MAX1136-39 Datasheet by Analog Devices Inc./Maxim Integrated

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lVI/JXI/VI [MAXI/VI
Hand-Held Portable
Applications
Medical Instruments
Battery-Powered Test
Equipment
Solar-Powered Remote
Systems
Received-Signal-Strength
Indicators
System Supervision
General Description
The MAX1136–MAX1139 low-power, 10-bit, multichannel
analog-to-digital converters (ADCs) feature internal
track/hold (T/H), voltage reference, clock, and an
I2C-compatible 2-wire serial interface. These devices
operate from a single supply of 2.7V to 3.6V (MAX1137/
MAX1139) or 4.5V to 5.5V (MAX1136/MAX1138) and
require only 670µA at the maximum sampling rate of
94.4ksps. Supply current falls below 230µA for sampling
rates under 46ksps. AutoShutdown™ powers down the
devices between conversions, reducing supply current to
less than 1µA at low throughput rates. The
MAX1136/MAX1137 have four analog input channels
each, while the MAX1138/MAX1139 have 12 analog input
channels each. The fully differential analog inputs are
software configurable for unipolar or bipolar, and single
ended or differential operation.
The full-scale analog input range is determined by the
internal reference or by an externally applied reference
voltage ranging from 1V to VDD. The MAX1137/
MAX1139 feature a 2.048V internal reference and the
MAX1136/MAX1138 feature a 4.096V internal reference.
The MAX1136/MAX1137 are available in an 8-pin µMAX®
package. The MAX1138/MAX1139 are available in a
16-pin QSOP package. The MAX1136–MAX1139 are
guaranteed over the extended temperature range
(-40°C to +85°C). For pin-compatible 12-bit parts, refer to
the MAX1236–MAX1239 data sheet. For pin-compatible
8-bit parts, refer to the MAX1036–MAX1039 data sheet.
Applications
Features
oHigh-Speed I2C-Compatible Serial Interface
400kHz Fast Mode
1.7MHz High-Speed Mode
oSingle-Supply
2.7V to 3.6V (MAX1137/MAX1139)
4.5V to 5.5V (MAX1136/MAX1138)
oInternal Reference
2.048V (MAX1137/MAX1139)
4.096V (MAX1136/MAX1138)
oExternal Reference: 1V to VDD
oInternal Clock
o4-Channel Single-Ended or 2-Channel Fully
Differential (MAX1136/MAX1137)
o12-Channel Single-Ended or 6-Channel Fully
Differential (MAX1138/MAX1139)
oInternal FIFO with Channel-Scan Mode
oLow Power
670µA at 94.4ksps
230µA at 40ksps
60µA at 10ksps
6µA at 1ksps
0.5µA in Power-Down Mode
oSoftware-Configurable Unipolar/Bipolar
oSmall Packages
8-Pin µMAX (MAX1136/MAX1137)
16-Pin QSOP (MAX1138/MAX1139)
MAX1136–MAX1139
2.7V to 3.6V and 4.5V to 5.5V, Low-Power,
4-/12-Channel, 2-Wire Serial 10-Bit ADCs
________________________________________________________________
Maxim Integrated Products
1
Ordering Information
19-2334; Rev 6; 3/10
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642,
or visit Maxim’s website at www.maxim-ic.com.
Pin Configurations and Typical Operating Circuit appear at
end of data sheet.
PART TEMP RANGE PIN-
PACKAGE
I
2
C SLAVE
ADDRESS
MAX1136EUA+ -40°C to +85°C 8 µMAX 0110100
MAX1137EUA+ -40°C to +85°C 8 µMAX 0110100
MAX1138EEE+ -40°C to +85°C 16 QSOP 0110101
MAX1139EEE+ -40°C to +85°C 16 QSOP 0110101
Selector Guide
PART INPUT
CHANNELS
INTERNAL
REFERENCE
(V)
SUPPLY
VOLTAGE
(V)
INL
(LSB)
MAX1136 4 4.096 4.5 to 5.5 ±1
MAX1137 4 2.048 2.7 to 3.6 ±1
MAX1138 12 4.096 4.5 to 5.5 ±1
MAX1139 12 2.048 2.7 to 3.6 ±1
AutoShutdown is a trademark of Maxim Integrated Products, Inc.
µMAX is a registered trademark of Maxim Integrated Products, Inc.
+
Denotes a lead(Pb)-free/RoHS-compliant package.
lVI/JXIIVI
MAX1136–MAX1139
2.7V to 3.6V and 4.5V to 5.5V, Low-Power,
4-/12-Channel, 2-Wire Serial 10-Bit ADCs
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(VDD = 2.7V to 3.6V (MAX1137/MAX1139), VDD = 4.5V to 5.5V (MAX1136/MAX1138), VREF = 2.048V (MAX1137/MAX1139), VREF =
4.096V (MAX1136/MAX1138), fSCL = 1.7MHz, TA= TMIN to TMAX, unless otherwise noted. Typical values are at TA= +25°C. See
Tables 1–5 for programming notation.)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
VDD to GND..............................................................-0.3V to +6V
AIN0–AIN11,
REF to GND............-0.3V to the lower of (VDD + 0.3V) and 6V
SDA, SCL to GND.....................................................-0.3V to +6V
Maximum Current Into Any Pin .........................................±50mA
Continuous Power Dissipation (TA= +70°C)
8-Pin µMAX (derate 5.9mW/°C above +70°C) ..........470.6mW
16-Pin QSOP (derate 8.3mW/°C above +70°C)........666.7mW
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature......................................................+150°C
Storage Temperature Range .............................-60°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
DC ACCURACY (Note 1)
Resolution 10 Bits
Relative Accuracy INL (Note 2) ±1 LSB
Differential Nonlinearity DNL No missing codes over temperature ±1 LSB
Offset Error ±1 LSB
Offset-Error Temperature
Coefficient Relative to FSR 0.3 ppm/°C
Gain Error (Note 3) ±1 LSB
Gain-Temperature Coefficient Relative to FSR 0.3 ppm/°C
Channel-to-Channel Offset
Matching ±0.1 LSB
Channel-to-Channel Gain
Matching ±0.1 LSB
DYNAMIC PERFORMANCE (fIN(SINE-WAVE) = 10kHz, VIN(P-P) = VREF, fSAMPLE = 94.4ksps)
Signal-to-Noise Plus Distortion SINAD 60 dB
Total Harmonic Distortion THD Up to the 5th harmonic -70 dB
Spurious Free Dynamic Range SFDR 70 dB
Full-Power Bandwidth SINAD > 57dB 3.0 MHz
Full-Linear Bandwidth -3dB point 5.0 MHz
CONVERSION RATE
Internal clock 6.8
Conversion Time (Note 4) tCONV External clock 10.6 µs
Internal clock, SCAN[1:0] = 01 53
Internal clock, SCAN[1:0] = 00
CS[3:0] = 1011 (MAX1138/MAX1139) 53
Throughput Rate fSAMPLE
External clock 94.4
ksps
Track/Hold Acquisition Time 800 ns
[VI I] XIIVI
MAX1136–MAX1139
2.7V to 3.6V and 4.5V to 5.5V, Low-Power,
4-/12-Channel, 2-Wire Serial 10-Bit ADCs
_______________________________________________________________________________________ 3
ELECTRICAL CHARACTERISTICS (continued)
(VDD = 2.7V to 3.6V (MAX1137/MAX1139), VDD = 4.5V to 5.5V (MAX1136/MAX1138), VREF = 2.048V (MAX1137/MAX1139), VREF =
4.096V (MAX1136/MAX1138), fSCL = 1.7MHz, TA= TMIN to TMAX, unless otherwise noted. Typical values are at TA= +25°C. See
Tables 1–5 for programming notation.)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Internal Clock Frequency 2.8 MHz
External clock, fast mode 60
Aperture Delay (Note 5) tAD External clock, high-speed mode 30 ns
ANALOG INPUT (AIN0–AIN11)
Unipolar 0 VREF
Input-Voltage Range, Single-
Ended and Differential (Note 6) Bipolar 0 ±VREF/2 V
Input Multiplexer Leakage Current ON/OFF leakage current, VAIN_ = 0 or VDD ±0.01 ±1 µA
Input Capacitance CIN 22 pF
INTERNAL REFERENCE (Note 7)
MAX1137/MAX1139 1.968 2.048 2.128
Reference Voltage VREF TA = +25°C MAX1136/MAX1138 3.939 4.096 4.256 V
Reference-Voltage Temperature
Coefficient TCVREF 25 ppm/°C
REF Short-Circuit Current 2mA
REF Source Impedance 1.5 k
EXTERNAL REFERENCE
REF Input-Voltage Range VREF (Note 8) 1 VDD V
REF Input Current IREF fSAMPLE = 94.4ksps 40 µA
DIGITAL INPUTS/OUTPUTS (SCL, SDA)
Input High Voltage VIH 0.7 VDD V
Input Low Voltage VIL 0.3 VDD V
Input Hysteresis VHYST 0.1 VDD V
Input Current IIN VIN 0 to VDD ±10 µA
Input Capacitance CIN 15 pF
Output Low Voltage VOL ISINK = 3mA 0.4 V
POWER REQUIREMENTS
MAX1137/MAX1139 2.7 3.6
Supply Voltage VDD MAX1136/MAX1138 4.5 5.5 V
Internal reference 900 1150
fSAMPLE = 94.4ksps
external clock External reference 670 900
Internal reference 530
fSAMPLE = 40ksps
internal clock External reference 230
Internal reference 380
fSAMPLE = 10ksps
internal clock External reference 60
Internal reference 330
fSAMPLE =1ksps
internal clock External reference 6
Supply Current IDD
Shutdown (internal reference OFF) 0.5 10
µA
[VI/J XI [VI
MAX1136–MAX1139
2.7V to 3.6V and 4.5V to 5.5V, Low-Power,
4-/12-Channel, 2-Wire Serial 10-Bit ADCs
4 _______________________________________________________________________________________
ELECTRICAL CHARACTERISTICS (continued)
(VDD = 2.7V to 3.6V (MAX1137/MAX1139), VDD = 4.5V to 5.5V (MAX1136/MAX1138), VREF = 2.048V (MAX1137/MAX1139), VREF =
4.096V (MAX1136/MAX1138), fSCL = 1.7MHz, TA= TMIN to TMAX, unless otherwise noted. Typical values are at TA= +25°C. See
Tables 1–5 for programming notation.)
TIMING CHARACTERISTICS (Figure 1)
(VDD = 2.7V to 3.6V (MAX1137/MAX1139), VDD = 4.5V to 5.5V (MAX1136/MAX1138), VREF = 2.048V (MAX1137/MAX1139), VREF =
4.096V (MAX1136/MAX1138), fSCL = 1.7MHz, TA= TMIN to TMAX, unless otherwise noted. Typical values are at TA= +25°C. See
Tables 1–5 for programming notation.)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
POWER REQUIREMENTS
Power-Supply Rejection Ratio PSRR Full-scale input (Note 9) ±0.01 ±0.5 LSB/V
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
TIMING CHARACTERISTICS FOR FAST MODE
Serial Clock Frequency fSCL 400 kHz
Bus Free Time Between a
STOP (P) and a
START (S) Condition
tBUF 1.3 µs
Hold Time for START (S) Condition tHD
,
STA 0.6 µs
Low Period of the SCL Clock tLOW 1.3 µs
High Period of the SCL Clock tHIGH 0.6 µs
Setup Time for a Repeated START
Condition (Sr) tSU
,
STA 0.6 µs
Data Hold Time tHD
,
DAT (Note 10) 0 900 ns
Data Setup Time tSU
,
DAT 100 ns
Rise Time of Both SDA and SCL
Signals, Receiving tRMeasured from 0.3VDD to 0.7VDD 20 + 0.1CB300 ns
Fall Time of SDA Transmitting tFMeasured from 0.3VDD to 0.7VDD (Note 11) 20 + 0.1CB300 ns
Setup Time for STOP (P) Condition tSU
,
STO 0.6 µs
Capacitive Load for Each Bus Line CB400 pF
Pulse Width of Spike Suppressed tSP 50 ns
TIMING CHARACTERISTICS FOR HIGH-SPEED MODE (CB = 400pF, Note 12)
Serial Clock Frequency fSCLH (Note 13) 1.7 MHz
Hold Time, Repeated START
Condition (Sr) tHD
,
STA 160 ns
Low Period of the SCL Clock tLOW 320 ns
High Period of the SCL Clock tHIGH 120 ns
Setup Time for a Repeated START
Condition (Sr) tSU, STA 160 ns
Data Hold Time tHD, DAT (Note 10) 0 150 ns
Data Setup Time tSU, DAT 10 ns
[VI I] XIIVI
Note 1: For DC accuracy, the MAX1136/MAX1138 are tested at VDD = 5V and the MAX1137/MAX1139 are tested at VDD = 3V. All
devices are configured for unipolar, single-ended inputs.
Note 2: Relative accuracy is the deviation of the analog value at any code from its theoretical value after the full-scale range and
offsets have been calibrated.
Note 3: Offset nulled.
Note 4: Conversion time is defined as the number of clock cycles needed for conversion multiplied by the clock period. Conversion
time does not include acquisition time. SCL is the conversion clock in the external clock mode.
Note 5: A filter on the SDA and SCL inputs suppresses noise spikes and delays the sampling instant.
Note 6: The absolute input-voltage range for the analog inputs (AIN0–AIN11) is from GND to VDD.
Note 7: When the internal reference is configured to be available at AIN_/REF (SEL[2:1] = 11) decouple AIN_/REF to GND with a
0.1µF capacitor and a 2kseries resistor (see the
Typical Operating Circuit
).
Note 8: ADC performance is limited by the converter’s noise floor, typically 300µVP-P.
Note 9: Measured as for the MAX1137/MAX1139
and for the MAX1136/MAX1138
Note 10: A master device must provide a data hold time for SDA (referred to VIL of SCL) in order to bridge the undefined region of
SCL’s falling edge (see Figure 1).
Note 11: The minimum value is specified at +25°C.
Note 12: CB= total capacitance of one bus line in pF.
Note 13: fSCL must meet the minimum clock low time plus the rise/fall times.
VVVV
V
VV
FS FS
REF
N
(. ) (. )
(. . )
55 45 21
55 45
[]
×
VVVV
V
VV
FS FS
REF
N
(. ) (. )
(. . )
36 27 21
36 27
[]
×
MAX1136–MAX1139
2.7V to 3.6V and 4.5V to 5.5V, Low-Power,
4-/12-Channel, 2-Wire Serial 10-Bit ADCs
_______________________________________________________________________________________ 5
TIMING CHARACTERISTICS (Figure 1) (continued)
(VDD = 2.7V to 3.6V (MAX1137/MAX1139), VDD = 4.5V to 5.5V (MAX1136/MAX1138), VREF = 2.048V (MAX1137/MAX1139), VREF =
4.096V (MAX1136/MAX1138), fSCL = 1.7MHz, TA= TMIN to TMAX, unless otherwise noted. Typical values are at TA= +25°C. See
Tables 1–5 for programming notation.).)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Rise Time of SCL Signal
(Current Source Enabled) tRCL Measured from 0.3VDD to 0.7VDD 20 80 ns
Rise Time of SCL Signal after
Acknowledge Bit tRCL1 Measured from 0.3VDD to 0.7VDD 20 160 ns
Fall Time of SCL Signal tFCL Measured from 0.3VDD to 0.7VDD 20 80 ns
Rise Time of SDA Signal tRDA Measured from 0.3VDD to 0.7VDD 20 160 ns
Fall Time of SDA Signal tFDA Measured from 0.3VDD to 0.7VDD (Note 11) 20 160 ns
Setup Time for STOP (P) Condition tSU, STO 160 ns
Capacitive Load for Each Bus Line CB400 pF
Pulse Width of Spike Suppressed tSP (Notes 10 and 13) 0 10 ns
DNULSB) m) an AMPUYUDE mks) um ‘20 ND mu \bb BAA) uz u ‘ 27 mu 0 VDZUSDAQSUBDWQBUDDV towns UN WE (ksps! Wk 2m 3m 43k FREUUENUV (Hm [MAXI/VI
MAX1136–MAX1139
2.7V to 3.6V and 4.5V to 5.5V, Low-Power,
4-/12-Channel, 2-Wire Serial 10-Bit ADCs
6 _______________________________________________________________________________________
Typical Operating Characteristics
(VDD = 3.3V (MAX1137/MAX1139), VDD = 5V (MAX1136/MAX1138), fSCL = 1.7MHz, external clock, fSAMPLE = 94.4ksps, single-
ended, unipolar, TA= +25°C, unless otherwise noted.)
-0.3
-0.1
-0.2
0.1
0
0.2
0.3
0 1000
DIFFERENTIAL NONLINEARITY
vs. DIGITAL CODE
MAX1136 toc01
DIGITAL OUTPUT CODE
DNL (LSB)
400200 600 800
-0.5
-0.2
-0.3
-0.4
-0.1
0
0.1
0.2
0.3
0.4
0.5
0 400200 600 800 1000
INTEGRAL NONLINEARITY
vs. DIGITAL CODE
MAX1136 toc02
DIGITAL OUTPUT CODE
INL (LSB)
-160
-140
-120
-100
-80
-60
-40
-20
0
0 10k 20k 30k 40k 50k
FFT PLOT
MAX1136 toc03
FREQUENCY (Hz)
AMPLITUDE (dBc)
fSAMPLE = 94.4ksps
fIN = 10kHz
300
400
350
500
450
600
550
650
750
700
800
-40 -10 5-25 20 35 50 65 80
SUPPLY CURRENT vs. TEMPERATURE
MAX1136 toc04
TEMPERATURE (°C)
SUPPLY CURRENT (µA)
INTERNAL REFERENCE MAX1138/1136
MAX1139/1137
MAX1138/1136
MAX1139/1137
INTERNAL REFERENCE
EXTERNAL REFERENCE
EXTERNAL REFERENCE
SETUP BYTE
EXT REF: 10111011
INT REF: 11011011
0
0.10
0.05
0.20
0.15
0.30
0.25
0.35
0.45
0.40
0.50
-40 -10 5
-25 20 35 50 65 80
SHUTDOWN SUPPLY CURRENT
vs. TEMPERATURE
MAX1136 toc06
TEMPERATURE (°C)
SUPPLY CURRENT (µA)
MAX1138
MAX1139
200
300
250
350
400
450
500
550
600
650
700
750
800
0 20 30 40 60 80 100
AVERAGE SUPPLY CURRENT vs.
CONVERSION RATE (EXTERNAL CLOCK)
MAX1136 toc07
CONVERSION RATE (ksps)
AVERAGE IDD (µA)
010 50 70 90
A
B
A) INTERNAL REFERENCE ALWAYS ON
B) EXTERNAL REFERENCE
MAX1138
0.9990
0.9994
0.9992
0.9998
0.9996
1.0002
1.0000
1.0004
1.0008
1.0006
1.0010
-40 -10 5-25 20 35 50 65 80
INTERNAL REFERENCE VOLTAGE
vs. TEMPERATURE
MAX1136 toc08
TEMPERATURE (°C)
V
REF
NORMALIZED
MAX1138
MAX1139
NORMALIZED TO REFERENCE VALUE
AT +25°C
0.99990
0.99994
0.99992
0.99998
0.99996
1.00002
1.00000
1.00004
1.00008
1.00006
1.00010
2.7 3.3 3.6 3.93.0 4.2 4.5 4.8 5.1 5.4
NORMALIZED REFERENCE VOLTAGE
vs. SUPPLY VOLTAGE
MAX1136 toc09
VDD (V)
VREF NORMALIZED
MAX1138/MAX1136,
NORMALIZED TO
REFERENCE VALUE AT
VDD = 5V
MAX1139/MAX1137,
NORMALIZED TO
REFERENCE VALUE AT
VDD = 3.3V
[VI A X I [VI
MAX1136–MAX1139
2.7V to 3.6V and 4.5V to 5.5V, Low-Power,
4-/12-Channel, 2-Wire Serial 10-Bit ADCs
_______________________________________________________________________________________ 7
Typical Operating Characteristics (continued)
(VDD = 3.3V (MAX1137/MAX1139), VDD = 5V (MAX1136/MAX1138), fSCL = 1.7MHz, external clock, fSAMPLE = 94.4ksps, single-
ended, unipolar, TA= +25°C, unless otherwise noted.)
-1.0
-0.8
-0.9
-0.6
-0.7
-0.4
-0.5
-0.3
-0.1
-0.2
0
-40 -10 5-25 2035506580
OFFSET ERROR vs. TEMPERATURE
MAX1136 toc10
TEMPERATURE (°C)
OFFSET ERROR (LSB)
-1.0
-0.8
-0.9
-0.6
-0.7
-0.4
-0.5
-0.3
-0.1
-0.2
0
2.7 3.3 3.6 3.93.0 4.2 4.5 4.8 5.1 5.4
OFFSET ERROR vs. SUPPLY VOLTAGE
MAX1136 toc11
VDD (V)
OFFSET ERROR (LSB)
0
0.2
0.1
0.4
0.3
0.6
0.5
0.7
0.9
0.8
1.0
-40 -10 5-25 2035506580
GAIN ERROR vs. TEMPERATURE
MAX1136 toc12
TEMPERATURE (°C)
GAIN ERROR (LSB)
0
0.3
0.2
0.1
0.4
0.5
0.6
0.7
0.8
0.9
1.0
2.7 3.73.2 4.2 4.7 5.2
GAIN ERROR vs. SUPPLY VOLTAGE
MAX1136 toc13
VDD (V)
GAIN ERROR (LSB)
+ V + [VI/J XI [VI
MAX1136–MAX1139
2.7V to 3.6V and 4.5V to 5.5V, Low-Power,
4-/12-Channel, 2-Wire Serial 10-Bit ADCs
8 _______________________________________________________________________________________
Pin Description
PIN
MAX1136
MAX1137
MAX1138
MAX1139
NAME FUNCTION
1, 2, 3 1, 2, 3 AIN0–AIN2
4–8 AIN3–AIN7
16, 15, 14 AIN8–AIN10
Analog Inputs
4 AIN3/REF Analog Input 3/Reference Input or Output. Selected in the Setup Register.
(See Tables 1 and 6.)
13 AIN11/REF Analog Input 11/Reference Input or Output. Selected in the Setup Register.
(See Tables 1 and 6.)
5 9 SCL Clock Input
6 10 SDA Data Input/Output
7 11 GND Ground
812V
DD Positive Supply. Bypass to GND with a 0.1µF capacitor.
tHD.STA
tSU.DAT
tHIGH
tRtF
tHD.DAT tHD.STA
SSr A
SCL
SDA
tSU.STA
tLOW
tBUF
tSU.STO
PS
tHD.STA
tSU.DAT
tHIGH
tFCL
tHD.DAT tHD.STA
S Sr A
SCL
SDA
tSU.STA
tLOW
tBUF
tSU.STO
S
tRCL tRCL1
HS-MODE F/S-MODE
A. F/S-MODE 2-WIRE SERIAL INTERFACE TIMING
B. HS-MODE 2-WIRE SERIAL INTERFACE TIMING
tFDA
tRDA
t
tRtF
P
Figure 1. 2-Wire Serial Interface Timing
[MAXIM [VI I] XIIVI
Detailed Description
The MAX1136–MAX1139 analog-to-digital converters
(ADCs) use successive-approximation conversion tech-
niques and fully differential input track/hold (T/H) cir-
cuitry to capture and convert an analog signal to a
serial 12-bit digital output. The MAX1136/MAX1137 are
4-channel ADCs, and the MAX1138/MAX1139 are
12-channel ADCs. These devices feature a high-speed
2-wire serial interface supporting data rates up to
1.7MHz. Figure 2 shows the simplified internal structure
for the MAX1138/MAX1139.
Power Supply
The MAX1136–MAX1139 operates from a single supply
and consumes 670µA (typ) at sampling rates up to
94.4ksps. The MAX1137/MAX1139 feature a 2.048V
internal reference and the MAX1136/MAX1138 feature
a 4.096V internal reference. All devices can be config-
ured for use with an external reference from 1V to VDD.
Analog Input and Track/Hold
The MAX1136–MAX1139 analog-input architecture con-
tains an analog-input multiplexer (mux), a fully differen-
tial track-and-hold (T/H) capacitor, T/H switches, a
comparator, and a fully differential switched capacitive
digital-to-analog converter (DAC) (Figure 4).
In single-ended mode the analog-input multiplexer con-
nects CT/H between the analog input selected by
CS[3:0] (see the
Configuration/Setup Bytes
section)
and GND (Table 3). In differential mode, the analog-
input multiplexer connects CT/H to the “+” and “-” ana-
log inputs selected by CS[3:0] (Table 4).
During the acquisition interval the T/H switches are in
the track position and CT/H charges to the analog input
MAX1136–MAX1139
2.7V to 3.6V and 4.5V to 5.5V, Low-Power,
4-/12-Channel, 2-Wire Serial 10-Bit ADCs
_______________________________________________________________________________________ 9
ANALOG
INPUT
MUX
AIN1
AIN11/REF
AIN2
AIN3
AIN4
AIN5
AIN6
AIN7
AIN8
AIN9
AIN10
AIN0
SCL
SDA
INPUT SHIFT REGISTER
SETUP REGISTER
CONFIGURATION REGISTER
CONTROL
LOGIC
REFERENCE
4.096V (MAX1138)
2.048V (MAX1139)
INTERNAL
OSCILLATOR
OUTPUT SHIFT
REGISTER
AND RAM
REF
T/H 10-BIT
ADC
VDD
GND
MAX1138
MAX1139
Figure 2. MAX1138/MAX1139 Functional Diagram
VDD
IOL
IOH
VOUT
400pF
SDA
Figure 3. Load Circuit
[VI/J XI [VI
MAX1136–MAX1139
signal. At the end of the acquisition interval, the T/H
switches move to the hold position retaining the charge
on CT/H as a stable sample of the input signal.
During the conversion interval, the switched capacitive
DAC adjusts to restore the comparator input voltage to
0V within the limits of 10-bit resolution. This action
requires 10 conversion clock cycles and is equivalent
to transferring a charge of 11pF (VIN+ - VIN-) from
CT/H to the binary weighted capacitive DAC, forming a
digital representation of the analog input signal.
Sufficiently low source impedance is required to ensure
an accurate sample. A source impedance of up to 1.5k
does not significantly degrade sampling accuracy. To
minimize sampling errors with higher source impedances,
connect a 100pF capacitor from the analog input to GND.
This input capacitor forms an RC filter with the source
impedance limiting the analog-input bandwidth. For larg-
er source impedances, use a buffer amplifier to maintain
analog-input signal integrity and bandwidth.
When operating in internal clock mode, the T/H circuitry
enters its tracking mode on the eighth rising clock edge
of the address byte (see the
Slave Address
section). The
T/H circuitry enters hold mode on the falling clock edge of
the acknowledge bit of the address byte (the ninth clock
pulse). A conversion, or series of conversions, are then
internally clocked and the MAX1136–MAX1139 holds
SCL low. With external clock mode, the T/H circuitry
enters track mode after a valid address on the rising
edge of the clock during the read (R/W= 1) bit. Hold
mode is then entered on the rising edge of the second
clock pulse during the shifting out of the first byte of the
result. The conversion is performed during the next 10
clock cycles.
The time required for the T/H circuitry to acquire an
input signal is a function of the input sample capaci-
tance. If the analog-input source impedance is high,
the acquisition time constant lengthens and more time
must be allowed between conversions. The acquisition
time (tACQ) is the minimum time needed for the signal
to be acquired. It is calculated by:
tACQ 9 (RSOURCE + RIN) CIN
where RSOURCE is the analog-input source impedance,
RIN = 2.5k, and CIN = 22pF. tACQ is 1.5/fSCL for internal
clock mode and tACQ = 2/fSCL for external clock mode.
Analog Input Bandwidth
The MAX1136–MAX1139 feature input-tracking circuitry
with a 5MHz small-signal bandwidth. The 5MHz input
bandwidth makes it possible to digitize high-speed
transient events and measure periodic signals with
bandwidths exceeding the ADC’s sampling rate by
using under sampling techniques. To avoid high-fre-
quency signals being aliased into the frequency band
of interest, anti-alias filtering is recommended.
Analog Input Range and Protection
Internal protection diodes clamp the analog input to
VDD and GND. These diodes allow the analog inputs to
2.7V to 3.6V and 4.5V to 5.5V, Low-Power,
4-/12-Channel, 2-Wire Serial 10-Bit ADCs
10 ______________________________________________________________________________________
TRACK
TRACK
HOLD
CT/H
CT/H
TRACK
TRACK
HOLD
AIN0
AIN1
AIN2
AIN3/REF
GND
ANALOG INPUT MUX
CAPACITIVE
DAC
REF
CAPACITIVE
DAC
REF MAX1136
MAX1137
HOLD
HOLD
TRACK
HOLD
VDD/2
Figure 4. Equivalent Input Circuit
—‘j*—LF”L— WWW [VI I] XIIVI
swing from (GND - 0.3V) to (VDD + 0.3V) without caus-
ing damage to the device. For accurate conversions
the inputs must not go more than 50mV below GND or
above VDD.
Single-Ended/Differential Input
The SGL/DIF of the configuration byte configures the
MAX1136–MAX1139 analog-input circuitry for single-
ended or differential inputs (Table 2). In single-ended
mode (SGL/DIF = 1), the digital conversion results are the
difference between the analog input selected by CS[3:0]
and GND (Table 3). In differential mode (SGL/ DIF = 0) the
digital conversion results are the difference between the
“+” and the “-” analog inputs selected by CS[3:0] (Table 4).
Unipolar/Bipolar
When operating in differential mode, the BIP/UNI bit of
the setup byte (Table 1) selects unipolar or bipolar
operation. Unipolar mode sets the differential input
range from 0 to VREF. A negative differential analog
input in unipolar mode will cause the digital output
code to be zero. Selecting bipolar mode sets the differ-
ential input range to ±VREF/2. The digital output code is
binary in unipolar mode and two’s complement in bipo-
lar mode, see the
Transfer Functions
section.
In single-ended mode the MAX1136–MAX1139 will
always operate in unipolar mode irrespective of
BIP/UNI. The analog inputs are internally referenced to
GND with a full-scale input range from 0 to VREF.
2-Wire Digital Interface
The MAX1136–MAX1139 feature a 2-wire interface con-
sisting of a serial data line (SDA) and serial clock line
(SCL). SDA and SCL facilitate bidirectional communica-
tion between the MAX1136–MAX1139 and the master at
rates up to 1.7MHz. The MAX1136–MAX1139 are slaves
that transfer and receive data. The master (typically a
microcontroller) initiates data transfer on the bus and
generates the SCL signal to permit that transfer.
SDA and SCL must be pulled high. This is typically done
with pullup resistors (750or greater) (see the
Typical
Operating Circuit
). Series resistors (RS) are optional.
They protect the input architecture of the MAX1136–
MAX1139 from high voltage spikes on the bus lines, min-
imize crosstalk, and undershoot of the bus signals.
Bit Transfer
One data bit is transferred during each SCL clock
cycle. A minimum of eighteen clock cycles are required
to transfer the data in or out of the MAX1136–MAX1139.
The data on SDA must remain stable during the high
period of the SCL clock pulse. Changes in SDA while
SCL is stable are considered control signals (see the
START and STOP Conditions
section). Both SDA and
SCL remain high when the bus is not busy.
START and STOP Conditions
The master initiates a transmission with a START condi-
tion (S), a high-to-low transition on SDA while SCL is high.
The master terminates a transmission with a STOP condi-
tion (P), a low-to-high transition on SDA while SCL is high
(Figure 5). A repeated START condition (Sr) can be used
in place of a STOP condition to leave the bus active and
the mode unchanged (see HS-mode).
Acknowledge Bits
Data transfers are acknowledged with an acknowledge
bit (A) or a not-acknowledge bit (A). Both the master
and the MAX1136–MAX1139 (slave) generate acknowl-
edge bits. To generate an acknowledge, the receiving
device must pull SDA low before the rising edge of the
acknowledge-related clock pulse (ninth pulse) and
keep it low during the high period of the clock pulse
(Figure 6). To generate a not-acknowledge, the receiv-
er allows SDA to be pulled high before the rising edge
of the acknowledge-related clock pulse and leaves
SDA high during the high period of the clock pulse.
Monitoring the acknowledge bits allows for detection of
unsuccessful data transfers. An unsuccessful data
transfer happens if a receiving device is busy or if a
system fault has occurred. In the event of an unsuc-
cessful data transfer the bus master should reattempt
communication at a later time.
MAX1136–MAX1139
2.7V to 3.6V and 4.5V to 5.5V, Low-Power,
4-/12-Channel, 2-Wire Serial 10-Bit ADCs
______________________________________________________________________________________ 11
SCL
SDA
SP
Sr
Figure 5. START and STOP Conditions
SCL
SDA
SNOT ACKNOWLEDGE
ACKNOWLEDGE
12 89
Figure 6. Acknowledge Bits
WWW [VI/J XI [VI
MAX1136–MAX1139
Slave Address
A bus master initiates communication with a slave device
by issuing a START condition followed by a slave
address. When idle, the MAX1136–MAX1139 continuous-
ly wait for a START condition followed by their slave
address. When the MAX1136–MAX1139 recognize their
slave address, they are ready to accept or send data.
The slave address has been factory programmed and is
always 0110100 for the MAX1136/MAX1137, and
0110101 for MAX1138/MAX1139 (Figure 7). The least sig-
nificant bit (LSB) of the address byte (R/W) determines
whether the master is writing to or reading from the
MAX1136–MAX1139 (R/W= 0 selects a write condition,
R/W= 1 selects a read condition). After receiving the
address, the MAX1136–MAX1139 (slave) issues an
acknowledge by pulling SDA low for one clock cycle.
Bus Timing
At power-up, the MAX1136–MAX1139 bus timing is set
for fast mode (F/S-mode) which allows conversion rates
up to 22.2ksps. The MAX1136–MAX1139 must operate
in high-speed mode (HS-mode) to achieve conversion
rates up to 94.4ksps. Figure 1 shows the bus timing for
the MAX1136–MAX1139’s 2-wire interface.
HS-Mode
At power-up, the MAX1136–MAX1139 bus timing is set
for F/S-mode. The bus master selects HS-mode by
addressing all devices on the bus with the HS-mode
master code 0000 1XXX (X = don’t care). After success-
fully receiving the HS-mode master code, the
MAX1136–MAX1139 issue a not-acknowledge allowing
SDA to be pulled high for one clock cycle (Figure 8).
After the not-acknowledge, the MAX1136–MAX1139 are
in HS-mode. The bus master must then send a repeated
START followed by a slave address to initiate HS-mode
communication. If the master generates a STOP condi-
tion the MAX1136–MAX1139 returns to F/S-mode.
2.7V to 3.6V and 4.5V to 5.5V, Low-Power,
4-/12-Channel, 2-Wire Serial 10-Bit ADCs
12 ______________________________________________________________________________________
011 10 0 0 R/W A
SLAVE ADDRESS
MAX1136/MAX1137
S
SCL
SDA
123456789
DEVICE SLAVE ADDRESS
0110100
0110101
MAX1136/MAX1137
MAX1138/MAX1139
Figure 7. MAX1136/MAX1137 Slave Address Byte
000 10XXXA
HS-MODE MASTER CODE
SCL
SDA
S Sr
F/S-MODE HS-MODE
Figure 8. F/S-Mode to HS-Mode Transfer
[VI I] XIIVI
Configuration/Setup Bytes (Write Cycle)
A write cycle begins with the bus master issuing a
START condition followed by seven address bits (Figure
7) and a write bit (R/W= 0). If the address byte is suc-
cessfully received, the MAX1136–MAX1139 (slave)
issues an acknowledge. The master then writes to the
slave. The slave recognizes the received byte as the
setup byte (Table 1) if the most significant bit (MSB) is
1. If the MSB is 0, the slave recognizes that byte as the
configuration byte (Table 2). The master can write either
one or two bytes to the slave in any order (setup byte
then configuration byte; configuration byte then setup
byte; setup byte or configuration byte only; Figure 9). If
the slave receives a byte successfully, it issues an
acknowledge. The master ends the write cycle by issu-
ing a STOP condition or a repeated START condition.
When operating in HS-mode, a STOP condition returns
the bus into F/S-mode (see the
HS-Mode
section).
MAX1136–MAX1139
2.7V to 3.6V and 4.5V to 5.5V, Low-Power,
4-/12-Channel, 2-Wire Serial 10-Bit ADCs
______________________________________________________________________________________ 13
B. TWO-BYTE WRITE CYCLE
SLAVE TO MASTER
MASTER TO SLAVE
S
1
SLAVE ADDRESS A
711
WSETUP OR
CONFIGURATION BYTE
SETUP OR
CONFIGURATION BYTE
8
P or Sr
1
A
1
MSB DETERMINES WHETHER
SETUP OR CONFIGURATION BYTE
S
1
SLAVE ADDRESS A
711
WSETUP OR
CONFIGURATION BYTE
8
P or Sr
1
A
1
MSB DETERMINES WHETHER
SETUP OR CONFIGURATION BYTE
A
18
A. ONE- BYTE WRITE CYCLE
NUMBER OF BITS
NUMBER OF BITS
Figure 9. Write Cycle
BIT 7
(MSB) BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0
(LSB)
REG SEL2 SEL1 SEL0 CLK BIP/UNI RST X
BIT NAME DESCRIPTION
7 REG Register bit. 1 = setup byte, 0 = configuration byte (see Table 2).
6 SEL2
5 SEL1
4 SEL0
Three bits select the reference voltage and the state of AIN_/REF (Table 6). Defaulted to 000 at
power-up.
3 CLK 1 = external clock, 0 = internal clock. Defaulted to 0 at power-up.
2 BIP/UNI 1 = bipolar, 0 = unipolar. Defaulted to 0 at power-up.
1RST 1 = no action, 0 = resets the configuration register to default. Setup register remains unchanged.
0 X Don’t care, can be set to 1 or 0.
Table 1. Setup Byte Format
[VI/J XI [VI
MAX1136–MAX1139
2.7V to 3.6V and 4.5V to 5.5V, Low-Power,
4-/12-Channel, 2-Wire Serial 10-Bit ADCs
14 ______________________________________________________________________________________
BIT 7
(MSB) BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0
(LSB)
REG SCAN1 SCAN0 CS3 CS2 CS1 CS0 SGL/DIF
BIT NAME DESCRIPTION
7 REG Register bit 1= setup byte (see Table 1), 0 = configuration byte
6 SCAN1
5 SCAN0
Scan select bits. Two bits select the scanning configuration
(Table 5). Defaulted to 00 at power-up.
4 CS3
3 CS2
2 CS1
1 CS0
Channel select bits. Four bits select which analog input channels are to be used for conversion
(Tables 3 and 4). Defaulted to 0000 at power-up. For MAX1136/MAX1137, CS3 and CS2 are
internally set to 0.
0SGL/DIF 1 = single-ended, 0 = differential (Tables 3 and 4). Defaulted to 1 at power-up. See the Single-
Ended/Differential Input section.
Table 2. Configuration Byte Format
CS31CS21CS1 CS0 AIN0 AIN1 AIN2 AIN32AIN4 AIN5 AIN6 AIN7 AIN8 AIN9 AIN10 AIN112GND
0000+ -
0001 + -
0010 + -
0011 + -
0100 + -
0101 + -
0110 + -
0111 + -
1000 + -
1001 +-
1010 +-
1011 +-
1 1 0 0 RESERVED
1 1 0 1 RESERVED
1 1 1 0 RESERVED
1 1 1 1 RESERVED
1. For MAX1136/MAX1137, CS3 and CS2 are internally set to 0.
2. When SEL1 = 1, a single-ended read of AIN3/REF (MAX1136/MAX1137) or AIN11/REF (MAX1138/MAX1139) will be ignored; scan
will stop at AIN2 or AIN10.
Table 3. Channel Selection in Single-Ended Mode (SGL/DIF = 1)
[VI I] XIIVI
Data Byte (Read Cycle)
A read cycle must be initiated to obtain conversion
results. Read cycles begin with the bus master issuing
a START condition followed by seven address bits and
a read bit (R/W= 1). If the address byte is successfully
received, the MAX1136–MAX1139 (slave) issues an
acknowledge. The master then reads from the slave.
The result is transmitted in two bytes; first six bits of the
first byte are high, then MSB through LSB are consecu-
tively clocked out. After the master has received the
byte(s) it can issue an acknowledge if it wants to con-
tinue reading or a not-acknowledge if it no longer wish-
es to read. If the MAX1136–MAX1139 receive a not-
acknowledge, they release SDA allowing the master to
generate a STOP or a repeated START condition. See
the
Clock Mode
and
Scan Mode
sections for detailed
information on how data is obtained and converted.
Clock Modes
The clock mode determines the conversion clock and
the data acquisition and conversion time. The clock
mode also affects the scan mode. The state of the set-
up byte’s CLK bit determines the clock mode (Table 1).
At power-up the MAX1136–MAX1139 are defaulted to
internal clock mode (CLK = 0).
Internal Clock
When configured for internal clock mode (CLK = 0), the
MAX1136–MAX1139 use their internal oscillator as the con-
version clock. In internal clock mode, the MAX1136–
MAX1139 begin tracking the analog input after a valid
address on the eighth rising edge of the clock. On the
falling edge of the ninth clock the analog signal is acquired
and the conversion begins. While converting the analog
input signal, the MAX1136–MAX1139 holds SCL low (clock
stretching). After the conversion completes, the results are
stored in internal memory. If the scan mode is set for multi-
ple conversions, they will all happen in succession
with each additional result stored in memory.The
MAX1136/MAX1137 contain four 10-bit blocks of memory,
and the MAX1138/MAX1139 contain twelve 10-bit blocks
of memory. Once all conversions are complete, the
MAX1136–MAX1139 release SCL allowing it to be pulled
high. The master may now clock the results out of the
memory in the same order the scan conversion has been
done at a clock rate of up to 1.7MHz. SCL will be stretched
for a maximum of 7.6µs per channel (see Figure 10).
MAX1136–MAX1139
2.7V to 3.6V and 4.5V to 5.5V, Low-Power,
4-/12-Channel, 2-Wire Serial 10-Bit ADCs
______________________________________________________________________________________ 15
CS31CS21CS1 CS0 AIN0 AIN1 AIN2 AIN32AIN4 AIN5 AIN6 AIN7 AIN8 AIN9 AIN10 AIN112
0000+-
0001 -+
0010 + -
0011 - +
0100 + -
0101 - +
0110 +-
0111 -+
1000 +-
1001 -+
1010 +-
1011 -+
1 1 0 0 RESERVED
1 1 0 1 RESERVED
1 1 1 0 RESERVED
1 1 1 1 RESERVED
1. For MAX1136/MAX1137, CS3 and CS2 are internally set to 0.
2. When SEL1 = 1, a differential read between AIN2 and AIN3/REF (MAX1136/MAX1137) or AIN10 and AIN11/REF
(MAX1138/MAX1139) will return the difference between GND and AIN2 or AIN10, respectively. For example, a differential read of
1011 will return the negative difference between AIN10 and GND. In differential scanning, the address increments by 2 until limit set
by CS3:CS1 has been reached.
Table 4. Channel Selection in Differential Mode (SGL/DIF = 0)
B <7 d:|]]:|:l]:l]:l="" m14="" \="" \="" +\="" p="" :h:="" m:="" 4="" [vi/j="" xi="" [vi="">
MAX1136–MAX1139
The device memory contains all of the conversion
results when the MAX1136–MAX1139 release SCL. The
converted results are read back in a first-in-first-out
(FIFO) sequence. If AIN_/REF is set to be a reference
input or output (SEL1 = 1, Table 6), AIN_/REF will be
excluded from a multichannel scan. The memory con-
tents can be read continuously. If reading continues
past the result stored in memory, the pointer will wrap
around and point to the first result. Note that only the
current conversion results will be read from memory.
The device must be addressed with a read command
to obtain new conversion results.
The internal clock mode’s clock stretching quiets the
SCL bus signal reducing the system noise during con-
version. Using the internal clock also frees the bus
master (typically a microcontroller) from the burden of
running the conversion clock, allowing it to perform
other tasks that do not need to use the bus.
2.7V to 3.6V and 4.5V to 5.5V, Low-Power,
4-/12-Channel, 2-Wire Serial 10-Bit ADCs
16 ______________________________________________________________________________________
B. SCAN MODE CONVERSIONS WITH INTERNAL CLOCK
S
1
SLAVE ADDRESS A
711
RCLOCK STRETCH
NUMBER OF BITS
P or Sr
1
8
RESULT 8 LSBs
8
RESULT 2 MSBs A
A
1
A. SINGLE CONVERSION WITH INTERNAL CLOCK
S
1
SLAVE ADDRESS
711
RCLOCK STRETCH
A
NUMBER OF BITS
P or Sr
18
RESULT 1 ( 2MSBs) A
1
A
8
RESULT 1 (8 LSBs) A
8
RESULT N (8LSBs)A
18
RESULT N (8MSBs)
SLAVE TO MASTER
MASTER TO SLAVE
CLOCK STRETCH
tACQ1
tCONV2
tACQ2
tCONVN
tACQN
tCONV
tACQ
11
tCONV1
Figure 10. Internal Clock Mode Read Cycles
SLAVE ADDRESS
tCONV1
tACQ1 tACQ2
tCONVN
tACQN
tCONV
tACQ
NUMBER OF BITS
NUMBER OF BITS
18
A
1
S
1
A
711
R
S
1711
RP OR Sr
1
8
A
1
A
8
A
8
B. SCAN MODE CONVERSIONS WITH EXTERNAL CLOCK
11
SLAVE ADDRESS P OR SrRESULT (8 LSBs)
8
A
1
RESULT (2 MSBs)
A. SINGLE CONVERSION WITH EXTERNAL CLOCK
SLAVE TO MASTER
MASTER TO SLAVE
RESULT 1 (2 MSBs) RESULT 2 (8 LSBs) RESULT N (8 LSBs)
A
1
8
RESULT N (2 MSBs)
A
Figure 11. External Clock Mode Read Cycle
[VI I] XIIVI
External Clock
When configured for external clock mode (CLK = 1),
the MAX1136–MAX1139 use the SCL as the conversion
clock. In external clock mode, the MAX1136–MAX1139
begin tracking the analog input on the ninth rising clock
edge of a valid slave address byte. Two SCL clock
cycles later the analog signal is acquired and the con-
version begins. Unlike internal clock mode, converted
data is available immediately after the first four empty
high bits. The device will continuously convert input
channels dictated by the scan mode until given a not
acknowledge. There is no need to re-address the
device with a read command to obtain new conversion
results (see Figure 11).
The conversion must complete in 1ms or droop on the
track-and-hold capacitor will degrade conversion
results. Use internal clock mode if the SCL clock period
exceeds 60µs.
The MAX1136–MAX1139 must operate in external clock
mode for conversion rates from 40ksps to 94.4ksps.
Below 40ksps internal clock mode is recommended
due to much smaller power consumption.
Scan Mode
SCAN0 and SCAN1 of the configuration byte set the
scan mode configuration. Table 5 shows the scanning
configurations. If AIN_/REF is set to be a reference
input or output (SEL1 = 1, Table 6), AIN_/REF will be
excluded from a multichannel scan. The scanned
results are written to memory in the same order as the
conversion. Read the results from memory in the order
they were converted. Each result needs a 2-byte trans-
mission, the first byte begins with six empty bits during
which SDA is left high. Each byte has to be acknowl-
edged by the master or the memory transmission will
be terminated. It is not possible to read the memory
independently of conversion.
Applications Information
Power-On Reset
The configuration and setup registers (Tables 1 and 2)
will default to a single-ended, unipolar, single-channel
conversion on AIN0 using the internal clock with VDD as
the reference and AIN_/REF configured as an analog
input. The memory contents are unknown after power-up.
Automatic Shutdown
Automatic shutdown occurs between conversions when
the MAX1136–MAX1139 are idle. All analog circuits
participate in automatic shutdown except the internal
reference due to its prohibitively long wake-up time.
When operating in external clock mode, a STOP, not-
acknowledge or repeated START, condition must be
issued to place the devices in idle mode and benefit
from automatic shutdown. A STOP condition is not nec-
essary in internal clock mode to benefit from automatic
shutdown because power-down occurs once all con-
version results are written to memory (Figure 10). When
using an external reference or VDD as a reference, all
analog circuitry is inactive in shutdown and supply cur-
rent is less than 0.5µA (typ). The digital conversion
results obtained in internal clock mode are maintained
in memory during shutdown and are available for
access through the serial interface at any time prior to a
STOP or a repeated START condition.
When idle the MAX1136–MAX1139 continuously wait
for a START condition followed by their slave address
(see
Slave Address
section). Upon reading a valid
address byte the MAX1136–MAX1139 power-up. The
internal reference requires 10ms to wake up, so when
using the internal reference it should be powered up
MAX1136–MAX1139
2.7V to 3.6V and 4.5V to 5.5V, Low-Power,
4-/12-Channel, 2-Wire Serial 10-Bit ADCs
______________________________________________________________________________________ 17
SCAN1 SCAN0 SCANNING CONFIGURATION
00
S cans up fr om AIN 0 to the i np ut sel ected b y C S 3–C S 0. When C S 3–C S 0 exceed s 1011, the scanni ng w i l l
stop at AIN 11. When AIN _/RE F i s set to b e a r efer ence i np ut/outp ut, scanni ng w i l l stop at AIN 2 and AIN 10.
0 1 *Converts the input selected by CS3–CS0 eight times. (See Tables 3 and 4)
Scans up from AIN2 to the input selected by CS1 and CS0. When CS1 and CS0 are set for AIN0–AIN2,
the only scan that takes place is AIN2 (MAX1136/MAX1137). When AIN/REF is set to be a reference
input/output, scanning stops at AIN2.
10
Scans up from AIN6 to the input selected by CS3–CS0. When CS3–CS0 is set for AIN0–AIN6, the only
scan that takes place is AIN6 (MAX1138/MAX1139). When AIN/REF is set to be a reference input/
output, scanning stops at selected channel or AIN10.
1 1 *Converts channel selected by CS3–CS0.
*
When operating in external clock mode there is no difference between SCAN[1:0] = 01 and SCAN[1:0] = 11 and converting will occur
perpetually until not acknowledge occurs.
Table 5. Scanning Configuration
MAXIM [VI/J XI [VI
MAX1136–MAX1139
10ms prior to conversion or powered continuously.
Wake-up is invisible when using an external reference or
VDD as the reference.
Automatic shutdown results in dramatic power savings,
particularly at slow conversion rates and with internal
clock. For example, at a conversion rate of 10ksps, the
average supply current for the MAX1137 is 60µA (typ) and
drops to 6µA (typ) at 1ksps. At 0.1ksps the average sup-
ply current is just 1µA, or a minuscule 3µW of power con-
sumption, see Average Supply Current vs. Conversion
Rate in the
Typical Operating Characteristics
.
Reference Voltage
SEL[2:0] of the setup byte (Table 1) control the reference
and the AIN_/REF configuration (Table 6). When AIN_/REF
is configured to be a reference input or reference output
(SEL1 = 1), differential conversions on AIN_/REF appear
as if AIN_/REF is connected to GND (see Note 2 and
Table 4). Single-ended conversion in scan mode on
AIN_/REF will be ignored by internal limiter, which sets the
highest available channel at AIN2 or AIN10.
Internal Reference
The internal reference is 4.096V for the MAX1136/
MAX1138 and 2.048V for the MAX1137/MAX1139. SEL1
of the setup byte controls whether AIN_/REF is used for an
analog input or a reference (Table 6). When AIN_/REF is
configured to be an internal reference output (SEL[2:1] =
11), decouple AIN_/REF to GND with a 0.1µF capacitor
and a 2ksereis resistor (see the
Typical Operating
Circuit
). Once powered up, the reference always remains
on until reconfigured. The internal reference requires 10ms
to wake up and is accessed using SEL0 (Table 6). When
in shutdown, the internal reference output is in a high-
impedance state. The reference should not be used to
supply current for external circuitry. The internal reference
does not require an external bypass capacitor and works
best when not connected to the pin (SEL1 = 0).
External Reference
The external reference can range from 1V to VDD. For
maximum conversion accuracy, the reference must be
able to deliver up to 40µA and have an output imped-
ance of 500or less. If the reference has a higher out-
put impedance or is noisy, bypass it to GND as close to
AIN_/REF as possible with a 0.1µF capacitor.
Transfer Functions
Output data coding for the MAX1136–MAX1139 is bina-
ry in unipolar mode and two’s complement in bipolar
mode with 1 LSB = (VREF/2N) where ‘N’ is the number
of bits (10). Code transitions occur halfway between
successive-integer LSB values. Figure 12 and Figure
13 show the input/output (I/O) transfer functions for
unipolar and bipolar operations, respectively.
Layout, Grounding, and Bypassing
Only use PC boards. Wire-wrap configurations are not
recommended since the layout should ensure proper
separation of analog and digital traces. Do not run ana-
log and digital lines parallel to each other, and do not
layout digital signal paths underneath the ADC pack-
2.7V to 3.6V and 4.5V to 5.5V, Low-Power,
4-/12-Channel, 2-Wire Serial 10-Bit ADCs
18 ______________________________________________________________________________________
SEL2 SEL1 SEL0 REFERENCE VOLTAGE AIN_/REF INTERNAL REFERENCE
STATE
00X V
DD Analog Input Always Off
0 1 X External Reference Reference Input Always Off
1 0 0 Internal Reference Analog Input Always Off
1 0 1 Internal Reference Analog Input Always On
1 1 0 Internal Reference Reference Output Always Off
1 1 1 Internal Reference Reference Output Always On
Table 6. Reference Voltage and AIN_/REF Format
OUTPUT CODE
FULL-SCALE
TRANSITION
11 . . . 111
11 . . . 110
11 . . . 101
00 . . . 011
00 . . . 010
00 . . . 001
00 . . . 000
123
0FS
FS - 3/2 LSB
FS = VREF
ZS = GND
INPUT VOLTAGE (LSB)
1 LSB = VREF
1024
MAX1136–
MAX1139
Figure 12. Unipolar Transfer Function
l ’ l v l “ rFsr'Vfl 1 non all) 7 2 ‘ , ,VFi l um um tLSB W ‘ um nun ,,,,,,,,,,,,,,,,,,,, i,, ttt Ill 7 : i ttt Ill)? : 1 fit Int 7 , i tm uni, : l tm um) : 1 r5 9 oFSrtLSB iNrLir VOLTAGE (tsB) Mummy 2mm Win *(Ale) . (Aw) Figure 73. BipU/ar Transfer Function age. Use separate analog and digital PC board ground sections with only one star point (Figure 14) connecting the two ground systems (analog and digital). For lowest noise operation. ensure the ground return to the star ground‘s power supply is low impedance and as short as possible Route digital signals far away from sensi- tive analog and reference inputs High-frequency noise in the power supply (VDD) could influence the proper operation of the ABC‘s fast com- parator Bypass VDD to the star ground with a network of two parallel capacitors. O tuF and 4 7uF. located as close as possible to the MAXt tafi—MAXt 139 power-sup- ply pin Minimize capacitor lead length for best supply noise reiection. and add an attenuation resistor (59) in series With the power supply. if it is extremely noisy. Definitions lnlegral Nonlinearily Integral nonlinearity (lNL) is the deviation of the values on an actual transfer function from a straight line. This straight line can be either a best straight-line fit or a line drawn between the endpoints of the transfer function. once offset and gain errors have been nullified The MAXHBG— MAX1139‘s INL is measured using the endpoint. Differential Nonlinearily Differential nonlinearity (DNL) is the difference between an actual step Width and the ideal value of 1 LSB A DNL error specification of less than 1 L83 guarantees no missing codes and a monotonic transfer function. [VI/JXIIIII MAXI/VI Aperture Jil Aperture iitter (IAJ) is the sample-to-sample variatio the time between the samples. Aperture De Aperture delay (tAD) is the time between the fa edge of the sampling clock and the instant whe actual sample is taken. Signal-Io-llloise Ra For a waveform perfectly reconstructed from digital s ples the theoretical maximum SNR is the ratio of the scale analog input (HMS value) to the RMS quantiz error (residual error) The ideal. theoretical minimum log-to-digital noise is caused by quantization error and results directly from the ABC‘s resolution (N Bits SNRMAx[dB] : 6.02:15 x N + t 76dB In reality. there are other noise sources besides qu zation noise. thermal noise reference noise clock etc. SNR is computed by taking the ratio of the signal to the RMS noise. which includes all spe components minus the fundamental. the first five monics, and the DC offset. Signal-to-Noise Plus Disfori Signal-to-noise plus distortion (SINAD) is the ratio o fundamental input frequency's HMS amplitude to equivalent of all other ADC output signals SINAD (dB) : 20 x log (SignalRMS/NoiseRMS)
age. Use separate analog and digital PC board ground
sections with only one star point (Figure 14) connecting
the two ground systems (analog and digital). For lowest
noise operation, ensure the ground return to the star
ground’s power supply is low impedance and as short
as possible. Route digital signals far away from sensi-
tive analog and reference inputs.
High-frequency noise in the power supply (VDD) could
influence the proper operation of the ADC’s fast com-
parator. Bypass VDD to the star ground with a network of
two parallel capacitors, 0.1µF and 4.7µF, located as
close as possible to the MAX1136–MAX1139 power-sup-
ply pin. Minimize capacitor lead length for best supply
noise rejection, and add an attenuation resistor (5) in
series with the power supply, if it is extremely noisy.
Definitions
Integral Nonlinearity
Integral nonlinearity (INL) is the deviation of the values on
an actual transfer function from a straight line. This straight
line can be either a best straight-line fit or a line drawn
between the endpoints of the transfer function, once offset
and gain errors have been nullified. The MAX1136–
MAX1139’s INL is measured using the endpoint.
Differential Nonlinearity
Differential nonlinearity (DNL) is the difference between
an actual step width and the ideal value of 1 LSB. A
DNL error specification of less than 1 LSB guarantees
no missing codes and a monotonic transfer function.
Aperture Jitter
Aperture jitter (tAJ) is the sample-to-sample variation in
the time between the samples.
Aperture Delay
Aperture delay (tAD) is the time between the falling
edge of the sampling clock and the instant when an
actual sample is taken.
Signal-to-Noise Ratio
For a waveform perfectly reconstructed from digital sam-
ples, the theoretical maximum SNR is the ratio of the full-
scale analog input (RMS value) to the RMS quantization
error (residual error). The ideal, theoretical minimum ana-
log-to-digital noise is caused by quantization error only
and results directly from the ADC’s resolution (N Bits):
SNRMAX[dB] = 6.02dB N + 1.76dB
In reality, there are other noise sources besides quanti-
zation noise: thermal noise, reference noise, clock jitter,
etc. SNR is computed by taking the ratio of the RMS
signal to the RMS noise, which includes all spectral
components minus the fundamental, the first five har-
monics, and the DC offset.
Signal-to-Noise Plus Distortion
Signal-to-noise plus distortion (SINAD) is the ratio of the
fundamental input frequency’s RMS amplitude to RMS
equivalent of all other ADC output signals.
SINAD (dB) = 20 log (SignalRMS/NoiseRMS)
MAX1136–MAX1139
2.7V to 3.6V and 4.5V to 5.5V, Low-Power,
4-/12-Channel, 2-Wire Serial 10-Bit ADCs
______________________________________________________________________________________ 19
011 . . . 111
011 . . . 110
000 . . . 010
000 . . . 001
000 . . . 000
111 . . . 111
111 . . . 110
111 . . . 101
100 . . . 001
100 . . . 000
- FS 0
INPUT VOLTAGE (LSB)
OUTPUT CODE
ZS = 0
+FS - 1 LSB
NOTE: VCOM VREF / 2
VIN = (AIN+) - (AIN-)
FS = VREF
2
-FS = -VREF
2
MAX1136–
MAX1139
1 LSB = VREF
1024
Figure 13. Bipolar Transfer Function
GND
VLOGIC = 3V/5V3V OR 5V
SUPPLIES
DGND3V/5VGND
*OPTIONAL
4.7µF
R* = 5
0.1µF
VDD
DIGITAL
CIRCUITRY
MAX1136–
MAX1139
Figure 14. Power-Supply Grounding Connection
[VI/J XI [VI
Effective Number of Bits
Effective number of bits (ENOB) indicates the global
accuracy of an ADC at a specific input frequency and
sampling rate. An ideal ADC’s error consists of quanti-
zation noise only. With an input range equal to the
ADC’s full-scale range, calculate the ENOB as follows:
ENOB = (SINAD - 1.76)/6.02
Total Harmonic Distortion
Total harmonic distortion (THD) is the ratio of the RMS
sum of the input signal’s first five harmonics to the fun-
damental itself. This is expressed as:
where V1is the fundamental amplitude, and V2through V5
are the amplitudes of the 2nd through 5th order harmonics.
Spurious-Free Dynamic Range
Spurious-free dynamic range (SFDR) is the ratio of RMS
amplitude of the fundamental (maximum signal compo-
nent) to the RMS value of the next largest distortion
component.
THD VVVV
V
+++
20 22324252
1
log
SINAD dB SignalRMS
NoiseRMS THDRMS
( ) log+
20
MAX1136–MAX1139
2.7V to 3.6V and 4.5V to 5.5V, Low-Power,
4-/12-Channel, 2-Wire Serial 10-Bit ADCs
20 ______________________________________________________________________________________
5v Mi SDA SCL 'DPHDNAL "mm UREF (MAxusstAxms) % RF RF C C C C [MAXIM LILILILI ‘ WWFIWFIF‘FI MAXIM LILILILILILILILI [VI I] XIIVI www.maxim-icLom/Qackages 21-0036 21-0055
MAX1136–MAX1139
2.7V to 3.6V and 4.5V to 5.5V, Low-Power,
4-/12-Channel, 2-Wire Serial 10-Bit ADCs
______________________________________________________________________________________ 21
*OPTIONAL
**AIN11/REF (MAX1138/MAX1139)
*RS
*RS
ANALOG
INPUTS
RC NETWORK*
µCSDA
SCL
GND
VDD
SDA
SCL
AIN0
AIN1
AIN3/REF**
3.3V OR 5V
2k
0.1µF
0.1µF
5V
RP
CREF
RP
5V
MAX1136
MAX1137
MAX1138
MAX1139
Typical Operating Circuit
SDA
SCLAIN3/REF
1
+
+
2
8
7
VDD
GNDAIN1
AIN2
AIN0
µMAX
TOP VIEW
3
4
6
5
MAX1136
MAX1137
16
15
14
13
12
11
10
9
1
2
3
4
5
6
7
8
AIN0 AIN8
AIN9
AIN10
AIN11/REF
VDD
GND
SDA
SCL
MAX1138
MAX1139
QSOP
AIN1
AIN2
AIN5
AIN3
AIN4
AIN6
AIN7
Pin Configurations
Chip Information
PROCESS: BiCMOS
PACKAGE TYPE PACKAGE CODE DOCUMENT NO.
8 µMAX U8+1 21-0036
16 QSOP E16+4 21-0055
Package Information
For the latest package outline information and land patterns
(footprints), go to www.maxim-ic.com/packages. Note that a
“+”, “#”, or “-” in the package code indicates RoHS status only.
Package drawings may show a different suffix character, but
the drawing pertains to the package regardless of RoHS status.
MAX1136–MAX1139
2.7V to 3.6V and 4.5V to 5.5V, Low-Power,
4-/12-Channel, 2-Wire Serial 10-Bit ADCs
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
22
____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600
© 2010 Maxim Integrated Products Maxim is a registered trademark of Maxim Integrated Products, Inc.
Revision History
REVISION
NUMBER
REVISION
DATE DESCRIPTION PAGES CHANGED
5 5/09 Discontinued some versions of the family 1–5, 13, 17–21
6 3/10 Changed Absolute Maximum Ratings and timing diagram 2, 12

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