VJ...W1BC Soldering, Footprint Design Datasheet by Vishay Vitramon

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VISHAY. mlcc@wshay.com www.v\shay.com/doc?91000
VJ....W1BC Soldering and Footprint Design
www.vishay.com Vishay
Revision: 13-Aug-15 1Document Number: 45017
For technical questions, contact: mlcc@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Surface Mount Multilayer Ceramic Chip Capacitors
for Commodity Applications
RECOMMENDED SOLDERING CONDITIONS
Lead (Pb)-free terminated MLCCs are not only used on SMT with lead (Pb)-free solder paste, but also suitable to be used with
lead-containing solder paste. In case the optimized solder joint is requested, increasing soldering time, temperature and
concentration of N2 within the oven are recommended.
SOLDERING PROFILES
Recommended IR reflow soldering profile for SMT process with SnAgCu series solder paste
Recommended wave soldering profile for SMT process with SnAgCu series solder
280
260
20
40
80
100
120
60
140
160
180
220
240
200
120 s120 s120 s
60 s to 90 s
Time
SnAgCu solder paste
3 °C/s
4 °C/s
4 °C/s
Min. temp.
Max. temp.
Peak temperature: 280 °C max.
Duration time: > 260 °C,10 s max.
> 215 °C, 60 s to 90 s
Temperature in °C
< 100 s
Over 60 s at least
by natural cooling
3 s to
5 s
Time
Temperature in °C
Total contact
time
100
50
0
200
150
250
260 °C
120 °C
4 °C/s max.
150 °C/s max.
VISHAY. m‘cc@wshay,com www.v\shay,com/doc?91000
VJ....W1BC Soldering and Footprint Design
www.vishay.com Vishay
Revision: 13-Aug-15 2Document Number: 45017
For technical questions, contact: mlcc@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
FOOTPRINT DESIGN
Circuit board design first steps are to consider how the surface mount board will be manufactured. The manufacturing process
determines the necessary dimensions of the solder land, the minimum spacing between components, the area underneath the
SMD where tracks may be laid down and the required component orientation during wave soldering. Therefore a footprint
related to the manufacturing process with all this information is an essential tool for SMD circuit board design.
Footprint details depend on following parameters:
Component dimensions and tolerance as given in the component data
Board dimensional accuracy
Placement accuracy of the component with respect to the solder lands on the board
Solder paste position tolerances with respect to the solder lands (for reflow soldering only)
The soldering parameters
Solder resist position tolerances with respect to the solder lands
Solder joint parameters for reliable joints
TYPICAL SMD FOOTPRINT
REFLOW SOLDERING
SIZE FOOTPRINT DIMENSIONS IN mm PROCESSING
REMARKS
PLACEMENT
ACCURACY
ABCDEFG
0201 0.65 0.23 0.21 0.30 n/a 0.90 0.60
Reflow or hot plate
soldering
± 0.05
0402 1.50 0.40 0.50 0.50 0.10 1.75 0.95 ± 0.15
0603 2.30 0.70 0.80 0.80 0.20 2.55 1.40 ± 0.25
0805 2.80 1.00 0.90 1.30 0.40 3.05 1.85 ± 0.25
1206 4.00 2.20 0.90 1.60 1.60 4.25 2.25 ± 0.25
1210 4.00 2.20 0.90 2.50 1.60 4.25 3.15 ± 0.25
WAVE SOLDERING
SIZE
FOOTPRINT DIMENSIONS IN mm PROPOSED NUMBER
AND DIMENSIONS OF
DUMMY TRACKS
PLACEMENT
ACCURACY
ABCDEFG
0603 2.40 1.00 0.70 0.80 0.20 3.10 1.90 1 x (0.20 x 0.80) ± 0.10
0805 3.20 1.40 0.90 1.30 0.36 4.10 2.50 1 x (0.30 x 1.30) ± 0.15
1206 4.80 2.30 1.25 1.70 1.25 5.90 3.20 3 x (0.25 x 1.70) ± 0.25
1210 5.30 2.30 1.50 2.60 1.25 6.30 4.20 3 x (0.25 x 2.60) ± 0.25
FOOTPRINT FOR MLCC CHIP ARRAY
SIZE DIMENSIONS IN mm
A 2.85 + 0.10 / - 0.05
B 0.45 ± 0.05
D 0.80 ± 0.10
P0.80
F 3.10 ± 0.30
Occupied area
Solder land/Solder paste pattern
Solder resist pattern
Tracks or Dummy tracks
(for wave soldering only)
A
F
BC
G
D
E
B
A
P
D
F

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