Crystal Device Selection Guide Datasheet by KYOCERA AVX

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1. Shock & Drop • Vibration
Do not inflict excessive shock and mechanical vibration that
exceeds the norm, such as hitting or mistakenly dropping,
when transporting and mounting on a board. There are cases
when pieces of crystal break, and pieces that are used become
damaged, and become inoperable. When a shock or vibration
that exceeds the norm has been infl icted, make sure to check the
characteristics.
2. Cleaning
Since a crystal piece can be broken by resonance when a crystal
device is cleaned by ultrasonic cleaning, be careful when carrying
out ultrasonic cleaning.
3. Soldering conditions
To maintain the product reliability, please follow recommended conditions.
Standard soldering iron conditions
Clock Oscillators
Soldering iron 280°C to 340°C
Time 3+1/ 0 sec. max.
Refl ow conditions (Example)
Time (sec.)
Temperature (qC)
Clock Oscillators
120 sec. max.
10 sec. max.
230qC min.
40 sec. max.
Peak: 260
qC
0
10
180 qC
0
10
Recommended reflow Conditions vary depending upon products.
Please check with the respective specification for details.
4. Mounting Precautions
The lead of the device and the pattern of the board is soldered on the surface. Since extreme deformation of the board tears off the pattern,
tears off the lead metal, cracks the solder and damages the sealed part of the device and there are cases in which performance deteriorates
and operation fails, use it within the stipulated bending conditions. Due to the small cracks in the board resulting from mounting, please pay
suffi cient attention when attaching a device at the position where the warping of the board is great.
When using an automatic loading machine, as far as possible, select a type that has a small impact and use it while confi rming that there is
no damage.
Surface mount devices are NOT fl ow soldering compatible.
5. Storage Condition
Since the long hour high temperature and low temperature storage, as well as the storage at high humidity are causes of deterioration in
frequency accuracy and solderability.
Parts should be stored in temperature range of 5 to +40°C, humidity 40 to 60% RH, and avoid direct sunlight. Then use within 6 months.
Handling Notes for Clock Oscillators
As of March 2018
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6. In order to use clock oscillators
(1) The miniature oscillator for the clock utillzes a CMOS IC and incorporates a protective circuit against static electricity. However, exercise
care in the same manner as for a normal CMOS IC.
(2) Internal capacitor is not provided in the power supply section (+DC-GND). *
To serve as overimpressed voltage and overcurrent protective device, place a bypass capacitor (0.01μF) as near as possible to the (+DC-GND)
terminal. However, the capacitance value is meant as a guideline. Depending on the capacitor type, frequency characteristics vary. Accordingly,
use a capacitor that matches the frequency characteristics.
* KC7050S series has Bypass Capacitior between VCC and GND.
(3) Applying reverse voltage could result in damage to internal parts. Take care not to connect terminals incorrectly.
(4) Please do not use oscillators under unfavorable condition such as beyond specifi ed range in catalog or specifi cation sheet.
(5) Please keep oscillators away from water, salt water or harmful gas.
(6) KC7050S series should be stored in humidity-controlled area after the package is unsealed, in temperature +25±5°C, under humidity of
65%RH, and should be mounted on PCB within 7 days.
Clock Timing Chart
[CMOS Output]
GND
VCC
VOH
VOL
VOH
VOL
T1
Tr Tf
T0 1/ FOUT Symmetry T1/ T0u100 (%)
90% VCC
50% VCC
10% VCC
[LV-PECL (3.3V) Output]
2.420V
2.275V
1.680V
1.490V
Output
Symmetry T1/ T0u100 (%)
Output
Tr Tf
T0 1/ FOUT
T1
80% Waveform
20% Waveform
Crossing Point
VOH
VOL
[LV-PECL (2.5V) Output]
Output
1.760V
1.475V
1.095V
Symmetry T1/ T0u100 (%)
Output
0.690V
Tr Tf
T0 1/ FOUT
T1
80% Waveform
20% Waveform
Crossing Point
VOH
VOL
Crossing Point
0.85V
0.60V
Voh
Vol
0.15V
-0.15V
0.525V
0.175V
Output
Output
Tr Tf
Symmetry T1/ T0u100(%)
T0 1/ FOUT
T1
[HCSL-Output]
[LVDS Output]
Symmetry T1/ T0u100 (%)
VOH
VOL
Output
80% Waveform
20% Waveform
Crossing Point
Tr Tf
T0 1/ FOUT
T1
Output
Handling Notes for Clock Oscillators
As of March 2018
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Test Circuits
Note) Maximum load (Includes capacitances of fixture and probe)
CMOS Output Test Circuits
A
V
Power
Supply
Oscillator
Pad4
Pad1
Pad3
Pad2
INH
0.01PF
Test Point
CL
Oscillator
①②
⑥⑤
Z0 50ohm
50ohm 50ohm
0.01PF10PF3.3V
E/ D Control
V
A
HCSL Output Test Circuits
LV-PECL (3.3V/ XO) Output Test Circuits
V
Oscillator
E/ D Control
0.01PF10PF
A
3.3V
Z0 50ohm
Z0 50ohm Test Point1
ECL Termination
ECL Termination
Test Point2
①②
⑥⑤
ECL
ECL
VCC2.0VBIAS
LV-PECL (2.5V/ XO) Output Test Circuits
V
Oscillator
E/ D Control
0.01PF10PF
A
2.5V
Z0 50ohm
Z0 50ohm Test Point1
ECL Termination
ECL Termination
Test Point2
①②
⑥⑤
ECL
ECL
BIAS VCC2.0V
LVDS (3.3V/ XO) Output Test Circuits
V
Oscillator
INH
0.01PF
10PF
A
3.3V
①②
⑥⑤
RL
RL
VOS,dVOS
VOD,dVOD
Duty,Vopp,Tr/Tf
VOH
VOL
VOS, dVOS
VOD, dVOD
Duty, Vopp, Tr/ Tf
VOH
VOL
Note) RL=50:
LVDS (2.5V/ XO) Output Test Circuits
V
Oscillator
INH
0.01PF
10PF
A
2.5V
①②
⑥⑤
RL
RL
VOS,dVOS
VOD,dVOD
Duty,Vopp,Tr/Tf
VOH
VOL
VOS, dVOS
VOD, dVOD
Duty, Vopp, Tr/ Tf
VOH
VOL
Note) RL=50:
Note) Maximum load (Includes capacitances of fixture and probe)
CMOS (VCXO 4pad) Output Test Circuits
A
V
Power
Supply
Power
Supply
(VC)
0.01PF
Test Point
CL
V
Oscillator
Pad4
Pad1
Pad3
Pad2
Note) Maximum load (Includes capacitances of fixture and probe)
CMOS (VCXO 6pad) Output Test Circuits
A
V
Power
Supply
Power
Supply
(VC)
Oscillator
INH
0.01PF
Test Point
CL
①②③
⑥⑤④
V
Handling Notes for Clock Oscillators
As of March 2018

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