MAC08BT1, MT1-LF Datasheet by Littelfuse Inc.

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% Lilleltuse“ Ewmm 4,1;me \ AM»; mm
© 2019 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 07/25/19
Thyristors
Surface Mount – 200V - 600V > MAC08BT1, MAC08MT1
Sensitive Gate Trigger
Current in Four Trigger
Modes
Blocking Voltage to 600
Volts
Glass Passivated Surface
for Reliability and
Uniformity
Surface Mount Package
Pb−Free Packages are
Available
Features
Designed for high volume, low cost, industrial and
consumer applications such as motor control; process
control; temperature, light and speed control.
Description
MAC08BT1, MAC08MT1
Functional Diagram
MT
2MT
1
G
Pb
Additional Information
Samples
Resources
Datasheet
Pin Out
123
4
% Lillelfuse‘ Expemxekuphnd \ Amway: Dshveved
© 2019 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 07/25/19
Thyristors
Surface Mount – 200V - 600V > MAC08BT1, MAC08MT1
Rating Symbol Value Unit
Peak Repetitive Off-State Voltage (Note 1)
(Gate Open, Sine Wave 50 to 60 Hz, TJ = -40° to 110°C) MAC08BT1
MAC08MT1 VDRM,
VRRM
200
600 V
On-State RMS Current (Full Cycle Sine Wave, 60 Hz, TC = 80°C) IT (RMS) 0.8 A
Peak Non-Repetitive Surge Current
(One Full Cycle Sine Wave, 60 Hz, TC= 25°C) ITSM 8.0 A
Circuit Fusing Consideration (t = 8.3 msec) I2t 0.4 A²sec
Peak Gate Power (Pulse Width ≤ 10 µsec, TC= 80°C) PGM 5.0 W
Average Gate Power (t = 8.3 msec, TC= 80°C) PG(AV) 0.1 W
Operating Junction Temperature Range TJ-40 to +110 °C
Storage Temperature Range Tstg -40 to +150 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended
exposure to stresses above the Recommended Operating Conditions may affect device reliability.
1. VDRM and VRRM for all types can be applied on a continuous basis. Ratings apply for zero or negative gate voltage; however, positive gate voltage shall not be applied concurrent with negative potential
on the anode. Blocking voltages shall not be tested with a constant current source such that the voltage ratings of the devices are exceeded.
2. These ratings are applicable when surface mounted on the minimum pad sizes recommended.
3. 1/8" from case for 10 seconds.
Rating Symbol Value Unit
Thermal Resistance, Junction−to−Ambient PCB Mounted per Figure 1 R8JA 156 °C/W
2. Pulse Test: Pulse Width ≤ 2.0 ms, Duty Cycle ≤ 2%.
Characteristic Symbol Min Ty p Max Unit
Peak On−State Voltage (Note 2) (ITM = ±1.1 A) VTM 1.9 V
Gate Trigger Current (Continuous dc) (VD = 12 V, RL = 100 Ω) IGT 10 mA
Holding Current (VD = 12 V, Gate Open, Initiating Current = ±20 mA)) IH 5.0 mA
Gate Trigger Voltage (Continuous dc) (VD = 12 V, RL = 100 Ω) VGT – 2.0 V
Maximum Ratings (TJ = 25°C unless otherwise noted)
Thermal Characteristics
Electrical Characteristics - OFF (TC = 25°C unless otherwise noted)
Characteristic Symbol Min Ty p Max Unit
†Peak Repetitive Blocking Current
(VAK = VDRM = VRRM; Gate Open) TJ = 25°C
TJ = 110°C IDRM,
IRRM
- - 10 µA
- - 200 mA
Electrical Characteristics - ON (TC = 25°C unless otherwise noted; Electricals apply in both directions)
Dynamic Characteristics
Characteristic Symbol Min Ty p Max Unit
Critical Rate of Rise of Commutation Voltage
(f = 250 Hz, ITM = 1.0 A, Commutating di/dt = 1.5 A/mS
On−State Current Duration = 2.0 mS, VDRM = 200 V,
Gate Unenergized, TC = 110°C,
Gate Source Resistance = 150 Ω, See Figure 10)
(dI/dt)c 1.5 − A/ms
Critical Rate of Rise of Off-State Voltage
(VD = 0.67 x VDRM, Exponential Waveform, Gate Open, TJ = 110°C) dV/dt 10 − V/µs
MTZ Pusiliva +CuneM 71% 7’1 a. ,_7L, m1 T¥H¥L was was 01159 (W)
© 2019 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 07/25/19
Thyristors
Surface Mount – 200V - 600V > MAC08BT1, MAC08MT1
Figure 1. PCB for Thermal Impedance and Power Testing
of SOT-223
Voltage Current Characteristic of SCR
Quadrant Definitions for a Triac
Symbol Parameter
VDRM Peak Repetitive Forward Off State Voltage
IDRM Peak Forward Blocking Current
VRRM Peak Repetitive Reverse Off State Voltage
IRRM Peak Reverse Blocking Current
VTM Maximum On State Voltage
IHHolding Current
Quadrant 1
Main Terminal 2+
VTM
IH
IDRM at VDRM
+Voltag
e
Off State
Quadrant 3
Main Terminal 2-
+Current
On State
IRRM at VRRM
IH
VTM
+
+
MT2 Positive
(Positive Half Cycle)
MT2 Negative
(Negative Half Cycle)
Quadrant IV
Quadrant I
Quadrant III
Quadrant II
IGT
IGT
(-) MT 2
(+) MT 2
(-) MT 2
(+) MT 2
(-) IGT
Gate
(-) IGT
Gate
(-) IGT
Gate
(-) IGT
Gate
REF
REF
REF
REF
MT 1
MT 1
MT 1
MT 1
All Polarities are referenced to MT1.
With in-phase signals (using standard AC lines) quadrants I and III are used
0.079
2.0
0.079
2.0
0.059
1.5
0.091
2.3
0.091
2.3
mm
inches
0.472
12.0
0.096
2.44
0.984
25.0
0.244
6.2
0.059
1.5
0.059
1.5
0.096
2.44
0.096
2.44
0.059
1.5
0.059
1.5
0.15
3.8
BOARD M
OUNTED VERTICALLY IN CINCH 8840 EDGE CONNECT
OR.
BOARD THICKNESS = 65 MIL., FOIL THICKNESS = 2.5 MIL.
MATERIAL: G10 FIBERGLASS BASE EPOXY
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© 2019 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 07/25/19
Thyristors
Surface Mount – 200V - 600V > MAC08BT1, MAC08MT1
Figure 5. Current Derating, 1.0 cm Square Pad Reference:
Ambient Temperature
Figure 4. Current Derating, Minimum Pad Size Reference:
Ambient Temperature
Figure 7. Current Derating Reference: MT2 Tab
Figure 6. Current Derating, 2.0 cm Square Pad Reference:
Ambient Temperature
TA
,
MAXIMUM ALLOWABLEAMBIENT TEMPERATURE ( C)°
I
T(RMS
)
,
RMS ON-STATE CURRENT (AMPS)
110
0.5
0.30.20.
1
0
100
90
80
60
50
40
30
20 0.4
70 dc
30° 60°
90°
α = 180°
MINIMUM FOOTPRINT
50 OR 60 Hz
120°
α
α
α =CONDUCTION
ANGLE
vT
,
INSTANTANEOUS ON-STATE VOLTAGE (VOLTS)
I
T
,
INSTANTANEOUS ON-STATE CURRENT (AMPS)
10
1.0
0.
1
0.01 5.04.03.02.01.00
TYPICAL AT TJ = 11C
MAX AT T
J = 11C
MAX AT T
J = 25°C
Figure 2. On-State Characteristics Figure 3. Junction to Ambient Thermal Resistance vs.
Copper Tab Area
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© 2019 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 07/25/19
Thyristors
Surface Mount – 200V - 600V > MAC08BT1, MAC08MT1
Figure 8. Power Dissipation Figure 9. Thermal Response, Device Mounted on Figure 1
Printed Circuit Board
Figure 10. Simplified Test Circuit to Measure the Critical Rate of Rise of Commutating Current (di/dt)
10
1.0
di/dt
c
,
RATE OF CHANGE OF COMMUTATING CURRENT (A/mS)
1.01 0
110°
VDRM
I
TM
tw
f =
1
2 tw
COMMUTATING dv/dt
dv/dt , (V/ S)
cµ
60°
80°
(d
i
dt
)
cTM
1000
100°
Figure 11. Typical Commutating dv/dt versus Current Crossing
Rate and Junction Temperature Figure 12. Typical Commutating dv/dt versus Junction
Temperature at 0.8 Amps RMS
COMMUTATING dv/dt
dv/dt , (V/ S)
cµ
10
1.0
TJ
,
JUNCTION TEMPERATURE
(
°C
)
908070 0
11
00
1
06
VDRM = 200 V
400 Hz
300 Hz
60 Hz
180 Hz
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© 2019 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 07/25/19
Thyristors
Surface Mount – 200V - 600V > MAC08BT1, MAC08MT1
Figure 16. Gate Trigger Voltage VariationFigure 15. Typical Holding Current Variation
V , GATE TRIGGER VOLTAGE (VOLTS)
1.
1
0.3
TJ
,
JUNCTION TEMPERATURE
(
°C
)
GT
02 01 0040 60 80
VGT2
VGT
1
VGT3 VGT4
HOLDING CURRENT (mA)
6.0
0
TJ
,
JUNCTION TEMPERATURE
(
°C
)
5.0
4.0
3.0
2.0
1.0
I
,
H
02 01 0040 60 80
MAIN TERMINAL #2
POSITIVE
MAIN TERMINAL #1
POSITIVE
STATIC dv/dt (V/ s)
60
20
RG
10 10,000
µ
600 Vpk
TJ = 11C
50
40
30
1000100
MAIN TERMINAL #2
POSITIVE
MAIN TERMINAL #1
POSITIVE
Figure 13. Exponential Static dv/dt versus Gate −
Main Terminal 1 Resistance Figure 14. Typical Gate Trigger Current Variation
TJ, JUNCTION TEMPER ATURE
(
°C
)
0.
1
10
0
I
1.0
I
GT4
I
GT
1
I
GT3
I
GT2
GT, GATE TRIGGER CURRENT (mA)
40 60 80
% L' leltuse“ mun
© 2019 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 07/25/19
Thyristors
Surface Mount – 200V - 600V > MAC08BT1, MAC08MT1
Dimensions Part Marking System
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
Dim Inches Millimeters
Min Nom Max Min Nom Max
A--- --- 0.071 --- --- 1.80
A1 0.001 0.003 0.005 0.02 0.07 0.13
b0.026 0.030 0.033 0.66 0.75 0.84
b1 0.114 0.118 0.122 2.90 3.00 3.10
c0.009 0.011 0.014 0.23 0.29 0.35
D0.260 0.260 0.264 6.60 6.60 6.71
E0.130 0.138 0.146 3.30 3.50 3.70
e--- 0.091 --- --- 2.30 ---
e1 0.030 0.037 0.045 0.75 0.95 1.15
L1 0.059 0.069 0.079 1.50 1.75 2.00
HE 0.268 0.276 0.283 6.80 7. 0 0 7.20
ø --- 10° --- 10°
Pin Assignment
1Main Terminal 1
2Main Terminal 2
3 Gate
4Main Terminal 2
Ordering Information
Device Package Type Shipping
MAC08BT1 SOT−223 1000 / Tape & Reel
MAC08BT1G SOT−223
(Pb−Free) 1000 / Tape & Reel
MAC08MT1 SOT−223 1000 / Tape & Reel
MAC08MT1G SOT−223
(Pb−Free) 1000 / Tape & Reel
Soldering Footprint
Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and
test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete
Disclaimer Notice at: www.littelfuse.com/disclaimer-electronics
A1
b1
D
E
b
e
e1
4
12 3
0.08 (0003)
A
L1
C
HE
SOT-223
Case 318E
Style 11
4
1
3
2
AC08X =Device Code
x =D, M, or N
Y =Year
M =Month
A =Assembly Site
XX =Lot Serial Code
G =Pb-Free Package
AC08x
YMAXX
1. 5
mm
in ch es
SCALE 6:
1
0.15
2. 0
0.079
6. 3
0.24 8
2. 3
0.091
2. 3
0.091
2. 0
0.079

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