TCD1103GFG Datasheet by Toshiba Semiconductor and Storage

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TCD1103GFG
Rev. 2.0
2009-01-15
1
TOSHIBA CCD Image Sensor CCD (charge coupled device)
TCD1103GFG
The TCD1103GFG is a high sensitive and low dark current
1500-elements linear image sensor.
This device consists of sensitivity CCD chip.
The TCD1103GFG has electronic shutter function (ICG).
Electronic shutter function can keep always output voltage
constant that vary with intensity of lights.
Features
Number of Image Sensing Elements: 1500 elements
Image Sensing Element Size: 5.5 μm × 64 μm
Photo Sensing Region: High sensitive and low dark current
pn photodiode
Internal Circuit: CCD Drive Circuit
Power Supply: Only 3.0V Drive (MIN.)
Function: Electronics Shutter, Sample and Hold Circuit
Package: 16 pin GLCC Package
Maximum Ratings (Note1)
Characteristic Symbol Rating Unit
Master clock pulse voltage VφΜ
Shift pulse voltage VSH
ICG pulse voltage VICG
Digital power supply VDD
Analog Power Supply VAD
0.3~7.0
V
Operating temperature Topr -25~60 °C
Storage temperature Tstg -40~85 °C
Note 1: All voltage are with respect to SS terminals (ground).
Weight: 0.37 g (typ.)
Pin Connections
NC16
15
OS 1
2
3
SS
10
9
8
NC
14
NC
VAD
NC NC
4
NC
NC11
13
12
5
6
NC
φΜ
VDD
ICG
SH 7NC
TOSHIBA TCD1103GFG Rev 2 l) 05 m 0 .799“ 9:82 ga—m PHOTO gggg W) OUTPUT DDDD 99mm “DIODE“- ——DD 33 BUFFER ‘0 ‘0 VAD ‘ ‘ 3 CCD ANALOG SHIFT REGISTER 1 ‘ VDD 4 6 7 ICG SH Pin Names Pm No, Symbm Name Pm No Symbol Name 1 as ompm sxgnal 16 NC Non Connecmn 2 SS Ground 15 NC Nan Connecmn a VAD Power {Ana‘og} 14 NC Non Connecmn 4 VDD Power 4mm 13 NC Non Connecmn 5 61M Master dock 12 NC Nan Connecmn s was Integrahon dear gate 11 NC Non Connecmn 7 SH smn gate 10 NC Nan Connecmn E NC Non Ccnnechon 9 NC Nan Connecmn 2 200901-15
TCD1103GFG
Rev. 2.0
2009-01-15
2
Block Diagram
Pin Names
Pin No. Symbol Name Pin No. Symbol Name
1 OS Output signal 16 NC Non Connection
2 SS Ground 15 NC Non Connection
3 VAD Power (Analog) 14 NC Non Connection
4 VDD Power (Digital) 13 NC Non Connection
5 φM Master clock 12 NC Non Connection
6 ICG Integration clear gate 11 NC Non Connection
7 SH Shift gate 10 NC Non Connection
8 NC Non Connection 9 NC Non Connection
CCD ANALOG SHIFT REGISTER 2
CCD ANALOG SHIFT REGISTER 1
VDD
OS
3
VAD
SHIFT GATE 2
D16
D17
……
D18
D19
D30
D31
S1
S2
PHOTO
DIODE
S1499
S1500
D32
D33
D44
D45
SHIFT GATE 1
INTEGRATION CLEAR GATE 1
SIGNAL
OUTPUT
BUFFER
1
4
5 7
φ M SSSH
ICG
6 2
INTEGRATION CLEAR GATE 2
LOGIC CIRCUIT
TOSHIBA
TCD1103GFG
Rev. 2.0
2009-01-15
3
Optical/Electrical Characteristics
(Ta = 25°C, Vφ = 3.3V (pulse), fφ = 2.0 MHz (Data rate=1MHz), Tint(Integration time) =10ms,
Load resistance
= 100 kΩ, VAD = VDD = 3.3V, Light source = Daylight fluorescent lamp)
Characteristics Symbol Min Typ. Max Unit Note
Sensitivity R 55 79 V/lxs (Note2)
Photo response non uniformity PRNU 10 % (Note3)
Register imbalance RI 3 % (Note4)
Saturation output voltage VSAT 450 900 mV (Note5)
Saturation exposure SE 0.008 lxs (Note6)
Dark signal voltage VMDK 3 15 mV (Note7)
DC power dissipation PD 16 48 mW
Total transfer efficiency TTE 92 95 %
Output impedance ZO 0.5 1.0 κΩ
DC output voltage VOS 1.0 1.5 2.0 V (Note8)
Dynamic range DR 200 (Note9)
Note 2: Sensitivity is defined for signal outputs when the photosensitive surface is applied with the light of uniform
illumination and uniform color temperature.
Note 3: PRNU is defined for a single chip by the expressions below when the photosensitive surface is applied with
the light of uniform illumination and uniform color temperature.
ΔX
PRNU =X × 100(%)
Where X is average of total signal output and ΔX is the maximum deviation from X. The amount of
incident light is 1/2SE.
Note 4: Register imbalance is defined as follows.
Δ Y ΔΖ
RI = X ×100(%)
Where X is average of total signal output.
ΔY : | average of odd signal output – average of even signal output |
ΔZ : | average of odd dummy signal – average of even dummy signal |
Note 5: VSAT is defined as minimum saturation output of all effective pixels.
Note 6: Definition of SE
VSAT
SE = R (lxs)
Note 7: VMDK is defined as maximum dark signal voltage of all effective pixels.
VMDK
OS
TCD1103GFG
Rev. 2.0
2009-01-15
4
Note 8: DC signal output voltage is defined as follows.
Note 9: Definition of DR
VSAT
DR = VMDK
VMDK is proportional to Tint (Integration time), so, the shorter Tint condition makes wider DR.
VOS
OS
TOSHIBA
TCD1103GFG
Rev. 2.0
2009-01-15
5
Operating Condition
Characteristics Symbol Min Typ. Max Unit
“H” Level 3.0 3.3 4.0
Master clock pulse voltage “L” Level VφΜ 0 0 0.44
V (Note 10)
“H” Level 3.0 3.3 4.0
Shift pulse voltage “L” Level VSH 0 0 0.44
V (Note 10)
“H” Level 3.0 3.3 4.0
ICG pulse voltage “L” Level VICG 0 0 0.44
V (Note 10)
Power supply voltage (Digital) VDD 3.0 3.3 4.0 V (Note 11)
Power supply voltage (Analog) VAD 3.0 3.3 4.0 V (Note 11)
Note 10: “H” level of maximum pulse voltage = VDD VDD-0.5V = “H” level of minimum pulse voltage.
Note 11: V
AD = VDD
Clock Characteristics (Ta = 25°C) (3.0V V
AD = VDD 4.0V)
Characteristics Symbol Min Typ. Max Unit
Master clock frequency fφΜ 0.4 2 4 MHz
Data Rate fDATA 0.2 1 2 MHz
Master clock capacitance CφΜ 10 pF
ICG Pulse capacitance CICG 35 pF
Shift pulse capacitance CSH 150 pF
Optical/Electrical characteristics of page 3 are defined under the condition of 1MHz data rate.
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TCD1103GFG
Rev. 2.0
2009-01-15
6
Timing Chart 1
TINT (Integration Time)
SH
ICG
φM
D45
D44
D43
D42
D41
D40
D37
D36
D35
D34
D33
D32
S1500
S1499
S1498
S1497
S1496
S4
S3
S2
S1
D31
D30
D29
D28
D27
D26
D25
D19
D18
D17
D16
D15
D14
D13
D3
D2
D1
D0
1 LINE READOUT PERIOD 1546 elements
)
DUMMY OUTPUTS
(16 elements) LIGHT SHIELD OUTPUTS
(13 elements)
(3 elements)
DUMMY OUTPUTS (32 elements)
SIGNAL OUTPUTS
(1500 elements) DUMMY OUTPUTS 14 elements)
O
S
(Output at S/H ON)
TOSHIBA 1,4 ~ ‘ w; 0 L1IIIJ4||l|l IIH
TCD1103GFG
Rev. 2.0
2009-01-15
7
Timing Chart 2 (Use electric shutter function)
SH
ICG
TINT (Integration Time)
Read Out Time
φM
D45
D44
D43
D42
D41
D40
D37
D36
D35
D34
D33
D32
S1500
S1499
S1498
S1497
S1496
S4
S3
S2
S1
D31
D30
D29
D28
D27
D26
D25
D19
D18
D17
D16
D15
D14
D13
D3
D2
D1
D0
1 LINE READOUT PERIOD 1546 elements
)
DUMMY OUTPUTS
(16 elements) LIGHT SHIELD OUTPUTS
(13 elements)
(3 elements)
DUMMY OUTPUTS (32 elements)
SIGNAL OUTPUTS
(1500 elements) DUMMY OUTPUTS 14 elements)
O
S
(Output at S/H ON)
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TCD1103GFG
Rev. 2.0
2009-01-15
8
Timing Requirements
OS (S/H ON)
Characteristics Symbol Min Typ. Max Unit
ICG pulse delay t1 1000 5000 ns
Pulse timing of ICG and SH t2 100 500 1000 ns
Shift pulse width t3 1000 ns
Pulse timing of ICG and φM t4 0 20 ns
* : To keep φM “ High “ level when ICG switch from “Low” to “High” level.
Use electronic shutter
Pulse timing of SH and ICG
t3 ** *** *** *** ****
・・・・・・・・・・・
** : Each SH high pulse have to keep always the same value with “ t3 “. (t3 1000ns (Min.))
*** : SH pulse cycle have to keep the same cycle (SH cycle period 10μs) except TINT period.
**** : TINT 10μs (Min.)
Note : The illumination of light source must be used with less that 1000 times based on 10ms TINT.
t4
t1
t2 t3
SH
ICG
φM
SH
ICG
Read out time
Integration time (TINT)
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TCD1103GFG
Rev. 2.0
2009-01-15
9
Typical performance curves
SENSITIVITY RESPONSE
0
50
100
150
33.33.63.9
POWER SUPPLY VAD,VDD(V)
SE NSITIV ITY (V /lx.s)
TOSHIBA
TCD1103GFG
Rev. 2.0
2009-01-15
10
Typical performance curves
DC OUTPUT VOLTAGE -
POWER SUPPLY VOLTAGE
0
1
2
3
3 3.3 3.6 3.9
POWER SUPPLY VAD,VDD (V)
DC OUTPUT VOLTAGE
VOS(V)
TOSHIBA SV 16 15 M 13 12 H 10 S TCDW 1036K] T000000? ”NF/25V OS
TCD1103GFG
Rev. 2.0
2009-01-15
11
Typical Drive Circuit
ICG
φM
NC
15 16 1314 1112 910
2 1 4 3 65 87
TCD
1
103
FG
IC1 : TC74AC04P
R1 : 150 Ω
R2 : 2200 Ω
3.3V
0.1 μF/25 V
IC
OS
3.3V
10μF/25V
R1
TR
R1
VAD SS
OS VDD
NC
NC
SH
φM
NC NC NCNC
NC
NC
ICG
SH
R2
TOSHIBA
TCD1103GFG
Rev. 2.0
2009-01-15
12
Caution
1. Electrostatic Breakdown
Store in shorting clip or in conductive foam to avoid electrostatic breakdown.
CCD Image Sensor is protected against static electricity, but inferior puncture mode device due to static
electricity is sometimes detected. In handing the device, it is necessary to execute the following static
electricity preventive measures, in order to prevent the trouble rate increase of the manufacturing system
due to static electricity.
a. Prevent the generation of static electricity due to friction by making the work with bare hands or by
putting on cotton gloves and non-charging working clothes.
b. Discharge the static electricity by providing earth plate or earth wire on the floor, door or stand of the
work room.
c. Ground the tools such as soldering iron, cutting pliers, tweezers or pincer.
It is not necessarily required to execute all precaution items for static electricity.
It is all right to mitigate the precautions by confirming that the trouble rate within the prescribed
range.
d. When the product is handed, please use tweezers to avoid the damage of CCD image sensor.
Recommended tweezers is P-815 (HOZAN) or equivalent.
e. Ionized air is recommended for discharge when handling CCD image sensors.
2. Incident Light
CCD sensor is sensitive to infrared light. Note that infrared light component degrades resolution and
PRNU of CCD sensor.
3. Ultrasonic Cleaning
Ultrasonic cleaning should not be used with such hermetically-sealed ceramic package as CCD because
the bonding wires can become disconnected due to resonance during the cleaning process.
4. Window Glass Protective Tape
The window glass protective tape is manufactured from materials in which static charges tend to build
up. When removing the tape from CCD sensor after solder mounting, install an ionizer to prevent the tape
from being charged with static electricity.
When the tape is removed, adhesives will remain in the glass surface. Since these adhesives appear as
black or white flaws on the image, please wipe the window glass surface with the cloth into which the
organic solvent was infiltrated. Then please attach CCD to a product.
Do not reuse the tape.
TOSHIBA 13
TCD1103GFG
Rev. 2.0
2009-01-15
13
5. Cleaning Method of the Window Glass Surface
Wiping Cloth
a. Use soft cloth with a fine mesh.
b. The wiping cloth must not cause dust from itself.
c. Use a clean wiping cloth necessarily.
Recommended wiping cloth is as follow;
- MK cloth (Toray Industries)
Cleaner
Recommended cleaning liquid of window glass are as follow;
- EE-3310 (Olympus)
When using solvents, such as alcohol, unavoidably, it is cautious of the next.
a. A clean thing with quick-drying.
b. After liquid dries, there needs to be no residual substance.
c. A thing safe for a human body.
And, please observe the use term of a solvent and use the storage container of a solvent to be clean.
Be cautious of fire enough.
Way of Cleaning
First, the surface of window glass is wiped with the wiping cloth into which the cleaner was infiltrated.
Please wipe down the surface of window glass at least 2 times or more.
Next, the surface of window glass wipes with the dry wiping cloth. Please wipe down the surface of
window glass at least 3 times or more.
Finally, blow cleaning is performed by dry N2 filtered.
If operator wipes the surface of the window glass with the above-mentioned process and dirt still remains,
Toshiba recommends repeating the clean operation from the beginning.
Be cautious of the next thing.
a. Don't infiltrate the cleaner too much.
b. A wiping portion is performed into the optical range and don't touch the edge of window glass.
c. Be sure to wipe in a long direction and the same direction.
d. A wiping cloth always uses an unused portion.
Wiper
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TCD1103GFG
Rev. 2.0
2009-01-15
14
The standard reflow condition for GLCC (Surface Mount device, Pb-Free)
1. Storage precautions
1) Do not drop or toss device packaging. The laminated aluminum material in it can be rendered
ineffective by rough handling.
2) Ensure packaging materials are stored in a 3090%RH environment and do not store at the low
temperature to prevent dew condensation. Use devices within 12 months; do not store them longer
than that.
3) If the 30% humidity indicator is pink when the packaging is opened, bake the devices at 125
for 24 hours to remove any moisture present. Devices should also be baked, whether still packed
or not, if the effective usage period of the indicator has expires.
4) Perform destructive prevention of the devices by static electricity in case of implementation of
baking processing.
5) After opening the moiture-proof packing, store the products in the environment under 30, and below
60%RH, and use them within 5 days.
If the effective usage period passed after opening the moisture-proof packing, baking should be done
before use at 125 for 24 hours.
6) CCD surface mount products may have a haze on the inside of glass, so be careful about folling.
Even if the haze arises inside of glass, when it is not on the pixel eria, there is no problem in quality.
2. Mounting conditions using reflow
1) Mounting method : (a) Hot air reflows.
(b) Infrared ray reflow
2) Preheating condition : 150180, 60120 seconds
3) Reflow condition : (a) maximum 240
(b) over 230, within 3050 seconds
4) Heating times : only 1 time
5) Caution : This product does not support a Re-flow with Pb-Sn solder. Pb-free solder
should be used to Re-flow with Fig1s profile.
* The temperature profile is specified in terms of the temperature of top surface of the device.
This temperature profile shows maximum guaranteed device temperature. Please set up the
optimum temperature profile conditions within the Fig.1 profile.
Fig.1 Example of recommended temperature profile for reflows
In addition, in case of the repair work accompanied by IC removal, since the degree of parallel may be
spoiled with the left solder, please do not carry out.
TOSHIBA
TCD1103GFG
Rev. 2.0
2009-01-15
15
3. Mounting
1) In the case of solder mounting, the devices should be mounted with the window glass protective tape
in order to avoid dust or dirt included in reflow machine.
2) The window glass protective tape is manufactured from materials in which static charges tend to build
up. When removing the tape from CCD sensor after solder mounting, install an ionizer to prevent the
tape from being charged with static electricity.
3) When the tape is removed, adhesives will remain in the glass surface. Since these adhesives appear as
black or white flaws on the image, please wipe the window glass surface with the cloth into which the
organic solvent was infiltrated. Then please attach CCD to a product.
4) Do not reuse the window glass protective tape.
5) The parts of glass seal area have possibility to be became clouded by reflow process, however, there is
no problem in quality..
4. Foot Pattern on the PCB
We recommend Fig 2’s foot pattern for your PCB (Printed circuit Board).
Fig.2
5. Mask for Solder Paste Application
We recommend metal mask that have the following thickness.
a thickness of 0.1mm.
And, we recommend that the size of the pattern of the metal mask is 100% of recommended
foot pattern at fig. 2.
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TCD1103GFG
Rev. 2.0
2009-01-15
16
Package Dimensions
TOSHIBA
TCD1103GFG
Rev. 2.0
2009-01-15
17
Revision Date Description Note
1.0 2008-6-23 New -
2.0 2009-01-15 Added: Caution of storage
Deleted: Caution of soft tray
-
The information contained herein is subject to change without notice. 021023_D
TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
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such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc. 021023_A
The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc. Unintended Usage of TOSHIBA products listed in this
document shall be made at the customers own risk. 021023_B
The products described in this document shall not be used or embedded to any downstream products of which
manufacture, use and/or sale are prohibited under any applicable laws and regulations. 060106_Q
The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of
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Please use this product in compliance with all applicable laws and regulations that regulate the inclusion or use of
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and regulations. 060819_AF
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