mA max.
Recovery 6 to 24 hrs Standard condition Note 5  
Class 2
All items
Preconditioning Voltage treatment
Rated voltage are applied for 1 hour at 40 Note 3
Temperature 40±2
Humidity 90 to 95RH
Duration 50024/0 hrs
Applied voltage Rated voltage
Charge/discharge current 50mA max.
Recovery 24±2 hrs Standard condition Note 5
17. High Temperature Loading
Specified
Value
Temperature Compensating
Class 1
Standard
Appearance: No abnormality
Capacitance change: Within ±3% or ±0.3pF, whichever is larger.
Q C10pF Q20010C
10C30pF Q2752.5C
C30pF Q350 CNominal capacitance
Insulation resistance: 1000 MΩ min.
High Frequency Type
Appearance: No abnormality
Capacitance change: Within ±3% or ±0.3pF, whichever is larger.
Insulation resistance: 1000 MΩ min.
High Permittivity Class 2 Note 1
Appearance: No abnormality
Capacitance change: Within ±12.5%BJ, B7, C6, C7
Within ±30%F
Dissipation factor 5.0% max.BJ, B7, C6, C7
11.0% max.F
Insulation resistance: 50 MΩ
μF or 1000 MΩ, whichever is smaller.
Test Methods and Remarks
Class 1
Standard High Frequency Type
Preconditioning None
Temperature 125±3
Duration 100048/0 hrs
Applied voltage Rated voltage×2
Charge/discharge current 50mA max.
Recovery 6 to 24hr Standard condition Note 5  
Class 2
BJ, F C6 B7, C7
Preconditioning Voltage treatment Twice the rated voltage shall be
applied for 1 hour at 85, 105 or 125 Note 3, 4
Temperature 85±2105±3125±3
Duration 100048/0 hrs
Applied voltage Rated voltage×2 Note 4
Charge/discharge current 50mA max.
Recovery 24±2 hrs Standard condition Note 5
Note 1 The figures indicate typical specifications. Please refer to individual specifications in detail.
Note 2 Thermal treatment : Initial value shall be measured after test sample is heat-treated at 1500/10 for an hour and kept at room temperature for 24±2hours.
Note 3 Voltage treatment : Initial value shall be measured after test sample is voltage-treated for an hour at both the temperature and voltage specified in the test conditions, and
kept at room temperature for 24±2hours.
Note 4 150% of rated voltage is applicable to some items. Please refer to their specifications for further information.
Note 5 Standard condition: Temperature: 5 to 35, Relative humidity: 45 to 85 % RH, Air pressure: 86 to 106kPa
When there are questions concerning measurement results, in order to provide correlation data, the test shall be conducted under the following condi-
tion.
Temperature: 20±2, Relative humidity: 60 to 70 % RH, Air pressure: 86 to 106kPa
Unless otherwise specified, all the tests are conducted under the "standard condition".
CI] DUDE: Lg} DDEQ: FEE: TAIYD YUDEN 2012
1
2
mlcc_prec-P1 mlcc_prec_e-01
PRECAUTIONS
This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
1. Circuit Design
Precautions
Verification of operating environment, electrical rating and performance
1. A malfunction of equipment in fields such as medical, aerospace, nuclear control, etc. may cause serious harm to human life or have severe social ramifications.
Therefore, any capacitors to be used in such equipment may require higher safety and reliability, and shall be clearly differentiated from them used in general pur-
pose applications.
Operating Voltage Verification of Rated voltage
1. The operating voltage for capacitors must always be their rated voltage or less.
If an AC voltage is loaded on a DC voltage, the sum of the two peak voltages shall be the rated voltage or less.
For a circuit where an AC or a pulse voltage may be used, the sum of their peak voltages shall also be the rated voltage or less.
2. Even if an applied voltage is the rated voltage or less reliability of capacitors may be deteriorated in case that either a high frequency AC voltage or a pulse voltage
having rapid rise time is used in a circuit.
2. PCB Design
Precautions
Pattern configurations Design of Land-patterns
1. When capacitors are mounted on PCBs, the amount of solder used size of fillet can directly affect the capacitor performance. Therefore, the following items must
be carefully considered in the design of land patterns:
1Excessive solder applied can cause mechanical stresses which lead to chip breaking or cracking. Therefore, please consider appropriate land-patterns for proper
amount of solder.
2When more than one component are jointly soldered onto the same land, each component's soldering point shall be separated by solder-resist.
Pattern configurationsCapacitor layout on PCBs
After capacitors are mounted on boards, they can be subjected to mechanical stresses in subsequent manufacturing processes PCB cutting, board inspection,
mounting of additional parts, assembly into the chassis, wave soldering of the boards, etc.. For this reason, land pattern configurations and positions of capacitors
shall be carefully considered to minimize stresses.
Technical
consider-
ations
Pattern configurations Design of Land-patterns
The following diagrams and tables show some examples of recommended land patterns to prevent excessive solder amounts.
1Recommended land dimensions for typical chip capacitors
Multilayer Ceramic Capacitors : Recommended land dimensions unit: mm
 Wave-soldering Land patterns for PCBs
Type 107 212 316 325
Size L 1.6 2.0 3.2 3.2
W 0.8 51.25 1.6 2.5
A 0.8 to 1.0 1.0 to 1.4 1.8 to 2.5 1.8 to 2.5
B 0.5 to 0.8 0.8 to 1.5 0.8 to 1.7 0.8 to 1.7
C 0.6 to 0.8 0.9 to 1.2 1.2 to 1.6 1.8 to 2.5
Solder-resist
Chip capacitor
L
L
W
B
C
B
A
W
LWDC
Land
Chip capacitor
Reflow-soldering
Type 042 063 105 107 212 316 325 432
Size L 0.4 0.6 1.0 1.6 2.0 3.2 3.2 4.5
W 0.2 0.3 0.5 0.8 51.25 1.6 2.5 3.2
A
0.15 to 0.25 0.20 to 0.30 0.45 to 0.55
0.8 to 1.0 0.8 to 1.2 1.8 to 2.5 1.8 to 2.5 2.5 to 3.5
B
0.15 to 0.20 0.20 to 0.30 0.40 to 0.50
0.6 to 0.8 0.8 to 1.2 1.0 to 1.5 1.0 to 1.5 1.5 to 1.8
C
0.15 to 0.30 0.25 to 0.40 0.45 to 0.55
0.6 to 0.8 0.9 to 1.6 1.2 to 2.0 1.8 to 3.2 2.3 to 3.5
NoteRecommended land size might be different according to the allowance of the size of the product.
LWDC: Recommended land dimensions for reflow-solderingunit: mm
Type 105 107 212
Size L 0.52 50.8 1.25
W 1.0 1.6 2.0
A 0.18 to 0.22 0.25 to 0.3 0.5 to 0.7
B 0.2 to 0.25 0.3 to 0.4 0.4 to 0.5
C 0.9 to 1.1 1.5 to 1.7 1.9 to 2.1
Array type: Recommended land dimensions for reflow-soldering unit: mm
2 circuits 4 circuits
Type 0962 circuits1102 circuits2122 circuits2124 circuits
Size L 0.9 1.37 2.0 2.0
W 0.6 1.0 1.25 1.25
a 0.25 to 0.35 0.35 to 0.45 0.5 to 0.6 0.5 to 0.6
b 0.15 to 0.25 0.55 to 0.65 0.5 to 0.6 0.5 to 0.6
c 0.15 to 0.25 0.3 to 0.4 0.5 to 0.6 0.2 to 0.3
d 0.45 0.64 1.0 0.5
Chip capacitor
a
a
b
d
c
Land
c
d
a
a
b
2Examples of good and bad solder application
Items Not recommended Recommended
Mixed mounting of
SMD and leaded
components
Component
placement close to
the chassis
Hand-soldering
of leaded
components
near mounted
components
Horizontal
component
placement
Precautions on the use of Multilayer Ceramic Capacitors
To next page
\ WWW“ , up» dwamnr mm Perfuramn Mazmmne m sues: A>E 7 or»: '5 4:; WW, w] 75;, , 412%]; “1:": ff W" WM "5 Snmsv upehm! ’mm mm m mm. A‘lev rm-mmxremrdm TAIYD YUDEN 2012
1
2
mlcc_prec-P2
mlcc_prec_e-01
PRECAUTIONS
This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
Precautions on the use of Multilayer Ceramic Capacitors
2. PCB Design
Technical
consider-
ations
Pattern configurationsCapacitor layout on PCBs
1-1. The following is examples of good and bad capacitor layouts ; capacitors shall be located to minimize any possible mechanical stresses from board warp or de-
flection.
Items Not recommended Recommended
Deflection of board
1-2. The amount of mechanical stresses given will vary depending on capacitor layout. Please refer to diagram below.
1-3. When PCB is split, the amount of mechanical stress on the capacitors can vary according to the method used. The following methods are listed in order from
least stressful to most stressful: push-back, slit, V-grooving, and perforation. Thus, please consider the PCB, split methods as well as chip location.
3. Mounting
Precautions
Adjustment of mounting machine
1. When capacitors are mounted on PCB, excessive impact load shall not be imposed on them.
2.Maintenance and inspection of mounting machines shall be conducted periodically.
Selection of Adhesives
1. When chips are attached on PCBs with adhesives prior to soldering, it may cause capacitor characteristics degradation unless the following factors are appro-
priately checked : size of land patterns, type of adhesive, amount applied, hardening temperature and hardening period. Therefore, please contact us for further
information.
Technical
consider-
ations
Adjustment of mounting machine
1. When the bottom dead center of a pick-up nozzle is too low, excessive force is imposed on capacitors and causes damages. To avoid this, the following points
shall be considerable.
1 The bottom dead center of the pick-up nozzle shall be adjusted to the surface level of PCB without the board deflection.
2 The pressure of nozzle shall be adjusted between 1 and 3 N static loads.
3 To reduce the amount of deflection of the board caused by impact of the pick-up nozzle, supporting pins or back-up pins shall be used on the other side of the
PCB. The following diagrams show some typical examples of good and bad pick-up nozzle placement:
Items Not recommended Recommended
Single-sided
mounting
Double-sided
mounting
2. As the alignment pin is worn out, adjustment of the nozzle height can cause chipping or cracking of capacitors because of mechanical impact on the capacitors.
To avoid this, the monitoring of the width between the alignment pins in the stopped position, maintenance, check and replacement of the pin shall be conducted
periodically.
Selection of Adhesives
Some adhesives may cause IR deterioration. The different shrinkage percentage of between the adhesive and the capacitors may result in stresses on the capaci-
tors and lead to cracking. Moreover, too little or too much adhesive applied to the board may adversely affect components. Therefore, the following precautions
shall be noted in the application of adhesives.
1Required adhesive characteristics
a. The adhesive shall be strong enough to hold parts on the board during the mounting & solder process.
b. The adhesive shall have sufficient strength at high temperatures.
c. The adhesive shall have good coating and thickness consistency.
d. The adhesive shall be used during its prescribed shelf life.
e. The adhesive shall harden rapidly.
f . The adhesive shall have corrosion resistance.
g. The adhesive shall have excellent insulation characteristics.
h. The adhesive shall have no emission of toxic gasses and no effect on the human body.
2The recommended amount of adhesives is as follows;
Recommended condition
Figure 212/316 case sizes as examples
a 0.3mm min
b 100 to 120 μm
c Adhesives shall not contact land   
‘—‘ ‘—' V‘/Zr~‘/3r ‘ > T / TAIYD YUDEN 2012
1
2
mlcc_prec-P3 mlcc_prec_e-01
PRECAUTIONS
This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
Precautions on the use of Multilayer Ceramic Capacitors
4. Soldering
Precautions
Selection of Flux
Since flux may have a significant effect on the performance of capacitors, it is necessary to verify the following conditions prior to use;
1Flux used shall be less than or equal to 0.1 wt% in CI equivalent of halogenated content. Flux having a strong acidity content shall not be applied.
2When shall capacitors are soldered on boards, the amount of flux applied shall be controlled at the optimum level.
3When water-soluble flux is used, special care shall be taken to properly clean the boards.
Soldering
Temperature, time, amount of solder, etc. shall be set in accordance with their recommended conditions.
Sn-Zn solder paste can adversely affect MLCC reliability.
Please contact us prior to usage of Sn-Zn solder.
Technical
consider-
ations
Selection of Flux
1-1. When too much halogenated substance Chlorine, etc. content is used to activate fl ux, or highly acidic fl ux is used, it may lead to corrosion of terminal elec-Chlorine, etc. content is used to activate fl ux, or highly acidic fl ux is used, it may lead to corrosion of terminal elec-Chlorine, etc. content is used to activate fl ux, or highly acidic fl ux is used, it may lead to corrosion of terminal elec- content is used to activate fl ux, or highly acidic fl ux is used, it may lead to corrosion of terminal elec- content is used to activate flux, or highly acidic flux is used, it may lead to corrosion of terminal elec-
trodes or degradation of insulation resistance on the surfaces of the capacitors.
1-2. Flux is used to increase solderability in wave soldering. However if too much flux is applied, a large amount of flux gas may be emitted and may adversely affect
the solderability. To minimize the amount of flux applied, it is recommended to use a flux-bubbling system.
1-3. Since the residue of water-soluble flux is easily dissolved in moisture in the air, the residues on the surfaces of capacitors in high humidity conditions may cause
a degradation of insulation resistance and reliability of the capacitors. Therefore, the cleaning methods and the capability of the machines used shall also be
considered carefully when water-soluble flux is used.
Soldering
Ceramic chip capacitors are susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling.
Therefore, the soldering must be conducted with great care so as to prevent malfunction of the components due to excessive thermal shock.
Preheating : Capacitors shall be preheated sufficiently, and the temperature difference between the capacitors and solder shall be within 100 to 130.
Cooling : The temperature difference between the capacitors and cleaning process shall not be greater than 100.
Reflow soldering
Recommended conditions for eutectic soldering Recommended condition for Pb-free soldering
Temperature(℃)
0
100
200
300
230
Within 10 sec.
60sec.
Min.
60sec.
Min.
Slow cooling
Preheating
Temperature (℃)
0
100
200
300
Temperature (℃
0
100
200
300
Temperature (℃
Temperature (℃
0
100
200
300
Peak 260 Max.
Within 10sec.
Heating above
230
40sec. Max.
Slow
cooling
Preheating 150
60sec. Min.
230250
Within 3sec.
Preheating
120sec. Min.
Slow cooling
Peak 260 Max.
Within 10sec.
Slow
cooling
120sec. Min.
Preheating
150
0
100
200
300
400
230280
Within 3 sec.
Preheating
60sec. Min.
Slow cooling
Temperature (℃
0
100
200
300
400
Temperature (℃
0
100
200
300
400
Peak 350 Max.
Within 3sec.
Peak 280 Max.
Within 3sec.
Slow cooling Slow cooling
T
T
Preheating
150 Min.
60sec. Min.
Preheating
150 Min.
60sec. Min.
Caution
The ideal condition is to have solder mass fillet controlled to 1/2 to 1/3 of the thickness of a capacitor.
Capacitor
PC board
T
Solder
Because excessive dwell times can adversely affect solderability, soldering duration shall be kept as
close to recommended times as possible.
Wave soldering
Recommended conditions for eutectic soldering Recommended condition for Pb-free soldering
Temperature (℃
0
100
200
300
Temperature (℃)
0
100
200
300
Temperature (℃
Temperature (℃
0
100
200
300
Peak 260 Max.
Within 10sec.
Heating above
230
40sec. Max.
Slow
cooling
Preheating 150
60sec. Min.
230250
Within 3sec.
Preheating
120sec. Min.
Slow cooling
Peak 260 Max.
Within 10sec.
Slow
cooling
120sec. Min.
Preheating
150
0
100
200
300
400
230280
Within 3 sec.
Preheating
60sec. Min.
Slow cooling
Temperature (℃
0
100
200
300
400
Temperature (℃
0
100
200
300
400
Peak 350 Max.
Within 3sec.
Peak 280 Max.
Within 3sec.
Slow cooling Slow cooling
T
T
Preheating
150 Min.
60sec. Min.
Preheating
150 Min.
60sec. Min.
Temperature (℃
0
100
200
300
Temperature (℃
0
100
200
300
Temperature (℃)
Temperature (℃
0
100
200
300
Peak 260 Max.
Within 10sec.
Heating above
230
40sec. Max.
Slow
cooling
Preheating 150
60sec. Min.
230250
Within 3sec.
Preheating
120sec. Min.
Slow cooling
Peak 260 Max.
Within 10sec.
Slow
cooling
120sec. Min.
Preheating
150
0
100
200
300
400
230280
Within 3 sec.
Preheating
60sec. Min.
Slow cooling
Temperature (℃
0
100
200
300
400
Temperature (℃
0
100
200
300
400
Peak 350 Max.
Within 3sec.
Peak 280 Max.
Within 3sec.
Slow cooling Slow cooling
T
T
Preheating
150 Min.
60sec. Min.
Preheating
150 Min.
60sec. Min.
Caution
Wave soldering must not be applied to capacitors designated as for reflow soldering only.
Hand soldering
Recommended conditions for eutectic soldering Recommended condition for Pb-free soldering
Temperature (℃
0
100
200
300
Temperature (℃
0
100
200
300
Temperature (℃
Temperature (℃)
0
100
200
300
Peak 260 Max.
Within 10sec.
Heating above
230
40sec. Max.
Slow
cooling
Preheating 150
60sec. Min.
230250
Within 3sec.
Preheating
120sec. Min.
Slow cooling
Peak 260 Max.
Within 10sec.
Slow
cooling
120sec. Min.
Preheating
150
0
100
200
300
400
230280
Within 3 sec.
Preheating
60sec. Min.
Slow cooling
Temperature (℃
0
100
200
300
400
Temperature (℃
0
100
200
300
400
Peak 350 Max.
Within 3sec.
Peak 280 Max.
Within 3sec.
Slow cooling Slow cooling
T
T
Preheating
150 Min.
60sec. Min.
Preheating
150 Min.
60sec. Min.
Temperature (℃
0
100
200
300
Temperature (℃
0
100
200
300
Temperature (℃
Temperature (℃
0
100
200
300
Peak 260 Max.
Within 10sec.
Heating above
230
40sec. Max.
Slow
cooling
Preheating 150
60sec. Min.
230250
Within 3sec.
Preheating
120sec. Min.
Slow cooling
Peak 260 Max.
Within 10sec.
Slow
cooling
120sec. Min.
Preheating
150
0
100
200
300
400
230280
Within 3 sec.
Preheating
60sec. Min.
Slow cooling
Temperature (℃)
0
100
200
300
400
Temperature (℃
0
100
200
300
400
Peak 350 Max.
Within 3sec.
Peak 280 Max.
Within 3sec.
Slow cooling Slow cooling
T
T
Preheating
150 Min.
60sec. Min.
Preheating
150 Min.
60sec. Min.
Temperature (℃
0
100
200
300
Temperature (℃
0
100
200
300
Temperature (℃
Temperature (℃
0
100
200
300
Peak 260 Max.
Within 10sec.
Heating above
230
40sec. Max.
Slow
cooling
Preheating 150
60sec. Min.
230250
Within 3sec.
Preheating
120sec. Min.
Slow cooling
Peak 260 Max.
Within 10sec.
Slow
cooling
120sec. Min.
Preheating
150
0
100
200
300
400
230280
Within 3 sec.
Preheating
60sec. Min.
Slow cooling
Temperature (℃
0
100
200
300
400
Temperature (℃)
0
100
200
300
400
Peak 350 Max.
Within 3sec.
Peak 280 Max.
Within 3sec.
Slow cooling Slow cooling
T
T
Preheating
150 Min.
60sec. Min.
Preheating
150 Min.
60sec. Min.
T
316type or less
T150
T
325type or more
T130
Caution
Use a 50W soldering iron with a maximum tip diameter of 1.0 mm.
The soldering iron shall not directly touch capacitors.
TAIYD YUDEN 2012
1
2
mlcc_prec-P4
mlcc_prec_e-01
PRECAUTIONS
This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
Precautions on the use of Multilayer Ceramic Capacitors
5. Cleaning
Precautions
Cleaning conditions
1. When PCBs are cleaned after capacitors mounting, please select the appropriate cleaning solution in accordance with the intended use of the cleaning.e.g. to
remove soldering flux or other materials from the production process.
2. Cleaning condition shall be determined after it is verified by using actual cleaning machine that the cleaning process does not affect capacitor's characteristics.
Technical
consider-
ations
1. The use of inappropriate cleaning solutions can cause foreign substances such as flux residue to adhere to capacitors or deteriorate their outer coating, resulting in
a degradation of the capacitor's electrical properties especially insulation resistance.
2. Inappropriate cleaning conditions insufficient or excessive cleaning may adversely affect the performance of the capacitors.
In the case of ultrasonic cleaning, too much power output can cause excessive vibration of PCBs which may lead to the cracking of capacitors or the soldered
portion, or decrease the terminal electrodes' strength. Therefore, the following conditions shall be carefully checked;
Ultrasonic output : 20 W/ or less
Ultrasonic frequency : 40 kHz or less
Ultrasonic washing period : 5 min. or less
6. Resin coating and mold
Precautions
1. With some type of resins, decomposition gas or chemical reaction vapor may remain inside the resin during the hardening period or while left under normal stor-
age conditions resulting in the deterioration of the capacitor's performance.
2. When a resin's hardening temperature is higher than capacitor's operating temperature, the stresses generated by the excessive heat may lead to damage or
destruction of capacitors.
The use of such resins, molding materials etc. is not recommended.
7. Handling
Precautions
Splitting of PCB
1. When PCBs are split after components mounting, care shall be taken so as not to give any stresses of deflection or twisting to the board.
2. Board separation shall not be done manually, but by using the appropriate devices.
Mechanical considerations
Be careful not to subject capacitors to excessive mechanical shocks.
1If ceramic capacitors are dropped onto a floor or a hard surface, they shall not be used.
2Please be careful that the mounted components do not come in contact with or bump against other boards or components.
8. Storage conditions
Precautions
Storage
1.
To maintain the solderability of terminal electrodes and to keep packaging materials in good condition, care must be taken to control temperature and humidity in
the storage area. Humidity should especially be kept as low as possible.
Recommended conditions
Ambient temperature : Below 30
Humidity : Below 70% RH
The ambient temperature must be kept below 40. Even under ideal storage conditions, solderability of capacitor is deteriorated as time passes, so capaci-
tors shall be used within 6 months from the time of delivery.
Ceramic chip capacitors shall be kept where no chlorine or sulfur exists in the air.
2.
The capacitance values of high dielectric constant capacitors will gradually decrease with the passage of time, o care shall be taken to design circuits . Even if
capacitance value decreases as time passes, it will get back to the initial value by a heat treatment at 150 for 1hour.
Technical
consider-
ations
If capacitors are stored in a high temperature and humidity environment, it might rapidly cause poor solderability due to terminal oxidation and quality loss of taping/
packaging materials. For this reason, capacitors shall be used within 6 months from the time of delivery. If exceeding the above period, please check solderability be-
fore using the capacitors.
RCR-2335BSafety Application Guide for fixed ceramic capacitors for use in electronic equipmentis published by JEITA.
 Please check the guide regarding precautions for deflection test, soldering by spot heat, and so on.

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