SSL5021BTS Datasheet by NXP USA Inc.

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1. General description
The SSL5021BTS is a highly integrated, high-precision, non-isolated MOSFET/bipolar
buck controller. It is intended to drive LED lamps in universal mains non-dimmable lighting
applications up to 25 W. The SSL5021BTS is designed for low-ripple applications.
The SSL5021BTS operates in Boundary Conduction Mode (BCM) with on-time regulation.
Operating in BCM provides a constant output current control with high accuracy. Adaptive
switching frequency gives freedom to choose the inductor, which enables the optimization
of inductor size, efficiency and EMI.
The SSL5021BTS starts up and operates in switching mode directly from an external
resistor without dV/dt supply or auxiliary supply. This feature simplifies the VCC supply. It
allows a low-cost off-the-shelf inductor to be used, providing flexibility in application
design.
The SSL5021BTS comes in a compact TSOP6 package.
The SSL5031BTS is suitable for high power factor/Low-THD applications with a
high-temperature foldback function. The SSL5031CTS is best for high power
factor/low-THD applications without a high-temperature foldback function.
2. Features and benefits
Driving LED strings from a rectified mains supply, low-ripple (< ±5 %)
Small electronic Bill of Materials (BOM) enabling a compact solution and a small,
single layer Printed-Circuit Board (PCB) footprint
Excellent line and load regulation and LED output current accuracy
Efficient BCM operation with:
Minimal reverse recovery losses in freewheel diode
Zero Current Switching (ZCS) and valley switching for switch turn-on
Minimal inductance value and size required
High efficiency (up to 91 %)
Ultra low IC current during operation (< 150 A)
Auto-recovery protections:
UnderVoltage LockOut (UVLO)
Cycle-by-cycle OverCurrent Protection (OCP)
Internal OverTemperature Protection (OTP)
Output OverVoltage Protection (OVP)
Output Short Protection (OSP)
SSL5021BTS
Compact low-ripple buck LED driver IC
Rev. 2 — 11 March 2015 Product data sheet
SSL5021BTS All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 2 — 11 March 2015 2 of 20
NXP Semiconductors SSL5021BTS
Compact low-ripple buck LED driver IC
Thermal foldback protection via a single PTC or NTC resistor
Compatible with wall switches with built-in standby indicator lights (Hotaru switch)
Extended IC lifetime
3. Applications
The SSL5021BTS is intended for low-cost, non-isolated LED lighting applications with
accurate fixed current output up to 25 W for single mains or universal mains voltage
(90 V (AC) to 277 V (AC)).
4. Quick reference data
[1] An internal clamp sets the supply voltage. The current into the VCC pin must not exceed the maximum IVCC
value (see Table 4).
5. Ordering information
Table 1. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
VCC supply voltage operating range [1] 9.5 - 16 V
RDSon on-state resistance of internal switch
Tj=25C - 0.75 0.90
Tj=125C-1.20-
II(SW) input current in pin SW triangle wave;
duty cycle < 20 %
2- +2A
VI(SW) input voltage on pin
SW current limited at
8.8 mA;
internal switch off
0.4 - +22 V
Table 2. Ordering information
Type number Package
Name Description Version
SSL5021BTS TSOP6 plastic surface-mounted package; 6 leads SOT457
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SSL5021BTS All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 2 — 11 March 2015 3 of 20
NXP Semiconductors SSL5021BTS
Compact low-ripple buck LED driver IC
6. Block diagram
7. Pinning information
7.1 Pinning
Fig 1. Block diagram
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SSL5021BTS All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 2 — 11 March 2015 4 of 20
NXP Semiconductors SSL5021BTS
Compact low-ripple buck LED driver IC
7.2 Pin description
8. Functional description
8.1 Converter operation
The SSL5021BTS is a power MOSFET and bipolar compatible controller. The converter in
the SSL5021BTS is a source/emitter switch, Boundary Conduction Mode (BCM), on-time
controlled system. Figure 3 shows the basic application diagram for MOSFET. Figure 4
shows the basic application diagram for bipolar.
The integrated switch is used to save IC supply current. It enables the use a single
external resistor as supply even in switching mode. This converter operates at the
boundary between Continuous Conduction Mode (CCM) and Discontinuous Conduction
Mode (DCM). Figure 5 shows the waveforms.
When the internal switch is switched on at t0, the inductor current IL builds up from zero in
proportional with VIN -V
OUT during the switch on-time (t0 to t1). Energy is stored in the
inductor.
When the internal switch switches off at t1, IL drops proportionally to the value of VOUT.
The current flows through the freewheeling diode and the output capacitor (t2 to t3). When
IL reaches zero, after a short delay (t3 to t00), a new switching cycle starts.
Table 3. Pin description
Symbol Pin Description
ISNS 1 current sense input
VCC 2 supply voltage
SW 3 internal switch drain
DEMOVP 4 input from LED output for demagnetization timing, valley detection,
temperature foldback, and OVP
GND 5 ground
COMP 6 loop compensation to provide a stable response
Fig 3. SSL5021BTS basic application diagram for MOSFET
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SSL5021BTS All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 2 — 11 March 2015 5 of 20
NXP Semiconductors SSL5021BTS
Compact low-ripple buck LED driver IC
8.2 On-time control
When measuring the inductor current IL using sense resistor R4, the on-time is regulated
so that the average regulated voltage on pin ISNS (Vintregd(AV)ISNS) equals an internal
reference voltage. IL can be calculated with Equation 1:
(1)
Where:
0.09 = ISNS bond wire resistance.
is the buck topology duty cycle.
8.3 Valley detection
After IL has decreased to zero at t3, the LEDP voltage starts to oscillate around the bus
voltage (VIN) minus output voltage level (VOUT), with amplitude output voltage (VOUT) and
frequency (fring). Valley detection is a special circuit that is integrated in the SSL5021BTS.
It senses when the LEDP voltage reaches its lowest level (valley) through DEMOVP pin
connection. If a valley is detected, the internal switch is switched on again. As a result, the
switch-on switching losses are reduced.
Fig 4. SSL5021BTS basic application diagram for bipolar
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ass-014783 Figure 6
SSL5021BTS All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 2 — 11 March 2015 6 of 20
NXP Semiconductors SSL5021BTS
Compact low-ripple buck LED driver IC
8.4 Start-up current
The supply current for the IC is supplied by resistor R3. The IC drawns an additional
start-up current (ICC(startup)) just before VCC reaches the start-up voltage level (Vstartup). So
the supply current in operating mode is lower than during start-up conditions, preventing
lamp flicker when the mains voltage is increased or decreased slowly. Figure 6 shows the
basic behavior.
Fig 5. Buck waveforms and valley detection
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SSL5021BTS All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 2 — 11 March 2015 7 of 20
NXP Semiconductors SSL5021BTS
Compact low-ripple buck LED driver IC
8.5 Leading-Edge Blanking (LEB)
To prevent false detection of overcurrent, a blanking time following switch-on is
implemented. When the internal switch turns on, a short current spike can occur because
of the discharge capacitance of the MOSFET/bipolar (Q1) drain/collector node.
8.6 Protections
The IC incorporates the following protections:
UnderVoltage LockOut (UVLO)
Cycle-by-cycle OverCurrent Protection (OCP)
Internal OverTemperature Protection (OTP)
Cycle-by-cycle maximum on-time protection
Output OverVoltage Protection
Output Short Protection (OSP)
8.6.1 UnderVoltage LockOut (UVLO)
When voltage on VCC pin drops to below Vth(UVLO), the IC stops switching. An attempt is
made to restart IC when the voltage on the VCC pin > Vstartup.
8.6.2 Cycle-by-cycle OverCurrent Protection (OCP)
The SSL5021BTS incorporates a built-in peak current detector. It triggers when the
voltage at the ISNS pin reaches the peak level VI(max)ISNS. A resistor connected to ISNS
pin senses the current through inductor IL. The maximum current in inductor, IL(max)
equals:
(2)
Fig 6. Start-up current waveform
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SSL5021BTS All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 2 — 11 March 2015 8 of 20
NXP Semiconductors SSL5021BTS
Compact low-ripple buck LED driver IC
The sense circuit is activated after the leading-edge blanking time (tleb). Because the LED
current is half the peak current by design, the sense circuit automatically provides
protection for the maximum LED current during operation. A propagation delay exists
between the overcurrent detection and the actual switch switch-off. Due to this delay, the
actual peak current is slightly higher than the OCP level set by the resistor connected in
series with the ISNS pin.
8.6.3 OverTemperature Protection (OTP)
The converter stops switching when the internal OTP function is triggered at the IC
junction temperature Tpl(IC). The safe-restart protection is triggered and the IC resumes
switching when the IC temperature drops to below Trst(IC).
8.6.4 Cycle-by-cycle maximum on-time protection
Measuring the inductor current IL using sense resistor R4 regulates the on-time. The
on-time is limited to a fixed value (ton(max)). It protects the system and the IC when the
ISNS pin is shorted or when the system works at very low mains voltage.
8.6.5 Output OverVoltage Protection (OVP)
An accurate output OVP is implemented by measuring the voltage at the DEMOVP pin
during the secondary stroke. The resistive divider connected between the LEDP node and
the DEMOVP pin sets the maximum LED voltage.
An internal counter prevents false OVP detection because of noise on the DEMOVP pin.
After three continuous cycles with a DEMOVP pin voltage above the OVP level, the OVP
protection is triggered.
The over voltage protection triggers a restart sequence: A discharge current (ICC(dch)) is
enabled and discharges the voltage on the VCC pin to below Vrst(latch). When Vrst(latch) is
reached, the system restarts.
8.6.6 Output Short Protection (OSP)
The converter operates in Discontinuous Conduction Mode (DCM). A new cycle is only
started after the previous cycle has ended. The end of the cycle is detected by measuring
the voltage on the DEMOVP pin. When the DEMOVP pin voltage drops to below the
demagnetization level (Vth(comp)DEMOVP) and a valley is detected, a new cycle starts.
When output is shorted, the demagnetization is not finalized within the 40 s. The
converter still regulates the adjusted output current and the on-time is reduced to a safe
value by this feedback. The reduced on-time in combination with very long
demagnetization time prevents that the converter is damaged or excessive dissipation
occurs.
A blanking time (tsup(xfmr_ring)) is implemented at the start of the secondary stroke to
prevent false demagnetization detection.
Table 4 Figure 7 Figure 8
SSL5021BTS All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 2 — 11 March 2015 9 of 20
NXP Semiconductors SSL5021BTS
Compact low-ripple buck LED driver IC
8.7 Supply management
The IC starts up when the voltage on the VCC pin increases to exceed Vstartup. The IC
locks out (stops switching) when the voltage on the VCC pin drops to below Vth(UVLO). The
hysteresis between the start and stop levels allows the VCC capacitor to supply the IC
during zero-crossings of the mains.
The SSL5021BTS incorporates an internal clamping circuit to limit the voltage on the VCC
pin. The clamp limits the voltage on the VCC pin to the maximum value, Vclamp(VCC). If the
maximum current of the external resistor minus the current consumption of the IC is lower
than the limiting value of IVCC in Table 4, no external Zener diode is required.
8.8 PTC or NTC function and high-temperature foldback
The PTC function or NTC function can be used as a control method for LED thermal
protection. The PTC resistor which is connected to DEMOVP pin senses the temperature.
When the voltage on DEMOVP pin is higher than the foldback level (Vth(fold)), the on-time
is reduced with the increased DEMOVP pin voltage. Then the average LED current is
reduced.
When the temperature keeps increasing, the Vth(ovp) is exceeded. The converter stops
switching. The IC restarts when OVP is triggered.
This feature is optional as shown in Figure 7 and Figure 8. PTC is normally shorted.
SSL5021BTS All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 2 — 11 March 2015 10 of 20
NXP Semiconductors SSL5021BTS
Compact low-ripple buck LED driver IC
9. Limiting values
[1] The current into the VCC pin must not exceed the maximum I(VCC) value.
[2] An internal clamp sets the supply voltage and current limits.
[3] Equivalent to discharge a 100 pF capacitor through a 1.5 k series resistor.
[4] Charged device model: equivalent to charging the IC up to 1 kV and the subsequent discharging of each
pin down to 0 V over a 1 resistor.
10. Thermal characteristics
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
Voltages
VCC supply voltage current limited [1][2] 0.4 +18 V
VI(SW) input voltage on pin SW current limited to
8.8 mA;
internal switch off
[2] 0.4 +22 V
VI(ISNS) input voltage on pin ISNS 0.4 +5 V
VIO(COMP) input/output voltage on pin
COMP
0.4 +5.3 V
VI(DEMOVP) input voltage on pin
DEMOVP
6+6V
Currents
II(VCC) input current on pin VCC - 8.8 mA
II(SW) input current on pin SW RMS current - 380 mA
triangle wave;
duty cycle < 20 %
2+2A
II(ISNS) input current on pin ISNS triangle wave;
duty cycle < 20 %
2+2A
General
Ptot total power dissipation Tamb <75C - 0.28 W
Tstg storage temperature 55 +150 C
Tjjunction temperature 40 +160 C
ESD
ESD electrostatic discharge class 1
human body
model
[3] 2000 +2000 V
charged device
model
[4] 500 +500 V
Table 5. Thermal characteristics
Symbol Parameter Conditions Typ Unit
Rth(j-a) thermal resistance from junction
to ambient In free air;
JEDEC test board 259 K/W
Rth(j-c) thermal resistance from junction
to case In free air;
JEDEC test board 152 K/W
SSL5021BTS All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 2 — 11 March 2015 11 of 20
NXP Semiconductors SSL5021BTS
Compact low-ripple buck LED driver IC
11. Characteristics
Table 6. Characteristics
Tamb =25
C; VCC = 15 V; all voltages are measured with respect to ground pin (pin 5); currents are positive when flowing into
the IC; unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
Supply (pin VCC)
Vstartup start-up voltage 12.25 12.65 13.05 V
Vth(UVLO) undervoltage lockout threshold
voltage 9.6 9.9 10.2 V
VVCC voltage difference on pin VCC 0.17 0.30 0.43 V
Vclamp(VCC) clamp voltage on pin VCC II(VCC) =2.6mA [1] 15.2 15.8 16.4 V
Vrst(latch) latched reset voltage 6.0 6.2 6.4 V
ICC(oper) operating supply current switching at 100 kHz 100 125 150 A
ICC(startup) start-up supply current 64 82 100 A
ICC(dch) discharge supply current VCC =V
rst(latch) 3.7 4.8 5.5 mA
Loop compensation (pin COMP)
Vton(zero)COMP zero on-time voltage on pin
COMP 1.96 2.04 2.12 V
Vton(max)COMP maximum on-time voltage on pin
COMP 3.8 4.0 4.2 V
Vclamp(COMP) clamp voltage on pin COMP 4.3 4.7 5.1 V
ton(max) maximum on-time VIO(COMP) = 4 V 12.3 15.5 18.7 s
IO(COMP) output current on pin COMP VI(ISNS) = 0 V 3.2 4.0 4.8 A
Valley detection and overvoltage detection (pin DEMOVP)
Iprot(DEMOVP) protection current on pin
DEMOVP open current;
VI(DEMOVP) =0V
250 180 50 nA
Vth(ovp) overvoltage protection threshold
voltage 1.74 1.81 1.88 V
Ncy(ovp) number of overvoltage protection
cycles -3- -
Vth(fold) foldback threshold voltage 1.56 1.64 1.72 V
gmDEMOVP transconductance on pin
DEMOVP VI(DEMOVP) to IO(COMP) 24 29 34 A/V
Vth(comp)DEMOVP comparator threshold voltage on
pin DEMOVP 41832mV
(dV/dt)vrec valley recognition voltage
change with time
[2] --3.8- V/s
tsup(xmfr_ring) transformer ringing suppression
time 1.2 1.5 1.8 s
Current sensing (pin ISNS)
VI(max)ISNS maximum input voltage on pin
ISNS 0.94 1.00 1.06 V
ton(min) minimum on-time [3] 310 410 510 ns
tddelay time [2][4] -100- ns
gmISNS transconductance on pin ISNS VI(ISNS) to IO(COMP) 8.4 9.7 11.0 A/V
SSL5021BTS All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 2 — 11 March 2015 12 of 20
NXP Semiconductors SSL5021BTS
Compact low-ripple buck LED driver IC
[1] The start-up voltage and the clamp voltage are correlated.
[2] Guaranteed by design.
[3] The minimum on-time is only effective when OCP is triggered.
[4]
Vintregd(AV)ISNS average internal regulated
voltage on pin ISNS 0.396 0.410 0.424 V
Driver (pin SW)
RDSon on-state resistance Tj=25C - 0.75 0.90
Tj=125C - 1.20 -
toff(max) maximum turn-off time 30 40 50 s
Temperature protection
Tpl(IC) IC protection level temperature 140 150 165 C
Trst(IC) IC reset level temperature 106 118 130 C
Table 6. Characteristics …continued
Tamb =25
C; VCC = 15 V; all voltages are measured with respect to ground pin (pin 5); currents are positive when flowing into
the IC; unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
tleb ton min
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ass—014595
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Product data sheet Rev. 2 — 11 March 2015 13 of 20
NXP Semiconductors SSL5021BTS
Compact low-ripple buck LED driver IC
12. Application information
(1) R3b, R6b, C1 and C2 are the parts for the 230 V (AC) mains application. Short R3b and R6b out and reduce C1 and C2 voltage
rating for the 120 V (AC) mains application.
(2) RT1 is optional. It is normally shorted.
Fig 7. SSL5021BTS application diagram for MOSFET
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SSL5021BTS All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 2 — 11 March 2015 14 of 20
NXP Semiconductors SSL5021BTS
Compact low-ripple buck LED driver IC
(1) R3b, R6b, C1 and C2 are the parts for the 230 V (AC) mains application. Short R3b and R6b out and reduce C1 and C2 voltage
rating for the 120 V (AC) mains application.
(2) RT1 is optional. It is normally shorted.
Fig 8. SSL5021BTS application diagram for bipolar
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SSL5021BTS All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 2 — 11 March 2015 15 of 20
NXP Semiconductors SSL5021BTS
Compact low-ripple buck LED driver IC
13. Package outline
Fig 9. Package outline SOT457 (TSOP6)
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SSL5021BTS All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 2 — 11 March 2015 16 of 20
NXP Semiconductors SSL5021BTS
Compact low-ripple buck LED driver IC
14. Abbreviations
Table 7. Abbreviations
Acronym Description
BCM Boundary Conduction Mode
BOM Bill Of Materials
LEB Leading-Edge Blanking
OCP OverCurrent Protection
OSP Output Short Protection
OTP OverTemperature Protection
OVP OverVoltage Protection
PCB Printed-Circuit Board
UVLO UnderVoltage LockOut
ZCS Zero Current Switching
SSL5021BTS All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 2 — 11 March 2015 17 of 20
NXP Semiconductors SSL5021BTS
Compact low-ripple buck LED driver IC
15. Revision history
Table 8. Revision history
Document ID Release date Data sheet status Change notice Supersedes
SSL5021BTS v.2 20150311 Product data sheet - SSL5021BTS v.1
Modifications: The data sheet status has changed from Preliminary to Product.
Text and graphics have been updated throughout the data sheet.
SSL5021BTS v.1 20141015 Preliminary data sheet - -
SSL5021BTS All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 2 — 11 March 2015 18 of 20
NXP Semiconductors SSL5021BTS
Compact low-ripple buck LED driver IC
16. Legal information
16.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
16.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
16.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.
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SSL5021BTS All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 2 — 11 March 2015 19 of 20
NXP Semiconductors SSL5021BTS
Compact low-ripple buck LED driver IC
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
16.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
GreenChip — is a trademark of NXP Semiconductors N.V.
17. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
NXP Semiconductors SSL5021BTS
Compact low-ripple buck LED driver IC
© NXP Semiconductors N.V. 2015. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 11 March 2015
Document identifier: SSL5021BTS
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
18. Contents
1 General description. . . . . . . . . . . . . . . . . . . . . . 1
2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1
3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
4 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2
5 Ordering information. . . . . . . . . . . . . . . . . . . . . 2
6 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
7 Pinning information. . . . . . . . . . . . . . . . . . . . . . 3
7.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
7.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
8 Functional description . . . . . . . . . . . . . . . . . . . 4
8.1 Converter operation . . . . . . . . . . . . . . . . . . . . . 4
8.2 On-time control. . . . . . . . . . . . . . . . . . . . . . . . . 5
8.3 Valley detection. . . . . . . . . . . . . . . . . . . . . . . . . 5
8.4 Start-up current. . . . . . . . . . . . . . . . . . . . . . . . . 6
8.5 Leading-Edge Blanking (LEB) . . . . . . . . . . . . . 7
8.6 Protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
8.6.1 UnderVoltage LockOut (UVLO) . . . . . . . . . . . . 7
8.6.2 Cycle-by-cycle OverCurrent Protection (OCP) . 7
8.6.3 OverTemperature Protection (OTP) . . . . . . . . . 8
8.6.4 Cycle-by-cycle maximum on-time protection . . 8
8.6.5 Output OverVoltage Protection (OVP) . . . . . . . 8
8.6.6 Output Short Protection (OSP). . . . . . . . . . . . . 8
8.7 Supply management. . . . . . . . . . . . . . . . . . . . . 9
8.8 PTC or NTC function and high-temperature
foldback . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
9 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 10
10 Thermal characteristics . . . . . . . . . . . . . . . . . 10
11 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . 11
12 Application information. . . . . . . . . . . . . . . . . . 13
13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 15
14 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 16
15 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 17
16 Legal information. . . . . . . . . . . . . . . . . . . . . . . 18
16.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 18
16.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
16.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 18
16.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 19
17 Contact information. . . . . . . . . . . . . . . . . . . . . 19
18 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

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