
(2)
3M™ Electrically Conductive Adhesive Transfer Tape 9703
Peel Adhesion to Stainless Steel:
Tested in accordance with a modified ASTM D3330 test method, 12 ipm peel rate, 1 in. width, 2 mil PET backing, 180 degree)
Dwell Time @ Room Temperature 1 Hour 24 Hours
23°C 29 oz./in. (3.2 N/cm) 32 oz./in. (3.5 N/cm)
Note: Peel values will often be higher than noted above when using a non-PET backing. Different backing types effect the
backing modulus, thickness and stiffness and these differences directly effect the peel test result value. As an example, a
2 mil aluminum backing will change the test value of the peel adhesion as the peel back angle at the interface will change
due to the backing stiffness. A 2 mil aluminum backing would generally increase the peel values.
Temperature Performance1 Application Use Temperatures:
-40 to +85°C in a properly designed end use application. See Note 1.
Application Storage Temperatures:
See “Shelf Life and Storage” comments. End user needs to qualify converted material for a
broader storage environmental range.
See also the Application section of this document
Outgassing:
(NASA SP-R-0022 or ASTM E595) 125°C, 24 hrs, 2 × 10-6 Torr vacuum
Total Mass Loss (TML) 0.7%
Collected Volatile Condensable Materials (CVCM) 0.01%
Electrical Properties:
Insulation Resistance2,3 3.4 × 1014 ohms/square (estimated based on 3M™ Electrically Conductive Adhesive
Transfer Tape 9703)
Contact Resistance1 < 0.3 ohms (3M Test Method, Gold PI Flex onto Gold PCB, RT Initial R, 6 mm2)
Minimum Gap4 15 mil (0.4 mm)
Minimum Overlap Area5 5000 mil2 (3.2 mm2)
Apparent Thermal Conductivity6 0.16-0.20 W/mK
Typical Physical Properties and Performance Characteristics
Note: The following technical information and data should be considered representative or typical only and
should not be used for specification purposes.
Adhesive Properties:
1. The final assembly must be tested to verify that the 3M™ Electrically Conductive Adhesive Transfer Tape 9703 can achieve the desired performance in
the assembly’s end use application environmental conditions (temperature, humidity, temperature cycling, shock, application assembly design, assembly
variation, etc.). 3M ECATT 9703 may achieve the -40 to +85°C temperature range (or broader temperature range excursions) in an end use application
if the final assembly design is designed so that the conductive particles remain in sufficient mechanical contact between surfaces to achieve the desired
contact resistance. Some type of mechanical bond line compression design as determined by the end use customer (clip, clamp, screw, compressed foam,
etc.) that will apply a constant minimum pressure across the bond line may be required to meet the desired end use environmental ranges and contact
resistance specification. The temperature use range is dictated by two primary items: Temperature performance of the acrylic adhesive (generally in the
range of -40°C to about 95°C depending on other environmental conditions) as it supports the conductive particles in the adhesive/ particle matrix and the
potential movement of the conductive fillers in the adhesive system in an end use application design. Items contributing to the performance of the Tape
9703 for resistance level performance include, but are not limited to: assembled bond line force (constant force present across the bond line after assembly
and over the life of the product), types of substrates bonding, surface features in bonded area, environmental conditions, (temperature, humidity, CTE,
shock, environmental cycling, etc.), assembly surfaces and 3M ECATT 9703 compatibility, 3M ECATT 9703 filler and assembly surfaces galvanic potential
compatibility, etc. (See section on mechanical clamping for added information).
2. Tested in accordance with ASTM D-257 test method.
3. Estimate based on 3M™ Electrically Conductive Adhesive Transfer Tape 9703 test data.
4. Minimum free space between adjacent conductors suggested to ensure electrical isolation. Customers may qualify finer pitch performance in their
applications.
5. Minimum recommended conductor overlap area (pad area) in the interconnection of individual circuit lines to ensure Z-Axis conductio.
6. Tested in accordance with a modified ASTM D5470 thermal test method.