MEGA-FIT W-B Conn System Prod Spec Datasheet by Molex

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molex’“ C) RECEPTACLE HOUSING FEMALE TERMINAL RIGHT ANGLE HEADER VERTICAL HEADER REVISION: ECR/ECN INFORMATION: TITLE: SHEET No. EC No: E CONNECTOR SYSTEM DOCUMENT NUMBER: CREATED / REVISED BV: CHECKED BV: ‘ APPROVED BY:
PRODUCT SPECIFICATION
REVISION:
ECR/ECN INFORMATION:
TITLE:
PRODUCT SPECIFICATION FOR
MEGA-FIT® WIRE TO BOARD
CONNECTOR SYSTEM
SHEET No.
B1
EC No:
UCP2016-2880
1 of 13
DATE:
2016/01/20
CREATED / REVISED BY:
CHECKED BY:
APPROVED BY:
PS-76823-100
GES
JBELL
FSMITH
FILENAME: PS75431r0.DOC
MEGA-FIT®
WIRE-TO-BOARD
CONNECTOR SYSTEM
171692 / 170001
RECEPTACLE HOUSING
76823 / 172063
FEMALE TERMINAL
76825 / 172064 / 171596
RIGHT ANGLE HEADER
76829 / 172065 / 171597
VERTICAL HEADER
> Table of Contents REVISION. ECR/ECN INFORMATION. TITLE. SHEET No. EC No. E CONNECTOR SYSTEM DOCUMENT NUMBER. CREATED / REVISED BY. CHECKED EV. APPROVED BY.
PRODUCT SPECIFICATION
REVISION:
ECR/ECN INFORMATION:
TITLE:
PRODUCT SPECIFICATION FOR
MEGA-FIT® WIRE TO BOARD
CONNECTOR SYSTEM
SHEET No.
B1
EC No:
UCP2016-2880
2 of 13
DATE:
2016/01/20
CREATED / REVISED BY:
CHECKED BY:
APPROVED BY:
PS-76823-100
GES
JBELL
FSMITH
FILENAME: PS75431r0.DOC
Table of Contents
1.0 SCOPE 3
2.0 PRODUCT DESCRIPTION 3
2.1 Product Name and Series Numbers 3
2.2 Dimensions, Materials, Plating and Markings 3
2.3 Safety Agency Approvals 3
3.0 APPLICABLE DOCUMENTS AND SPECIFICATIONS 4
3.1 Molex Documents 4
3.2 Industry Documents 4
4.0 ELECTRICAL PERFORMANCE RATINGS 4
4.1 Voltage 4
4.2 Applicable Wires 5
4.3 Maximum Current Rating 5
4.4 Temperature 6
4.5 Durability 6
4.6 Current Interruption 7
4.7 Glow Wire 7
5.0 QUALIFICATION 7
6.0 PERFORMANCE 7
6.1 Electrical Performance 7
6.2 Mechanical Performance 8
6.3 Environmental Performance 10
7.0 TEST SEQUENCE GROUPS 12
8.0 SOLDER INFORMATION 14
8.1 Solder Process Temperature 14
8.2 Reflow Solder Profile 14
> molex‘ C REVTSION. ECR/ECN INFORMATION. TITLE. SHEET No. EC No. E CONNECTOR SYSTEM DOCUMENT NUMBER. CREATED / REVTSED BY. CHECKED av. APPROVED BY.
PRODUCT SPECIFICATION
REVISION:
ECR/ECN INFORMATION:
TITLE:
PRODUCT SPECIFICATION FOR
MEGA-FIT® WIRE TO BOARD
CONNECTOR SYSTEM
SHEET No.
B1
EC No:
UCP2016-2880
3 of 13
DATE:
2016/01/20
CREATED / REVISED BY:
CHECKED BY:
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GES
JBELL
FSMITH
FILENAME: PS75431r0.DOC
1.0 SCOPE
This product specification covers the performance requirements and test methods of Mega-fit® 5.70 mm pitch
wire to board connector systems terminated with 16 to 12 awg or 1.5 to 4.0mm2 stranded wire using crimp
technology with tin or gold plating.
2.0 PRODUCT DESCRIPTION
2.1 PRODUCT NAME AND SERIES NUMBER (S)
Table 1 WIRE-TO-BOARD
Description
Series Number
Female Crimp Terminal
76823 / 172063
Receptacle Housing
170001 / 171692
Vertical Header
76829 / 172065 / 171597
Right Angle Header
76825 / 172064 / 171596
2.2 DIMENSIONS, MATERIALS, PLATING AND MARKINGS
Dimensions & Plating: See individual sales drawings.
Material: RoHS compliant materials.
2.3 SAFETY AGENCY APPROVALS
2.3.1 UL File Number: UL E29179
UL (12 ckt fully loaded)
NON-current interruption
Current interruption per UL1977
Applies when using 170001 Series Only
23 Amps @ 600V (12 AWG or 4.0mm2 wire)
20 Amps @ 600V (14 AWG or 2.5mm2 wire)
18 Amps @ 600V (16 AWG or 1.5mm2 wire)
23 Amps @ 48V AC/DC (12 AWG wire)
2.3.2 IEC License Number per IEC / EN 61984-2009: Certificate Number: 1400024
IEC (12 ckt fully loaded)
NON-current interruption
23 Amps @ 600V (12 AWG or 4.0 mm2 wire)
> REVTSION. ECR/ECN INFORMATION. TITLE. SHEET No. EC No. % CONNECTOR SYSTEM DOCUMENT NUMBER. CREATED / REVTSED BY. CHECKED EV. APPROVED BY.
PRODUCT SPECIFICATION
REVISION:
ECR/ECN INFORMATION:
TITLE:
PRODUCT SPECIFICATION FOR
MEGA-FIT® WIRE TO BOARD
CONNECTOR SYSTEM
SHEET No.
B1
EC No:
UCP2016-2880
4 of 13
DATE:
2016/01/20
CREATED / REVISED BY:
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FILENAME: PS75431r0.DOC
2.3.3 File Number*: LR-19980_A_000 CLASS 6233-01 and 6233-81
CSA approval meets following standards/test procedures:
a) CSA std. C22.2 No. 182.3-M1987
b) UL-1977
* “C” and “US” mark adjacent to CSA signifies that the product has been evaluated to the applicable CSA and
ANSI/UL standards, for use in Canada and US respectively.
CSA (single circuit)
NON-current interruption
23 Amps @ 600V (12 AWG or 4.0mm2 wire)
20 Amps @ 600V (14 AWG or 2.5mm2 wire)
18 Amps @ 600V (16 AWG or 1.5mm2 wire)
3.0 APPLICABLE DOCUMENTS AND SPECIFICATIONS
3.1 MOLEX DOCUMENTS
See series specific sales drawings and the other sections of this specifications for the necessary
referenced documents and specifications.
Mega Fit Test Summary TS-76823-100
Molex Solderability Specification SMES-152
Molex Heat Resistance Specification AS-40000-5013
3.2 INDUSTRY DOCUMENTS
EIA-364-1000.01
SAE/USCAR-2
UL-60950-1
UL-1977
CSA STD. C22.2 NO. 182.3-M1987
IEC / EN 61984
4.0 ELECTRICAL PERFORMANCE RATINGS
4.1 VOLTAGE *
600 Volts AC (RMS) or 600 Volts DC max.
* Voltage rating based on UL 1977. Maximum voltage allowed may vary dependent upon “End Use
Application.” Refer to the applicable end use standard for additional information on Voltage, Creepage
and Clearance requirements.
> molex‘ C lemma/5) cu. Sile AWG & melric Wire Size zermma/s} Ckl. Size AWG & meiric Wile Size REVTSION. ECR/ECN INFORMATION. TITLE. SHEET No. EC No. % CONNECTOR SYSTEM DOCUMENT NUMBER. CREATED / REVTSED BY. CHECKED av. APPROVED BY.
PRODUCT SPECIFICATION
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ECR/ECN INFORMATION:
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PRODUCT SPECIFICATION FOR
MEGA-FIT® WIRE TO BOARD
CONNECTOR SYSTEM
SHEET No.
B1
EC No:
UCP2016-2880
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4.2 APPLICABLE WIRES
Maximum Insulation
Diameter and
Applicable Wire Gauges
Stranded copper 16 AWG: 3.18 mm / .125 inches MAXIMUM
Stranded copper 1.5 mm2: 3.18 mm / .125 inches MAXIMUM
Stranded copper 14 AWG: 3.66 mm / .144 inches MAXIMUM
Stranded copper 2.5 mm2: 3.75 mm / .148 inches MAXIMUM
Stranded copper 12 AWG: 4.11 mm / .162 inches MAXIMUM
Stranded copper 4.0 mm2: 4.11 mm / .162 inches MAXIMUM
4.3 MAXIMUM CURRENT RATING
Current rating is application dependent and may be affected by the wire rating such as listed in UL-60950-
1. Each application should be evaluated by the end user for compliance to specific safety agency
requirements. The ratings listed in the chart below are per Molex test method based on a 30° C maximum
temperature rise over ambient temperature and are provided as a guideline. Appropriate de-rating is
required based on circuit size, ambient temperature, copper trace size on the PCB, gross heating from
adjacent modules/components and other factors that influence connector performance. Wire size &
stranding, tin coated or bare copper, wire length & crimp quality are other factors that influence current
rating.
Ckt. Size
AWG
& metric
Wire Size
12 AWG, 4.0mm221 18 16 14
14 AWG, 2.5mm219 15 13 11
16 AWG, 1.5mm215 13 11 10
8-12
Wire to Board Current Rating (Amp Max.)
Connector fully loaded with all circuits powered
2
4
(As tested with bare awg copper wire and tin or gold plated
terminals)
6
Ckt. Size
AWG
& metric
Wire Size
12 AWG, 4.0mm223 20 18 16
14 AWG, 2.5mm221 17 15 13
16 AWG, 1.5mm217 15 13 12
8-12
Wire to Board Current Rating (Amp Max.)
Connector fully loaded with all circuits powered
2
4
(As tested with tinned awg copper wire and tin or gold plated
terminals)
6
) REVISION: ECFI/ECN INFORMATION: TITLE: SHEET N0. EC No: E CONNECTOR SYSTEM DOCUMENT NUMBER: CREATED / REVISED BY: CHECKED BY: APPROVED BY:
PRODUCT SPECIFICATION
REVISION:
ECR/ECN INFORMATION:
TITLE:
PRODUCT SPECIFICATION FOR
MEGA-FIT® WIRE TO BOARD
CONNECTOR SYSTEM
SHEET No.
B1
EC No:
UCP2016-2880
6 of 13
DATE:
2016/01/20
CREATED / REVISED BY:
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FILENAME: PS75431r0.DOC
0
10
20
30
40
50
60
6 8 10 12 14 16 18 20 22 24 26
Temperature Rise (C)
Current (Amps)
Avg. Temp. Rise vs. Current per EIA-364-70
12 AWG Tinned Copper Wire, 2oz Copper Traces
2 ckt
12 ckt
0
10
20
30
40
50
60
6 8 10 12 14 16 18 20 22 24 26
Temperature Rise (C)
Current (Amps)
Avg. Temp. Rise vs. Current per EIA-364-70
12 AWG Bare Copper Wire, 2oz Copper Traces
2 ckt
12 ckt
4.4 TEMPERATURE
Tin Plated:
Max. operating temperature range (including T-rise from applied current) is -40°C to 105°C.
Field temperatures and field life: Tested per EIA 364-1000.01 to meet field temperature of 65°C for 10
years life per table-8 in EIA-364-1000.01.
Gold Plated:
Max. operating temperature range (including T-rise from applied current) is -40°C to 120°C, based on
test sequence Group VIII, thermal aging at 120°C for 1000 hours.
Field temperatures and field life: Tested per EIA 364-1000.01 to exceed a field temperature of 65°C for
10 years life per table-8 in EIA-364-1000.01.
4.5 DURABILITY
Tin plated: 25 mate/unmates
Gold plated: 200 mate/unmates
As tested in accordance with EIA-364-1000.01 test method (see Sec. 7.0 of this specification). Durability
per EIA-364-09.
> molex‘ C REVISION. ECR/ECN INFORMATION. TITLE. SHEET No. EC No. E CONNECTOR SYSTEM DOCUMENT NUMBER. CREATED / REVISED BV. CHECKED av. APPROVED BY.
PRODUCT SPECIFICATION
REVISION:
ECR/ECN INFORMATION:
TITLE:
PRODUCT SPECIFICATION FOR
MEGA-FIT® WIRE TO BOARD
CONNECTOR SYSTEM
SHEET No.
B1
EC No:
UCP2016-2880
7 of 13
DATE:
2016/01/20
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FILENAME: PS75431r0.DOC
4.6 CURRENT INTERRUPTION (Applies when using 170001 Series ONLY)
48 Volt AC/DC @ 23 Amp
Tested 250 cycles at 48 volt DC with a test current of 34.5 Amp hot-plug test conducted with all circuits
powered with 12 awg wire per UL1977 with tin plated contacts in a 12 circuit housing fully populated.
4.7 Glow Wire
The following series are glow capable:170001, 76825, 76829, 172064. 172065, 171596, 171597.
Representative samples were tested and found compliant with EN 60695-2-11-2001 / IEC 60695-2-11-
2000 Glow Wire Test Methods for End-Products. These were additionally investigated for compliance with
EN 60335-1 / IEC 60335-1 750C/2 sec with no flaming. VDE Test report available upon request.
5.0 QUALIFICATION
Laboratory conditions and sample selection are in accordance with EIA-364-1000.01
6.0 PERFORMANCE
6.1 ELECTRICAL PERFORMANCE
DESCRIPTION
TEST CONDITION
REQUIREMENT
Initial Contact Resistance
(Low Level)
Resistance Measure Points
Mate connectors, apply a maximum
voltage of 20 mV and a current of 100
mA (measurement locations shown)
Per EIA-364-23
Wire resistance and traces shall be
removed from the measured value.
Maximum (Initial):
Tin: 2 m
15µ & 30µGold: 2 m
Contact Resistance
@Rated Current
(Voltage Drop)
Mate connectors; apply the rated
current.
Per EIA-364-70
Maximum:
Tin: 10 m
15µ” & 30µGold: 5 m
Insulation
Resistance
Apply 500 VDC between adjacent
terminals or ground.
Per EIA-364-21
1,000 M
minimum
Dielectric
Withstanding
Voltage
Apply 2200 VAC for 1 minute
between adjacent terminals.
Per EIA-364-20
No breakdown
Current leakage <5mA
Temperature
Rise
Mate connectors, measure
T- Rise @ Rated Current
After 96 Hours.
Per EIA-364-70
Temperature rise: 30° C
maximum
> molex‘ C REVTSION. ECR/ECN INFORMATION. TITLE. SHEET No. EC No. E CONNECTOR SYSTEM DOCUMENT NUMBER. CREATED / REVTSED BY. CHECKED av. APPROVED BY.
PRODUCT SPECIFICATION
REVISION:
ECR/ECN INFORMATION:
TITLE:
PRODUCT SPECIFICATION FOR
MEGA-FIT® WIRE TO BOARD
CONNECTOR SYSTEM
SHEET No.
B1
EC No:
UCP2016-2880
8 of 13
DATE:
2016/01/20
CREATED / REVISED BY:
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JBELL
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FILENAME: PS75431r0.DOC
6.2 MECHANICAL PERFORMANCE
ITEM
TEST CONDITION
REQUIREMENT
Connector
Mating Force
Mate connectors at a rate of 25.4
+/- 6 mm per minute. Per EIA-364-
37
Tin plated: 6.8 N MAX. initial mate
force per circuit
15µ” & 30µGold plated: 6.0 N MAX.
per circuit
Connector
Un-mating Force
(latch disabled)
Un-mate connectors with latch
disabled at a rate of 25.4 +/- 6 mm
per minute.
Per EIA-364-37
Tin plated: 6.5 N MAX. initial
un-mate force per circuit
15µ” & 30µGold plated: 5.6 N MAX.
per circuit
Thumb Latch Yield
Strength
Mate loaded connectors fully. Pull
connectors apart at a rate of 25.4
+/- 6 mm per minute.
68 N MIN.
Durability
Mate connectors 25 cycles for tin
plated and 200 cycles for gold
plated connectors at a maximum
rate of 10 cycles per minute.
Per EIA-364-09
Maximum change from initial:
Tin: 2 m
15µ” & 30µGold: 2 m
Durability with
Environment
(Preconditioning)
Mate connectors 5 cycles for tin
plated and 20 cycles for gold plated
connecters at a maximum rate of 10
cycles per minute. Per EIA-364-09.
Maximum change from initial:
Tin: 2 m
15µ” & 30µGold: 2 m
Header Pin Retention
Force in Housing
Vertical Header
Axial pull force on the vertical
header housing away from the PCB
at a rate of 25.4 +/- 6 mm per
minute.
89 N min per pin
Header Pin Retention
Force in Housing
Right Angle Header
Axial push force on the pin in the
housing at a rate of 25.4 +/- 6 mm
per minute.
9.81 N min per pin
> REVISION. ECR/ECN INFORMATION. TITLE. SHEET No. EC No. % CONNECTOR SYSTEM DOCUMENT NUMBER. CREATED / REVISED BY. CHECKED EV. APPROVED BY.
PRODUCT SPECIFICATION
REVISION:
ECR/ECN INFORMATION:
TITLE:
PRODUCT SPECIFICATION FOR
MEGA-FIT® WIRE TO BOARD
CONNECTOR SYSTEM
SHEET No.
B1
EC No:
UCP2016-2880
9 of 13
DATE:
2016/01/20
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FILENAME: PS75431r0.DOC
6.2 MECHANICAL PERFORMANCE (CONT.)
ITEM
TEST CONDITION
REQUIREMENT
PCB Peg Engagement
Force
(Nominal PCB hole
diameter & location)
Insert a header at a rate of 25.4±6
mm/minute.
(Applies to parts with PCB retention
pegs only)
Header with 2 pegs:
85 N max insertion force
Headers with 1 peg:
45 N max insertion force
Crimp Terminal
Retention Force
(in housing)
Axial pullout force on the terminal
in the housing at a rate of 25 ± 6
mm per minute.
Per EIA-364-29
30 N
MINIMUM retention force
Wire Pull Out Force
From Terminal (Axial)
Apply an axial pullout force on the
wire at a rate of 25 ± 6 mm per
minute.
4.0mm2 = 220 N Min.
12 Awg = 220 N Min.
2.5mm2 = 220 N Min.
14 Awg = 220 N Min.
1.5mm2 = 220 N Min.
16 Awg = 200 N Min.
Values may vary depending on crimp
tooling. Refer to Molex Applicator
Tooling specification.
Vibration
(Random)
Mate connectors and vibrate per
EIA-364-28
test condition VII-D
Tin: 15 minutes each axis.
Gold: 1.5 hours each axis.
Maximum Change from Initial:
Tin: 2 m
15µ” & 30µ” Gold: 2 m
Discontinuity < 1 microsecond
Reseating
Unmate/Mate connectors by hand
three cycles
Maximum Change from Initial:
Tin: 2 m
Except for After Thermal Cycling:
Tin: 10 m
15µ” & 30µ” Gold: 2 m
Vibration/Mechanical
Shock
(SAE/USCAR-2)
Tin Plated only
USCAR-2 Rev 6 per sequence M
per section 5.9.6, Classification: V1,
S1, T2
Shock: 35 G’s, 10 shocks per axis
Vibration: 8 hours per axis, 1.81 g
No discontinuity of 7 or more for
1 microsecond maximum during
Vibration & Shock
Total Connector Resistance:
Tin: 16.13 mMax
(less conductor resistance)
Voltage drop was not evaluated
> Perform 500 c cles. REVISION. ECR/ECN INFORMATION. TITLE. SHEET No. EC No. E CONNECTOR SYSTEM DOCUMENT NUMBER. CREATED / REVISED BY. CHECKED EV. APPROVED BY.
PRODUCT SPECIFICATION
REVISION:
ECR/ECN INFORMATION:
TITLE:
PRODUCT SPECIFICATION FOR
MEGA-FIT® WIRE TO BOARD
CONNECTOR SYSTEM
SHEET No.
B1
EC No:
UCP2016-2880
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DATE:
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6.3 ENVIRONMENTAL PERFORMANCE*
ITEM
TEST CONDITION
REQUIREMENT
Thermal
Shock
Mate connectors, expose to 10
cycles from -55°C to 85°C
Per EIA-364-32 method A,
condition 1
Maximum Change from Initial:
Tin: 2 m
15µ” & 30µ” Gold: 2 m
Thermal Aging
Mate Connectors, expose to 240
hours at 105°C
Per EIA-364-17
Method A
Maximum Change from Initial:
Tin: 2 m
15µ” & 30µ” Gold: 2 m
Thermal Aging
Gold Plated Only
Mate Connectors, expose to
1000 hours at 120°C
Per EIA-364-17
Method A
Maximum Change from Initial:
15µ” Gold: 6 m
30µ” Gold: 2 m
Thermal Aging
(Preconditioning)
Mate Connectors, expose to 120
hours at 105°C
Per EIA-364-17
Method A
Maximum Change from Initial:
Tin: 2 m
15µ” & 30µ” Gold: 2 m
Cyclic Temperature
And Humidity
Mate connectors: expose to 24
cycles from 25 °C / 80% RH to 65
°C / 50% RH
ramp time: 0.5hr dwell time: 1hr
Per EIA-364-1000.01
Maximum Change from Initial:
Tin: 2 m
15µ” & 30µ” Gold: 2 m
Solderability
Dip Test
Per Molex test method:
SMES-152
Solder area shall have MIN. of 95%
solder coverage
Reflow Solder
Resistance
Convection reflow solder process
260°C Max per AS-40000-5013
Visual: No damage
Wave Solder
Resistance
Dip header terminal tails in solder:
Duration: 10±0.5 seconds
Solder temperature: 260±5° C
Per AS-40000-5013
Visual: No damage
Thermal Cycling
Tin Plated Only
Per EIA-364-1000.01 Test Group
5: Cycle mated connector
between 15°C±3°C and
85°C±3°C as measured on the
part. Ramps should be a
minimum of 2°C per minute, and
dwell times should insure
contacts reach the temperature
extremes (minimum of 5 minutes).
Humidity is not controlled.
Perform 500 cycles.
Maximum Change from Initial:
Tin: 10 m
*Environmental tests have been performed based on EIA-364-1000.01
> molex‘ C REVTSION. ECR/ECN INFORMATION. TITLE. SHEET No. EC No. E CONNECTOR SYSTEM DOCUMENT NUMBER. CREATED / REVTSED BY. CHECKED av. APPROVED BY.
PRODUCT SPECIFICATION
REVISION:
ECR/ECN INFORMATION:
TITLE:
PRODUCT SPECIFICATION FOR
MEGA-FIT® WIRE TO BOARD
CONNECTOR SYSTEM
SHEET No.
B1
EC No:
UCP2016-2880
11 of 13
DATE:
2016/01/20
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FILENAME: PS75431r0.DOC
7.0 TEST SEQUENCE GROUPS
Reliability Test Sequences Based on EIA-364-1000.01 & USCAR-2
Group I
Temperature Life
144 contacts tin
144 contacts gold
Group II
Thermal Shock
144 contacts tin
144 contacts gold
Group III
Vibration
144 contacts tin
144 contacts gold
Group V
Thermal Cycling
144 contacts tin
(tin plated only)
|
|
|
|
Initial Contact
Resistance
EIA-364-23
Initial Contact
Resistance
EIA-364-23
Initial Contact
Resistance
EIA-364-23
Initial Contact
Resistance
EIA-364-23
|
|
|
|
Durability
Tin plated: 5 cycles
Gold plated: 20 cycles
EIA-364-09
Durability
Tin plated: 5 cycles
Gold plated: 20 cycles
EIA-364-09
Durability
Tin plated: 5 cycles
Gold plated: 20 cycles
EIA-364-09
Durability
5 cycles
EIA-364-09
|
|
|
|
Contact Resistance
Contact Resistance
Contact Resistance
Contact Resistance
|
|
|
|
Thermal Aging
105C, 240 hrs
10 Yrs @ 65C
EIA-364-17
Thermal Shock
10 cycles
-55C and +85C
EIA-364-32
Thermal Aging
105C, 120 hours
10 Yrs @ 65C
EIA-364-17
Thermal Aging
105C, 120 hours
10 Yrs @ 65C
EIA-364-17
|
|
|
|
Contact Resistance
Contact Resistance
Contact Resistance
Contact Resistance
|
|
|
|
Reseating
3 cycles
Cyclic Temperature
and Humidity
EIA-364-31
Random Vibration
EIA-364-28
Condition VIID
Thermal Cycling
EIA-364-1000.01
|
|
|
|
Contact Resistance
Contact Resistance
Contact Resistance
Contact Resistance
|
|
Reseating
3 cycles
Reseating
3 cycles
|
|
Contact Resistance
Contact Resistance
> REVISION. ECR/ECN INFORMATION. TITLE. SHEET No. EC No. % CONNECTOR SYSTEM DOCUMENT NUMBER. CREATED / REVISED BY. CHECKED EV. APPROVED BY.
PRODUCT SPECIFICATION
REVISION:
ECR/ECN INFORMATION:
TITLE:
PRODUCT SPECIFICATION FOR
MEGA-FIT® WIRE TO BOARD
CONNECTOR SYSTEM
SHEET No.
B1
EC No:
UCP2016-2880
12 of 13
DATE:
2016/01/20
CREATED / REVISED BY:
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FILENAME: PS75431r0.DOC
Group VI
Dust
144 contacts tin
(tin plated only)
Group VII
Durability
144 contacts tin
144 contacts gold
Group VIII
Temperature Life
144 contacts gold
(gold plated only)
Group IX
Uscar-2 Vibration and
Shock
144 contacts tin
(tin plated only)
Individual Tests
|
|
|
|
Initial Contact
Resistance
EIA-364-23
DWV
EIA-364-20
Initial Contact
Resistance
EIA-364-23
Visual Inspection /
Initial Contact
Resistance
EIA-364-23
Connector
Mating / Unmating
Force
|
|
|
|
Durability
5 cycles
EIA-364-09
Initial Contact
Resistance
EIA-364-23
Durability
5 cycles
EIA-364-09
Durability
10 cycles
Temperature Rise /
Voltage Drop
|
|
|
|
Dust
EIA-364-91
Durability
Tin plated: 25 cycles
Gold plated: 200
cycles
EIA-364-09
Contact Resistance
Contact Resistance
Wire pullout force
from terminal (axial)
|
|
Thermal Aging
120C, 250 hrs
EIA-364-17
Mechanical shock w/
continuity monitoring
Header Pin Retention
in Housing
|
|
|
|
Contact Resistance
Contact Resistance
Contact Resistance
Random vibration w/
continuity monitoring
Crimped Terminal
Retention Force in
Housing
|
|
|
|
Thermal Disturbance
EIA-364-1000.01
DWV
EIA-364-20
Thermal Aging
120C, 250 hrs
EIA-364-17
Contact Resistance
Wave / Reflow Solder
Resistance
|
|
Contact Resistance
Contact Resistance
Voltage drop was not
conducted due to test
setup
Solderability
|
I
Reseating
3 cycles
Thermal Aging
120C, 250 hrs
EIA-364-17
Insulation Resistance
|
I
Contact Resistance
Contact Resistance
PCB Peg
Engagement
Forces
I
Thermal Aging
120C, 250 hrs
EIA-364-17
Thumb Latch yield
strength
I
Contact Resistance
I
Crimped terminal
retention force in
housing
> REVTSION. ECR/ECN INFORMATION. TITLE. SHEET No. EC No. % CONNECTOR SYSTEM DOCUMENT NUMBER. CREATED / REVTSED BY. CHECKED EV. APPROVED BY.
PRODUCT SPECIFICATION
REVISION:
ECR/ECN INFORMATION:
TITLE:
PRODUCT SPECIFICATION FOR
MEGA-FIT® WIRE TO BOARD
CONNECTOR SYSTEM
SHEET No.
B1
EC No:
UCP2016-2880
13 of 13
DATE:
2016/01/20
CREATED / REVISED BY:
CHECKED BY:
APPROVED BY:
PS-76823-100
GES
JBELL
FSMITH
FILENAME: PS75431r0.DOC
8.0 SOLDER INFORMATION
8.1 SOLDER PROCESS TEMPERATURES
Wave Solder: 265°C Max
Reflow Solder: 260°C Max
8.2 REFLOW SOLDERING PROFILE
See AS-40000-5013

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