LXESxxA Series Datasheet by Murata Electronics

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muRata mum/nan w “EzrnoNlcs LXES g A E 1133 Code Dimension 03 0‘6 x 0.3 15 1‘0 x 0.5
Ceramic ESD Protection Device LXES**A series
Document No. LX–1-1111
Rev1.3
p1/18
MURATA MFG. CO., LTD.
1. This specification shall be applied to the ESD Protection Device.
LXES15AAA1-133
LXES15AAA1-153
LXES03AAA1-154
LXES03AAA1-193
2. Part Number Configuration
LXES 15 A AA 1 133
② ③ ④ ⑤
Product ID LXES = ESD Protection device
Dimension Code
Unit : mm
Code
Dimension
03
0.6 x 0.3
15
1.0 x 0.5
Type (A:Ceramic ESD)
Control Code
Number of channel
Serial Number
RoHS Compliant
Halogen free
T/R only.
MSL 1
03 03 8X 05 05 05 8X 10
p2/18
MURATA MFG. CO., LTD.
3. CONSTRUCTION, DIMENSIONS
3 - 1 DIMENSIONS
Unit : mm
Size L W T a b
0603 0.60±0.03
0.30±0.03
0.33 max
0.15±0.05
0.20 min
1005 1.00±0.05
0.50±0.05
0.33 max
0.20±0.10
0.40 min
3 - 2 Circuit Diagram
TERMINAL CONFIGURATION
This device is bi-directional.
3 - 3 Product Weight
P/N Weight [mg]
LXES03AAA1-154
LXES03AAA1-193 0.2
LXES15AAA1-133
LXES15AAA1-153 0.5
p3/18
MURATA MFG. CO., LTD.
4. CHARACTERISTICS
4 - 1 - 1 Ratings (LXES15AAA1-133)
Parameter Symbol Ratings Units
Rated Voltage VDC 15 V
VAC 0±40 V
Operating Temperature T
OP
-40 to +85
o
C
Storage Temperature T
STO
-40 to +85
o
C
Frequency : >1MHz
4 - 1 - 2 Ratings (LXES15AAA1-153/ LXES03AAA1-154)
Parameter Symbol Ratings Units
Rated Voltage VDC 4 V
VAC 0±25 V
Operating Temperature T
OP
-40 to +85
o
C
Storage Temperature TSTO -40 to +85
o
C
Frequency : >1MHz
4 - 1 - 3 Ratings (LXES03AAA1-193)
Parameter Symbol Ratings Units
Rated Voltage VDC 6.3 V
VAC 0±80 V
Operating Temperature T
OP
-40 to +85
o
C
Storage Temperature TSTO -40 to +85
o
C
Frequency : >1MHz, 1/8 duty
4 - 2 Electrical Characteristics (T=25 deg.C)
Chip
size
[ mm ]
Part No. Capacitance
ESD
IEC 61000-4-2
(Air)
ESD
IEC 61000-4-2
(Contact)
Symbol C - -
Unit [pF] kV kV
Test condition 1MHz
Vbias=0V
0603 LXES03AAA1-154
0.05 typ ±15 ±15
LXES03AAA1-193
0.05typ ±15 ±15
1005 LXES15AAA1-133
0.05 typ ±15 ±15
LXES15AAA1-153
0.05 typ ±15 ±15
$3.56 15 In VDCM $3.56 15 In VDCM
p4/18
MURATA MFG. CO., LTD.
4 - 3 Typical Characteristic
LXES03AAA1-154
ESD Waveform (IEC61000-4-28kV Contact) Voltage – Capacitance Characteristic
LXES03AAA1-193
ESD Waveform (IEC61000-4-28kV Contact) Voltage – Capacitance Characteristic
LXES15AAA1-133
ESD Waveform (IEC61000-4-28kV Contact) Voltage – Capacitance Characteristic
0
50
100
150
200
250
-10.0 0.0 10.0 20.0 30.0 40.0 50.0
Voltage [V]
Tine [nsec]
0
50
100
150
200
250
300
-10 0 10 20 30 40 50
Clamping voltage (V)
Time (nsec.)
0.00
0.02
0.04
0.06
0.08
0.10
-15 -10 -5 0 5 10 15
Cline(pF)
VDC(V)
0
50
100
150
200
250
300
350
400
-10 0 10 20 30 40 50
Voltage [V]
Time [nsec]
£3.56 15 )u VDCM
p5/18
MURATA MFG. CO., LTD.
LXES15AAA1-153
ESD Waveform (IEC61000-4-28kV Contact) Voltage – Capacitance Characteristic
0
50
100
150
200
250
300
-10 0 10 20 30 40 50
Voltage [V]
Time [nsec]
p6/18
MURATA MFG. CO., LTD.
5. Reliability Test
No.
Items Specifications Test Methods Number
Result
(Fail)
1
Vibration Resistance
No severe damages
Satisfy
dimension
specifications
Solder specimens on the testing jig (glass fluorine
boards) shown in appended Fig.1 by a Pb free solder.
The soldering shall be done either by iron or reflow and
be conducted with care so that the soldering is uniform
and free of defect such as by heat shock.
Frequency : 10~2000 Hz
Acceleration : 196 m/s2
Direction : X,Y,Z 3 axis
Period : 2 h on each directionTotal 6 h.
22 G
(0)
2
Shock
Solder specimens on the testing jig (glass fluorine
boards) shown in appended Fig.1 by a Pb free solder.
The soldering shall be done either by iron or reflow and
be conducted with care so that the soldering is uniform
and free of defect such as by heat shock
Acceleration : 14,700 m/s2
Period : 0.3 ms.
Cycle : 3 times
22 G
(0)
3
Deflection
Solder specimens on the testing jig (glass epoxy
boards) shown in appended Fig.2 by a Pb free solder.
The soldering shall be done either by iron or reflow and
be conducted with care so that the soldering is uniform
and free of defect such as by heat shock.
No damage with 1.6mm deflection
22 G
(0)
4
Soldering strength
(Push Strength)
LXES03A series
2N Minimum
LXES15A series
3N Minimum
Solder specimens onto test jig shown below. Apply
pushing force at 0.5mm/s until electrode pads are
peeled off or ceramics are broken. Pushing force is
applied to longitudinal direction.
22 G
(0)
5
Solderability of Termination
95% of the
terminations is to be
soldered evenly and
continuously.
Immerse specimens first an ethanol solution of rosin,
then in a Pb free solder solution for 3±0.5 sec. at
245±5 °C.
Preheat : 100-120 °C, 60 sec.
Solder Paste : Sn-3.0Ag-0.5Cu
Flux : Solution of ethanol and rosin
(25 % rosin in weight proportion)
22 G
(0)
6
Resistance
to Soldering
Heat
(Reflow)
Appearance
Electrical
specifications
No
severe damages
Satisfy specifications
listed in paragraph 4-
2 over operational
temperature range
Preheat Temperature : 150-200 °C
Preheat Period : 120+/-60 s
High Temperature : 217
High Temp. Period : 105+/-45 s
Peak Temperature : 260+0/-5 °C
Specimens are soldered twice with the above condition,
and then kept in room condition for 24 h before
measurements.
22 G
(0)
Pushing Direction
Jig
Specimen
p7/18
MURATA MFG. CO., LTD.
No.
Items Specifications Test Methods Number
Result
(Fail)
7
High Temp.
Exposure
Appeara
nce
Electrical
Specifica
tions
No severe damages
Satisfy specifications listed in
paragraph 4-2 over
operational temperature
range
Temperature : 85+2/-0 °C
Period : 1000+48/-0 h
Room Condition : 2 ~ 24 h 22 G
(0)
8
Temperature
Cycle
Set the specimens to the
supporting jig in the same
manner and under the same
conditions as Fig.1 and conduct
the 100 cycles according to the
temperatures and time shown in
the following table. Set it for 2 to
24 h at room temperature, then
measure.
Step
Temp(°C) Time(min)
1
Min.
Operating
Temp.+0/-3
30±3
2
Max.
Operating
Temp.+3/-0
30±3
22 G
(0)
9
Humidity
(Steady
State)
Temperature85±2
Humidity8090 %RH
Period1000+48/-0 h
Room Condition2 24 h 22 G
(0)
10
Low Temp.
Exposure Temperature-40±2
Period1000+48/-0 h
Room Condition2 24 h 22 G
(0)
Fig. 1
Reference Land Pattern
Unit : mm
Size a b c
0603 0.25 0.8 0.3
1005 0.4 1.2 0.5
Notes : this land layout is for reference purpose only.
Testing board Mounted situation 45 45 Test method
p8/18
MURATA MFG. CO., LTD.
Fig. 2
Testing board
100
40
Mounted situation
Test method
Land
Land pattern is same as figure1
Glass-fluorine board t1.6mm
Copper thickness over 35 mm
(Unit : mm)
(Unit : mm)
(Unit : mm)
45
45
CHIP
R230
50
20
deflection
‘wm“ II III
p9/18
MURATA MFG. CO., LTD.
6. Tape and Reel Packing
(1) LXES03A series
1Dimensions of Tape
Unit : mm
Symbol
L W T a b c d e f
Size (0.67) (0.37) 0.5 max 2.00+/-0.05
4.00+/-0.10
3.50+/-0.05
1.75+/-0.1
8.00+/-0.30 φ1.55+/-0.05
(2) LXES15A series
2 Dimensions of Reel
Unit : mm
Symbol
L W T a b c d e f
Size (1.12) (0.62) 0.5 max 2.00+/-0.05
4.00+/-0.10
3.50+/-0.05
1.75+/-0.1
8.00+/-0.30 φ1.55+/-0.05
e
d
c
b
a
f
Feeding direction
p10/18
MURATA MFG. CO., LTD.
(3) Dimensions of Reel
Unit : mm
(4) Packaging
P/N pcs / reel
LXES03AAA1-154
LXES03AAA1-193 15,000
LXES15AAA1-133
LXES15AAA1-153 10,000
Symbol a b c d e
Size 2.0+/-0.5
φ13.0+/-0.2
9.0+1.0/-0
φ60+1.0/-0
φ180+0/-
1.5
d e
c
b
a
p11/18
MURATA MFG. CO., LTD.
(5) Taping Diagrams
1) LXES03A series
[1] Feeding Hole : As specified in (1) (2)
[2] Hole for chip : As specified in (1) (2)
[3] Cover tape : 50 m m in thickness
[4] Base tape : As specified in (1) (2)
Chip
Feeding Direction
Feeding Hole
[1]
[2]
[3]
[3]
[4]
p12/18
MURATA MFG. CO., LTD.
2) LXES15A series
[1] Feeding Hole : As specified in (1)
[2] Hole for chip : As specified in (1)
[3] Cover tape : 50 m m in thickness
[4] Base tape : As specified in (1)
[5] Bottom tape : 50 m m in thickness
Chip
Feeding Direction
Feeding Hole
[2]
[3]
[4]
[3]
[1]
[5]
IHVIJI H \l M HI
p13/18
MURATA MFG. CO., LTD.
(6) Leader and Tail tape
(7) The tape for chips are wound clockwise, the feeding holes to the right side as the tape is pulled
toward the user.
(8) Material : Base tape ...... Paper
Reel ...... Plastic
Base tape, Reel and Top tape have an anti-ESD function.
(9) Peeling of force : 0.1~1.0 N in the direction of peeling as shown below.
165 to 180 °
0.11.0
N
Cover tape
Tail tape
(No components) Components No components
Feeding direction
Leader tape
(Cover tape alone)
Over160mm
Over100mm
Over400mm
Base tape
p14/18
MURATA MFG. CO., LTD.
NOTICE
1. Storage Conditions:
To avoid damaging the solderability of the external electrodes, be sure to observe the following points.
- Store products where the ambient temperature is 15 to 35 °C and humidity 45 to 75% RH.
(Packing materials, In particular, may be deformed at the temperature over 40 °C.).
- Store products in non corrosive gas (Cl2, NH3,SO2, Nox, etc.).
- Stored products should be used within 6 months of receipt. Solderability should be verified if this period
is exceeded.
This product is applicable to MSL1 (Based on IPC/JEDEC J-STD-020)
2. Handling Conditions:
Be careful in handling or transporting products because excessive stress or mechanical shock may break
products due to the nature of ceramics structure.
Handle with care if products may have cracks or damages on their terminals, the characteristics of products
may change. Do not touch products with bear hands that may result in poor solderability.
3. Standard PCB Design (Land Pattern and Dimensions):
All the ground terminals should be connected to the ground patterns. Furthermore, the ground pattern
should be provided between IN and OUT terminals. Please refer to the specifications for the standard
land dimensions.
The recommended land pattern and dimensions is as Murata's standard. The characteristics of products
may vary depending on the pattern drawing method, grounding method, land dimensions, land forming
method of the NC terminals and the PCB material and thickness. Therefore, be sure to verify the
characteristics in the actual set. When using non-standard lands, contact Murata beforehand.
4. Notice for Chip Placer:
When placing products on the PCB, products may be stressed and broken by uneven forces from a worn-out
chucking locating claw or a suction nozzle. To prevent products from damages, be sure to follow the
specifications for the maintenance of the chip placer being used. For the positioning of products on the PCB, be
aware that mechanical chucking may damage products.
0 “C “C 217 “C “C 50 “C Cooling down
p15/18
MURATA MFG. CO., LTD.
5. Soldering Conditions:
Carefully perform preheating so that the temperature difference (DT) between the solder and products surface
should be in the following range. When products are immersed in solvent after mounting, pay special attention
to maintain the temperature difference within 100 °C. Soldering must be carried out by the above mentioned
conditions to prevent products from damage. Contact Murata before use if concerning other soldering
conditions.
Soldering method Temperature
Soldering iron method DT<=130 °C
Reflow method
- Soldering iron method conditions are indicated below.
Kind of iron Item Ceramics heater
Soldering iron wattage <=18 W
Temperature of iron-tip <=350 °C
Iron contact time within 3 sec
- Diameter of iron-tip : f3.0 mm max.
- Do not allow the iron-tip to directly touch the ceramic element.
Reflow soldering standard conditions (Example)
Use rosin type flux or weakly active flux with a chlorine content of 0.2 wt % or less.
60-180 sec
DT
Temperature (°C)
Pre-heating
Time (s.)
217 °C
60-150 sec.
Cooling down
slowly
255-260 °C
20-40 sec
MAX260 °C
1
50 °C
200
°C
255
°C
te
p16/18
MURATA MFG. CO., LTD.
Amount of Solder Paste:
- Ensure that solder is applied smoothly to a minimum height of 0.2 to 0.5 mm at the end surface of the
external electrodes. If too much or little solder is applied, there is high possibility that the mechanical
strength will be insufficient, creating the variation of characteristics.
Chassis
Lead wire of leaded
component
Soldering iron
Solder resist
<Unacceptable>
<Improvements by land division >
High
Chip
Amount of solder paste
Chip
Chip
PCB
Land
Solder (Grounding solder)
Solder resist
Solder resist
Lead wire of component
mounted later
p17/18
MURATA MFG. CO., LTD.
6. Cleaning Conditions:
Any cleaning is not permitted..
7. Operational Environment Conditions:
Products are designed to work for electronic products under normal environmental conditions (ambient
temperature, humidity and pressure). Therefore, products have no problems to be used under the similar
conditions to the above-mentioned. However, if products are used under the following circumstances, it
may damage products and leakage of electricity and abnormal temperature may occur.
- In an atmosphere containing corrosive gas ( Cl2, NH3, SOx, NOx etc.).
- In an atmosphere containing combustible and volatile gases.
- In a dusty environment.
- Direct sunlight
- Water splashing place.
- Humid place where water condenses.
- In a freezing environment.
If there are possibilities for products to be used under the preceding clause, consult with Murata before
actual use.
If product malfunctions may result in serious damage, including that to human life, sufficient fail-safe
measures must be taken, including the following:
(1) Installation of protection circuits or other protective device to improve system safety
(2) Installation of redundant circuits in the case of single-circuit failure
8. Limitation of Applications:
The products are designed and produced for application in ordinary electronic equipment
(AV equipment, OA equipment, telecommunication, etc). If the products are to be used in devices requiring
extremely high reliability following the application listed below, you should consult with the Murata staff in
advance.
- Aircraft equipment.
- Aerospace equipment
- Undersea equipment.
- Power plant control equipment.
- Medical equipment.
- Transportation equipment (vehicles, trains, ships, etc.).
- Traffic signal equipment.
- Disaster prevention / crime prevention equipment.
- Data-procession equipment.
- Application which malfunction or operational error may endanger human life and property of assets.
- Application which related to occurrence the serious damage
- Application of similar complexity and/ or reliability requirements to the applications listed in the above.
9. Place of use
LXES15AAA1-153 / LXES03AAA1-154 are developed mainly for antenna line and signal line use.
We do not recommend that you use it in places where DC voltage is always applied, even if it is within rated
voltage. LXES15AAA1-133 / LXES03AAA1-193 are withstand voltage products and can be used within the rated
voltage in places where the constant DC voltage such as the power supply line is applied.
Note:
p18/18
MURATA MFG. CO., LTD.
! Note:
Please make sure that your product has been evaluated and confirmed against your specifications when
our product is mounted to your product.
Product specifications are subject to change or our products in it may be discontinued without advance
notice.
This catalog is for reference only and not an official product specification document, therefore, please
review and approve our official product specification before ordering this product.
Note:
This catalog is for reference only and not an official product specification document, therefore, please review and approve our official
product specification before ordering this product.

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