Si8610, 20, 21, 22 Datasheet by Skyworks Solutions Inc.

2/ SKYWORKé
Si861x/2x Data Sheet
Low-Power Single and Dual-Channel Digital Isolators
Silicon Lab's family of ultra-low-power digital isolators are CMOS devices offering sub-
stantial data rate, propagation delay, power, size, reliability, and external BOM advan-
tages over legacy isolation technologies. The operating parameters of these products
remain stable across wide temperature ranges and throughout device service life for
ease of design and highly uniform performance. All device versions have Schmitt trigger
inputs for high noise immunity and only require VDD bypass capacitors.
Data rates up to 150 Mbps are supported, and all devices achieve propagation delays
of less than 10 ns. Ordering options include a choice of isolation ratings (2.5, 3.75 and
5 kV) and a selectable fail-safe operating mode to control the default output state during
power loss. All products are safety certified by UL, CSA, VDE, and CQC, and products
in wide-body packages support reinforced insulation withstanding up to 5 kVRMS.
Automotive Grade is available for certain part numbers. These products are built using
automotive-specific flows at all steps in the manufacturing process to ensure the robust-
ness and low defectivity required for automotive applications.
KEY FEATURES
High-speed operation
DC to 150 Mbps
No start-up initialization required
Wide Operating Supply Voltage
2.5–5.5 V
Up to 5000 VRMS isolation
Reinforced VDE 0884-10, 10 kV surge-
capable (Si862xxT)
60-year life at rated working voltage
High electromagnetic immunity
Ultra low power (typical)
5 V Operation
1.6 mA per channel at 1 Mbps
5.5 mA per channel at 100 Mbps
2.5 V Operation
1.5 mA per channel at 1 Mbps
3.5 mA per channel at 100 Mbps
Schmitt trigger inputs
Selectable fail-safe mode
Default high or low output (ordering
option)
Precise timing (typical)
10 ns propagation delay
1.5 ns pulse width distortion
0.5 ns channel-channel skew
2 ns propagation delay skew
5 ns minimum pulse width
Transient Immunity 50 kV/µs
AEC-Q100 qualification
Wide temperature range
–40 to 125 °C
RoHS-compliant packages
WB SOIC-16
• SOIC-8
DFN-8 compact package
Automotive-grade OPNs available
AIAG compliant PPAP documentation
support
IMDS and CAMDS listing support
Industrial Applications
Industrial automation systems
Medical electronics
Isolated switch mode supplies
Isolated ADC, DAC
Motor control
Power inverters
Communications systems
Safety Regulatory Approvals
UL 1577 recognized
Up to 5000 VRMS for 1 minute
CSA approval
IEC 60950-1, 62368-1, 60601-1 (re-
inforced insulation)
VDE certification conformity
Si862xxT options certified to re-
inforced per VDE 0884-10 and
62368-1
All other options certified to
VDE 0884-10 (basic), 60950-1 (rein-
forced), and 62368-1 (reinforced)
CQC certification approval
• GB4943.1-2011
Automotive Applications
On-board chargers
Battery management systems
Charging stations
Traction inverters
Hybrid Electric Vehicles
Battery Electric Vehicles
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1. Ordering Guide
Industrial and Automotive Grade OPNs
Industrial-grade devices (part numbers having an “-I” in their suffix) are built using well-controlled, high-quality manufacturing flows to
ensure robustness and reliability. Qualifications are compliant with JEDEC, and defect reduction methodologies are used throughout
definition, design, evaluation, qualification, and mass production steps.
Automotive-grade devices (part numbers having an “-A” in their suffix) are built using automotive-specific flows at all steps in the
manufacturing process to ensure robustness and low defectivity. These devices are supported with AIAG-compliant Production Part
Approval Process (PPAP) documentation, and feature International Material Data System (IMDS) and China Automotive Material
Data System (CAMDS) listing. Qualifications are compliant with AEC-Q100, and a zero-defect methodology is maintained throughout
definition, design, evaluation, qualification, and mass production steps.
Table 1.1. Ordering Guide for Valid OPNs1, 2, 4
See the Top Marking section of this data sheet for the part number decoder.
Ordering Part Number
(OPN) Automotive OPNs5, 6
Number
of Inputs
VDD1
Side
Number
of Inputs
VDD2
Side
Max Data
Rate
(Mbps)
Default
Output
State
Isolation
Rating
(kV)
Package
Si8610BB-B-IS Si8610BB-AS 1 0 150 Low 2.5 SOIC-8
Si8610BC-B-IS Si8610BC-AS 1 0 150 Low 3.75 SOIC-8
Si8610EC-B-IS Si8610EC-AS 1 0 150 High 3.75 SOIC-8
Si8610BD-B-IS Si8610BD-AS 1 0 150 Low 5.0 WB SOIC-16
Si8610ED-B-IS Si8610ED-AS 1 0 150 High 5.0 WB SOIC-16
Si8620BB-B-IS Si8620BB-AS 2 0 150 Low 2.5 SOIC-8
Si8620EB-B-IS Si8620EB-AS 2 0 150 High 2.5 SOIC-8
Si8620BC-B-IS Si8620BC-AS 2 0 150 Low 3.75 SOIC-8
Si8620EC-B-IS Si8620EC-AS 2 0 150 High 3.75 SOIC-8
Si8620BD-B-IS Si8620BD-AS 2 0 150 Low 5.0 WB SOIC-16
Si8620ED-B-IS Si8620ED-AS 2 0 150 High 5.0 WB SOIC-16
Si8621BB-B-IS Si8621BB-AS 1 1 150 Low 2.5 SOIC-8
Si8621BC-B-IS Si8621BC-AS 1 1 150 Low 3.75 SOIC-8
Si8621EC-B-IS Si8621EC-AS 1 1 150 High 3.75 SOIC-8
Si8621BD-B-IS Si8621BD-AS 1 1 150 Low 5.0 WB SOIC-16
Si8621ED-B-IS Si8621ED-AS 1 1 150 High 5.0 WB SOIC-16
Si8622BB-B-IS Si8622BB-AS 1 1 150 Low 2.5 SOIC-8
Si8622EB-B-IS Si8622EB-AS 1 1 150 High 2.5 SOIC-8
Si8622BC-B-IS Si8622BC-AS 1 1 150 Low 3.75 SOIC-8
Si8622EC-B-IS Si8622EC-AS 1 1 150 High 3.75 SOIC-8
Si8622BD-B-IS Si8622BD-AS 1 1 150 Low 5.0 WB SOIC-16
Si8622ED-B-IS Si8622ED-AS 1 1 150 High 5.0 WB SOIC-16
SI8610BB-B-IM1 SI8610BB-AM1 1 0 150 Low 2.5 DFN-8
SI8610EB-B-IM1 SI8610EB-AM1 1 0 150 High 2.5 DFN-8
Si861x/2x Data Sheet • Ordering Guide
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Ordering Part Number
(OPN) Automotive OPNs5, 6
Number
of Inputs
VDD1
Side
Number
of Inputs
VDD2
Side
Max Data
Rate
(Mbps)
Default
Output
State
Isolation
Rating
(kV)
Package
SI8620BB-B-IM1 SI8620BB-AM1 2 0 150 Low 2.5 DFN-8
SI8620EB-B-IM1 SI8620EB-AM1 2 0 150 High 2.5 DFN-8
SI8621BB-B-IM1 SI8621BB-AM1 1 1 150 Low 2.5 DFN-8
SI8621EB-B-IM1 SI8621EB-AM1 1 1 150 High 2.5 DFN-8
SI8622BB-B-IM1 SI8622BB-AM1 1 1 150 Low 2.5 DFN-8
SI8622EB-B-IM1 SI8622EB-AM1 1 1 150 High 2.5 DFN-8
Product Options with Reinforced VDE 0884-10 Rating with 10 kV Surge Capability
Si8620BT-IS Si8620BT-AS 2 0 150 Low 5.0 WB SOIC-16
Si8620ET-IS Si8620ET-AS 2 0 150 High 5.0 WB SOIC-16
Si8621BT-IS Si8621BT-AS 1 1 150 Low 5.0 WB SOIC-16
Si8621ET-IS Si8621ET-AS 1 1 150 High 5.0 WB SOIC-16
Si8622BT-IS Si8622BT-AS 1 1 150 Low 5.0 WB SOIC-16
Si8622ET-IS Si8622ET-AS 1 1 150 High 5.0 WB SOIC-16
Note:
1. All packages are RoHS-compliant with peak reflow temperatures of 260 °C according to the JEDEC industry standard classifica-
tions and peak solder temperatures.
2. “Si” and “SI” are used interchangeably.
3. An "R" at the end of the part number denotes tape and reel packaging option.
4. The temperature ranges is –40 to +125 °C.
5. Automotive-Grade devices (with an "–A" suffix) are identical in construction materials, topside marking, and electrical parameters
to their Industrial-Grade (with an "–I" suffix) version counterparts. Automotive-Grade products are produced utilizing full automo-
tive process flows and additional statistical process controls throughout the manufacturing flow. The Automotive-Grade part
number is included on shipping labels.
6. In the top markings of each device, the Manufacturing Code represented by either “RTTTTT” or “TTTTTT” contains as its first
character a letter in the range N through Z to indicate Automotive-Grade.
Si861x/2x Data Sheet • Ordering Guide
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Table of Contents
1. Ordering Guide ..............................2
2. System Overview ..............................5
2.1 Theory of Operation ............................5
2.2 Eye Diagram...............................6
3. Device Operation ..............................7
3.1 Device Startup ..............................8
3.2 Undervoltage Lockout ...........................8
3.3 Layout Recommendations ..........................8
3.3.1 Supply Bypass ............................8
3.3.2 Output Pin Termination ..........................8
3.4 Fail-Safe Operating Mode ..........................8
3.5 Typical Performance Characteristis .......................9
4. Electrical Specifications ...........................11
5. Pin Descriptions (WB SOIC-16) ....................... 28
6. Pin Descriptions (SOIC-8) ......................... 29
7. Pin Descriptions (DFN-8) .......................... 30
8. Package Outline: WB SOIC-16 ........................ 31
9. Land Pattern: WB SOIC-16 ......................... 33
10. Package Outline: SOIC-8 ......................... 34
11. Land Pattern: SOIC-8 ........................... 35
12. Package Outline: DFN-8 .......................... 36
13. Land Pattern: DFN-8 ........................... 37
14. Top Marking: WB SOIC-16 ......................... 38
15. Top Marking: SOIC-8 ........................... 39
16. Top Marking: DFN-8 ........................... 40
17. Revision History............................. 41
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Transmitter I i Receiver RF ' l OSCILLATOR : : | l | l l : Semiconducior- : I MODULATOR —I Based “9'3"” I— DEMODULATOR B I I Barrier I I | I I I I I I I | | I I Input Signal Modulation Signal Output Signal
2. System Overview
2.1 Theory of Operation
The operation of an Si861x/2x channel is analogous to that of an opto coupler, except an RF carrier is modulated instead of light. This
simple architecture provides a robust isolated data path and requires no special considerations or initialization at start-up. A simplified
block diagram for a single Si861x/2x channel is shown in the figure below.
Figure 2.1. Simplified Channel Diagram
A channel consists of an RF Transmitter and RF Receiver separated by a semiconductor-based isolation barrier. Referring to the
transmitter, input A modulates the carrier provided by an RF oscillator using on/off keying. The Receiver contains a demodulator that
decodes the input state according to its RF energy content and applies the result to output B via the output driver. This RF on/off keying
scheme is superior to pulse code schemes as it provides best-in-class noise immunity, low power consumption, and improved immunity
to magnetic fields. See the following figure for more details.
Figure 2.2. Modulation Scheme
Si861x/2x Data Sheet • System Overview
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2.2 Eye Diagram
The figure below illustrates an eye diagram taken on an Si8610. For the data source, the test used an Anritsu (MP1763C) Pulse Pattern
Generator set to 1000 ns/div. The output of the generator's clock and data from an Si8610 were captured on an oscilloscope. The
results illustrate that data integrity was maintained even at the high data rate of 150 Mbps. The results also show that 2 ns pulse width
distortion and 350 ps peak jitter were exhibited.
Figure 2.3. Eye Diagram
Si861x/2x Data Sheet • System Overview
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3. Device Operation
Device behavior during start-up, normal operation, and shutdown is shown in Figure 3.1 Device Behavior during Normal Operation on
page 8, where UVLO+ and UVLO– are the respective positive-going and negative-going thresholds. Refer to the following table to
determine outputs when power supply (VDD) is not present.
Table 3.1. Si86xx Logic Operation
VI Input1, 2 VDDI State1, 3, 4 VDDO State1, 3, 4 VO Output1, 2 Comments
H P P H Normal operation.
L P P L
X5UP P L6
H6
Upon transition of VDDI from unpowered to powered, VO re-
turns to the same state as VI in less than 1 µs.
X5P UP Undetermined Upon transition of VDDO from unpowered to powered, VO
returns to the same state as VI within 1 µs.
Note:
1. VDDI and VDDO are the input and output power supplies. VI and VO are the respective input and output terminals.
2. X = not applicable; H = Logic High; L = Logic Low; Hi-Z = High Impedance.
3. “Powered” state (P) is defined as 2.5 V < VDD < 5.5 V.
4. “Unpowered” state (UP) is defined as VDD = 0 V.
5. Note that an I/O can power the die for a given side through an internal diode if its source has adequate current.
6. See Ordering Guide for details. This is the selectable fail-safe operating mode (ordering option). Some devices have default
output state = H, and some have default output state = L, depending on the ordering part number (OPN). For default high
devices, the data channels have pull-ups on inputs/outputs. For default low devices, the data channels have pull-downs on
inputs/outputs.
Si861x/2x Data Sheet • Device Operation
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ma. 7 7 um. 77 VW mo. 7 uvLo- 7 vm \NPLIT m m 5qu 15- 74mm .7lmw ‘_.‘ ._.‘ OUTPUT
3.1 Device Startup
Outputs are held low during powerup until VDD is above the UVLO threshold for time period tSTART. Following this, the outputs follow
the states of inputs.
3.2 Undervoltage Lockout
Undervoltage Lockout (UVLO) is provided to prevent erroneous operation during device startup and shutdown or when VDD is below its
specified operating circuits range. Both Side A and Side B each have their own undervoltage lockout monitors. Each side can enter or
exit UVLO independently. For example, Side A unconditionally enters UVLO when VDD1 falls below VDD1(UVLO–) and exits UVLO when
VDD1 rises above VDD1(UVLO+). Side B operates the same as Side A with respect to its VDD2 supply.
Figure 3.1. Device Behavior during Normal Operation
3.3 Layout Recommendations
To ensure safety in the end-user application, high-voltage circuits (i.e., circuits with >30 VAC) must be physically separated from
the safety extra-low-voltage circuits (SELV is a circuit with <30 VAC) by a certain distance (creepage/clearance). If a component,
such as a digital isolator, straddles this isolation barrier, it must meet those creepage/clearance requirements and also provide a
sufficiently large high-voltage breakdown protection rating (commonly referred to as working voltage protection). Table 4.6 Insulation
and Safety-Related Specifications on page 24 and Table 4.8 VDE 0884-10 Insulation Characteristics1 on page 25 detail the working
voltage and creepage/clearance capabilities of the Si86xx. These tables also detail the component standards (UL1577, IEC60747,
CSA 5A), which are readily accepted by certification bodies to provide proof for end-system specifications requirements. Refer to the
end-system specification (61010-1, 60950-1, 60601-1, etc.) requirements before starting any design that uses a digital isolator.
3.3.1 Supply Bypass
The Si861x/2x family requires a 0.1 µF bypass capacitor between VDD1 and GND1 and VDD2 and GND2. The capacitor should be
placed as close as possible to the package. To enhance the robustness of a design, the user may also include resistors (50–300 Ω ) in
series with the inputs and outputs if the system is excessively noisy.
3.3.2 Output Pin Termination
The nominal output impedance of an isolator driver channel is approximately 50 Ω, ±40%, which is a combination of the value of the
on-chip series termination resistor and channel resistance of the output driver FET. When driving loads where transmission line effects
will be a factor, output pins should be appropriately terminated with controlled impedance PCB traces.
3.4 Fail-Safe Operating Mode
Si86xx devices feature a selectable (by ordering option) mode whereby the default output state (when the input supply is unpowered)
can either be a logic high or logic low when the output supply is powered. See Table 3.1 Si86xx Logic Operation on page 7 and
1. Ordering Guide for more information.
Si861x/2x Data Sheet • Device Operation
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.5... :23 2o so no so so 70 I: so low no 120 no no Isa so o m w so no no no no no 150 so do so so mm o Mu late [Mbusl on. In: (Mm! +sv +3 av +2.5v mo 3m: zso no N n, m .5... $2.5 —o—5v +3 av 2n n s, m o .5... iota +2 sv so so on no so 70 an so mo no no no no 150 mmtmhos) 1o 20 so to so u so so 7o so so 109 no no :so 140 150 m zo N on u on: m (Mbps) +sv +s.sv --25v soo 25o o.o on 10 2o so 4o so so 7o so so 100 no no no no 150 o so on so w 70 so so 100 no no no no :so 2o m nan me (Mbosl um um: (MIIIIs)
3.5 Typical Performance Characteristis
The typical performance characteristics depicted in the following diagrams are for information purposes only. Refer to 4. Electrical
Specifications for actual specification limits.
Figure 3.2. Si8610 Typical VDD1 Supply Current vs. Data Rate
5, 3.3, and 2.50 V Operation Figure 3.3. Si8610 Typical VDD2 Supply Current vs. Data Rate
5, 3.3, and 2.50 V Operation (15 pF Load)
Figure 3.4. Si8620 Typical VDD1 Supply Current vs. Data Rate
5, 3.3, and 2.50 V Operation
Figure 3.5. Si8620 Typical VDD2 Supply Current vs. Data Rate
5, 3.3, and 2.50 V Operation (15 pF Load)
Figure 3.6. Si8621 Typical VDD1 or VDD2 Supply Current vs.
Data Rate 5, 3.3, and 2.50 V Operation (15 pF Load) Figure 3.7. Si8622 Typical VDD1 or VDD2 Supply Current vs.
Data Rate 5, 3.3, and 2.50 V Operation (15 pF Load)
Si861x/2x Data Sheet • Device Operation
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_ _ _ _ Illlfll filllfilllfilll _ _ _ _ _ _ _ _ IIII1II 1III1III._.III _ _ _ _ _ _ _ IIII1III III1III._.III _ _ _ _ _ _ _ IIIJIIII III1III4III _ _ _ _ _ _ _ _ IIIITIIIT II+III+III _ _ _ _ _ _ _ _ IlllnllllT I+III+III _ Illlrl ___r__r__ IIIIF IIFIIIPIIIFIII _ _ _ Ilrl flll ___r__r__ 10.0 9.0 80 70 GE >22”. 30 -20 -10 0 10 20 30 4O 50 60 7O 80 90 100110120 -40 _ Temperature (Degrees C)
Figure 3.8. Propagation Delay vs. Temperature (5.0 V Data)
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4. Electrical Specifications
Table 4.1. Recommended Operating Conditions
Parameter Symbol Min Typ Max Unit
Ambient Operating Temperature1TA –40 25 1251°C
Supply Voltage VDD1 2.5 5.5 V
VDD2 2.5 5.5 V
Note:
1. The maximum ambient temperature is dependent on data frequency, output loading, number of operating channels, and supply
voltage.
Table 4.2. Electrical Characteristics1
Parameter Symbol Test Condition Min Typ Max Unit
VDD Undervoltage Threshold VDDUV+ VDD1, VDD2 rising 1.95 2.24 2.375 V
VDD Undervoltage Threshold VDDUV– VDD1, VDD2 falling 1.88 2.16 2.325 V
VDD Undervoltage Hysteresis VDDHYS 50 70 95 mV
Positive-Going Input Threshold VT+ All inputs rising 1.4 1.67 1.9 V
Negative-Going Input Threshold VT– All inputs falling 1.0 1.23 1.4 V
Input Hysteresis VHYS 0.38 0.44 0.50 V
High Level Input Voltage VIH 2.0 — — V
Low Level Input Voltage VIL — 0.8 V
High Level Output Voltage VOH loh = –4 mA VDD1, VDD2 – 0.4 4.8 V
Low Level Output Voltage VOL lol = 4 mA 0.2 0.4 V
Input Leakage Current
Si86xxxB/C/D
Si86xxxT
IL
±10
±15
µA
Output Impedance2ZO 50 — Ω
DC Supply Current (All Inputs 0 V or at Supply)
Si8610Bx, Ex
VDD1
VDD2
VDD1
VDD2
VI = 0(Bx), 1(Ex)
VI = 0(Bx), 1(Ex)
VI = 1(Bx), 0(Ex)
VI = 1(Bx), 0(Ex)
0.6
0.8
1.8
0.8
1.2
1.5
2.9
1.5
mA
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Parameter Symbol Test Condition Min Typ Max Unit
Si8620Bx, Ex
VDD1
VDD2
VDD1
VDD2
VI = 0(Bx), 1(Ex)
VI = 0(Bx), 1(Ex)
VI = 1(Bx), 0(Ex)
VI = 1(Bx), 0(Ex)
0.8
1.4
3.3
1.4
1.4
2.2
5.3
2.2
mA
Si8621Bx, Ex
VDD1
VDD2
VDD1
VDD2
VI = 0(Bx), 1(Ex)
VI = 0(Bx), 1(Ex)
VI = 1(Bx), 0(Ex)
VI = 1(Bx), 0(Ex)
1.2
1.2
2.4
2.4
1.9
1.9
3.8
3.8
mA
Si8622Bx, Ex
VDD1
VDD2
VDD1
VDD2
VI = 0(Bx), 1(Ex)
VI = 0(Bx), 1(Ex)
VI = 1(Bx), 0(Ex)
VI = 1(Bx), 0(Ex)
2.6
3.3
4.0
4.8
4.2
5.3
6.4
7.7
mA
1 Mbps Supply Current (All Inputs = 500 kHz Square Wave, CL = 15 pF on All Outputs)
Si8610Bx, Ex
VDD1
VDD2
1.2
0.9
2.0
1.5
mA
Si8620Bx, Ex
VDD1
VDD2
2.1
1.6
3.1
2.4
mA
Si8621Bx, Ex
VDD1
VDD2
1.9
1.9
2.9
2.9
mA
Si8622Bx, Ex
VDD1
VDD2
3.4
4.2
5.1
6.2
mA
10 Mbps Supply Current (All Inputs = 5 MHz Square Wave, CL = 15 pF on All Outputs)
Si8610Bx, Ex
VDD1
VDD2
1.2
1.2
2.0
2.0
mA
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Parameter Symbol Test Condition Min Typ Max Unit
Si8620Bx, Ex
VDD1
VDD2
2.1
2.2
3.1
3.3
mA
Si8621Bx, Ex
VDD1
VDD2
2.2
2.2
3.3
3.3
mA
Si8622Bx, Ex
VDD1
VDD2
3.7
4.4
5.5
6.7
mA
100 Mbps Supply Current (All Inputs = 50 MHz Square Wave, CL = 15 pF on All Outputs)
Si8610Bx, Ex
VDD1
VDD2
1.2
4.8
2.0
6.7
mA
Si8620Bx, Ex
VDD1
VDD2
2.1
8.9
3.1
12.5
mA
Si8621Bx, Ex
VDD1
VDD2
5.8
5.8
8.1
8.1
mA
Si8622Bx, Ex
VDD1
VDD2
7.6
8.2
10.6
11.4
mA
Timing Characteristics
Si861x/2x Bx, Ex
Data Rate 0 150 Mbps
Minimum Pulse Width 5.0 ns
Propagation Delay tPHL, tPLH See Figure 4.1 Propa-
gation Delay Timing on
page 15
5.0 8.0 13 ns
Pulse Width Distortion
|tPLH – tPHL| PWD
See Figure 4.1 Propa-
gation Delay Timing on
page 15
0.2 4.5 ns
Propagation Delay Skew3tPSK(P-P) 2.0 4.5 ns
Channel-Channel Skew tPSK 0.4 2.5 ns
All Models
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Parameter Symbol Test Condition Min Typ Max Unit
Output Rise Time tr
CL = 15 pF
See Figure 4.1 Propa-
gation Delay Timing on
page 15
2.5 4.0 ns
Output Fall Time tf
CL = 15 pF
See Figure 4.1 Propa-
gation Delay Timing on
page 15
2.5 4.0 ns
Peak Eye Diagram Jitter tJIT(PK) See Figure 2.3 Eye Di-
agram on page 6
350 — ps
Common Mode Transient Immunity
Si86xxxB/C/D
Si86xxxT
CMTI
VI = VDD or 0 V
VCM = 1500 V
See Figure 4.2 Com-
mon-Mode Transient
Immunity Test Circuit
on page 15
35
60
50
100
kV/µs
Start-up Time4tSU 15 40 µs
Note:
1. VDD1 = 5 V ±10%; VDD2 = 5 V ±10%, TA = –40 to 125 °C
2. The nominal output impedance of an isolator driver channel is approximately 50 Ω, ±40%, which is a combination of the value of
the on-chip series termination resistor and channel resistance of the output driver FET. When driving loads where transmission
line effects will be a factor, output pins should be appropriately terminated with controlled-impedance PCB traces.
3. tPSK(P-P) is the magnitude of the difference in propagation delay times measured between different units operating at the same
supply voltages, load, and ambient temperature.
4. Start-up time is the time period from the application of power to the appearance of valid data at the output.
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Supply SiBSxx VDDl VDDZ Input Slgnal % INPUT OUTPUT Switch + 3toSV 7 Isolated Supply GNDl GNDZ Isolaked ' v Ground HughVoItage WW. In Differemial —> put Probe chSurge Output HighVoltage 3(05V Surge Generator Oscilloscope
Figure 4.1. Propagation Delay Timing
Figure 4.2. Common-Mode Transient Immunity Test Circuit
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Table 4.3. Electrical Characteristics1
Parameter Symbol Test Condition Min Typ Max Unit
VDD Undervoltage Threshold VDDUV+ VDD1, VDD2 rising 1.95 2.24 2.375 V
VDD Undervoltage Threshold VDDUV– VDD1, VDD2 falling 1.88 2.16 2.325 V
VDD Undervoltage Hysteresis VDDHYS 50 70 95 mV
Positive-Going Input Threshold VT+ All inputs rising 1.4 1.67 1.9 V
Negative-Going Input Threshold VT– All inputs falling 1.0 1.23 1.4 V
Input Hysteresis VHYS 0.38 0.44 0.50 V
High Level Input Voltage VIH 2.0 — — V
Low Level Input Voltage VIL — 0.8 V
High Level Output Voltage VOH loh = –4 mA VDD1, VDD2 – 0.4 3.1 V
Low Level Output Voltage VOL lol = 4 mA 0.2 0.4 V
Input Leakage Current
Si86xxxB/C/D
Si86xxxT
IL
±10
±15
µA
Output Impedance2ZO 50 — Ω
DC Supply Current (All Inputs 0 V or at Supply)
Si8610Bx, Ex
VDD1
VDD2
VDD1
VDD2
VI = 0(Bx), 1(Ex)
VI = 0(Bx), 1(Ex)
VI = 1(Bx), 0(Ex)
VI = 1(Bx), 0(Ex)
0.6
0.8
1.8
0.8
1.2
1.5
2.9
1.5
mA
Si8620Bx, Ex
VDD1
VDD2
VDD1
VDD2
VI = 0(Bx), 1(Ex)
VI = 0(Bx), 1(Ex)
VI = 1(Bx), 0(Ex)
VI = 1(Bx), 0(Ex)
0.8
1.4
3.3
1.4
1.4
2.2
5.3
2.2
mA
Si8621Bx, Ex
VDD1
VDD2
VDD1
VDD2
VI = 0(Bx), 1(Ex)
VI = 0(Bx), 1(Ex)
VI = 1(Bx), 0(Ex)
VI = 1(Bx), 0(Ex)
1.2
1.2
2.4
2.4
1.9
1.9
3.8
3.8
mA
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Parameter Symbol Test Condition Min Typ Max Unit
Si8622Bx, Ex
VDD1
VDD2
VDD1
VDD2
VI = 0(Bx), 1(Ex)
VI = 0(Bx), 1(Ex)
VI = 1(Bx), 0(Ex)
VI = 1(Bx), 0(Ex)
2.6
3.3
4.0
4.8
4.2
5.3
6.4
7.7
mA
1 Mbps Supply Current (All Inputs = 500 kHz Square Wave, CL = 15 pF on All Outputs)
Si8610Bx, Ex
VDD1
VDD2
1.2
0.9
2.0
1.5
mA
Si8620Bx, Ex
VDD1
VDD2
2.1
1.6
3.1
2.4
mA
Si8621Bx, Ex
VDD1
VDD2
1.9
1.9
2.9
2.9
mA
Si8622Bx, Ex
VDD1
VDD2
3.4
4.2
5.1
6.2
mA
10 Mbps Supply Current (All Inputs = 5 MHz Square Wave, CL = 15 pF on All Outputs)
Si8610Bx, Ex
VDD1
VDD2
1.2
1.0
2.0
1.8
mA
Si8620Bx, Ex
VDD1
VDD2
2.1
1.9
3.1
2.8
mA
Si8621Bx, Ex
VDD1
VDD2
2.0
2.0
3.0
3.0
mA
Si8622Bx, Ex
VDD1
VDD2
3.5
4.3
5.3
6.4
mA
100 Mbps Supply Current (All Inputs = 50 MHz Square Wave, CL = 15 pF on All Outputs)
Si8610Bx, Ex
VDD1
VDD2
1.2
3.4
2.0
5.1
mA
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Parameter Symbol Test Condition Min Typ Max Unit
Si8620Bx, Ex
VDD1
VDD2
2.1
6.3
3.1
8.8
mA
Si8621Bx, Ex
VDD1
VDD2
4.4
4.4
6.1
6.1
mA
Si8622Bx, Ex
VDD1
VDD2
5.9
6.6
8.2
9.3
mA
Timing Characteristics
Si861x/2x Bx, Ex
Data Rate 0 150 Mbps
Minimum Pulse Width 5.0 ns
Propagation Delay tPHL, tPLH See Figure 4.1 Propa-
gation Delay Timing on
page 15
5.0 8.0 13 ns
Pulse Width Distortion
|tPLH – tPHL| PWD
See Figure 4.1 Propa-
gation Delay Timing on
page 15
0.2 4.5 ns
Propagation Delay Skew3tPSK(P-P) 2.0 4.5 ns
Channel-Channel Skew tPSK 0.4 2.5 ns
All Models
Output Rise Time tr
CL = 15 pF
See Figure 4.1 Propa-
gation Delay Timing on
page 15
2.5 4.0 ns
Output Fall Time tf
CL = 15 pF
See Figure 4.1 Propa-
gation Delay Timing on
page 15
2.5 4.0 ns
Peak Eye Diagram Jitter tJIT(PK) See Figure 2.3 Eye Di-
agram on page 6
350 — ps
Common Mode Transient Immunity
Si86xxxB/C/D
Si86xxxT
CMTI
VI = VDD or 0 V
VCM = 1500 V
See Figure 4.2 Com-
mon-Mode Transient
Immunity Test Circuit
on page 15
35
60
50
100
kV/µs
Start-up Time4tSU 15 40 µs
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Parameter Symbol Test Condition Min Typ Max Unit
Note:
1. VDD1 = 3.3 V ±10%; VDD2 = 3.3 V ±10%, TA = –40 to 125 °C
2. The nominal output impedance of an isolator driver channel is approximately 50 Ω, ±40%, which is a combination of the value of
the on-chip series termination resistor and channel resistance of the output driver FET. When driving loads where transmission
line effects will be a factor, output pins should be appropriately terminated with controlled-impedance PCB traces.
3. tPSK(P-P) is the magnitude of the difference in propagation delay times measured between different units operating at the same
supply voltages, load, and ambient temperature.
4. Start-up time is the time period from the application of power to the appearance of valid data at the output.
Table 4.4. Electrical Characteristics1
Parameter Symbol Test Condition Min Typ Max Unit
VDD Undervoltage Threshold VDDUV+ VDD1, VDD2 rising 1.95 2.24 2.375 V
VDD Undervoltage Threshold VDDUV– VDD1, VDD2 falling 1.88 2.16 2.325 V
VDD Undervoltage Hysteresis VDDHYS 50 70 95 mV
Positive-Going Input Threshold VT+ All inputs rising 1.4 1.67 1.9 V
Negative-Going Input Threshold VT– All inputs falling 1.0 1.23 1.4 V
Input Hysteresis VHYS 0.38 0.44 0.50 V
High Level Input Voltage VIH 2.0 — — V
Low Level Input Voltage VIL — 0.8 V
High Level Output Voltage VOH loh = –4 mA VDD1, VDD2 – 0.4 2.3 V
Low Level Output Voltage VOL lol = 4 mA 0.2 0.4 V
Input Leakage Current
Si86xxxB/C/D
Si86xxxT
IL
±10
±15
µA
Output Impedance2ZO 50 — Ω
DC Supply Current (All Inputs 0 V or at Supply)
Si8610Bx, Ex
VDD1
VDD2
VDD1
VDD2
VI = 0(Bx), 1(Ex)
VI = 0(Bx), 1(Ex)
VI = 1(Bx), 0(Ex)
VI = 1(Bx), 0(Ex)
0.6
0.8
1.8
0.8
1.2
1.5
2.9
1.5
mA
Si8620Bx, Ex
VDD1
VDD2
VDD1
VDD2
VI = 0(Bx), 1(Ex)
VI = 0(Bx), 1(Ex)
VI = 1(Bx), 0(Ex)
VI = 1(Bx), 0(Ex)
0.8
1.4
3.3
1.4
1.4
2.2
5.3
2.2
mA
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Parameter Symbol Test Condition Min Typ Max Unit
Si8621Bx, Ex
VDD1
VDD2
VDD1
VDD2
VI = 0(Bx), 1(Ex)
VI = 0(Bx), 1(Ex)
VI = 1(Bx), 0(Ex)
VI = 1(Bx), 0(Ex)
1.2
1.2
2.4
2.4
1.9
1.9
3.8
3.8
mA
Si8622Bx, Ex
VDD1
VDD2
VDD1
VDD2
VI = 0(Bx), 1(Ex)
VI = 0(Bx), 1(Ex)
VI = 1(Bx), 0(Ex)
VI = 1(Bx), 0(Ex)
2.6
3.3
4.0
4.8
4.2
5.3
6.4
7.7
mA
1 Mbps Supply Current (All Inputs = 500 kHz Square Wave, CL = 15 pF on All Outputs)
Si8610Bx, Ex
VDD1
VDD2
1.2
0.9
2.0
1.5
mA
Si8620Bx, Ex
VDD1
VDD2
2.1
1.6
3.1
2.4
mA
Si8621Bx, Ex
VDD1
VDD2
1.9
1.9
2.9
2.9
mA
Si8622Bx, Ex
VDD1
VDD2
3.4
4.2
5.1
6.2
mA
10 Mbps Supply Current (All Inputs = 5 MHz Square Wave, CL = 15 pF on All Outputs)
Si8610Bx, Ex
VDD1
VDD2
1.2
1.0
2.0
1.6
mA
Si8620Bx, Ex
VDD1
VDD2
2.1
1.7
3.1
2.6
mA
Si8621Bx, Ex
VDD1
VDD2
2.0
2.0
2.9
2.9
mA
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Parameter Symbol Test Condition Min Typ Max Unit
Si8622Bx, Ex
VDD1
VDD2
3.5
4.2
5.2
6.3
mA
100 Mbps Supply Current (All Inputs = 50 MHz Square Wave, CL = 15 pF on All Outputs)
Si8610Bx, Ex
VDD1
VDD2
1.2
2.7
2.0
4.4
mA
Si8620Bx, Ex
VDD1
VDD2
2.1
5.1
3.1
7.1
mA
Si8621Bx, Ex
VDD1
VDD2
3.7
3.7
5.2
5.2
mA
Si8622Bx, Ex
VDD1
VDD2
5.2
6.0
7.3
8.4
mA
Timing Characteristics
Si861x/2x Bx, Ex
Data Rate 0 150 Mbps
Minimum Pulse Width 5.0 ns
Propagation Delay tPHL, tPLH See Figure 4.1 Propa-
gation Delay Timing on
page 15
5.0 8.0 14 ns
Pulse Width Distortion
|tPLH – tPHL| PWD
See Figure 4.1 Propa-
gation Delay Timing on
page 15
0.2 5.0 ns
Propagation Delay Skew3tPSK(P-P) 2.0 5.0 ns
Channel-Channel Skew tPSK 0.4 2.5 ns
All Models
Output Rise Time tr
CL = 15 pF
See Figure 4.1 Propa-
gation Delay Timing on
page 15
2.5 4.0 ns
Output Fall Time tf
CL = 15 pF
See Figure 4.1 Propa-
gation Delay Timing on
page 15
2.5 4.0 ns
Peak Eye Diagram Jitter tJIT(PK) See Figure 2.3 Eye Di-
agram on page 6
350 — ps
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Parameter Symbol Test Condition Min Typ Max Unit
Common Mode Transient Immunity
Si86xxxB/C/D
Si86xxxT
CMTI
VI = VDD or 0 V
VCM = 1500 V
See Figure 4.2 Com-
mon-Mode Transient
Immunity Test Circuit
on page 15
35
60
50
100
kV/µs
Start-up Time4tSU 15 40 µs
Note:
1. VDD1 = 2.5 V ±5%; VDD2 = 2.5 V ±5%, TA = –40 to 125 °C
2. The nominal output impedance of an isolator driver channel is approximately 50 Ω, ±40%, which is a combination of the value of
the on-chip series termination resistor and channel resistance of the output driver FET. When driving loads where transmission
line effects will be a factor, output pins should be appropriately terminated with controlled-impedance PCB traces.
3. tPSK(P-P) is the magnitude of the difference in propagation delay times measured between different units operating at the same
supply voltages, load, and ambient temperature.
4. Start-up time is the time period from the application of power to the appearance of valid data at the output.
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Table 4.5. Regulatory Information1, 2, 3, 4
For All Product Options Except Si86xxxT
CSA
The Si861x/2x is certified under CSA. For more details, see Master Contract File 232873.
60950-1, 62368-1: Up to 600 VRMS reinforced insulation working voltage; up to 1000 VRMS basic insulation working voltage.
60601-1: Up to 125 VRMS reinforced insulation working voltage; up to 380 VRMS basic insulation working voltage.
VDE
The Si861x/2x is certified according to VDD 0884-10. For more details, see File 5006301-4880-0001.
VDD 0884-10: Up to 1200 Vpeak for basic insulation working voltage.
60950-1, 62368-1: Up to 600 VRMS reinforced insulation working voltage; up to 1000 VRMS basic insulation working voltage.
UL
The Si861x/2x is certified under UL1577 component recognition program. For more details, see File E257455.
Rated up to 5000 VRMS isolation voltage for basic protection.
CQC
The Si861x/2x is certified under GB4943.1-2011. For more details, see certificates CQC13001096110 and CQC13001096239.
Rated up to 600 VRMS reinforced insulation working voltage; up to 1000 VRMS basic insulation working voltage.
For All Si86xxxT Product Options
CSA
Certified under CSA. For more details, see Master Contract File 232873.
60950-1, 62368-1: Up to 600 VRMS reinforced insulation working voltage; up to 1000 VRMS basic insulation working voltage.
VDE
Certified according to VDE 0884-10.
UL
Certified under UL1577 component recognition program. For more details, see File E257455.
Rated up to 5000 VRMS isolation voltage for basic protection.
CQC
Certified under GB4943.1-2011.
Rated up to 600 VRMS reinforced insulation working voltage; up to 1000 VRMS basic insulation working voltage.
Note:
1. Regulatory Certifications apply to 2.5 kVRMS rated devices, which are production tested to 3.0 kVRMS for 1 s.
2. Regulatory Certifications apply to 3.75 kVRMS rated devices, which are production tested to 4.5 kVRMS for 1 s.
3. Regulatory Certifications apply to 5.0 kVRMS rated devices, which are production tested to 6.0 kVRMS for 1 s.
4. For more information, see 1. Ordering Guide.
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Table 4.6. Insulation and Safety-Related Specifications
Parameter Symbol Test Condi-
tion
Value Unit
WB SOIC-16 SOIC-8 DFN-8
Nominal External Air Gap (Clear-
ance)1
CLR 8.0 4.9 3.4 mm
Nominal External Tracking (Cree-
page)1
CPG 8.0 4.01 3.4 mm
Minimum Internal Gap
(Internal Clearance)
DTI 0.014 0.014 0.014 mm
Tracking Resistance PTI or CTI IEC60112 600 600 600 VRMS
Erosion Depth ED 0.019 0.019
0.051
mm
0.087
Resistance (Input-Output)2RIO 1012 1012 1012 W
Capacitance (Input-Output)2CIO f = 1 MHz 2.0 2.0 2.0 pF
Input Capacitance3CI4.0 4.0 4.0 pF
Note:
1. The values in this table correspond to the nominal creepage and clearance values. VDE certifies the clearance and creepage
limits as 4.7 mm minimum for the SOIC-8 package and 8.5 mm minimum for the WB SOIC-16 package. UL does not impose a
clearance and creepage minimum for component-level certifications. CSA certifies the clearance and creepage limits as 3.9 mm
minimum for the SOIC-8 and 7.6 mm minimum for the WB SOIC-16 package.
2. To determine resistance and capacitance, the Si86xx is converted into a 2-terminal device. All pins on the side 1 are shorted
together to form the first terminal, the same is done with side 2 to form the second terminal. The parameters are then measured
between these two terminals.
3. Measured from input pin to ground.
Table 4.7. IEC 60664-1 Ratings
Parameter Test Conditions Specification
WB SOIC-16 SOIC-8 DFN-8
Basic Isolation Group Material Group I I I
Installation Classification Rated Mains Voltages < 150 VRMS I-IV I-IV I-IV
Rated Mains Voltages < 300 VRMS I-IV I-III I-III
Rated Mains Voltages < 400 VRMS I-III I-II I-II
Rated Mains Voltages < 600 VRMS I-III I-II I-II
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Table 4.8. VDE 0884-10 Insulation Characteristics1
Parameter Symbol Test Condition Characteristic Unit
WB SOIC-16 SOIC-8
Maximum Working
Insulation Voltage
VIORM 1200 630 Vpeak
Input to Output Test
Voltage
VPR Method b1
(VIORM x 1.875 = VPR, 100%
Production Test, tm = 1 sec,
Partial Discharge < 5 pC)
2250 1182 Vpeak
Transient Overvolt-
age
VIOTM t = 60 sec 6000 6000 Vpeak
Surge Voltage VIOSM
Tested per IEC 60065 with surge voltage of 1.2 µs/50 µs
Si86xxxT tested with magnitude 6250 V x 1.6 = 10 kV
Si86xxxB/C/D tested with 4000 V
6250
4000
4000
Vpeak
Pollution Degree
(DIN VDE 0110, Ta-
ble 1)
2 2
Insulation Resist-
ance at TS, VIO =
500 V
RS>109>109Ω
Note:
1. Maintenance of the safety data is ensured by protective circuits. The Si86xxxx provides a climate classification of 40/125/21.
2. The DFN-8 package is not certified to VDE 0884-10 and hence cannot be listed under this table. Refer to Table 4.5, CSA section
for working voltage specifications.
Table 4.9. IEC Safety Limiting Values1
Parameter Symbol Test Condition Max Unit
WB SOIC-16 SOIC-8
Safety Temperature TS150 150 °C
Safety Input Current ISθJA = 140 °C/W (SOIC-8)
100 °C/W (WB SOIC-16)
VI = 5.5 V, TJ = 150 °C, TA = 25 °C
220 160 mA
Device Power Dissipation2PD150 150 mW
Note:
1. Maximum value allowed in the event of a failure; also see the thermal derating curve in Figure 4.3 (WB SOIC-16) Thermal
Derating Curve for Safety Limiting Current on page 26 and Figure 4.4 (SOIC-8) Thermal Derating Curve for Safety Limiting
Current on page 26.
2. The Si86xx is tested with VDD1 = VDD2 = 5.5 V; TJ = 150 ºC; CL = 15 pF, input a 150 Mbps 50% duty cycle square wave.
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. I . gm = 2.5V _,__________ Vum. V 460 375 Egg-mm— 0 O 5 2,5 mmam> meningfimm 0 200 Case Temperature (°C) 25V mm2m> m:_u_E_._é£mm 200 150 Case Temperature (”C)
Table 4.10. Thermal Characteristics
Parameter Symbol WB SOIC-16 SOIC-8 DFN-8 Unit
IC Junction-to-Air Thermal Resist-
ance
θJA 100 140 94 °C/W
Figure 4.3. (WB SOIC-16) Thermal Derating Curve for Safety Limiting Current
Figure 4.4. (SOIC-8) Thermal Derating Curve for Safety Limiting Current
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Table 4.11. Absolute Maximum Ratings1
Parameter Symbol Min Max Unit
Storage Temperature2TSTG –65 150 °C
Operating Temperature TA–40 125 °C
Junction Temperature TJ 150 °C
Supply Voltage VDD1, VDD2 –0.5 7.0 V
Input Voltage VI–0.5 VDD + 0.5 V
Output Voltage VO–0.5 VDD + 0.5 V
Output Current Drive Channel IO 10 mA
Lead Solder Temperature (10 s) 260 °C
Maximum Isolation (Input to Output) (1 sec)
SOIC-8 & DFN-8
4500 VRMS
Maximum Isolation (Input to Output) (1 sec)
WB SOIC-16
6500 VRMS
Note:
1. Permanent device damage may occur if the absolute maximum ratings are exceeded. Functional operation should be restricted
to conditions as specified in the operational sections of this data sheet. Exposure to absolute maximum ratings for exteneded
periods may degrade performance.
2. VDE certifies storage temperature from –40 to 150 °C.
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5. Pin Descriptions (WB SOIC-16)
GND1
NC
NC
A1
VDD1
GND2
B1
NC
NC
GND2
I
s
o
l
a
t
i
o
n
RF
XMITR
RF
RCVR
NC
GND1
NC
NC
VDD2
NC
Si8610 WB SOIC-16
GND1
A2
NC
A1
VDD1
GND2
B1
NC
B2
GND2
I
s
o
l
a
t
i
o
n
RF
XMITR
RF
RCVR
RF
XMITR
RF
RCVR
NC
GND1
NC
NC
VDD2
NC
Si8620 WB SOIC-16
GND1
A2
NC
A1
VDD1
GND2
B1
NC
B2
GND2
I
s
o
l
a
t
i
o
n
RF
XMITR
RF
RCVR
RF
XMITR
RF
RCVR
NC
GND1
NC
NC
VDD2
NC
Si8621 WB SOIC-16
GND1
A2
NC
A1
VDD1
GND2
B1
NC
B2
GND2
I
s
o
l
a
t
i
o
n
RF
XMITR
RF
RCVR
RF
XMITR
RF
RCVR
NC
GND1
NC
NC
VDD2
NC
Si8622 WB SOIC-16
Name WB SOIC-16 Pin#
Si8610
WB SOIC-16 Pin#
Si862x
Type Description
GND1 1 1 Ground Side 1 ground.
NC12, 5, 6, 8,10,
11, 12, 15
2, 6, 8,10,
11, 15
No Connect NC
VDD1 3 3 Supply Side 1 power supply.
A1 4 4 Digital I/O Side 1 digital input or output.
A2 NC 5 Digital I/O Side 1 digital input or output.
GND1 7 7 Ground Side 1 ground.
GND2 9 9 Ground Side 2 ground.
B2 NC 12 Digital I/O Side 2 digital input or output.
B1 13 13 Digital I/O Side 2 digital input or output.
VDD2 14 14 Supply Side 2 power supply.
GND2 16 16 Ground Side 2 ground.
Note:
1. No Connect. These pins are not internally connected. They can be left floating, tied to VDD, or tied to GND.
Si861x/2x Data Sheet • Pin Descriptions (WB SOIC-16)
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n
6. Pin Descriptions (SOIC-8)
I
s
o
l
a
t
i
o
n
VDD1 VDD2
A1 RF
XMITR
B1
RF
RCVR
GND1 GND2
Si8610 SOIC-8
VDD1/NC
GND2/NC
I
s
o
l
a
t
i
o
n
VDD1 VDD2
A1 B1
RF
XMITR
RF
RCVR
A2 B2
RF
XMITR
RF
RCVR
GND1 GND2
Si8620 SOIC-8
I
s
o
l
a
t
i
o
n
VDD1 VDD2
A1 B1
RF
XMITR
RF
RCVR
A2 B2
RF
XMITR
RF
RCVR
GND1 GND2
Si8621 SOIC-8
I
s
o
l
a
t
i
o
n
VDD1 VDD2
A1 B1
RF
XMITR
RF
RCVR
A2 B2
RF
XMITR
RF
RCVR
GND1 GND2
Si8622 SOIC-8
Name SOIC-8 Pin#
Si861x
SOIC-8 Pin#
Si862x
Type Description
VDD1/NC11, 3 1 Supply Side 1 power supply.
GND1 4 4 Ground Side 1 ground.
A1 2 2 Digital I/O Side 1 digital input or output.
A2 NA 3 Digital I/O Side 1 digital input or output.
B1 6 7 Digital I/O Side 2 digital input or output.
B2 NA 6 Digital I/O Side 2 digital input or output.
VDD2 8 8 Supply Side 2 power supply.
GND2/NC15.7 5 Ground Side 2 ground.
Note:
1. No connect. These pins are not internally connected. They can be left floating, tied to VDD, or tied to GND.
Si861x/2x Data Sheet • Pin Descriptions (SOIC-8)
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7. Pin Descriptions (DFN-8)
4
3
2
1
Si8610 DFN-8
VDD1
VDD1/NC
A1
GND1 5
6
7
8VDD2
GND2
GND2/NC
B1
RF
XMTR
I
s
o
l
a
t
i
o
n
RF
RCVR
4
3
2
1
Si8620 DFN-8
VDD1
A2
A1
GND1 5
6
7
8VDD2
GND2
B1
B2
I
s
o
l
a
t
i
o
n
RF
XMTR
RF
XMTR
RF
RCVR
RF
RCVR
4
3
2
1
Si8621 DFN-8
VDD1
A2
A1
GND1 5
6
7
8VDD2
GND2
B1
B2
I
s
o
l
a
t
i
o
n
RF
XMTR
RF
RCVR
RF
XMTR
RF
RCVR
4
3
2
1
Si8622 DFN-8
VDD1
A2
A1
GND1 5
6
7
8VDD2
GND2
B1
B2
I
s
o
l
a
t
i
o
n
RF
XMTR
RF
RCVR
RF
XMTR
RF
RCVR
Name DFN-8 Pin#
Si861x
DFN-8 Pin#
Si862x
Type Description
VDD1/NC11, 3 1 Supply Side 1 power supply.
GND1 4 4 Ground Side 1 ground.
A1 2 2 Digital I/O Side 1 digital input or output.
A2 NA 3 Digital I/O Side 1 digital input or output.
B1 6 7 Digital I/O Side 2 digital input or output.
B2 NA 6 Digital I/O Side 2 digital input or output.
VDD2 8 8 Supply Side 2 power supply.
GND2/NC15.7 5 Ground Side 2 ground.
Note:
1. No connect. These pins are not internally connected. They can be left floating, tied to VDD, or tied to GND.
Si861x/2x Data Sheet • Pin Descriptions (DFN-8)
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SEATING PLANE h \ Q L if SEE VIEW 'A’d‘
8. Package Outline: WB SOIC-16
The figure below illustrates the package details for the Triple-Channel Digital Isolator. The table lists the values for the dimensions
shown in the illustration.
Figure 8.1. WB SOIC-16
Si861x/2x Data Sheet • Package Outline: WB SOIC-16
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Table 8.1. WB SOIC-16 Package Diagram Dimensions1, 2, 3, 4
Dimension Min Max
A — 2.65
A1 0.10 0.30
A2 2.05
b 0.31 0.51
c 0.20 0.33
D 10.30 BSC
E 10.30 BSC
E1 7.50 BSC
e 1.27 BSC
L 0.40 1.27
h 0.25 0.75
θ 0° 8°
aaa — 0.10
bbb — 0.33
ccc — 0.10
ddd — 0.25
eee — 0.10
fff — 0.20
Note:
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing per ANSI Y14.5M-1994.
3. This drawing conforms to JEDEC Outline MS-013, Variation AA.
4. Recommended reflow profile per JEDEC J-STD-020 specification for small body, lead-free components.
Si861x/2x Data Sheet • Package Outline: WB SOIC-16
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9. Land Pattern: WB SOIC-16
The figure below illustrates the recommended land pattern details for the Si861x/2x in a WB SOIC-16 package. The table lists the
values for the dimensions shown in the illustration.
Figure 9.1. PCB Land Pattern: WB SOIC-16
Table 9.1. WB SOIC-16 Land Pattern Dimensions1, 2
Dimension Feature (mm)
C1 Pad Column Spacing 9.40
E Pad Row Pitch 1.27
X1 Pad Width 0.60
Y1 Pad Length 1.90
Note:
1. This Land Pattern Design is based on IPC-7351 pattern SOIC127P1032X265-16AN for Density Level B (Median Land Protru-
sion).
2. All feature sizes shown are at Maximum Material Condition (MMC) and a card fabrication tolerance of 0.05 mm is assumed.
Si861x/2x Data Sheet • Land Pattern: WB SOIC-16
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PM ‘ momma H PART‘NG UNE % A , Lab DETAH. A TOF> V‘EW mum-mag EB“ 775* ‘2 “Hf c ELEEEEM’LJ , 4; \ QJD 54» A1 55mm: PLANE S‘DE V‘EW SEE nEmL A END V‘EW
10. Package Outline: SOIC-8
The figure below illustrates the package details for the Si86xx. The table lists the values for the dimensions shown in the illustration.
α
Figure 10.1. SOIC-8 Package
Table 10.1. SOIC-8 Package Diagram Dimensions
Symbol Millimeters
Min Max
A 1.35 1.75
A1 0.10 0.25
A2 1.40 REF 1.55 REF
B 0.33 0.51
C 0.19 0.25
D 4.80 5.00
E 3.80 4.00
e 1.27 BSC
H 5.80 6.20
h 0.25 0.50
L 0.40 1.27
m 0° 8°
Si861x/2x Data Sheet • Package Outline: SOIC-8
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15 £33 X1
11. Land Pattern: SOIC-8
The figure below illustrates the recommended land pattern details for the Si86xx in a SOIC-8. The table lists the values for the
dimensions shown in the illustration.
Figure 11.1. PCB Land Pattern: SOIC-8
Table 11.1. SOIC-8 Land Pattern Dimensions1, 2
Dimension Feature (mm)
C1 Pad Column Spacing 5.40
E Pad Row Pitch 1.27
X1 Pad Width 0.60
Y1 Pad Length 1.55
Note:
1. This Land Pattern Design is based on IPC-7351 pattern SOIC127P600X173-8N for Density Level B (Median Land Protrusion).
2. All feature sizes shown are at Maximum Material Condition (MMC) and a card fabrication tolerance of 0.05 mm is assumed.
Si861x/2x Data Sheet • Land Pattern: SOIC-8
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9’ a 30 r, w a E—h E W ‘6) e = Eiw‘m I—i— ‘JL El _- L‘s“ I]— A!
12. Package Outline: DFN-8
Figure 12.1. DFN-8 Package Outline
Dimension MIN NOM MAX
A 0.80 0.85 0.90
A1 0 -- 0.05
b 0.25 0.30 0.35
D 4.90 5.00 5.10
e 0.65 BSC
E 3.90 4.00 4.10
E1 3.80 REF
L 0.45 0.50 0.55
L1 0.05 0.10 0.15
bbb -- -- 0.10
ccc -- -- 0.08
ddd -- -- 0.10
Note:
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing per ANSI Y14.5M-1994.
Si861x/2x Data Sheet • Package Outline: DFN-8
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13. Land Pattern: DFN-8
Figure 13.1. PCB Land Pattern: DFN-8
Table 13.1. DFN-8 Land Pattern Dimensions
Dimension mm
C1 4.30
E 0.65
X1 0.65
Y1 0.40
Note:
General
1. All dimensions shown are in millimeters (mm).
2. This Land Pattern Design is based on the IPC-7351 guidelines.
3. All dimensions shown are at Maximum Material Condition (MMC). Least Material Condition (LMC) is calculated based on a
Fabrication Allowance of 0.05 mm.
Solder Mask Design
1. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad is to be 60 mm
minimum, all the way around the pad.
Stencil Design
1. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release.
2. The stencil thickness should be 0.125 mm (5 mils).
3. The ratio of stencil aperture to land pad size should be 1:1.
Card Assembly
1. A No-Clean, Type-3 solder paste is recommended.
2. The recommended card reflow profile is per the JEDEC/IPC J-STD-020D specification for Small Body Components.
Si861x/2x Data Sheet • Land Pattern: DFN-8
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Si86X WRT
14. Top Marking: WB SOIC-16
Si86XYSV
YYWWRTTTTT
CC
e4
Figure 14.1. WB SOIC-16 Top Marking
Table 14.1. WB SOIC-16 Top Marking Explanation
Line 1 Marking: Base Part Number
Ordering Options
(See Ordering Guide for more
information.)
Si86 = Isolator product series
X = # of data channels (2, 1)
Y = # of reverse channels (2, 1, 0)1
S = Speed Grade (max data rate) and operating mode:
B = 150 Mbps (default output = low)
E = 150 Mbps (default output = high)
V = Insulation rating
B = 2.5 kV; C = 3.75 kV; D = 5.0 kV; T = 5.0 kV with 10 kV surge
capability.
Line 2 Marking: YY = Year
WW = Workweek
Assigned by assembly subcontractor. Corresponds to the year
and workweek of the mold date.
RTTTTT = Mfg Code Manufacturing code from assembly house
“R” indicates revision
Line 3 Marking: Circle = 1.7 mm Diameter
(Center-Justified)
“e4” Pb-Free Symbol
Country of Origin ISO Code Ab-
breviation
CC = Country of Origin ISO Code Abbreviation
TW = Taiwan
TH = Thailand
Note:
1. The Si8622 has 1 forward and 1 reverse channel, but directionality is reversed compared to the Si8621, as shown in 5. Pin
Descriptions (WB SOIC-16) and 6. Pin Descriptions (SOIC-8)
Si861x/2x Data Sheet • Top Marking: WB SOIC-16
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i86X YW
15. Top Marking: SOIC-8
Si86XYSV
YYWWRT
TTTT
e3
Figure 15.1. SOIC-8 Top Marking
Table 15.1. SOIC-8 Top Marking Explanation
Line 1 Marking: Base Part Number
Ordering Options
(See Ordering Guide for more information).
Si86 = Isolator Product Series
XY = Channel Configuration
S = Speed Grade (max data rate)
V = Insulation rating
Line 2 Marking: YY = Year
WW = Workweek
Assigned by assembly subcontractor. Corresponds to the
year and workweek of the mold date.
R = Product (OPN) Revision
T = First character of the manufacturing code
First two characters of the manufacturing code from As-
sembly.
Line 3 Marking: Circle = 1.1 mm Diameter “e3” Pb-Free Symbol.
TTTT = Last four characters of the manufacturing
code
Last four characters of the manufacturing code.
Note:
1. The Si8622 has 1 forward and 1 reverse channel, but directionality is reversed compared to the Si8621, as shown in 5. Pin
Descriptions (WB SOIC-16) and 6. Pin Descriptions (SOIC-8)
Si861x/2x Data Sheet • Top Marking: SOIC-8
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16. Top Marking: DFN-8
S i 8 6 X Y
S V
T T T T T T
Y Y W W
Figure 16.1. DFN-8 Top Marking
Line 1 Marking Base Part Number
Ordering Options
(See Ordering Guide for more information).
Si86 = Isolator Product Series
XY = Channel Configuration
Line 2 Marking Ordering Options S = Default High or Low Option
V = Insulation Rating
Line 3 Marking Manufacturing code
Line 4 Marking YY = Year
WW = Workweek
Assigned by assembly subcontractor. Corresponds to the year and
workweek of the mold date.
Note: The Si8622 has 1 forward and 1 reverse channel, but directionality is reversed as compared to Si8621, as shown in Pin
Descriptions sections.
Si861x/2x Data Sheet • Top Marking: DFN-8
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17. Revision History
Revision 1.76
December 2020
Added DFN-8 package option
Corrected typos in VT+, VT- and VHYS (HYS is subscript) values in Table 4.4
Standardized package designations across document
Revision 1.75
September 2019
Updated the Ordering Guide.
Revision 1.74
October 2018
Updated the Ordering Guide for Automotive-Grade OPN options.
Revision 1.73
May 2018
Updated the Ordering Guide for Automotive-Grade OPN options.
Revision 1.72
April 2018
Added Si8610ED-AS to Ordering Guide for Automotive-Grade OPN options.
Revision 1.71
Added new table to Ordering Guide for Automotive-Grade OPN options.
Revision 1.7
Added following note to 1. Ordering Guide: "An 'R' at the end of the part number denotes tape and reel packaging option."
Revision 1.6
Added product options Si862xxT in 1. Ordering Guide.
Added spec line items for Input Leakage Current pertaining to Si862xxT in 4. Electrical Specifications.
Updated IEC 60747-5-2 to IEC 60747-5-5 in all instances in document.
Revision 1.5
Updated Table 5 on page 17.
Added CQC certificate numbers.
Updated "5. Ordering Guide" on page 11.
Removed references to moisture sensitivity levels.
Removed Note 2.
Revision 1.4
Added Figure 2, “Common Mode Transient Immunity Test Circuit,” on page 8.
Added references to CQC throughout.
Added references to 2.5 kVRMS devices throughout.
Updated "5. Ordering Guide" on page 11.
Updated "10.1. WB SOIC-16 Top Marking" on page 18.
Si861x/2x Data Sheet • Revision History
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Revision 1.3
Updated Table 11 on page 21.
Added junction temperature spec.
Updated "2.3.1. Supply Bypass" on page 6.
Removed “3.3.2. Pin Connections” on page 22.
Updated "5. Ordering Guide" on page 11.
Removed Rev A devices.
Updated "6. Package Outline: WB SOIC-16" on page 13.
Updated Top Marks.
Added revision description.
Revision 1.2
Updated Table 1 on page 4.
Deleted reference to EN.
Updated "5. Ordering Guide" on page 11 to include MSL2A.
Revision 1.1
Updated High Level Output Voltage VOH to 3.1 V in Table 3, “Electrical Characteristics,” on page 9.
Updated High Level Output Voltage VOH to 2.3 V in Table 4, “Electrical Characteristics,” on page 13.
Revision 1.0
Updated “Table 3. Electrical Characteristics”.
Reordered spec tables to conform to new convention.
Removed “pending” throughout document.
Revision 0.3
Added chip graphics on page 1.
Updated Table 6, “Insulation and Safety-Related Specifications,” on page 18.
Updated Table 8, “IEC 60747-5-5 Insulation Characteristics for Si86xxxx*,” on page 19.
Updated "3. Pin Descriptions (WB SOIC-16)" on page 9.
Updated "4. Pin Descriptions (SOIC-8)" on page 10.
Updated "5. Ordering Guide" on page 11.
Revision 0.2
Added chip graphics on page 1.
Moved Tables 1 and 11 to page 21.
Updated Table 6, “Insulation and Safety-Related Specifications,” on page 18.
Updated Table 8, “IEC 60747-5-5 Insulation Characteristics for Si86xxxx*,” on page 19.
Moved Table 1 to page 4.
Moved “Typical Performance Characteristics” to page 7.
Updated "3. Pin Descriptions (WB SOIC-16)" on page 9.
Updated "4. Pin Descriptions (SOIC-8)" on page 10.
Updated "5. Ordering Guide" on page 11.
Si861x/2x Data Sheet • Revision History
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EEI'IDG
Copyright © 2021 Skyworks Solutions, Inc. All Rights Reserved.
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