Anisotropic Conductive Film Brochure Datasheet by 3M (TC)

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3M Anisotropic Conductive Film (ACF)
Interconnect Solutions
3
Get
Connected
FIex-On—Glm 1 | [in‘d/Coppernn Pn‘y‘mide Connection Type Fm m Ghs me PC Beam ‘Temd nnly lo! si‘vel cm; ml sums fol ITD [r
Flex-On-Board Flex-On-Glass Flex-On-PET/Glass Flex-On-PET Camera Module Camera Module Flex-On-PET
3M ACF 5363 3M ACF 7303 3M ACF 7378 3M ACF 5552R 3M ACF 7371 3M ACF 7393 3M ACF 7376-10 3M ACF 7376-20
Adhesive Thickness (micron) 40 75 40 19 25 25 40 35
Particle Diameter (micron) 10 43 10 610 10 10 20
Type of Particle Au/Ni Ag/Glass Au/Ni Au/Ni/Polymer Au/Ni/Polymer Au/Ni/Polymer Au/Ni/Polymer Au/Ni/Polymer
Bonding Temperature (°C) 195 to 210 135 to 150 160 to 180 170 to 190 140 to 170 150 to 170 140 to 160 140 to 160
Bonding Time (seconds) 10 to 20 25 5 to 9 20 to 30 10 to 15 10 to 20 7 to 15 7 to 15
Bonding Pressure (MPa) 3 to 5 23 to 4 2 to 4 1 to 2 1 to 2 1 to 2 1 to 2
Minimum Pitch (micron) 200 500 200 <100 200 200 200 500
Minimum Pad Area (mm2)0.15 0.75 0.2 0.015 0.2 0.2 0.2 0.5
Connection Resistance <100 mOhms <200 mOhms <100 mOhms <20 Ohms <100 mOhms <100 mOhms <100 mOhms <100 mOhms
90° Peel Adhesion (g/cm) >700 >500 >1000 >800 >700 >700 >700 >700
Temp/Humidity Aging (°C/%r.h.) 85/85 70/90 85/85 85/85 85/85 70/90 85/85 85/85
Temp Cycling (°C) -40 to 100 -40 to 80 -40 to 85 -40 to 100 -40 to 85 -20 to 60 -40 to 85 -40 to 85
Flex Type
Silver Ink on Polyester X X X X X
Gold/Copper on Polyester X X X X X X
Gold/Copper on Polyimide XXXXXXX X
Connection Type
Flex to Glass X1XXX
Flex to Plastic Device X2X X X
Flex to PC Board X X X X X
Flex to Flex XXXXXXX X
1Tested only for silver frit; not suitable for ITO traces. 2Suitable for silver ink traces only; not suitable for ITO traces.
Products for a variety of applications
– Flex circuit to PCB – Flex circuit to flex circuit – Flex circuit to glass panels
Good room temperature stability for long life on the factory floor
Low temperature processing for lead free solutions
Replaces connectors for cost savings, lower Z-axis standoff
3M offers you a variety of
high-performance anisotropic
conductive adhesive products,
used to mechanically and
electrically connect flex circuits
to a variety of substrates.
These reliable, production-
proven technologies can replace
soldering and mechanical
fasteners in many applications,
reducing assembly time and
saving on space requirements.
Get Connected
with 3M Anisotropic Conductive Film (ACF) Adhesive Technologies
Choose the 3M ACF Adhesive That’s Right for Your Application
Get the job done faster, easier and more economically
with 3M Anisotropic Conductive Film (ACF) Interconnect Solutions
Flex-On-Board Flex-On-Glass Flex-On-PET/Glass Flex-On-PET Camera Module Camera Module Flex-On-PET
3M ACF 5363 3M ACF 7303 3M ACF 7378 3M ACF 5552R 3M ACF 7371 3M ACF 7393 3M ACF 7376-10 3M ACF 7376-20
Adhesive Thickness (micron) 40 75 40 19 25 25 40 35
Particle Diameter (micron) 10 43 10 610 10 10 20
Type of Particle Au/Ni Ag/Glass Au/Ni Au/Ni/Polymer Au/Ni/Polymer Au/Ni/Polymer Au/Ni/Polymer Au/Ni/Polymer
Bonding Temperature (°C) 195 to 210 135 to 150 160 to 180 170 to 190 140 to 170 150 to 170 140 to 160 140 to 160
Bonding Time (seconds) 10 to 20 25 5 to 9 20 to 30 10 to 15 10 to 20 7 to 15 7 to 15
Bonding Pressure (MPa) 3 to 5 23 to 4 2 to 4 1 to 2 1 to 2 1 to 2 1 to 2
Minimum Pitch (micron) 200 500 200 <100 200 200 200 500
Minimum Pad Area (mm2)0.15 0.75 0.2 0.015 0.2 0.2 0.2 0.5
Connection Resistance <100 mOhms <200 mOhms <100 mOhms <20 Ohms <100 mOhms <100 mOhms <100 mOhms <100 mOhms
90° Peel Adhesion (g/cm) >700 >500 >1000 >800 >700 >700 >700 >700
Temp/Humidity Aging (°C/%r.h.) 85/85 70/90 85/85 85/85 85/85 70/90 85/85 85/85
Temp Cycling (°C) -40 to 100 -40 to 80 -40 to 85 -40 to 100 -40 to 85 -20 to 60 -40 to 85 -40 to 85
Flex Type
Silver Ink on Polyester X X X X X
Gold/Copper on Polyester X X X X X X
Gold/Copper on Polyimide XXXXXXX X
Connection Type
Flex to Glass X1XXX
Flex to Plastic Device X2X X X
Flex to PC Board X X X X X
Flex to Flex XXXXXXX X
1Tested only for silver frit; not suitable for ITO traces. 2Suitable for silver ink traces only; not suitable for ITO traces.
Get Connected
with 3M Anisotropic Conductive Film (ACF) Adhesive Technologies
Heat-bondable 3M ACF films, consisting of thermoplastic and thermoset adhesives
randomly loaded with conductive particles. These particles allow interconnection of
circuit lines through the adhesive thickness, but are spaced far enough apart for the
product to be electrically insulating along the plane of the adhesive.
3M Anisotropic Conductive Film (ACF) Adhesives
Product Use: All statements, technical information and recommendations contained in this document are based on tests or experience that 3M believes are reliable. However,
many factors beyond 3M’s control can affect the use and performance of a 3M product in a particular application, including conditions under which the product is used and the
time and environmental conditions in which the product is expected to perform. Since these factors are uniquely within the user’s knowledge and control, it is essential that the
user evaluate the 3M product to determine whether it is fit for a particular purpose and suitable for the user’s method of application.
Warranty and Limited Remedy: Unless stated otherwise in 3M’s product literature, packaging inserts or product packaging for individual products, 3M warrants that each
3M product meets the applicable specifications at the time 3M ships the product. Individual products may have additional or different warranties as stated on product literature,
package inserts or product packages. 3M MAKES NO OTHER WARRANTIES, EXPRESS OR IMPLIED, INCLUDING BUT NOT LIMITED TO, ANY IMPLIED WARRANTIES OF
MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR ANY IMPLIED WARRANTY ARISING OUT OF A COURSE OF DEALING, CUSTOM OR USAGE OF TRADE. User
is responsible for determining whether the 3M product is fit for a particular purpose and suitable for user’s application. If the 3M product is defective within the warranty period,
your exclusive remedy and 3M’s and seller’s sole obligation will be, at 3M’s option, to replace the product or refund the purchase price.
Limitation Of Liability: Except where prohibited by law, 3M and seller will not be liable for any loss or damage arising from the 3M product, whether direct, indirect, special,
incidental, or consequential regardless of the legal theory asserted, including warranty, contract, negligence or strict liability.
Please recycle. Printed in USA.
Issued: 5/09 © 3M 2009.
All rights reserved. 6859HB
60-5002-0057-5
3M is a trademark of 3M Company.
Used under license by 3M subsidiaries and affiliates.
Electronics Markets Materials Division
3M Electronics
3M Center, Building 225-3S-06
St. Paul, MN 55144-1000
www.3M.com/electronics
1-800-251-8634
3M Electrically Conductive Adhesive Transfer Tape (ECATT)
An easy-to-use, pressure sensitive tape designed for connecting, bonding and grounding flex
circuits, PCBs and EMI/RFI shields and gaskets. Applied at room temperature no thermal
bonding required! Not recommended for extreme high or low temperatures.
Contact 3M
3M provides applications development support. For more information, contact
3M at 800-251-8634. Or visit us on the web: www.3M.com/electronics.
3M ECATT 9703 3M ECATT 9705
Adhesive Thickness (micron) 50 50
Type of Particle Ag/Ni Ag/Ni
Pitch (micron) 800 800
Application Notes
Good adhesion; reworkable. For connecting/bonding/grounding flex circuits,
printed circuits boards, EMI/RFI shields & gaskets, PSA attachments at room temp.
Not recommended for extreme high/low temps.

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