iCG05 Series Datasheet by TDK-Lambda Americas Inc

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TDK-Lambda Advance Data Sheet: iCG Series , Non- isolated SMT Power Module . ISO Cenified manufacturing facilities 1-800-526-2324
Advance Data Sheet:
iCG
Series
Non
-
isolated SMT Power Module
©2015 TDK-Lambda Americas Inc.
2_iCG05_Full_Datasheet_111414.doc 10/4/2016
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iCG Series DC/DC Power Modules
2.4-5.5V Input, 6A Output
Surface Mount Power Module
iCG power modules perform local voltage conversion from either a
5V or 3.3V bus. The iCG05006A006V utilizes a low component
count that results in both a low cost structure and a high level of
performance. The open-frame, compact, surface mountable
design features an ultra-low profile and weight as well as
additional edge plated pads that allow for extremely flexible and
robust manufacturing processes.
Features
Size – 12.2mm x 12.2 mm x 8.5 mm
(0.48 in. x 0.48 in. x 0.335 in.)
DOSA Compatible Footprint
Edge plated castellations for forming
inspectable solder joints
Surface mountable
Maximum weight 3g (0.106 oz)
Up to 21.78W of output power in
high ambient temperature, low
airflow environments with no power
derating
Positive logic on/off
Flexible Output Voltage Sequencing
Starts with pre-biased output
Output voltage adjustment – industry
standard
Outstanding transient response
without the need for external loop
tuning components
Constant switching frequency
Remote Sense
Full, auto-recovery protection:
o Input under voltage
o Short circuit
o Thermal limit
ISO Certified manufacturing facilities
Optional Features
Negative logic on/off
No output voltage sequencing
Solder bumping for enhanced
solderability on the EPC footprint
TDK-Lambda Advance Data Sheet: iCG Series , Non- isolated SMT Power Module 1-800-526-2324
Advance Data Sheet:
iCG
Series
Non
-
isolated SMT Power Module
©2015 TDK-Lambda Americas Inc.
2_iCG05_Full_Datasheet_111414.doc 10/4/2016
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800
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TDK-Lambda Advance Data Sheet: iCG Series , Non- isolated SMT Power Module Mechanical S ecification: x H- l+ * r 9, [c7 ' n Hr an V1: mm: A L ( l_l an 7 2: 2E: :EE :ETAIL 7/ gain; {"1“ r TH,Ll\‘-l,>§ EIN "FT/“k LVNU um; Neiv’ 10 FLACE: Pin Locations: 457w; " 4biUec Cl’l;mler 'Llfidnl‘n?‘ (13 i 9 Pin Assignment: 1-800-526-2324
Advance Data Sheet:
iCG
Series
Non
-
isolated SMT Power Module
©2015 TDK-Lambda Americas Inc.
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Mechanical Specification:
Dimensions are in mm [in]. Unless otherwise specified tolerances are: x.x ± 0.5 [0.02], x.xx ± 0.25 [0.010]
-A-
A
-A-
A
Pin Locations: (bottom view)
DOSA PINS EPC PINS
PIN FUNCTION PIN FUNCTION
1 ON/OFF 6 TRIM
2 VIN 7 GND
3 GND 8 NC
4 VOUT 9 SEQ
5 SENSE 10 NC
Pin Assignment:
See ordering information
for solder bumping
options
TDK-Lambda Recommended Foot rim to vlew: 51 N E E 122m L:U/J 1219 an] i 119 [48317 ,ne7 II 1357 14"" 3:3LJ/3] 533,3. 1mm 1:711: x s n '94“) ) 4E6nmflf1fl] 5': r2437 D\ 3 :1 Arm 39' an] 331 15, [can] ‘Cf‘rh [04:] 151 . m] ‘ mmpr [J / v w L L” 751 [um a [m 15: [neg] ‘nnm 7 r4711 '21:; Man] 4 1-800-526-2324 :35] z 1 391 r‘sc] 1:451 us/ L423] 1214 [4731 Advance Data Sheet: iCG Series , Non- isolated SMT Power Module 1219 [mm 12 an L2CA 'mv [— 1, x Swm 7n] FLU: ' E'wr' [2711] x 4cm" ran] 3 F '1an [35m x SFNn mm] W / VJAELS
Advance Data Sheet:
iCG
Series
Non
-
isolated SMT Power Module
©2015 TDK-Lambda Americas Inc.
2_iCG05_Full_Datasheet_111414.doc 10/4/2016
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800
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Recommended Footprint (top view):
FOR DOSA STANDARD PADS FOR EPC PADS
TDK-Lambda Advance Data Sheet: iCG Series — Non- isolated SMT Power Module Absolute Maximum Ratin s: Ingut Characteristics: 1-800-526-2324
Advance Data Sheet:
iCG
Series
Non
-
isolated SMT Power Module
©2015 TDK-Lambda Americas Inc.
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Absolute Maximum Ratings:
Stress in excess of Absolute Maximum Ratings may cause permanent damage to the device.
* Engineering estimate
Input Characteristics:
Unless otherwise specified, specifications apply over all rated Input Voltage, Resistive Load, and Temperature conditions.
Characteristic
Min
Typ
Max
Unit
Notes & Conditions
Operating Input Voltage 2.4 --- 5.5 Vdc
Maximum Input Current --- --- 6.5 A Vin=2.4 to Vin,max; Io=Io,max
Startup Delay Time from application of input voltage --- 4 --- mS Vo=0 to 0.1*Vo,set; on/off=on,
Io=Io,max, Tc=25˚C
Startup Delay Time from on/off --- 4 --- mS Vo=0 to 0.1*Vo,set; Vin=Vi,nom,
Io=Io,max,Tc=25˚C
Output Voltage Rise Time --- 3 --- mS Io=Io,max,Tc=25˚C, Vo=0.1 to
0.9*Vo,set
Input Reflected Ripple --- 30 --- mApp See input/output ripple measurement
figure; BW=20 MHz
Input Ripple Rejection --- 40* --- dB @ 120 Hz
Turn on input voltage --- 2.1 --- V
Turn off input voltage --- 1.95 --- V
*Engineering Estimate
Caution: The power modules are not internally fused. An external input line normal blow fuse with a
maximum value of 10A is required, see the Safety Considerations section of the data sheet.
Character
istic
Min
Max
Unit
Notes & Conditions
Continuous Input Voltage -0.25 6 Vdc
Storage Temperature -55 125 ˚C
Operating Temperature Range (Tc) -40 115* ˚C Measured at the location specified in the thermal
measurement figure; maximum temperature varies
with output current – see curve in the thermal
performance section of the data sheet.
TDK-Lambda Advance Data Sheet: iCG Series , Non- isolated SMT Power Module Electrical Data: 1-800-526-2324
Advance Data Sheet:
iCG
Series
Non
-
isolated SMT Power Module
©2015 TDK-Lambda Americas Inc.
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Electrical Data:
Ch
aracteristic
Min
Typ
Max
Unit
Notes & Conditions
Output Voltage Initial Setpoint -2 - +2 % Vo=3.3Vsetting, Vin=Vin,nom; Io=Io,max;
Tc = 25˚C
Output Voltage Tolerance -3 - +3 % Over all rated input voltage, load, and
temperature conditions to end of life
Efficiency Vo = 1.2V
Vo = 1.5V
Vo = 1.8V
Vo = 2.5V
Vo = 3.3V
---
---
---
---
---
84
87
88
91
93
---
---
---
---
---
%
%
%
%
%
Vin=5V; Io=Io,max; Tc=25˚C
Line Regulation --- 3 --- mV Vin=Vin,min to Vin,max
Load Regulation --- 6 --- mV Io=Io,min to Io,max
Output Current 0 --- 6 A
Output Current Limiting Threshold --- 10 --- A Vo = 0.9*Vo,nom, Tc<Tc,max)
Short Circuit Current --- 0.5 --- A Vo = 0.25V, Tc = 25˚C
Output Ripple and Noise Voltage --- 15 --- mVpp Measured across one 0.1 uF ceramic
capacitor and one 47uF ceramic capacitor –
see input/output ripple measurement figure;
BW = 20MHz.
Output Voltage Adjustment Range 0.6 --- 3.63 V
Output Voltage Sense Range --- --- 0.5 V
Dynamic Response:
Recovery Time
Transient Voltage
---
---
20
100
---
---
uS
mV
di/dt =10A/uS, Vin=Vin,nom; Vo=1.5V, load
step from 25% to 75% of Io,max; Cout =
94uF
Switching Frequency --- 600 --- kHz Fixed
External Load Capacitance 47 --- 1000* uF
Vref 0.6 V Required for trim calculation
F 2000 Ω Required for trim calculation
*Please contact TDK - Lambda Americas for technical support for very low ESR capacitor banks or if higher capacitance is required
TDK-Lambda Advance Data Sheet: iCG Series , Non- isolated SMT Power Module Electrical Characteristics: 1-800-526-2324
Advance Data Sheet:
iCG
Series
Non
-
isolated SMT Power Module
©2015 TDK-Lambda Americas Inc.
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Electrical Characteristics:
Typical Efficiency vs. Input Voltage
92
92.5
93
93.5
94
94.5
95
95.5
96
96.5
97
0 0.6 1.2 1.8 2.4 3 3.6 4.2 4.8 5.4 6
Output Current (A)
Efficiency, h(%)
Vin = 4.5V Vin = 5V Vin = 5.5V
90
91
92
93
94
95
96
97
0 0.6 1.2 1.8 2.4 3 3.6 4.2 4.8 5.4 6
Output Current (A)
Efficiency, h(%)
Vin = 5V Vin = 3.3V
Vo = 3.3V Vo = 2.5V
83
85
87
89
91
93
95
0 0.6 1.2 1.8 2.4 3 3.6 4.2 4.8 5.4 6
Output Current (A)
Efficiency, h(%)
Vin = 5V Vin = 3.3V
80
82
84
86
88
90
92
94
96
0 0.6 1.2 1.8 2.4 3 3.6 4.2 4.8 5.4 6
Output Current (A)
Efficiency, h(%)
Vin = 5V Vin = 3.3V
Vo = 1.8V Vo = 1.5V
76
78
80
82
84
86
88
90
92
94
0 0.6 1.2 1.8 2.4 3 3.6 4.2 4.8 5.4 6
Output Current (A)
Efficiency, h(%)
Vin = 5V Vin = 3.3V
65
70
75
80
85
90
0 0.6 1.2 1.8 2.4 3 3.6 4.2 4.8 5.4 6
Output Current (A)
Efficiency, h(%)
Vin = 5V Vin = 3.3V
Vo = 1.2V Vo = 0.6V
TDK-Lambda Advance Data Sheet: iCG Series , Non- isolated SMT Power Module Electrical Characteristics: 1-800-526-2324
Advance Data Sheet:
iCG
Series
Non
-
isolated SMT Power Module
©2015 TDK-Lambda Americas Inc.
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Electrical Characteristics:
Typical Power Dissipation vs. Input Voltage
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
0 0.6 1.2 1.8 2.4 3 3.6 4.2 4.8 5.4 6
Output Current (A)
Power Dissipation (W)
Vin = 4.5V Vin = 5V Vin = 5.5V
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
0 0.6 1.2 1.8 2.4 3 3.6 4.2 4.8 5.4 6
Output Current (A)
Power Dissipation (W)
Vin = 5V Vin = 3.3V
Vo = 3.3V Vo = 2.5V
0
0.5
1
1.5
2
0 0.6 1.2 1.8 2.4 3 3.6 4.2 4.8 5.4 6
Output Current (A)
Power Dissipation (W)
Vin = 5V Vin = 3.3V
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
0 0.6 1.2 1.8 2.4 3 3.6 4.2 4.8 5.4 6
Output Current (A)
Power Dissipation (W)
Vin = 5V Vin = 3.3V
Vo = 1.8V Vo = 1.5V
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
0 0.6 1.2 1.8 2.4 3 3.6 4.2 4.8 5.4 6
Output Current (A)
Power Dissipation (W)
Vin = 5V Vin = 3.3V
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
0 0.6 1.2 1.8 2.4 3 3.6 4.2 4.8 5.4 6
Output Current (A)
Power Dissipation (W)
Vin = 5V Vin = 3.3V
Vo = 1.2V Vo = 0.6V
TDK-Lambda Advance Data Sheet: iCG Series , Non- isolated SMT Power Module Electrical Characteristics: 1-800-526-2324
Advance Data Sheet:
iCG
Series
Non
-
isolated SMT Power Module
©2015 TDK-Lambda Americas Inc.
2_iCG05_Full_Datasheet_111414.doc 10/4/2016
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800
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Electrical Characteristics:
Vo=1.8V Typical Output Ripple at nominal Input voltage and
full load at Ta=25 degrees Typical Output Short Circuit Current
Vo=1.8V Typical startup characteristic from on/off at full load.
Upper trace - output voltage, lower trace – on/off signal Vo=1.8V Typical Input Ripple at nominal Input Voltage and full
load at Ta=25 degrees. Input capacitors 2 x 22uF ceramic
Vo=1.8V Typical output voltage transient response to load step
from 0% to 50% of full load with output current slew rate of
10A/uS. (Cext = 1x47uF ceramic capacitor)
Vo=3.3V Typical output voltage transient response to load step
from 0% to 50% of full load with output current slew rate of
10A/uS. (Cext = 1x47uF ceramic capacitor)
Vert = 5A/div
Horz = 20ms/div
Vert = 10mV/div
Horz = 1us/div
CH1 = 1V/div
CH2 = 2V/div
Horz = 1ms/div Vert = 20mV/div
Horz = 1us/div
CH1 = 100mV/div
CH2 = 2A/div
Horz = 20us/div
CH1 = 100mV/div
CH2 = 2A/div
Horz = 20us/div
TDK-Lambda Advance Data Sheet: iCG Series , Non- isolated SMT Power Module Electrical Characteristics continued : 1-800-526-2324
Advance Data Sheet:
iCG
Series
Non
-
isolated SMT Power Module
©2015 TDK-Lambda Americas Inc.
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Electrical Characteristics (continued):
Typical Output Voltage vs. Input Voltage Characteristics
0
0.5
1
1.5
2
1.5 1.9 2.3 2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5
Input Voltage (V)
Output Voltage (V)
Io_min = 0A Io_mid = 3A Io_max = 6A
0
1
2
3
4
5
6
1.5 1.9 2.3 2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5
Input Voltage (V)
Input Current (A)
Io_min = 0A Io_mid = 3A Io_max = 6A
Vo=1.8V Typical Output Voltage vs. Input Voltage
Characteristics Vo=1.8V Typical Input Current vs. Input Voltage
Characteristics
3.2
3.22
3.24
3.26
3.28
3.3
3.32
0 1 2 3 4 5 6 7 8 9 10 11 12 13
Output Current (A)
Output Voltage (V)
Vin = 4.5V Vin = 5V Vin = 5.5V
3.28
3.29
3.3
3.31
3.32
0 0.6 1.2 1.8 2.4 3 3.6 4.2 4.8 5.4 6
Output Current (A)
Output Voltage (V)
Vin = 4.5V Vin = 5V Vin = 5.5V
Vo=3.3V Typical Current Limit Characteristics Vo=3.3V Typical load regulation
0
0.5
1
1.5
2
2.5
3
3.5
4
1 2 3 4 5 6
Input Voltage (V)
Output Voltage (V)
Upper Limit Lower Limit
Output Voltage versus Input Voltage Operating Range
TDK-Lambda Advance Data Sheet: iCG Series , Non- isolated SMT Power Module Thermal Performance: 1-800-526-2324
Advance Data Sheet:
iCG
Series
Non
-
isolated SMT Power Module
©2015 TDK-Lambda Americas Inc.
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800
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Thermal Performance:
0
1
2
3
4
5
6
7
45 65 85 105 125
Temperature (oC)
Output Current (A)
NC
Tc, Thermal
Limit
0
1
2
3
4
5
6
7
45 65 85 105 125
Temperature (oC)
Output Current (A)
NC
Tc, Thermal
Limit
Vo=3.3V, Vin=5V maximum output current vs. ambient
temperature at nominal input voltage for natural convection
(60lfm) with airflow from pin 3 to pin 7.
Vo=1.8V, Vin=5V maximum output current vs. ambient
temperature at nominal input voltage for natural convection
(60lfm) with airflow from pin 3 to pin 7.
0
1
2
3
4
5
6
7
45 65 85 105 125
Temperature (oC)
Output Current (A)
NC
Tc, Thermal
Limit
Temperature
measurement
location
on pad
Best Orientation
airflow
Q1
Vo=0.6V, Vin=5V maximum output current vs. ambient
temperature at nominal input voltage for natural convection
(60lfm) with airflow from pin 3 to pin 7.
iCG05006A006V thermal measurement location – top view
The thermal curves provided are based upon measurements made in TDK - Lambda Americas’ experimental test setup
that is described in the Thermal Management section. Due to the large number of variables in system design, TDK -
Lambda Americas recommends that the user verify the module’s thermal performance in the end application. The critical
component should be thermo coupled and monitored, and should not exceed the temperature limit specified in the
derating curve above. It is critical that the thermocouple be mounted in a manner that gives direct thermal contact or
significant measurement errors may result. TDK - Lambda Americas can provide modules with a thermocouple pre-
mounted to the critical component for system verification tests.
TDK-Lambda Advance Data Sheet: iCG Series 4 Non- isolated SMT Power Module Solderin Information: J 13¢ [‘48, Bil 3::< and="" place="" ’sdcet="" 4="" (m="" symbdl="" un="" ,abll)="" reflow="" soldering="" 1-800-526-2324="">
Advance Data Sheet:
iCG
Series
Non
-
isolated SMT Power Module
©2015 TDK-Lambda Americas Inc.
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Soldering Information:
iCG surface mountable power modules are intended to be compatible with standard surface mount component
soldering processes and either hand placed or automatically picked and placed. The figure below shows the position
for vacuum pick up. The maximum weight of the power module is 3g (0.106 oz.). Improper handling or cleaning
processes can adversely affect the appearance, testability, and reliability of the power modules. The iCG product is a
moisture sensitivity level 2 device. Contact TDK - Lambda Americas technical support for guidance regarding proper
handling, cleaning, and soldering of TDK - Lambda Americas’ power modules.
Reflow Soldering
The iCG platform is an open frame power module manufactured with SMT (surface mount technology). Due to the
high thermal mass of the power module and sensitivity to heat of some SMT components, extra caution should be
taken when reflow soldering. Failure to follow the reflow soldering guidelines described below may result in permanent
damage and/or affect performance of the power modules.
The iCG power modules can be soldered using natural convection, forced convection, IR (radiant infrared), and
convection/IR reflow technologies. The module should be thermally characterized in its application to develop a
temperature profile. Thermal couples should be mounted to terminal 3 and terminal 6 and be monitored. The
temperatures should be maintained below 260 degrees. Oven temperature and conveyer belt speeds should be
controlled to ensure these limits are not exceeded. In most manufacturing processes, the solder paste required to form
a reliable connection can be applied with a standard 6 mil stencil.
Recommended Reflow Profile
0
50
100
150
200
250
300
0 50 100 150 200 250 300 350
Reflow Time (seconds)
Temperature (ºC)
Liquidus Line
iCG Power Module suggested reflow-soldering profile
TDK-Lambda Advance Data Sheet: iCG Series , Non- isolated SMT Power Module ThermalMana ement: Adlaoenl PCB Module L/ i ! 12.7 g | i i i HiH 76+(3.0J AlRFLOW L /f fl AirVelccily and Ambient Temperature Air Passage Wind Tunnel Test Setup Figure 1-800-526-2324
Advance Data Sheet:
iCG
Series
Non
-
isolated SMT Power Module
©2015 TDK-Lambda Americas Inc.
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Thermal Management:
An important part of the overall system design process
is thermal management; thermal design must be
considered at all levels to ensure good reliability and
lifetime of the final system. Superior thermal design
and the ability to operate in severe application
environments are key elements of a robust, reliable
power module.
A finite amount of heat must be dissipated from the
power module to the surrounding environment. This
heat is transferred by the three modes of heat
transfer: convection, conduction and radiation. While
all three modes of heat transfer are present in every
application, convection is the dominant mode of heat
transfer in most applications. However, to ensure
adequate cooling and proper operation, all three
modes should be considered in a final system
configuration.
The open frame design of the power module provides
an air path to individual components. This air path
improves convection cooling to the surrounding
environment, which reduces areas of heat
concentration and resulting hot spots.
Test Setup: The thermal performance data of the
power module is based upon measurements obtained
from a wind tunnel test with the setup shown in the
wind tunnel figure. This thermal test setup replicates
the typical thermal environments encountered in most
modern electronic systems with distributed power
architectures. The electronic equipment in
networking, telecom, wireless, and advanced
computer systems operates in similar environments
and utilizes vertically mounted PCBs or circuit cards in
cabinet racks.
The power module, as shown in the figure, is mounted
on a printed circuit board (PCB) and is vertically
oriented within the wind tunnel. The cross section of
the airflow passage is rectangular. The spacing
between the top of the module and a parallel facing
PCB is kept at a constant (0.5 in). The power
module’s orientation with respect to the airflow
direction can have a significant impact on the
module’s thermal performance.
Thermal Derating:For proper application of the
power module in a given thermal environment, output
current derating curves are provided as a design
guideline on the Thermal Performance section for the
power module of interest. The module temperature
should be measured in the final system configuration
to ensure proper thermal management of the power
module. For thermal performance verification, the
module temperature should be measured at the
component indicated in the thermal measurement
location figure on the thermal performance page for
the power module of interest. In all conditions, the
power module should be operated below the
maximum operating temperature shown on the
derating curve. For improved design margins and
enhanced system reliability, the power module may be
operated at temperatures below the maximum rated
operating temperature.
Heat transfer by convection can be enhanced by
increasing the airflow rate that the power module
experiences. The maximum output current of the
power module is a function of ambient temperature
(TAMB) and airflow rate as shown in the thermal
performance figures on the thermal performance page
for the power module of interest. The curves in the
figures are shown for natural convection through 2 m/s
(400 ft/min). The data for the natural convection
condition has been collected at 0.3 m/s (60 ft/min) of
airflow, which is the typical airflow generated by other
heat dissipating components in many of the systems
that these types of modules are used in. In the final
system configurations, the airflow rate for the natural
convection condition can vary due to temperature
gradients from other heat dissipating components.
AIRFLOW
Air Vel
ocity and Ambient Temperature
Measurement Location
A
I
R
F
L
O
W
12.7
(0.50)
Module
Centerline
Air Passage
Centerline
Adjacent PCB
76 (3.0)
Wind Tunnel Test Setup Figure
Dimensions are in
millimeters and (inches).
TDK-Lambda Advance Data Sheet: iCG Series , Non- isolated SMT Power Module 0 eralin Information: i 1-800-526-2324
Advance Data Sheet:
iCG
Series
Non
-
isolated SMT Power Module
©2015 TDK-Lambda Americas Inc.
2_iCG05_Full_Datasheet_111414.doc 10/4/2016
-
800
-
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-
2324
14/16
Operating Information:
Over-Current Protection: The power modules have
short circuit protection to protect the module during
severe overload conditions. During overload
conditions, the power modules may protect
themselves by entering a hiccup current limit mode.
The modules will operate normally once the output
current returns to the specified operating range.
Remote On/Off: - The power modules have an
internal remote on/off circuit. The user must supply an
open-collector or compatible switch between the GND
pin and the on/off pin. The maximum voltage
generated by the power module at the on/off terminal
is 6V. The maximum allowable leakage current of the
switch is 10uA. The switch must be capable of
maintaining a low signal Von/off < 0.3V while sinking
2mA.
The standard on/off logic is positive logic. The power
module will turn on if terminal 1 (on/off) is left open
and will be off if terminal 1 is connected to terminal
GND. If the positive logic circuit is not being used,
terminal 1 should be left open.
GND
On/ Off
Vin (+)
On/Off Circuit for positive logic
An optional negative logic is available. In the circuit
configuration shown the power module will turn on if
the external switch is on and it will be off if the on/off
pin is pulled up to Vin by an external 3.6Kohm
resistor. If the negative logic feature is not being
used, terminal 1 should be left open.
GND
On/ Off
Vin (+)
Rpullup
On/Off Circuit for negative logic
Remote Sense: The power modules feature remote
sense to compensate for the effect of output
distribution drops. The output voltage sense range
defines the maximum voltage allowed between the
output power terminals and output sense terminals,
and it is found on the electrical data page for the
power module of interest. If the remote sense feature
is not being used, the Sense terminal should be
connected to the Vo terminal.
The output voltage at the Vo terminal can be
increased by either the remote sense or the output
voltage adjustment feature. The maximum voltage
increase allowed is the larger of the remote sense
range or the output voltage adjustment range; it is not
the sum of both.
As the output voltage increases due to the use of the
remote sense, the maximum output current may need
to be decreased for the power module to remain
below its maximum power rating.
Output Voltage Adjustment: The output voltage of
the power module may be adjusted by using an
external resistor connected between the Vout trim
terminal and GND terminal. If the output voltage
adjustment feature is not used, trim terminal should be
left open. Care should be taken to avoid injecting
noise into the power module’s trim pin.
TDK-Lambda Advance Data Sheet: iCG Series , Non- isolated SMT Power Module 1-800-526-2324
Advance Data Sheet:
iCG
Series
Non
-
isolated SMT Power Module
©2015 TDK-Lambda Americas Inc.
2_iCG05_Full_Datasheet_111414.doc 10/4/2016
-
800
-
526
-
2324
15/16
Trim
Vout(+)
Rup
GND
Circuit to increase output voltage
With a resistor between the trim and GND terminals,
the output voltage is adjusted up. To adjust the output
voltage from Vo,nom to Vo,up the trim resistor should
be chosen according to the following equation:
Ru Vref F( )
Voup Vonom( )
:= ohm
The values of Vref and F are found in the electrical
data section for the power module of interest. The
maximum power available from the power module is
fixed. As the output voltage is trimmed up, the
maximum output current must be decreased to
maintain the maximum rated power of the module.
e.g. Vo = 1.8V
Ru 0.6 2000
1.8 0.6
( )
:=
Vout (V) Ru (Kohm)
0.6 open
1.2 2
1.5 1.333
1.8 1
2.5 0.632
3.3 0.444
Voltage Sequencing:
Some iCG power modules include a voltage
sequence feature. The voltage sequence feature
enables the user to implement various types of power
up and power down sequencing schemes including
sequential startup, ratiometric startup, and
simultaneous startup. If the sequencing feature is not
being used the pin should be left open or tied to Vin.
When the voltage sequencing feature is used the pre-
bias immunity feature is disabled.
To use the voltage sequence feature, the module
should be set to an On state using the on/off feature.
The input voltage should be been applied and in the
specified operating range for 10mS during which a
50mV voltage potential should be maintained on the
sequence pin. After the 10mS interval, an analog
voltage can be applied to the sequence pin and the
module’s output will track the applied voltage on a one
to one basis until the output reaches its set point
voltage. The final sequence voltage must be higher
than the module set point. For sequential shut down,
the sequence pin voltage should be lowered. The
module will decrease its output voltage on a one to
one basis.
The voltage sequencing circuit has a brief internal
response time between the voltage appearing on the
sequence pin and impacting the output voltage. If
necessary, the impact of the time delay can be
minimized by limiting the slew rate of the voltage on
the sequence pin to less than 0.5 V/ms.
For additional assistance using the voltage
sequencing function, please contact TDK Lambda
Americas technical support.
EMC Considerations: TDK - Lambda Americas’
power modules are designed for use in a wide variety
of systems and applications. For assistance with
designing for EMC compliance, please contact TDK -
Lambda Americas’ technical support.
Input Impedance:
The source impedance of the power feeding the
DC/DC converter module will interact with the DC/DC
converter. To minimize the interaction, low-ESR
capacitors should be located at the input to the
module. It is recommended that a 22uF ceramic input
capacitor be placed as close as possible to the
module. Data is provided on the electrical
characteristics page, showing the typical input ripple
voltage with two 22uF ceramic capacitors (TDK part
C3225X7R1C226MT).
TDK-Lambda Reliability: Advance Data Sheet: iCG Series , Non- isolated SMT Power Module Qualiy: IngutIOthut Riggle and Noise Measurements: + i ‘ ‘ Voutput RLoad Salem Considerations: Warrang: “mm. mm mm: Snmfimnniam sunimxacmWnnxm-nm. 1-800-526-2324
Advance Data Sheet:
iCG
Series
Non
-
isolated SMT Power Module
©2015 TDK-Lambda Americas Inc.
2_iCG05_Full_Datasheet_111414.doc 10/4/2016
-
800
-
526
-
2324
16/16
Reliability:
The power modules are designed using TDK -
Lambda Americas’ stringent design guidelines for
component derating, product qualification, and design
reviews. The MTBF is calculated to be greater than
15M hours at full output power and Ta = 40˚C using
the Telcordia SR-332 calculation method.
Quality:
TDK - Lambda Americas’ product development
process incorporates advanced quality planning tools
such as FMEA and Cpk analysis to ensure designs
are robust and reliable. All products are assembled at
ISO certified assembly plants.
Input/Output Ripple and Noise Measurements:
100KHz
Voutput
Cext
1
2
+
1uH
1 2
esr<0.1
Battery
100KHz
+RLoad
1
2
esr<0.1 -
Vinput
200uF
1
2
Ground
Plane
300uF
1
2
-
The input reflected ripple is measured with a current probe and oscilloscope. The ripple current is the current through the 1uH inductor.
The output ripple measurement is made approximately 9 cm (3.5 in.) from the power module using an oscilloscope and BNC socket. The
capacitor Cext is located about 5 cm (2 in.) from the power module; its value varies from code to code and is found on the electrical data page
for the power module of interest under the ripple & noise voltage specification in the Notes & Conditions column.
Safety Considerations:
As of the publishing date, certain safety agency
approvals may have been received on the iCG series
and others may still be pending. Check with TDK -
Lambda Americas for the latest status of safety
approvals on the iCG product line.
For safety agency approval of the system in which the
DC-DC power module is installed, the power module
must be installed in compliance with the creepage and
clearance requirements of the safety agency.
To preserve maximum flexibility, the power modules
are not internally fused. An external input line normal
blow fuse with a maximum value of 10A is required by
safety agencies. A lower value fuse can be selected
based upon the maximum dc input current and
maximum inrush energy of the power module.
Warranty:
TDK - Lambda Americas’ comprehensive line of
power solutions includes efficient, high-density DC-DC
converters. TDK - Lambda Americas offers a three-
year limited warranty. Complete warranty information
is listed on our web site or is available upon request
from TDK - Lambda Americas.
Information furnished by TDK - Lambda Americas is believed to be accurate and reliable. However, TDK - Lambda Americas
assumes no responsibility for its use, nor for any infringement of patents or other rights of third parties, which may result from its
use. No license is granted by implication or otherwise under any patent or patent rights of TDK - Lambda Americas. TDK -
Lambda Americas components are not designed to be used in applications, such as life support systems, wherein failure or
malfunction could result in injury or death. All sales are subject to TDK - Lambda Americas’ Terms and Conditions of Sale, which
are available upon request.
Specifications are subject to change without notice.
TDK
-
Lambda Americas Inc.
401 Mile of Cars Way, Suite 325
National City, California 91950
Phone 1-800-526-2324
www.us.tdk-lambda.com/lp

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