EFJ-G25EF01 Datasheet by Panasonic Electronic Components

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1.Scope ( 5-1)
This Specification applies to the Piezoelectric sensor for mechanical shock. Test Method
5.3 Vibration 10 to 55 Hz(1 minute sweep),
2.Standard Products Amplitude:1.5 mm,
2 hours each direction
5.4 Solderability More than 3/4 of the soldered area Pre-heat:150 ±10 oC,1~2 minutes
2.1 Operating temperature range -10 ~60 oCof the terminal electrodes shall be Soldering:230 ±5 oC,3 ±0.5 s
2.2 Storage temperature range -30 ~80 oCcovered with new sold
2.3 Acceleration limit 5.5 Soldering heat Refolw soldering once
resistance 240oC peak ,over 220oC 10s max.
3.Construction Pre-heating 140 ±10 oC 1~2min.
5.6 Shock 15000 m/s, 0.5msec half sinusoidal
Item SPEC wave ,5 times each direction
3.1 Appearance No remarkable damage or stains allowed (Visual check)
3.2 Shape/Size As per Fig.1 attached 6.Environmental Performance
3.3 Marking Shape(F) , Inclined Angle(2),Product serial No.
Item SPEC Test Method
4.Electrical Performance 6.1 Dry heat 85 ±2 oC,500 hours
6.2 Cold -40 ±3oC,500 hours
4.1 Voltage Sensitivity (Vs) 100m/s ,1kHz 1)
4.2 Capacitance (Cp) 1Vrms , 1kHz 6.3 Damp heat 40 ±2 oC,90~95 %RH, 500 hours
4.3 Insulation Resistance 10V DC , after 1min.
4.4 Resonant Frequency 6.4 Heat cycle -40 ±3 oC~ RT ~85 ±3 oC~ RT
4.5 Non-linearity at 500m/s 30min 2min 30min 2min 5cycles
4.6 Incident Angle of 6.5 Temperature -10 ~ 60 oC
Sensitivity Axis
1) As measured with an applied acceleration in the direction of sensitivity axis of Fig.1.
5.Mechanical Performance
Item SPEC Test Method
5.1 Electrode No terminal electrode shall be 4.9 N from transverse
Strength peeled off. direction,10 ±0.5 s CLASSIFICATION SPECIFICATIONS
DATE
Sep. 1,1999
Number 151 - EFJ -G25F02 APPROVAL CHECK DESIGN
5.2 Bending No outstanding damage. PC boad deflection distance:1 mm Part name Piezoelectric sensor for mechanical shock
Strength (speed 1 mm/second) Part No Taped Type EFJG25EF01
10 ±0.5 s
Thickness of PC board : 1.6 mm
0.1 mV/(m/s2) ± 15 %
220 pF ± 20 %
500 Mohm min.
25 kHz min.
5 % max.
25 ± 3o
Vs drift:within±10%
Cp drift :within±10%
Vs drift:within±10%
Cp drift :within±10%
Vs drift:within±10%
Cp drift :within±10%
Vs drift:within±10%
Cp drift :within±10%
Item Rating
Test ConditionSPECItem
15000 m/s max.
Item SPEC
Vs drift:within±10%
Cp drift:within±10%
Vs drift:within±10%
Cp drift:within±10%
Vs drift:within±10%
Cp drift:within±10%
S.kawamura T.Ninomiya
Vs drift:within±10%
Cp drift :within±20%
2
2
2
2
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Item Test Method Figure 1 ( 5-2)
Standard test 20oC 65% RH,1.013×105 Pa as a rule;however,if there occurs no doubt about judgement,
conditions the test may be performed at 15~35oC, 25~85% RH and 0.860×105~1.060×105 Pa
4.1 Voltage See Fig.2 Tolerance : ±0.2
sensitivity
5.1 Electrode Solder the external electrodes to the PC board so that the marking side of a
Strength product is located upper, and apply the specified load from one side of the product
to maintain the conditions for a given period of time.
5.2 Bending Solder the external electrodes to the PC
Strength board so that the marking side of a
product is located upper, and deflect the
PC board at 90 mm span and deflection
distance 1 mm.
5.3 Vibration Repeat the vibration at specified frequency and specified oscillation amplitude,
and apply it in X.Y.Z directions orthogonal to the sample for the specified time
with one minute as a cycle.
5.4 Solderability Dip a product preheated as specified in the solder bath maintained at the specified
temperature so that the electrode is completely hidden for a given period of time.
Solder shall be H63A(eutectic solder JIS-Z-3282) or Sn-Pb solder including 2 to
5 % of Ag, the flux shall be rosin (JIS-K-5902) methanol (JIS-K-1501) solution
and the weight ratio shall be approx.25%.
5.5 Soldering After passing the sample through the reflow furnace maintained at the specified
heat
temperature and time, take it out in the room temperature, and after leaving it for
resistance 8 hours, measure the characteristics.
5.6 Shock After Dropping specified times and directions,measure the characteristics.
6.1 Dry heat After leaving a product in the thermostatic oven maintained at the specified ( Unit : mm )
temperature for the specified time, take it out in the room temperature, and after Serial No.
leaving it for 8 hours, measure the characteristics.
6.2 Cold After leaving a product in the thermostatic oven maintained at the specified
temperature for the specified time, take it out in the room temperature, and after
leaving it for 8 hours, measure the characteristics.
6.3 Damp heat After leaving a product in the thermostatic oven maintained at the specified
temperature and humidity for the specified time, take it out in the room
temperature, and after leaving it for 8 hours, measure the characteristics.
6.4 Heat cycle After repeating the specified cycle by the specified frequency, take it out in the
room temperature, and after leaving it for 8 hours, measure the characteristics.
F 2
(1.6)
(1.2)
(1.2)
4.8
(0.9) (0.9)
Polity making
Electrode 1
A
Sensitivity Axis
25±3
o
When an acceleration is applied in the direction of A axis,
positive voltage occurs at electrode 1.
Remark)
2.3
1.0
Serial No.
Electrode 2
Sample
(5-3)
7.Operating Precautions
7.1 Application (2) Automated Assembly
This piezoelectric sensor is designed for use in domestic electric appliances, AV. equipment, OA For automatic inserting , make sure to make inserting checks by means of the inserting machine in
equipment, communication equipment, measuring equipment and general electronic equipment. advance. In inserting the product, unsuitable chucking force or inserting speed may apply so excessive
Check with us separately, for use in equipment which needs high reliability impulse to break the product.
(such as automobiles, aircraft, medical equipment and space equipment). Avoid inserting using mechanical-chuck-type inserting machine. Also, for the inserting machine using
7.2 Precautions for Handling other method, select the low speed.
7.2.1 Precautions for Safety Please contact us for details.
(1) Fail-safe Design for Equipment (3) Soldering in PC boards and washing after soldering
In application of the piezoelectric sensor, it is recommended that equipment shall be protected by 1) The product is applicable to refold soldering. Conditions of the soldering temperature and time are
adding a protective and/or retarding design circuit against deterioration and failures of the recommended as shown below.
piezoelectric sensor.
(2) Operating Temperature Ranges Preheating temperature : 175oC
This piezoelectric sensor shall not be operated beyond the specified “Operating Temperature Range” Preheating time : 1~2 minutes
in the Specifications. Soldering temperature : 220oC
(3) Changes/Drifts in Voltage Sensitivity Soldering time : 20 sec max.
It shall be noted that voltage sensitivity of the piezoelectric sensor may drift depending IC Peak temperature : 250oC max.
applied (the type names, the manufacturer) and resistance values of external resisters and the
circuit design. 2) Take care that a soldering iron does not contact with the product body (out case).
(4) Stray Capacitance For manual soldering, the maximum soldering temperature and time should be 300o C and 3 seconds.
Stray capacitance and insulation resistance on printed circuit board may cause abnormalities of 3) Rosin-based and non-activated soldering flux is recommended.
the piezoelectric sensor such as the voltage sensitivity and the frequency characteristic. The content of halogen in the flux shall be 0.1 wt. or less.
Attention shall be paid to those abnormalities above mentioned in circuit design. 4) Post Soldering Cleaning
(5) Direct Voltage Application of ultrasonic cleaning is prohibited.
Avoid directly applying a direct voltage to the piezoelectric sensor. Cleaning Conditions such as kinds of cleaning solvents, immersion times and temperatures etc.
shall be checked by experiments before production.
(4) Maintenance and using environment
Avoid maintenance and use in the following environments.
7.2.2 Prohibited Applications 1) Corrosive gaseous atmospheres (Cl2 , NH3 , SO2 , Ox etc.)
(1) “Flow Soldering” shall not be applied to the piezoelectric sensor. 2) Dusty places
(2) “Ultrasonic Cleaning”and “Ultrasonic Welding”shall not be applied to the piezoelectric sensor 3) Places exposed to direct sunlight
for preventing them from electrical failures and mechanical damages. 4) Places over which water is splashed
(3) Avoid water washing after soldering. 5) To be exposed directly to water
7.2.3 Application Notes 6) Places exposed to briny air
(1) Handling precautions 7) Places apt to be affected by static electricity or electric field strength
1) Abnormal/excess electrical stresses such as over voltage spikes and electrostatic discharges may (5) Long Term Storage
cause electrical deterioration's and failures of the piezoelectric sensor and affect reliability of The piezoelectric sensor shall not be stored under severe conditions of high temperatures and high humidifies.
the devices. Store them indoors under 40oC max, and 75% RAH max. Use them within one year and check the
2) If the product is drooped or a strong stress is applied to it, it nay break. solderability before use.And avoid maintenance and use in the following environments.
Do not use the products which strong stress have been applied. 1) Corrosive gaseous atmospheres (Cl2 , NH3 , SO2 , Ox etc.)
2) Places exposed to direct sunlight
3) Places where dew is apt exposed to condense
7.3 The design is subject to change for improvement of quality.
220
175
()
1~2 minutes
20 seconds
Peak temperture:250oC max
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(5-4)
8.Embossed tape Packaging
8.1 Applicable Standard 8.4 Marking
JIS C 0806 The following items shall be marked at least on the side of the reel.
8.2 Specifications (1) Part Number
8.2.1 Dimensions
(2) Quantity
(1) Carrier Tape : Figure 3 (3) Lot Number
(2) Reel : Figure 4 (4) Manufacturer's Name
(3) The product shall be packed properly not to be damaged during transportation and storage.
8.2.2 Reeling Quantity 8.5 Tape Specifications
2000 pcs/reel
8.2.3 Taping structure (1) Tensile Strength of Carrier Tape : 9.8N min.
(1) The tape shall be wound around the reel in the direction shown below. (2) Top Cover Tape Adhesion (See the below figure.)
Pull off Angle : 0~15o
Speed : 300 mm/minute
Force : 0.19~0.69N
(2) Leader part and vacant position
(3) Missing Parts
The maximum number of missing parts shall not exceed 0.1% per reel and continuous missing
shall not be more than 3 parts.
+ 0
-50
Feeding um: ¢7D3 , chm mm
( 5-5)
Figure 4 Reel Dimensions
AB C DEW
Figure 3 Carrier Tape Dimensions 180±5 60min. 13.0±0.2 21±0.8 2±0.5 12.4
Ttr
18.4max 3max 1.0 Uint:mm
WFEP1 P2 P0 D0 t1 t2
12.0 5.5 1.75 4.0 2.0 4.0 0.60 1.70
±0.3 ±0.1 ±0.1 ±0.1 ±0.1 ±0.1 max. max.
2.6 5.4
±0.2 ±0.2 Unit:mm
1.5
AB
+0.1
-0
+2.0
-0
Polarity Marking
Vibrator
Oscillator Power Amplifier
Charge Amplifier
Vantage Meter
Oscilloscope Voltage Meter
Sample
Standard Acceleration
Sensor(ref.)
Feeding Hole
Chip Pocket
Chip Component
Tape running direction

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