FT-CAP, U2J Dielectric 10-50 VDC Datasheet by KEMET

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E‘ectromc Components KEII/IEI' CHARGED?
1© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1087_U2J_FT-CAP_SMD 8/12/2019
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
One world. One KEMET
Overview
The KEMET Flexible Termination (FT-CAP) Multilayer
Ceramic Capacitor in U2J dielectric incorporates a unique,
flexible termination system that is integrated with KEMET’s
standard termination materials. A conductive silver epoxy
is utilized between the base metal and nickel barrier layers
of the KEMET standard termination system in order to
establish pliability while maintaining terminal strength,
solderability and electrical performance. This technology
was developed in order to address the primary failure mode
of MLCCs — flex cracks, which are typically the result of
excessive tensile and shear stresses produced during
board flexure and thermal cycling. Flexible termination
technology inhibits the transfer of board stress to the
rigid ceramic body, therefore mitigating flex cracks which
can result in low insulation resistance (IR) or short circuit
failures. KEMET automotive grade capacitors meet the
demanding Automotive Electronics Council's AEC-Q200
qualification requirements.
Although this technology does not eliminate the potential
for mechanical damage that may propagate during extreme
environmental and handling conditions, it does provide
superior flex performance over standard termination
systems. FT-CAP complements KEMET’s Open Mode,
Floating Electrode (FE-CAP), Floating Electrode with Flexible
Termination (FF-CAP), and KEMET Power Solutions (KPS)
product lines provide a complete portfolio of flex mitigation
solutions.
Combined with the stability of U2J dielectric and designed
to accommodate all capacitance requirements, these flex-
robust devices are RoHS compliant, offer up to 5 mm of
flex-bend capability and capacitance change limited to –750
±20 ppm/°C from –55°C to +125°C. These devices are lead-
free, RoHS and REACH compliant without exception and are
capable of withstanding multiple passes through a lead-free
solder reflow profile.
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Flexible Termination System (FT-CAP), U2J Dielectric,
10 – 100 VDC (Commercial & Automotive Grade)
Ordering Information
C1206 X104 J 3 J A C TU
Ceramic
Case Size
(L" x W")
Specification/
Series
Capacitance
Code (pF)
Capacitance
Tolerance1
Rated Voltage
(VDC) Dielectric Failure Rate/
Design Termination Finish Packaging/
Grade (C-Spec)
0603
0805
1206
1210
1812
X = Flexible
Termination
Two significant
digits and
number of
zeros.
F = ±1%
G = ±2%
J = ±5%
K = ±10%
M = ±20%
8 = 10
4 = 16
3 = 25
5 = 50
1 = 100
J = U2J A = N/A C = 100% Matte Sn See
"Packaging
C-Spec
Ordering
Options Table"
1 Additional capacitance tolerance offerings may be available. Contact KEMET for details.
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Elecrmmc Compancnls KEIl/IEI' EHARGED! 7411 (EIA 0603 and smaller case sizes) 7210 (EIA 0805 and larger case sizes) AUT07411 (EIA 0603 and smaller case sizes) AUT07210 (EIA 0805 and larger case sizes)
2© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1087_U2J_FT-CAP_SMD 8/12/2019
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Flexible Termination System (FT-CAP), U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)
Packaging C-Spec Ordering Options Table
Packaging Type1Packaging/Grade
Ordering Code (C-Spec)
Commercial Grade1
Bulk Bag/Unmarked
Not required (Blank)
7" Reel/Unmarked
TU
13" Reel/Unmarked
7411 (EIA 0603 and smaller case sizes)
7210 (EIA 0805 and larger case sizes)
7" Reel/Unmarked/2 mm pitch
2
7081
13" Reel/Unmarked/2 mm pitch
2
7082
Automotive Grade
3
7" Reel
AUTO
13" Reel/Unmarked
AUTO7411 (EIA 0603 and smaller case sizes)
AUTO7210 (EIA 0805 and larger case sizes)
7" Reel/Unmarked/2 mm pitch
2
3190
13" Reel/Unmarked/2 mm pitch
2
3191
1 Default packaging is “Bulk Bag.” An ordering code C-Spec is not required for “Bulk Bag” packaging.
1 The terms “Marked” and “Unmarked” pertain to laser marking option of capacitors. All packaging options labeled as “Unmarked” will contain
capacitors that have not been laser marked. The option to laser mark is not available on these devices. For more information see “Capacitor Marking.
2 The 2 mm pitch option allows for double the packaging quantity of capacitors on a given reel size. This option is limited to EIA 0603 (1608 metric) case
size devices. For more information regarding 2 mm pitch option see “Tape & Reel Packaging Information.
3 Reeling tape options (paper or plastic) are dependent on capacitor case size (l" x w") and thickness dimensions. See "Chip Thickness/Tape & Reel
Packaging Quantities" and "Tape & Reel Packaging Information.
3 For additional information regarding "AUTO" C-Spec options, see "Automotive C-Spec Information."
3 All automotive packaging C-Specs listed exclude the option to laser mark components. The option to laser mark is not available on these devices.
For more information see "Capacitor Marking.
Benefits
AEC–Q200 automotive qualified
Low dissipation factor DF < 0.1%
Low noise solution similar to C0G
Low ESR and ESL
High thermal stability
High ripple current capability
Preferred capacitance solution at line frequencies and into the MHz range
Retains over 99% of nominal capacitance at full rated voltage
Small predictable and linear capacitance change with respect to temperature
Operating temperature range of −55°C to +125°C
Capacitance up to 470 nF
DC voltage ratings up to 100 V
Lead (Pb)-free, RoHS and REACH compliant
Non-polar device, minimizing installation concerns
100% pure matte Tin-plated termination finish allowing for excellent solderability
ammmc compmm KEIVIEI' crummy:
3© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1087_U2J_FT-CAP_SMD 8/12/2019
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Flexible Termination System (FT-CAP), U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)
Automotive C-Spec Information
KEMET automotive grade products meet or exceed the requirements outlined by the Automotive Electronics Council.
Details regarding test methods and conditions are referenced in document AEC–Q200, Stress Test Qualifi cation for Passive
Components. These products are supported by a Product Change Notifi cation (PCN) and Production Part Approval Process
warrant (PPAP).
Automotive products offered through our distribution channel have been assigned an inclusive ordering code C-Spec, “AUTO.
This C-Spec was developed in order to better serve small and medium-sized companies that prefer an automotive grade
component without the requirement to submit a customer Source Controlled Drawing (SCD) or specifi cation for review by a
KEMET engineering specialist. This C-Spec is therefore not intended for use by KEMET OEM automotive customers and are
not granted the same “privileges” as other automotive C-Specs. Customer PCN approval and PPAP request levels are limited
(see details below.)
Product Change Notifi cation (PCN)
The KEMET product change notifi cation system is used to communicate primarily the following types of changes:
• Product/process changes that affect product form, fi t, function, and/or reliability
• Changes in manufacturing site
• Product obsolescence
KEMET Automotive
C-Spec
Customer Notifi cation Due To: Days Prior To
Implementation
Process/Product change Obsolescence*
KEMET assigned1Yes (with approval and sign off) Yes 180 days minimum
AUTO Yes (without approval) Yes 90 days minimum
1 KEMET assigned C-Specs require the submittal of a customer SCD or customer specifi cation for review. For additional information contact KEMET.
Production Part Approval Process (PPAP)
The purpose of the Production Part Approval Process is:
• To ensure that supplier can meet the manufacturability and quality requirements for the purchased parts.
• To provide the evidence that all customer engineering design records and specifi cation requirements are properly
understood and fulfi lled by the manufacturing organization.
• To demonstrate that the established manufacturing process has the potential to produce the part.
KEMET Automotive
C-Spec
PPAP (Product Part Approval Process) Level
12345
KEMET assigned1●●●●●
AUTO
1 KEMET assigned C-Specs require the submittal of a customer SCD or customer specifi cation for review. For additional information contact KEMET.
Part number specifi c PPAP available
Product family PPAP only
ammm Compancnls KEIVIEI' EHARGED! 1.60 (0.053) 0.00 (0,032) 0.45 (0,010) 1 0.17 (0,007) g 0.15 (0,005) 1 0.15 (0.005) 2.00 (0.079) 1.25 (0,049) 0.50 (0.02) z 0.30 (0.012) 2 0.30 (0.012) 2 0.25 (0,010) 3.30 (0.130) 1.60 (0.063) 0.50 (0.024) :0.40(0,015) 2035(0013) 2025(0010) 3.30 (0130) 250(0102) 050 (0.024) :0.40(0,015) 2030(0012) 2025(0010) 4.50 (0.170) 3.20 (0.125) 0.70 (0,020) :0.40(0,015) :0.30(0.012) 1035(0014)
4© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1087_U2J_FT-CAP_SMD 8/12/2019
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Flexible Termination System (FT-CAP), U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)
Applications
Typical applications include critical timing, tuning, circuits requiring low loss, circuits with pulse, high current, decoupling,
bypass, filtering, transient voltage suppression and blocking, as well as energy storage in critical and safety relevant circuits
without (integrated) current limitation, including those subject to high levels of board flexure or temperature cycling.
Dimensions – Millimeters (Inches)
L
B
W
S
T
EIA
Size
Code
Metric
Size
Code
L
Length
W
Width
T
Thickness
B
Bandwidth
S
Separation
Minimum
Mounting
Technique
0603 1608
1.60 (0.063)
± 0.17 (0.007)
0.80 (0.032)
± 0.15 (0.006)
See Table 2
for thickness
0.45 (0.018)
± 0.15 (0.006)
0.58 (0.023)
Solder wave
or
Solder reflow
0805 2012
2.00 (0.079)
± 0.30 (0.012)
1.25 (0.049)
± 0.30 (0.012)
0.50 (0.02)
± 0.25 (0.010)
0.75 (0.030)
1206 3216
3.30 (0.130)
± 0.40 (0.016)
1.60 (0.063)
± 0.35(0.013)
0.60 (0.024)
± 0.25 (0.010)
N/A1210 3225
3.30 (0.130)
± 0.40 (0.016)
2.60(0.102)
± 0.30(0.012)
0.60 (0.024)
± 0.25 (0.010)
Solder reflow
only
1812 4532
4.50 (0.178)
± 0.40 (0.016)
3.20 (0.126)
± 0.30 (0.012)
0.70 (0.028)
± 0.35 (0.014)
ammmc compmm KEIl/IEI' EHARGED!
5© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1087_U2J_FT-CAP_SMD 8/12/2019
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Flexible Termination System (FT-CAP), U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)
Qualification/Certification
Commercial grade products are subject to internal qualification. Details regarding test methods and conditions are
referenced in Table 4, Performance & Reliability.
Automotive grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details
regarding test methods and conditions are referenced in the document AEC–Q200, Stress Test Qualification for Passive
Components. For additional information regarding the Automotive Electronics Council and AEC–Q200, please visit their
website at www.aecouncil.com.
Environmental Compliance
Lead (Pb)-free, RoHS, and REACH compliant without exemptions.
Electrical Parameters/Characteristics
Item Parameters/Characteristics
Operating Temperature Range −55°C to +125°C
Capacitance Change with Reference to +25°C and 0 VDC Applied
(TCC) 750 ±120 ppm/ºC
Aging Rate (Maximum % Capacitance Loss/Decade Hour) 0.1%
Dielectric Withstanding Voltage (DWV) 250% of rated voltage
Dissipation Factor (DF) Maximum Limit at 25ºC 0.1%
Insulation Resistance (IR) Limit at 25°C 1,000 MΩ µF or 100 GΩ
(Rated voltage applied for 120 ±5 seconds at 25°C)
To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits.
Capacitance and dissipation factor (DF) measured under the following conditions:
1 MHz ±100 kHz and 1.0 ±0.2 Vrms if capacitance ≤ 1,000 pF
1 kHz ±50 Hz and 1.0 ±0.2 Vrms if capacitance > 1,000 pF
Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 and Agilent E4980 have a feature known
as Automatic Level Control (ALC). The ALC feature should be switched to "ON."
ammmc compmm KEIVIEI' crummy: Capacitance vs. Temperature (TCC) 10% of Inmal llmll
6© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1087_U2J_FT-CAP_SMD 8/12/2019
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Flexible Termination System (FT-CAP), U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)
Electrical Characteristics (Typical)
−15
−10
−5
0
5
10
15
−60 −40 −20 0 20 40 60 80 100 120 140
Capacitance Change (%)
Temperature (°C)
Capacitance vs. Temperature (TCC)
Post Environmental Limits
High Temperature Life, Biased Humidity, Moisture Resistance
Dielectric Rated DC
Voltage
Capacitance
Value
Dissipation Factor
(Maximum %)
Capacitance
Shift
Insulation
Resistance
U2J All All 0.5 0.3% or ±0.25 pF
10% of Initial
limit
Elccxmmc compmm KEIl/IEI' crummy: capacilance Tnlelance Praducl Availability and Chip Thickness Codes See Table 2 fol Chip Thickness n imensians
7© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1087_U2J_FT-CAP_SMD 8/12/2019
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Flexible Termination System (FT-CAP), U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)
Table 1A – Capacitance Range/Selection Waterfall (0603 – 1812 Case Sizes)
Capacitance Cap
Code
Case Size/
Series C0603X C0805X C1206X C1210X C1812X
Voltage Code 8 4 3 5 8 4 3 5 8 4 3 5 8 4 3 5 1 8 4 3
Rated Voltage (VDC)
10
16
25
50
10
16
25
50
10
16
25
50
10
16
25
50
100
10
16
25
Capacitance
Tolerance
Product Availability and Chip Thickness Codes
See Table 2 for Chip Thickness Dimensions
1,000 pF 102 F G J K M CF CF CF CF
1,100 pF 112 F G J K M CF CF CF CF
1,200 pF 122 F G J K M CF CF CF CF
1,300 pF 132 F G J K M CF CF CF CF
1,500 pF 152 F G J K M CF CF CF CF
1,600 pF 162 F G J K M CF CF CF CF
1,800 pF 182 F G J K M CF CF CF CF
2,000 pF 202 F G J K M CF CF CF CF
2,200 pF 222 F G J K M CF CF CF CF
2,400 pF 242 F G J K M CF CF CF CF
2,700 pF 272 F G J K M CF CF CF CF
3,000 pF 302 F G J K M CF CF CF CF
3,300 pF 332 F G J K M CF CF CF CF
3,600 pF 362 F G J K M CF CF CF CF
3,900 pF 392 F G J K M CF CF CF CF
4,300 pF 432 F G J K M CF CF CF CF
4,700 pF 472 F G J K M CF CF CF CF DC DC DC DC
5,100 pF 512 F G J K M CF CF CF CF DC DC DC DC
5,600 pF 562 F G J K M CF CF CF CF DC DC DC DC
6,200 pF 622 F G J K M CF CF CF CF DC DC DC DC
6,800 pF 682 F G J K M CF CF CF CF DC DC DC DC
7,500 pF 752 F G J K M CF CF CF CF DC DC DC DC
8,200 pF 822 F G J K M CF CF CF CF DC DC DC DC
9,100 pF 912 F G J K M CF CF CF CF DC DC DC DC
10,000 pF 103 F G J K M CF CF CF CF DC DC DC DC EB EB EB EB FB FB FB FB FB
12,000 pF 123 F G J K M CF CF CF DC DC DC DC EB EB EB EB FB FB FB FB FB
15,000 pF 153 F G J K M CF CF CF DC DC DC DC EB EB EB EB FB FB FB FB FB
18,000 pF 183 F G J K M DC DC DC DC EB EB EB EB FB FB FB FB FB
22,000 pF 223 F G J K M DC DC DC DD EB EB EB EB FB FB FB FB FB
27,000 pF 273 F G J K M DD DD DD DD EB EB EB EB FB FB FB FB FB
33,000 pF 333 F G J K M DD DD DD DG EB EB EB EB FB FB FB FB FC GB GB GB
39,000 pF 393 F G J K M DG DG DG DG EB EB EB EB FB FB FB FB FC GB GB GB
47,000 pF 473 F G J K M DG DG DG DG EB EB EB EB FB FB FB FB FC GB GB GB
56,000 pF 563 F G J K M DG DG DG EB EB EB EC FB FB FB FB FE GB GB GB
68,000 pF 683 F G J K M EC EC EC EC FB FB FB FB FG GB GB GB
82,000 pF 823 F G J K M EC EC EC EE FB FB FB FB FG GB GB GB
100,000 pF 104 F G J K M EC EC EC EF FB FB FB FC FG GB GB GB
120,000 pF 124 F G J K M EF EP EF EH FC FC FC FE FH GB GB GB
150,000 pF 154 F G J K M EF EF EF EH FE FE FE FG FT GB GB GB
180,000 pF 184 F G J K M EH EH EH FG FG FG FG FK GB GB GB
220,000 pF 224 F G J K M EH EH EH FG FG FG FH GB GB GB
270,000 pF 274 F G J K M FH FH FH FM GB GB GB
330,000 pF 334 F G J K M FM FM FM GC GC GC
390,000 pF 394 F G J K M GH GH GH
470,000 pF 474 F G J K M GK GK GK
Capacitance Cap Code
Rated Voltage (VDC)
10
16
25
50
10
16
25
50
10
16
25
50
10
16
25
50
100
10
16
25
Voltage Code 8 4 3 5 8 4 3 5 8 4 3 5 8 4 3 5 1 8 4 3
Case Size/Series C0603X C0805X C1206X C1210X C1812X
ammm Compancnls KEIVIEI' crummy: CF 00 DD DG EB EC EE EF EP EH F0 F0 FE FG FH FM FT FK GB 60 GH GK 0603 0805 0805 0805 1206 1206 1206 1206 1206 1206 1210 1210 1210 1210 1210 1210 1210 1210 1812 1812 1812 1812 00020.07" 0.702010 0.902010 12520.15 0.702010 0.902010 1.102010 1.202015 1.2020 20 1.50 2 0 20 0.702010 0.902010 10020.10 12520.15 15520.15 170 2 0.20 190 2 0.20 21020.20 1.002010 1.102010 14020.15 1.602020 4.000 4.000 ooooooooooooooooo 15,000 10,000 ccaaaaacccccaaaaa 4.000 4.000 2.500 4.000 4.000 2.500 2.500 2.500 2.000 4.000 4.000 2.500 2.500 2.000 2.000 2.000 2.000 1.000 1.000 1.000 1.000 10.000 10.000 10.000 10.000 10.000 10.000 10.000 10.000 8.000 10.000 10.000 10.000 10.000 0.000 8.000 8.000 8.000 4.000 4.000 4.000 4.000
8© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1087_U2J_FT-CAP_SMD 8/12/2019
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Flexible Termination System (FT-CAP), U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)
Table 2A – Chip Thickness/Tape & Reel Packaging Quantities
Thickness
Code
Case
Size1
Thickness ±
Range (mm)
Paper Quantity1Plastic Quantity
7" Reel 13" Reel 7" Reel 13" Reel
CF
0603
0.80 ± 0.07*
4,000
15,000
0
0
DC
0805
0.78 ± 0.10
0
0
4,000
10,000
DD
0805
0.90 ± 0.10
0
0
4,000
10,000
DG
0805
1.25 ± 0.15
0
0
2,500
10,000
EB
1206
0.78 ± 0.10
4,000
10,000
4,000
10,000
EC
1206
0.90 ± 0.10
0
0
4,000
10,000
EE
1206
1.10 ± 0.10
0
0
2,500
10,000
EF
1206
1.20 ± 0.15
0
0
2,500
10,000
EP
1206
1.20 ± 0.20
0
0
2,500
10,000
EH
1206
1.60 ± 0.20
0
0
2,000
8,000
FB
1210
0.78 ± 0.10
0
0
4,000
10,000
FC
1210
0.90 ± 0.10
0
0
4,000
10,000
FE
1210
1.00 ± 0.10
0
0
2,500
10,000
FG
1210
1.25 ± 0.15
0
0
2,500
10,000
FH
1210
1.55 ± 0.15
0
0
2,000
8,000
FM
1210
1.70 ± 0.20
0
0
2,000
8,000
FT
1210
1.90 ± 0.20
0
0
2,000
8,000
FK
1210
2.10 ± 0.20
0
0
2,000
8,000
GB
1812
1.00 ± 0.10
0
0
1,000
4,000
GC
1812
1.10 ± 0.10
0
0
1,000
4,000
GH
1812
1.40 ± 0.15
0
0
1,000
4,000
GK
1812
1.60 ± 0.20
0
0
1,000
4,000
Thickness
Code
Case
Size1
Thickness ±
Range (mm)
7" Reel 13" Reel 7" Reel 13" Reel
Paper Quantity1Plastic Quantity
Package quantity based on finished chip thickness specifications.
1 If ordering using the 2 mm Tape & Reel pitch option, the packaging quantity outlined in the table above will be doubled. This option is limited to EIA 0603
(1608 metric) case size devices. For more information regarding 2 mm pitch option see “Tape & Reel Packaging Information.
Table 2B – Bulk Packaging Quantities
Packaging Type Loose Packaging
Bulk Bag (default)
Packaging C-Spec1N/A2
Case Size Packaging Quantities (pieces/unit packaging)
EIA (in) Metric (mm) Minimum Maximum
0603
1608
150,000
0805
2012
1206
3216
1210
3225
1812
4532
20,000
1 The "Packaging C-Spec" is a 4 to 8 digit code which identifies the packaging type and/or product grade. When ordering, the proper code must be
included in the 15th through 22nd character positions of the ordering code. See "Ordering Information" section of this document for further details.
Commercial Grade product ordered without a packaging C-Spec will default to our standard "Bulk Bag" packaging. Contact KEMET if you require a bulk
bag packaging option for automotive grade products.
2 A packaging C-Spec (see note 1 above) is not required for "Bulk Bag" packaging (excluding Anti-Static Bulk Bag and automotive grade products). The
15th through 22nd character positions of the ordering code should be left blank. All product ordered without a packaging C-Spec will default to our
standard "Bulk Bag" packaging.
E‘ucuomc Compcnonu K CHARGED!
9© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1087_U2J_FT-CAP_SMD 8/12/2019
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Flexible Termination System (FT-CAP), U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)
Table 3 – Chip Capacitor Land Pattern Design Recommendations per IPC–7351 (mm)
EIA
Size
Code
Metric
Size
Code
Density Level A:
Maximum (Most)
Land Protrusion (mm)
Density Level B:
Median (Nominal)
Land Protrusion (mm)
Density Level C:
Minimum (Least)
Land Protrusion (mm)
C Y X V1 V2 C Y X V1 V2 C Y X V1 V2
0603 1608 0.85 1.25 1.10 4.00 2.10 0.75 1.05 1.00 3.10 1.50 0.65 0.85 0.90 2.40 1.20
0805 2012 0.99 1.44 1.66 4.47 2.71 0.89 1.24 1.56 3.57 2.11 0.79 1.04 1.46 2.42 1.81
1206 3216 1.59 1.62 2.06 5.85 3.06 1.49 1.42 1.96 4.95 2.46 1.39 1.22 1.86 4.25 2.16
1210 3225 1.59 1.62 3.01 5.90 4.01 1.49 1.42 2.91 4.95 3.41 1.39 1.22 2.81 4.25 3.11
1812 4532 2.10 1.80 3.60 7.00 4.60 2.00 1.60 3.50 6.10 4.00 1.90 1.40 3.40 5.40 3.70
Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow
solder processes. KEMET only recommends wave soldering of EIA 0603, 0805, and 1206 case sizes.
Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes.
Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform
qualification testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).
Image below based on Density Level B for an EIA 1210 case size.
Y
C C
X X
V1
V2
Grid Placement Courtyard
Y
cccccccccccccccccccc Emma): mmmmmmm
10© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1087_U2J_FT-CAP_SMD 8/12/2019
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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Flexible Termination System (FT-CAP), U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)
Soldering Process
Recommended Soldering Technique:
• Solder wave or solder reflow for EIA case sizes 0603, 0805 and 1206
• All other EIA case sizes are limited to solder reflow only
Recommended Reflow Soldering Profile:
The KEMET families of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual),
convection, IR or vapor phase reflow techniques. Preheating of these components is recommended to avoid extreme thermal
stress. The KEMET recommended profile conditions for convection and IR reflow reflect the profile conditions of the IPC/J-
STD-020 standard for moisture sensitivity testing. These devices can safely withstand a maximum of three reflow passes at
these conditions.
Profile Feature Termination Finish
SnPb 100% Matte Sn
Preheat/Soak
Temperature Minimum (TSmin)
100°C
150°C
Temperature Maximum (T
Smax
)150°C 200°C
Time (tS) from TSmin to TSmax
60 – 120 seconds
60 – 120 seconds
Ramp-Up Rate (TL to TP)3°C/second
maximum
3°C/second
maximum
Liquidous Temperature (TL)183°C 217°C
Time Above Liquidous (tL)60 – 150 seconds 60 – 150 seconds
Peak Temperature (TP)235°C 260°C
Time Within 5°C of Maximum
Peak Temperature (tP)
20 seconds
maximum
30 seconds
maximum
Ramp-Down Rate (TP to TL)6°C/second
maximum
C/second
maximum
Time 25°C to Peak
Temperature 6 minutes maximum 8 minutes maximum
Note: All temperatures refer to the center of the package, measured on the
capacitor body surface that is facing up during assembly reflow.
Time
Temperature
Tsmin
25
Tsmax
TL
TPMaximum Ramp-up Rate = 3°C/second
Maximum Ramp-down Rate = 6°C/second
tP
tL
ts
25°C to Peak
Electronic Componcnls KEIl/IEI' EHARGED! 5 N (051 kg) Load Humidity: 1,000 hours 85"Cl85% RH and rated voltage. Add 100 K ohm resistor. Measurement at 24 hours 24 hours aitertest conclusion. Low Volt Humidity: 1.000 hours 850/8516 RH and 1.5 V. Add 100 K ohm resistor. Measurement at 24 hours 24 hours aitertest conclusion. t = 24 nours/cycle. Steps 7a and 7b not required. Measurement at 24 hours 24 hours alter test conclusion. 755"C/+125’C. Note: Number of cycles required 7 300. Maximum translertime 7 20 seconds. Dwell time 715 minutes, Air 7 air. M|L7STD7202 Method 108/EIA 7198 5 G‘s lor 20 minutes, 12 cycles each ol 3 orientations. Note: Use 8" X 5" PCB 0.031“ thick 7 secure points on one long side and 2 secure points at corners of mounted Within 2" from any secure point, Test from 10 7 2,000 Hz
11© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1087_U2J_FT-CAP_SMD 8/12/2019
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Flexible Termination System (FT-CAP), U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)
Table 4 – Performance & Reliability: Test Methods and Conditions
Stress Reference Test or Inspection Method
Terminal Strength JIS–C–6429 Appendix 1, Note:
Board Flex JIS–C–6429 Appendix 2, Note: 3.0 mm (minimum)
Solderability J–STD–002
Magnification 50 X Conditions:
a) Method B, 4 hours at 155°C, dry heat at 235°C
b) Method B, at 215°C, category 3
c) Method D, at 260°C, category 3
Temperature Cycling JESD22 Method JA-104 1,000 cycles (−55°C to +125°C). Measurement at 24 hours ±4 hours after test conclusion.
Biased Humidity MIL-STD-202 Method 103
Load Humidity: 1,000 hours 85°C/85% RH and rated voltage. Add 100 K ohm resistor.
Measurement at 24 hours ±4 hours after test conclusion.
Low Volt Humidity: 1,000 hours 85C°/85% RH and 1.5 V. Add 100 K ohm resistor.
Measurement at 24 hours ±4 hours after test conclusion.
Moisture Resistance MIL-STD-202 Method 106
t = 24 hours/cycle. Steps 7a and 7b not required. Measurement at 24 hours ±4 hours after
test conclusion.
Thermal Shock MIL-STD-202 Method 107
55°C/+125°C. Note: Number of cycles required 300. Maximum transfer time 20
seconds. Dwell time 15 minutes. Air air.
High Temperature Life
MIL-STD-202
Method 108/EIA -198
1,000 hours at 125°C with 2 X rated voltage applied.
Storage Life MIL-STD-202 Method 108 125°C, 0 VDC for 1,000 hours.
Vibration MIL-STD-202 Method 204
5 G's for 20 minutes, 12 cycles each of 3 orientations. Note: Use 8" X 5" PCB 0.031" thick
7 secure points on one long side and 2 secure points at corners of opposite sides. Parts
mounted within 2" from any secure point. Test from 10 2,000 Hz
Mechanical Shock MIL-STD-202 Method 213 Figure 1 of Method 213, Condition F.
Resistance to Solvents MIL-STD-202 Method 215 Add aqueous wash chemical, OKEM clean or equivalent.
Storage and Handling
Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in
other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres,
and long term storage. In addition, packaging materials will be degraded by high temperature – reels may soften or warp,
and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40ºC and maximum
storage humidity not exceed 70% relative humidity. Temperature fluctuations should be minimized to avoid condensation on
the parts and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized solderability chip stock
should be used promptly, preferably within 1.5 years of receipt.
Package Size (L" x W") Force Duration
0402
5 N (0.51 kg)
60 seconds
0603
10 N (1.02 kg)
≥ 0805
18 N (1.83 kg)
.................... CHARGED!
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Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Flexible Termination System (FT-CAP), U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)
Construction
Detailed Cross Section
Barrier Layer
(Ni)
Epoxy Layer
(Ag)
End Termination/
External Electrode
(Cu)
Barrier Layer
(Ni)
Epoxy Layer
(Ag)
End Termination/
External Electrode
(Cu)
Inner Electrodes
(Ni)
Inner Electrodes
(Ni)
Termination Finish
(100% Matte
Sn/SnPb–5% Pb min)
Termination Finish
(100% Matte
Sn/SnPb–5% Pb min)
Dielectric Material
(CaZrO3)
Dielectric Material
(CaZrO3)
Capacitor Marking (Optional):
Laser marking option is not available on:
C0G, U2J, Ultra Stable X8R and Y5V dielectric devices
EIA 0402 case size devices
EIA 0603 case size devices with flexible termination option.
KPS commercial and automotive grade stacked devices.
These capacitors are supplied unmarked only.
ammm Compancnls KEIVIEI' Emma): Bmm.12mm 180mm (700») mmmm camenape KPS1812 and 2220
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Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Flexible Termination System (FT-CAP), U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)
Tape & Reel Packaging Information
KEMET offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with
EIA Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for
details on reeling quantities for commercial chips.
8 mm, 12 mm
or 16 mm carrier tape
180 mm (7.00")
or
330 mm (13.00")
Anti-static reel
Embossed plastic* or
punched paper carrier.
Embossment or punched cavity
Anti-static cover tape
(0.10 mm (0.004") maximum thickness)
Chip and KPS orientation in pocket
(except 1825 commercial, and 1825 and 2225 Military)
*EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only.
KEMET
®
Bar code label
Sprocket holes
Table 5 – Carrier Tape Confi guration, Embossed Plastic & Punched Paper (mm)
EIA Case Size
Tape
Size
(W)*
Embossed Plastic Punched Paper
7" Reel 13" Reel 7" Reel 13" Reel
Pitch (P
1
)* Pitch (P
1
)*
01005 – 0402 8 2 2
0603 82/4 2/4
0805 84444
1206 – 1210 84444
1805 – 1808 12 4 4
≥ 1812 12 8 8
KPS 1210 12 8 8
KPS 1812
and 2220
16 12 12
Array 0612 844
*Refer to Figures 1 and 2 for W and P1 carrier tape reference locations.
*Refer to Tables 6 and 7 for tolerance specifi cations.
New 2 mm Pitch Reel Options*
Packaging
Ordering Code
(C-Spec)
Packaging Type/Options
C-3190
Automotive grade 7" reel unmarked
C-3191
Automotive grade 13" reel unmarked
C-7081
Commercial grade 7" reel unmarked
C-7082
Commercial grade 13" reel unmarked
* 2 mm pitch reel only available for 0603 EIA case size.
2 mm pitch reel for 0805 EIA case size under development.
Benefi ts of Changing from 4 mm to 2 mm Pitching Spacing
Lower placement costs.
Double the parts on each reel results in fewer reel
changes and increased effi ciency.
Fewer reels result in lower packaging, shipping and
storage costs, reducing waste.
Eiecxmmc Compancnls KEIVIEI' EHARGED: ‘ ' F mum: DY Minimum R Reierence SY Minimum T T‘ Note 1 Note 2 Note 3 Maximum Maximum i3Y Maximum E2 T2 W Nole4 Minimum Maximum Maximum
14© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1087_U2J_FT-CAP_SMD 8/12/2019
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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Flexible Termination System (FT-CAP), U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)
Figure 1 – Embossed (Plastic) Carrier Tape Dimensions
P
0
T
F
W
Center Lines of Cavity
A
0
B
0
User Direction of Unreeling
Cover Tape
K
0
B
1
is for tape feeder reference only,
including draft concentric about B
0
.
T
2
ØD
1
ØD
0
B
1
S
1
T
1
E
1
E
2
P
1
P
2
Embossment
For cavity size,
see Note 1 Table 4
(10 pitches cumulative
tolerance on tape ±0.2 mm)
Table 6 – Embossed (Plastic) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size D0
D
1
Minimum
Note 1
E1P0 P2
R Reference
Note 2
S
1
Minimum
Note 3
T
Maximum
T
1
Maximum
8 mm
1.5 +0.10/−0.0
(0.059 +0.004/−0.0)
1.0
(0.039)
1.75 ±0.10
(0.069 ±0.004) 4.0 ±0.10
(0.157 ±0.004) 2.0 ±0.05
(0.079 ±0.002)
25.0
(0.984)
0.600
(0.024) 0.600
(0.024) 0.100
(0.004)
12 mm 1.5
(0.059) 30
(1.181)
16 mm
Variable Dimensions — Millimeters (Inches)
Tape Size Pitch
B
1
Maximum
Note 4
E
2
Minimum
F P1
T
2
Maximum
W
Maximum
A0,B0 & K0
8 mm Single (4 mm)
4.35
(0.171)
6.25
(0.246)
3.5 ±0.05
(0.138 ±0.002)
4.0 ±0.10
(0.157 ±0.004)
2.5
(0.098)
8.3
(0.327)
Note 512 mm Single (4 mm)
and double (8 mm)
8.2
(0.323)
10.25
(0.404)
5.5 ±0.05
(0.217 ±0.002)
8.0 ±0.10
(0.315 ±0.004)
4.6
(0.181)
12.3
(0.484)
16 mm Triple (12 mm)
12.1
(0.476)
14.25
(0.561)
7.5 ±0.05
(0.138 ±0.002)
12.0 ±0.10
(0.157 ±0.004)
4.6
(0.181)
16.3
(0.642)
1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of the embossment
location and the hole location shall be applied independently of each other.
2. The tape with or without components shall pass around R without damage (see Figure 6.)
3. If S1 < 1.0 mm, there may not be enough area for a cover tape to be properly applied (see EIA Standard 481, paragraph 4.3, section b.)
4. B1 dimension is a reference dimension for tape feeder clearance only.
5. The cavity defi ned by A0, B0 and K0 shall surround the component with suffi cient clearance that:
(a) the component does not protrude above the top surface of the carrier tape.
(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been
removed.
(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3.)
(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape
(see Figure 4.)
(e) for KPS product, A0 and B0 are measured on a plane 0.3 mm above the bottom of the pocket.
(f) see addendum in EIA Standard 481 for standards relating to more precise taping requirements.
ammm Compancnls KEIVI mam): T - V 1 f ¢¢§9 W \ +7: Tiifi‘eri / #4 j/ l ‘X J x — RRefevence NmeZ 0.10 (0.904) maXImum (afiiflig (0237) 4.0 10.10 3.3 (0.157 :a 004) (0.327)
15© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1087_U2J_FT-CAP_SMD 8/12/2019
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Flexible Termination System (FT-CAP), U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)
Figure 2 – Punched (Paper) Carrier Tape Dimensions
User Direction of Unreeling
Top Cover Tape
T
Center Lines of Cavity
P1
ØDo Po E1
F
E2
W
G
A0
B0
Cavity Size,
See
Note 1, Table 7
Bottom Cover Tape
T1
T1
Bottom Cover Tape
(10 pitches cumulative
tolerance on tape ±0.2 mm)
Table 7 – Punched (Paper) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size D
0
E
1
P
0
P
2
T
1
Maximum G Minimum
R Reference
Note 2
8 mm 1.5 +0.10 -0.0
(0.059 +0.004 -0.0) 1.75 ±0.10
(0.069 ±0.004) 4.0 ±0.10
(0.157 ±0.004) 2.0 ±0.05
(0.079 ±0.002)
0.10
(0.004)
maximum
0.75
(0.030) 25
(0.984)
Variable Dimensions — Millimeters (Inches)
Tape Size Pitch E2 Minimum F P1 T Maximum W Maximum A0 B0
8 mm Half (2 mm) 6.25
(0.246) 3.5 ±0.05
(0.138 ±0.002)
2.0 ±0.05
(0.079 ±0.002)
1.1
(0.098)
8.3
(0.327)
Note 1
8 mm Single (4 mm)
4.0 ±0.10
(0.157 ±0.004)
8.3
(0.327)
1. The cavity defi ned by A0, B0 and T shall surround the component with suffi cient clearance that:
a) the component does not protrude beyond either surface of the carrier tape.
b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been
removed.
c) rotation of the component is limited to 20° maximum (see Figure 3.)
d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4.)
e) see addendum in EIA Standard 481 for standards relating to more precise taping requirements.
2. The tape with or without components shall pass around R without damage (see Figure 6.)
cccccccccccccccccccc Emma): e 7/////////////////////l‘ e O @379
16© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1087_U2J_FT-CAP_SMD 8/12/2019
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Flexible Termination System (FT-CAP), U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)
Packaging Information Performance Notes
1. Cover Tape Break Force: 1.0 kg minimum.
2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:
Tape Width Peel Strength
8 mm 0.1 to 1.0 newton (10 to 100 gf)
12 and 16 mm 0.1 to 1.3 newton (10 to 130 gf)
The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be
165° to 180° from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of
300 ±10 mm/minute.
3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA
Standards 556 and 624.
Figure 3 – Maximum Component Rotation
Ao
Bo
°
T
°
s
Maximum Component Rotation
Top View
Maximum Component Rotation
Side View
Tape Maximum
Width (mm) Rotation (°
T)
8,12 20
16 – 200 10 Tape Maximum
Width (mm) Rotation ( °
S)
8,12 20
16 – 56 10
72 – 200 5
Typical Pocket Centerline
Typical Component Centerline
Figure 4 – Maximum Lateral Movement
0.5 mm maximum
0.5 mm maximum
8 mm & 12 mm Tape
1.0 mm maximum
1.0 mm maximum
16 mm Tape
Figure 5 – Bending Radius
RR
Bending
Radius
Embossed
Carrier
Punched
Carrier
ammm Compancnls KEIVIEI' Emma): 0.4 mes/+0.0 (0331 +0 059400) 12.4 +2 0/00 (0.40:; +0 070/0 0) 15.4 +2.0/+0.0 (0.646 +0 070/0 0) 14.4 (0 567) 10.4 (0.724) 22.4 (0 882)
17© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1087_U2J_FT-CAP_SMD 8/12/2019
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Flexible Termination System (FT-CAP), U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)
Figure 6 – Reel Dimensions
AD(See Note)
Full Radius,
See Note
B(see Note)
Access Hole at
Slot Location
(Ø 40 mm minimum)
If present,
tape slot in core
for tape start:
2.5 mm minimum width x
10.0 mm minimum depth
W
3
(Includes
flange distortion
at outer edge)
W
2
(Measured at hub)
W
1
(Measured at hub)
C
(Arbor hole
diameter)
Note: Drive spokes optional; if used, dimensions B and D shall apply.
N
Table 8 – Reel Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size A B Minimum CD Minimum
8 mm 178 ±0.20
(7.008 ±0.008)
or
330 ±0.20
(13.000 ±0.008)
1.5
(0.059) 13.0 +0.5/−0.2
(0.521 +0.02/−0.008) 20.2
(0.795)
12 mm
16 mm
Variable Dimensions — Millimeters (Inches)
Tape Size N Minimum W1 W2 Maximum W3
8 mm
50
(1.969)
8.4 +1.5/0.0
(0.331 +0.059/0.0)
14.4
(0.567)
Shall accommodate tape
width without interference
12 mm
12.4 +2.0/0.0
(0.488 +0.078/0.0)
18.4
(0.724)
16 mm
16.4 +2.0/0.0
(0.646 +0.078/0.0)
22.4
(0.882)
EHARGED! 1 fi%¢ee¢o¢¢ o¢ as» ¢¢‘eo¢»$—e¢¢ / u )) rH/mm‘ yllm‘ #e4 keH/ +4 #:4 #é+\#++ \ \LLJ LLW (Lu ‘9900099fl/60fi999wv99 \‘ 90999990 Waif¢‘W¢oe6Too‘6o1 lg: Qiiiggfi1u9M133333§L @y’émawmammm gag“? HHHHH H‘HHHHH
18© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1087_U2J_FT-CAP_SMD 8/12/2019
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Flexible Termination System (FT-CAP), U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)
Figure 7 – Tape Leader & Trailer Dimensions
Trailer
160 mm minimum
Carrier Tape
END START
Round Sprocket Holes
Elongated Sprocket Holes
(32 mm tape and wider)
Top Cover Tape
Top Cover Tape
Punched Carrier
8 mm & 12 mm only
Embossed Carrier
Components
100 mm
minimum leader
400 mm minimum
Figure 8 – Maximum Camber
Carrier Tape
Round Sprocket Holes
1 mm maximum, either direction
Straight Edge
250 mm
Elongated Sprocket Holes
(32 mm & wider tapes)
ammmc compmm KEIVIEI' cumin:
19© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1087_U2J_FT-CAP_SMD 8/12/2019
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Flexible Termination System (FT-CAP), U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)
KEMET Electronics Corporation Sales Offi ces
For a complete list of our global sales offi ces, please visit www.kemet.com/sales.
Disclaimer
All product specifi cations, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for
checking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed. All Information given
herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied.
Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET) knowledge of typical operating conditions for such
applications, but are not intended to constitute – and KEMET specifi cally disclaims – any warranty concerning suitability for a specifi c customer application or use.
The Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any
technical advice inferred from this Information or otherwise provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes
no obligation or liability for the advice given or results obtained.
Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component
failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards
(such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury
or property damage.
Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other
measures may not be required.
KEMET is a registered trademark of KEMET Electronics Corporation.

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