NCP698 Datasheet by onsemi

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LDO Regulator *1 “1 6110 ON Semiconductma fl
© Semiconductor Components Industries, LLC, 2014
September, 2019 Rev. 2
1Publication Order Number:
NCP698/D
NCP698
LDO Regulator - CMOS,
Ultra Low, Iq, IGND, Enable
150 mA
This series of fixed output lowdropout linear regulators are
designed for handheld communication equipment and portable battery
powered applications which require low quiescent and ground current.
This series features an ultralow quiescent current of 2.5 A. Each
device contains a voltage reference unit, an error amplifier, a PMOS
power transistor, resistors for setting output voltage, current limit, and
temperature limit protection circuits. The NCP698 series provides an
enable pin for ON/OFF control.
The NCP698 has been designed to be used with low cost ceramic
capacitors and requires a minimum output capacitor of 0.1 F. The
device is housed in the microminiature SC82AB surface mount
package. Standard voltage versions are 1.3, 1.5, 1.8, 2.5, 2.8, 3.0, 3.3,
3.5 and 5.0 V. Other voltages are available in 100 mV steps.
Features
Ultra Low Quiescent Current of 2.5 A Typical
Output Voltage Accuracy of 2.0%
Operating Temperature Range of 40°C to 85°C
Enable Function
This is a PbFree Device
Typical Applications
Battery Powered Instruments
HandHeld Instruments
Camcorders and Cameras
Figure 1. Typical Application Diagram
This device contains 28 active transistors
Output
C2
+
Input
GND Enable
Vin Vout
+
C1
OFF
ON
See detailed ordering and shipping information in the package
dimensions section on page 8 of this data sheet.
ORDERING INFORMATION
SC82AB (SC704)
SQ SUFFIX
CASE 419C
1
4
PIN CONNECTIONS &
MARKING DIAGRAMS
GND
Top View)
1
2
4
3
Vin
Enable
Vout
xxxM G
G
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xxx = Specific Device Code
M = Month Code*
G= PbFree Package
(Note: Microdot may be in either location)
*Date Code orientation and/or position and
underbar may vary depending upon manu-
facturing location.
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PIN FUNCTION DESCRIPTION
Pin No. Pin Name Description
1 GND Power supply ground.
2Vin Positive power supply input voltage.
3 Vout Regulated output voltage.
4 Enable This input is used to place the device into lowpower standby. When this input is pulled low, the
device is disabled. If this function is not used, Enable should be connected to Vin.
N/C No internal connection.
MAXIMUM RATINGS
Rating Symbol Value Unit
Input Voltage Vin 6.0 V
Enable Voltage Enable 0.3 to Vin +0.3 V
Output Voltage Vout 0.3 to Vin +0.3 V
Power Dissipation and Thermal Characteristics (Note 1)
Power Dissipation
Thermal Resistance, JunctiontoAmbient (1 oz copper, 1 in2 copper area)
PD
RJA
Internally Limited
235
W
°C/W
Operating Junction Temperature TJ+150 °C
Operating Ambient Temperature TA40 to +85 °C
Storage Temperature Tstg 55 to +150 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Refer to Electrical Characteristics and Application Information for Safe Operating Area.
2. This device series contains ESD protection and exceeds the following tests:
Human Body Model 2000 V per MILSTD883, Method 3015
Machine Model Method 200 V
3. Latch up capability (85°C) "100 mA DC with trigger voltage.
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ELECTRICAL CHARACTERISTICS
(Vin = Vout(nom.) + 1.0 V, Venable = Vin, Cin = 1.0 F, Cout = 1.0 F, TA = 25°C, unless otherwise noted. Note 4)
Characteristic Symbol Min Typ Max Unit
Output Voltage (Iout = 1.0 mA)
1.3 V
1.5 V
1.8 V
2.5 V
2.8 V
3.0 V
3.3 V
3.5 V
5.0 V
Vout
1.261
1.455
1.746
2.425
2.744
2.940
3.234
3.430
4.900
1.3
1.5
1.8
2.5
2.8
3.0
3.3
3.5
5.0
1.339
1.545
1.854
2.575
2.856
3.060
3.366
3.570
5.100
V
Output Voltage (TA = 40 to +85°C, Iout = 1.0 mA)
1.3 V
1.5 V
1.8 V
2.5 V
2.8 V
3.0 V
3.3 V
3.5 V
5.0 V
Vout
1.261
1.455
1.746
2.425
2.716
2.910
3.201
3.430
4.900
1.3
1.5
1.8
2.5
2.8
3.0
3.3
3.5
5.0
1.339
1.545
1.854
2.575
2.884
3.090
3.399
3.570
5.100
V
Line Regulation
1.5 V4.4 V (Vin = Vo(nom.) + 1.0 V to 6.0 V
4.5 V5.0 V (Vin = 5.5 V to 6.0 V)
Regline
10
10
20
20
mV
Load Regulation (Iout = 10 mA to 150 mA) Regload 20 60 mV
Output Current (Vout = (Vout at Iout = 150 mA) 3.0%)
1.3 V to 3.9 V (Vin = Vout(nom.) + 2.0 V)
4.0 V5.0 V (Vin = 6.0 V)
Io(nom.)
150
150
280
280
mA
Dropout Voltage (TA = 40°C to 85°C, Iout = 80 mA, Measured at Vout 3.0%)
1.3 V
1.5 V
1.8 V
2.5 V2.8 V
3.0 V3.5 V
5.0 V
VinVout
750
550
400
250
200
140
1200
800
550
400
350
200
mV
Dropout Voltage (TA = 40°C to 85°C, Iout = 150 mA, Measured at Vout 3.0%)
1.3 V
1.5 V
1.8 V
2.5 V2.8 V
3.0 V3.5 V
5.0 V
VinVout
1050
870
700
520
370
280
1500
1070
900
700
525
400
mV
Disable Current (Enable Input = 0 V) IDIS 0.1 1.0 A
Quiescent Current (Enable Input = Vin, Iout = 0 mA) IQ2.5 6.0 A
Ground Current (Enable Input = Vin, Iout = 1.0 mA to 150 mA) IGND 2.5 6.0 A
Output Short Circuit Current
1.3 V to 3.9 V (Vin = Vnom + 2.0 V)
4.0 V5.0 V (Vin = 6.0 V)
Iout(max)
150
150
300
300
600
600
mA
Output Voltage Noise (f = 100 Hz to 100 kHz, Vout = 3.0 V) Vn100 Vrms
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ELECTRICAL CHARACTERISTICS (continued)
(Vin = Vout(nom.) + 1.0 V, Venable = Vin, Cin = 1.0 F, Cout = 1.0 F, TA = 25°C, unless otherwise noted. Note 4)
Enable Input Threshold Voltage
(Voltage Increasing, Output Turns On, Logic High)
(Voltage Decreasing, Output Turns Off, Logic Low)
Vth(en)
1.3
0.3
V
Output Voltage Temperature Coefficient TC"100 ppm/°C
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
4. Performance guaranteed over the indicated operating temperature range by design and/or characterization, production tested at TJ = TA =
25°C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
5. Maximum package power dissipation limits must be observed.
PD +TJ(max) *TA
RJA
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00
VIN, INPUT VOLTAGE (V)
IQ, QUIESCENT CURRENT (A)
IQ, QUIESCENT CURRENT (A)
100200204060
1.7
2.9
Figure 2. Quiescent Current versus Temperature
T, TEMPERATURE (°C)
Figure 3. Quiescent Current versus Input
Voltage
Figure 4. Output Voltage versus Temperature Figure 5. Output Voltage versus Input Voltage
Figure 6. Dropout Voltage versus Temperature Figure 7. TurnOn Response
2.7
2.5
653210
0
3
2
1
0.5
VIN VOUT
, DROPOUT VOLTAGE (mV)
1252550
T, TEMPERATURE (°C)
300 4
VOUT
, OUTPUT
VOLTAGE (V)
400250200100500
t, TIME (s)
1
1.9
2.5
VOUT
, OUTPUT VOLTAGE (V)
100604020204060
T, TEMPERATURE (°C)
VOUT
, OUTPUT VOLTAGE (V)
610
0
3.5
VIN, INPUT VOLTAGE (V)
3
2.5
2.990
3.020
3.000
2.1
2.3
VIN = 4.0 V
VOUT = 3.0 V
IOUT = 0 mA
1.5
VOUT = 3.0 V
080
2.995
3.015
3.005
3.010
VIN = 6.0 V
IOUT = 30 mA
VOUT(nom) = 3.0 V
80 mA LOAD VIN = 4.0 V
CIN = 1.0 F
3
2
2
0
150
40 60 80 4
VIN = 4.0 V
VOUT(nom) = 3.0 V
IOUT = 10 mA
2345
2
1.5
1
0.5
25 0 50 75 100
250
200
150
100
50
40 mA LOAD
10 mA LOAD
300 350
COUT = 0.1 F
IOUT = 10 mA
ENABLE
VOLTAGE (V)
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400 0
Figure 8. Line Transient Response Figure 9. Load Transient Response
3.5
Vn, OUTPUT VOLTAGE NOISE (mV/Hz)
100
0
10.10.01
f, FREQUENCY (kHz)
0.5
VIN = 5.0 V
VOUT = 3.0 V
IOUT = 50 mA
COUT = 0.1 F
1.5
1
2
2.5
10 100
1
6
OUTPUT VOLTAGE
DEVIATION (V)
500250200100500
t, TIME (s)
0.5
1
0
4
3
150 300 350
VOUT = 3.0 V
COUT = 0.1 F
IOUT = 10 mA
VIN, INPUT
VOLTAGE (V)
400 450
0.5
5
60
OUTPUT VOLTAGE
DEVIATION (V)
500250200100500
t, TIME (s)
1
0.5
0.5
0
30
150 300 350
IOUT
, OUTPUT
CURRENT (mA)
400 450
0
30
1
3
IOUT = 1 mA to 30 mA
VIN = 4.0 V
VOUT = 3.0 V
COUT = 0.1 F
60
600200100 5000
t, TIME (s)
30
0
0
400
300 700
400 800
200
30
200
IOUT = 1 mA to 30 mA
VIN = 4.0 V
COUT = 1.0 F
VOUT = 3.0 V
OUTPUT VOLTAGE
DEVIATION (mV)
IOUT
, OUTPUT
CURRENT (mA)
900 1000
Figure 10. Load Transient Response Figure 11. Output Voltage Noise
DEFINITIONS
Load Regulation
The change in output voltage for a change in output current
at a constant temperature.
Dropout Voltage
The input/output differential at which the regulator output
no longer maintains regulation against further reductions in
input voltage. Measured when the output drops 3.0% below
its nominal. The junction temperature, load current, and
minimum input supply requirements affect the dropout level.
Maximum Power Dissipation
The maximum total dissipation for which the regulator
will operate within its specifications.
Quiescent Current
The quiescent current is the current which flows through
the ground when the LDO operates without a load on its
output: internal IC operation, bias, etc. When the LDO
becomes loaded, this term is called the Ground current. It is
actually the difference between the input current (measured
through the LDO input pin) and the output current.
Line Regulation
The change in output voltage for a change in input voltage.
The measurement is made under conditions of low dissipation
or by using pulse technique such that the average chip
temperature is not significantly affected.
Line Transient Response
Typical over and undershoot response when input voltage
is excited with a given slope.
Thermal Protection
Internal thermal shutdown circuitry is provided to protect
the integrated circuit in the event that the maximum junction
temperature is exceeded. When activated at typically 160°C,
the regulator turns off. This feature is provided to prevent
failures from accidental overheating.
Maximum Package Power Dissipation
The maximum power package dissipation is the power
dissipation level at which the junction temperature reaches its
maximum operating value, i.e. 125°C. Depending on the
ambient power dissipation and thus the maximum available
output current.
J max TA Iol oul low I +|
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APPLICATIONS INFORMATION
A typical application circuit for the NCP698 is shown in
Figure 1.
Input Decoupling (C1)
A 1.0 F capacitor either ceramic or tantalum is
recommended and should be connected close to the NCP698
package. Higher values and lower ESR will improve the
overall line transient response.
TDK capacitor: C2012X5R1C105K, or C1608X5R1A105K
Output Decoupling (C2)
The NCP698 is a very stable regulator and does not
require any specific Equivalent Series Resistance (ESR) or
a minimum output current. Capacitors exhibiting ESRs
ranging from a few m up to 10 can thus safely be used.
The minimum decoupling value is 0.1 F and can be
augmented to fulfill stringent load transient requirements.
The regulator accepts ceramic chip capacitors as well as
tantalum devices. Larger values improve noise rejection and
load regulation transient response.
TDK capacitor: C2012X5R1C105K, C1608X5R1A105K,
or C3216X7R1C105K
Enable Operation
The enable pin will turn on the regulator when pulled high
and turn off the regulator when pulled low. These limits of
threshold are covered in the electrical specification section
of this data sheet. If the enable is not used, then the pin
should be connected to Vin.
Hints
Please be sure the Vin and GND lines are sufficiently
wide. When the impedance of these lines is high, there is a
chance to pick up noise or cause the regulator to
malfunction.
Place external components, especially the output
capacitor, as close as possible to the circuit, and make leads
as short as possible.
Thermal
As power across the NCP698 increases, it might become
necessary to provide some thermal relief. The maximum
power dissipation supported by the device is dependent
upon board design and layout. Mounting pad configuration
on the PCB, the board material and also the ambient
temperature effect the rate of temperature rise for the part.
This is stating that when the devices have good thermal
conductivity through the PCB, the junction temperature will
be relatively low with high power dissipation applications.
The maximum dissipation the package can handle is
given by:
PD +TJ(max) *TA
RJA
If junction temperature is not allowed above the
maximum 125°C, then the NCP698 can dissipate up to
250 mW @ 25°C.
The power dissipated by the NCP698 can be calculated
from the following equation:
Ptot +ƪVin *I
gnd (Iout)ƫ)[Vin *Vout]*I
out
or
VinMAX +Ptot )Vout *Iout
Ignd )Iout
If an 80 mA output current is needed then the ground
current from the data sheet is 2.5 A. For an NCP698
(3.0 V), the maximum input voltage will then be 6.0 V.
Figure 12. RqJA vs. Pad Copper Area
(1 oz Cu thickness)
JA (C/W)
700500400200100
PCB COPPER AREA (mm2)
150
350
190
0 600
170
250
210
230
No pin connected to Cu Plane
300
270
290
310
330
Pin 2 connected to Cu Plane
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ORDERING INFORMATION
Device
Nominal
Output Voltage Marking Package Shipping
NCP698SQ13T1G 1.3 LJW
SC82AB 3000 / Tape & Reel
NCP698SQ15T1G 1.5 LJX
NCP698SQ18T1G 1.8 LJY
NCP698SQ25T1G 2.5 LJZ
NCP698SQ28T1G 2.8 LKD
NCP698SQ30T1G 3.0 LKA
NCP698SQ33T1G 3.3 LKB
NCP698SQ35T1G 3.5 LKE
NCP698SQ50T1G 5.0 LKC
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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SC82AB
CASE 419C02
ISSUE F
DATE 22 JUN 2012
SCALE 4:1
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. 419C01 OBSOLETE. NEW STANDARD IS
419C02.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
12
3
A
G
S
N
J
K
4
D3 PL
B
F
L
C
H
0.05 (0.002)
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 1.80 2.20 0.071 0.087
B 1.15 1.35 0.045 0.053
C 0.80 1.10 0.031 0.043
D 0.20 0.40 0.008 0.016
F 0.30 0.50 0.012 0.020
G 1.10 1.50 0.043 0.059
H 0.00 0.10 0.000 0.004
J 0.10 0.26 0.004 0.010
K 0.10 −−− 0.004 −−−
L 0.05 BSC 0.002 BSC
N 0.20 REF 0.008 REF
S 1.80 2.40 0.07 0.09
XXX = Specific Device Code
M = Month Code
G= PbFree Package
XXX M
G
1
GENERIC
MARKING DIAGRAM*
*This information is generic. Please refer to
device data sheet for actual part marking.
PbFree indicator, “G” or microdot “ G”,
may or may not be present.
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
1.30
0.0512
ǒmm
inchesǓ
SCALE 10:1
0.65
0.026
1.90
0.075
0.90
0.035
0.70
0.028
0.95
0.037
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
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