3.7 Multiple Connector Prod Spec Datasheet by Molex

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A ‘ molex v <§> 3.7 MULTIPLE CONNECTOR
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TITLE: 3.7 MULTIPLE CONNECTOR SERIES
製品仕様書
A
新規作成
RELEASED
ECN No. J2010-0155
2009/7/24 H.KOBAYASHI
THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO
MOLEX INC. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
REV.
DESCRIPTION
DESIGN CONTROL
J
STATUS
WRITTEN BY:
H.KOBAYASHI
CHECKED BY:
S.SATO
APPROVED BY:
N.UKITA
DATE : YR/MO/DAY
2009/ 7/24
DOCUMENT NUMBER
PS-503471-001
FILE NAME
PS503471001.doc
SHEET
1 OF 15
EN-37(019)
PRODUCT SPECIFICATION
1.適用範囲 SCOPE
本仕様書は、 殿 に納入す
3.7 MULTIPLE CONNECTOR について規定する。
This specification covers the 3.7 MULTIPLE CONNECTOR series.
2.製品名称及び型番 PRODUCT NAME AND PART NUMBER
Product Name
Part Number
リセプタクルハウジングアッセンブリ
Receptacle Housing Assembly
503471-0209
プラグハウジングアッセンブリ
Plug Housing Assembly
503469-0209
503471-0209ーピング梱包
Embossed Tape Package for 503471-0209
503471-0200
503469-0209テーピング梱包品
Embossed Tape Package for 503469-0209
503469-0200
リセプタクル短絡ハウジングアッセンブリ
Receptacle Short Housing Assembly
503474-0200
プラグ圧着ハウジング
Plug Crimp Housing
503473-0200
プラグ圧着ターミナル
Plug Crimp Terminal
503485-0000
製品形状及び寸法については弊社製品図面を参照願います。
Please refer to MX drawing for detailed dimensions and shape.
molex‘ molex‘ C C 4 — 1 .i’fifi‘flflfifi Electrical periormance
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TITLE: 3.7 MULTIPLE CONNECTOR SERIES
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EN-37-1(019)
PRODUCT SPECIFICATION
【3.定格 RATINGS
Item
Standard
最大許容電圧
Rated Voltage (MAX.)
500 V
[ AC (実効値 rms) / DC ]
被覆外径:φ0.93~φ1.14mm
Insulation O.D.
最大許容電流 及び 用電線
Rated Current ( MAX. ) and
Applicable wires
AWG#26
2 A
AWG#28
2 A
使用温度範囲*2
Ambient Temperature Range
-40°C+ 85°C*1
低温において氷結しないこと
Not freeze to low temperature
製品保存温湿度範囲
Storage Temperature Range
of Connector
温度:-40℃~+80℃、相対湿度:85%以
Temperature : -40℃~+80℃、Percentage Humidity : 85% MAX.
梱包保管
Storage of Package
温湿度条件
Temperature and
Humidity Condition
温度 Temperature : -10℃~+40
相対湿度 Percentage Humidity : 70% MAX.
期間
Term
1
1 Year
*1 : 電による温度上昇分も含む。
This includes the terminal temperature rise generated by conducting electricity.
*2 : 合電線(ケーブル等)も本使用温度範囲を満足すること
Applicable wire (cables) must also meet the specified temperature range.
【4.性能 PERFORMANCE
4-1.電気的性能 Electrical performance
Item
Test Condition
Requirement
4-1-1
Contact
Resistance
コネクタを嵌合させ、開放電圧 20mV以下、
短絡電流 10mA にて測定する。
(JIS C5402 5.4)
Mate connectors and measured by dry circuit,
20mV MAX., 10mA.
(JIS C5402 5.4)
40 milliohms MAX.
4-1-2
Insulation
Resistance
コネクタを嵌合させ、隣接するターミナル間に、
DC 500V1分間印加し測定する。
(JIS C5402 5.2/MIL-STD-202 試験法 302)
Mate connectors and apply 500V DC for 1 minute
between adjacent terminal or ground.
(JIS C5402 5.2/MIL-STD-202 Method 302)
1000 Megohms MIN.
molex‘ molex‘ C C w
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EN-37-1(019)
PRODUCT SPECIFICATION
Item
Test Condition
Requirement
4-1-3
Dielectric
Strength
コネクタを嵌合させ、隣接するタ-ミナル間及び
タ-ミナル、アース間に、AC(rms) 1500V (実効)
1分間 印加する
(JIS C5402 5.1/MIL-STD-202 試験法 301)
Mate connectors and apply 1500V AC(rms) for 1
minute between adjacent terminal or ground.
(JIS C5402 5.1/MIL-STD-202 Method 301)
異状なきこと
No Breakdown
4-1-4
圧着部接触抵抗
Contact
Resistance
on Crimped
Portion
タ-ミナルに適合電線を圧着し、開放電圧20V
以下、短絡電流10mAにて測定する。
Crimp the applicable wire on to the terminal,
measure by dry circuit , 20mV MAX, 10mA.
5 milliohm MAX.
-2. 械的性 Mechanical Performance
Item
Test Condition
Requirement
4-2-1
挿入力及び抜去
Insertion and
Withdrawal Force
毎分25±3mm
挿入、抜去を行う。
Insert and withdrawal connectors At
the speed rate of 25±3mm/minute.
503471
503469
及び
503471
503473
挿入力
Insertion
14.7N{1.5kgf}
MAX.
抜去力
Withdrawal
0.4N{0.04kgf}
MIN.
503469
503474
挿入力
Insertion
19.6N{2.0kgf}
MAX.
抜去力
Withdrawal
4.9N{0.5kgf}
MIN.
4-2-2
ターミナル保持
Terminal
Retention Force
ハウジングに装着されたターミナル
毎分 25±3mm の速さで軸方向に引張る。
Apply axial pull out force at the speed rate of
25±3mm/minute on the rec. terminal assembled
in the rec. housing.
1.96N {0.2 kgf} MIN.
molex‘ C molex‘ C (Test sample have pin/termina‘.)
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PRODUCT SPECIFICATION
Item
Test Condition
Requirement
4-2-3
圧着部引張強度
Crimping
Pull out Force
圧着されたターミナルを治具に
固定し、電線を軸方向に毎分
25±3mm の速さで引張る。
(JIS C5402 6.8)
Fix the crimped terminal, apply axial
pull out force on the wire at the
speed rate of 25±3mm/minute.
(JIS C5402 6.8)
AWG#26
9.8 N { 1.0 kgf } MIN.
AWG#28
9.8 N { 1.0 kgf } MIN.
4-2-4
ターミナル挿入
(圧着端子)
Terminal Insertion
Force
(Crimp terminal)
圧着されたターミナルをハウジングに挿入する。
Insert the crimped terminal into the housing.
4.9 N { 0.5 kgf } MAX.
4-2-5
ターミナル保持
(圧着端子)
Terminal
Retention Force
(Crimp terminal)
圧着されたターミナルをハウジングに装着し、
電線を軸方向に毎分 25±3mm の速さで引張る。
Apply axial pull out force at the speed rate of
25±3mm/minute on the terminal assembled in
the housing.
6.9N {0.7 kgf} MIN.
4-2-6
ハウジングロック力
Housing Retention
Force
コネクタを嵌合させ、ロックを解除せずに
毎分25±3mm 速さで軸方向に引張る。
(試験サンプルは、端子装着状態とする。)
Mate connectors, apply axial pull out force at the
speed rate of 25±3mm /minute when it not
discharge lock.
(Test sample have pin/terminal.)
9.8 N { 1.0 kgf } MIN.
A‘ A‘ molex molex v C 4 — 3. % 0) 1th Environmental Performance and Others
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PRODUCT SPECIFICATION
-3. Environmental Performance and Others
Item
Test Condition
Requirement
4-3-1
寿
Repeated
Insertion /
Withdrawal
1分間 10 以下 の速さ
で、挿入、抜去を繰返す
When mated repeatedly
by the rate of 10 cycles
per minute.
挿抜回数:15
15 cycles
嵌合組み合わせ
Mate connector
503471503469
503471503473
Contact
Resistance
80 milliohms MAX.
挿抜回数:5
5 cycles
嵌合組み合わせ
Mate connector
503469503474
4-3-2
Temperature
Rise
コネクタを嵌合させ、最大許容電流を通電し、
コネクタの温度上昇分を測定する。(UL498)
Mate connector and measure the temperature
rise of contact when the maximum rated
current is passed.(UL 498)
Temperature
Rise
30 °C MAX.
4-3-3
Vibration
DC 1mA 通電状態にて嵌合軸を含む互いに垂
直な 3方向に 掃引割
105510 Hz/分、全振幅 1.52mm の振動を
2時間 加える。
(MIL-STD-202 試験法 201)
Mate connectors and subject to the following
vibration conditions, for a period of 2 hours in
each of 3 mutually perpendicular axes,
passing DC 1mA during the test.
Amplitude : 1.52mm P-P
Frequency : 10~55~10 Hz in 1 minute.
Duration : 2 hours in each X.Y.Z.axes.
(MIL-STD-202 Method 201)
Appearance
異状なきこと
No Damage
Contact
Resistance
80 milliohms MAX.
Discontinuity
1 microsecond
MAX.
molex‘ molex‘ C C
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EN-37-1(019)
PRODUCT SPECIFICATION
Item
Test Condition
Requirement
4-3-4
Mechanical
Shock
DC 1mA 通電状態にて、嵌合軸を含む互い
垂直な 6方向 490m/s { 50G }、作用時間
11msの衝撃を 3 加える
(JIS C60068-2-27/MIL-STD-202 験法 213)
Mate connectors and subject to the following
shock conditions. 3 shocks shall be applied
along 3 mutually perpendicular axes, passing
DC 1 mA current during the test.
(Total of 18 shocks)
Test pulse : Half Sine
Peak value : 490 m/s2 (50 G)
Duration : 11 ms
(JIS C60068-2-27/MIL-STD-202 Method 213)
Appearance
異状なきこと
No Damage
Contact
Resistance
80 milliohms MAX.
Discontinuity
1 microsecond
MAX.
4-3-5
Heat Resistance
コネクタを嵌合させ、85±2°C の雰囲気中に
96時間放置後取り出し、1時間室温に
放置する。
(JIS C60068-2-2/MIL-STD-202 試験法 108)
Mate connectors and expose to 85±2
For 96 hours. Upon completion of the
exposure period, the test specimens shall be
conditioned at ambient room conditions for
1 hour , after which the specified
measurement shall be performed.
(JIS C60068-2-2/MIL-STD-202 Method 108)
Appearance
異状なきこと
No Damage
Contact
Resistance
80 milliohms MAX
4-3-6
Cold Resistance
コネクタを嵌合させ、40±3°C の雰囲気中に
96時間 放置後取り出し1時間 室温に
放置する。(JIS C60068-2-1)
Mate connectors and expose to -40±3 for
96 hours. Upon completion of the exposure
period, the test specimens shall be
conditioned at ambient room conditions for 1
hour, after which the specified
measurements shall be performed.
(JIS C60068-2-1)
Appearance
異状なきこと
No Damage
Contact
Resistance
80 milliohms MAX.
molex‘ molex‘ C C
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PRODUCT SPECIFICATION
Item
Test Condition
Requirement
4-3-7
湿
Humidity
コネクタを嵌合させ、60±2°C 、相対湿度
90~95 の雰囲気中に 96時間 放置後
取り出し、1時間 室温に放置する。
(JIS C60068-2-3/MIL-STD-202 試験法 103)
Mate connectors and expose to 60±2,
relative humidity 90 to 95% for 96 hours.
Upon completion of the exposure period,
the test specimens shall be conditioned
at ambient room conditions for 1 to 2 hours,
after which the specified measurements shall
be performed.
(JIS C60068-2-3/MIL-STD-202 Method 103)
Appearance
異状なきこと
No Damage
Contact
Resistance
80 milliohms MAX.
Insulation
Resistance
4-1-2項満足のこと
Must meet 4-1-2
Dielectric
Strength
4-1-3項満足のこと
Must meet 4-1-3
4-3-8
温度サイクル
Temperature
Cycling
コネクタを嵌合させ、 40±3°C 30分、
+85±2 30 これを1イクルとし、
5サイクル 繰返す
但し、温度移行時間は 5分以内 とする
試験後12時間 室温に放置する。
(JIS C0025)
Mate connectors and subject to the following
conditions for 5 cycles. Upon completion of
the exposure period, the test specimens shall
be conditioned at ambient room conditions
for 1 to 2hours, after which the specified
measurements shall be performed.
5 cycles of :
a) 40±3°C 30 minutes
b) +85±2°C 30 minutes
(JIS C0025)
Appearance
異状なきこと
No Damage
Contact
Resistance
80 milliohms MAX.
molex‘ molex‘ C C
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EN-37-1(019)
PRODUCT SPECIFICATION
Item
Test Condition
Requirement
4-3-9
Salt Spray
コネクタを嵌合させ、35±2°Cにて5±1%重量比
の塩水を48±4間噴霧し、試験後常温で水洗
いした後、常温で乾燥させる
(JIS C60068-2-11/MIL-STD-202 試験法101)
Mate connectors and expose to the following
salt mist conditions. Upon completion of the
exposure period, salt deposits shall be
removed by a gentle wash or dip in running
water, after which the specified measurements
shall be performed.
NaCl solution
Concentration :5±1%
Spray time :48±4hours
Ambient temperature :35±2
(JIS C60068-2-11/MIL-STD-202 Method 101)
Appearance
著しいサビの
なきこと
No Damage
接触抵抗
Contact
Resistance
80 milliohms MAX.
4-3-10
耐亜硫酸ガス
SO2 Gas
コネクタを嵌合させ、40±2°Cにて
50±5ppm亜硫酸ガス中に24時間放置する。
Mated connectors and expose to the
conditions
of 50±5ppm SO2 gas ambient temperature
40±2 for 24 hours.
Appearance
異状なきこと
No Damage
Contact
Resistance
80 milliohms MAX.
4-3-11
半田付け性
Solderability
端子先端より0.2mm 、金具先端より0.2mm
位置まで、240±2°Cの半田に 3±0.5浸す
Soldering Time : 3±0.5 seconds
Solder Temperature : 240±2°C
0.2mm from terminal tip
0.2mm from fitting nail tip
濡れ性
Solder
Wetting
浸漬面積の
90%以上
90% of immersed
area must show no
voids, pinholes.
molex‘ molex‘ C C INFRARED REFLOW CONDITION 245:5 ) 2 MINIMlJM \\ 3040?) TEMPERATURE CONDITION GRAPH
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PRODUCT SPECIFICATION
Item
Test Condition
Requirement
4-3-12
半田耐熱性
Resistance to
Soldering Heat
<リフロー時>
赤外線リフロー条件
INFRARED REFLOW CONDITION
下部条件にてリフローを2回行う。
The reflow is passed twice.
245±5℃(ピーク温度
245±5 degree C (Peak temperature)
温度条件グラフ
TEMPERATURE CONDITION GRAPH
(リードはんだ付け部温度)
(TEMPERATURE ON SOLDER TAIL OF CONNECTOR)
注記本リフロー条件に関しては、リフロー装置及び基板等
により条件が異なりますので、事前にリフロー評価の確認を
お願いします。
NOTE: Please check the reflow soldering condition by your
own devices beforehand. Because the condition change by
the soldering devices, p.c.board, and so on.
Appearance
端子ガタ、割れ
異状なきこと
No Damage
<手半田時>
端子先端より0.2mm 、金具先端より0.2mm
位置まで、350±10 °Cの半田ゴテにて最大5秒間
加熱する。但し異常な加圧の無いこと。
Soldering Time : 5 seconds MAX.
Solder Temperature : 350±10°C
0.2mm from terminal tip
0.2mm from fitting nail tip
Without too much pressure to the terminal pin
and fitting nail.
( ) :参考規格 Reference Standard
{ } :考単位 Reference Unit
230 degree C
MINIMUM
30~60
230℃以上
90~120秒以上
(予熱150200℃)
(Preheat temperature : 150 200 degree C)
90~120 seconds
30~60seconds
molex‘ molex‘ C C
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PRODUCT SPECIFICATION
【5.外観形状・寸法・材質 PRODUCT SHAPE, DIMENSIONS, MATERIALS
図面参照 Refer to the drawing.
【6.環境指令への適合 COMPLIANCE WITH ENVIRONMENTAL DIRECTIVE
ELV及びRoHS適合品
ELV and RoHS compliant.
【7.使用上の注意事項 INSTRUCTION UPON USAGE
1. 本製品のプラスチック部に黒点等が確認される場合や色合いが異なる場合(経年変化によるハウジングの変色
を含む)がありますが、製品性能には影響ございません。
There is no influence in the product performance though the black spot etc. might be confirmed to
the plastic part of this product and the shade might be different (discoloration by secular distortion etc.).
2. 本製品は錫めっきを使用しているため、外観に摺動痕がつく場合が御座いますが、
製品性能に影響はありません
The wound of friction might adhere to externals because the tin plating is used for the tail and nail.
But there is no influence in the product performance.
3.梱包品の保管期限が過ぎた場合は外観、半田付け性を確認の上ご使用下さい。
Please use it after confirming externals and soldering when the storage limitation of the packing goods
passes.
4.本リフロー条件に関しては、温度プロファイル、半田ペースト、大気N2リフロー、基板などにより条件が
異なりますので事前に実装評価(リフロー評価) を必ず実施願います。実装条件によっては、製品性能に影響
を及ぼす場合があります。
Please investigate the mounting condition (reflow soldering condition) on your own devices beforehand. The
mounting conditions may change due to the soldering temperature, soldering paste, air reflow machine,
Nitrogen reflow machine, and the type of printed circuit board. The different mounting conditions may have
an influence on the product’s performance.
5.実装性能(平坦度)は、実装基板の反りの影響を含まないものと致します。板の反りはコネクタ両端部を基
準とし、コネクタ中央部にて Max0.02mmとして下さい
The mounting specification for coplanarity does not include the influence of warpage of the printed circuit
board. The warpage of the printed circuit board should be a maximum of 0.02mm if measuring from one
connector edge to the other.
6.本製品の一般性能確認はリジット基板にて実施おります。フレキシブル基板等の特殊な基板へ実装する場合は
事前に実装確認等を行った上でご使用願います。
The product performance was tested using rigid printed circuit board. In case the product needs to be
reflowed onto flexible circuit board, please conduct a reflow test on the flexible circuit board in advance.
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THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO
MOLEX INC. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
REV.
DESCRIPTION
DOCUMENT NUMBER
PS-503471-001
FILE NAME
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SHEET
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EN-37-1(019)
PRODUCT SPECIFICATION
7.本製品は端子先端部に、カット面がある為に端子先端部の実装性(基板への半田付け性)は、子側面・後側に
比べて悪くなります。しかし、側面及び後側においてフィレットが形成されていれば、機能及び強度に問題は
ありません.
Because this product has a cutoff area on the tip of the terminal, the solderability performance in this area is
not as good as compared to the side/back of the terminal. However, by building a good soldering fillet at the
side/back of the terminal, there will be no issue on either the product function or the printed circuit board
retention force.
8.半田実装部の未半田は、ターミナル脱落、ピン間ショート、ターミナル座屈、またコネクタの基板からの外れ
が懸念されます。従って全てのターミナルテール部及び、ネイル部に半田付けを行って下さい。
If you leave any soldering area on this product open, there may be the possibility of a missing terminal short
circuiting between pins, terminal buckling or the potential for the connector to come off of the printed circuit
board. Therefore, please solder all of the terminals and fitting nails on the printed circuit board.
9.本製品をご使用時に取り付けられた電線プリント基板の共振や、機器の回転構造や可動部分の動作によりコ
ネクタ嵌合部(接点部)が常に動いてしまう状態での御使用は避けて下さい。接触部の摺動磨耗等によ
触不良の原因となります。 従って、機器内で電線・プリント基板を固定し、共振を抑える等の処置をお願い
致します。
Please do not use the connector in a condition where the wire, the printed circuit board, or the contact area is
experiencing a sympathetic vibration of wires and printed circuit board, and constant movement of devices.
This may cause a defect in the contact due to the contact area being worn down. Therefore, please fix wires
and printed circuit board on the chassis, and reduces sympathetic vibration.
10.基板実装前後に端子、補強金具に触らないでください。
Please do not touch the terminals and fitting nails before ot after reflowing the connector onto the printed
circuit board.
11.コネクタ嵌合状態で基板の持ち運び等コネクタに負荷が掛かる作業は行わないようにしてください。コネクタ
破損等の原因となる場合が有ります
Please do not do work that the load hangs in the connector like the carrying of the substrate etc. with the
connector engages. There is a case where it causes the connector damage etc.
12.基板実装後に基板を直接積み重ねない様に注意してください。
Please do not stack the printed circuit board directly after mounted the connector on it.
13.コネクタは極力嵌合軸に沿って挿入抜去を行ってください。斜め挿抜はコネクタ破損等の原因になる場合が有
ります。
Please insert and withdraw the connector as much as possible along the engagement axis, or there is a case
where it causes the connector damage etc.
14.実装後において半田ごてによる手修正を行う際は、必ず仕様書掲載の条件以内で行って下さい。条件を超え
て実施した場合、端子の抜け、接点ギャップの変化、モールドの変形、溶融等、破損の原因になります。
When conducting manual repairs using a soldering iron, please follow the soldering conditions shown in the
product specification. If the conditions in the product spec are not followed, it may cause the terminals to
fall off, a change in the contact gap, a deformation of the housing, melting of the housing, and damage the
connector.
molex‘ molex‘ C C
LANGUAGE
JAPANESE
ENGLISH
REVISE ON PC ONLY
TITLE: 3.7 MULTIPLE CONNECTOR SERIES
製品仕様書
A
SEE SHEET 1 OF 15
THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO
MOLEX INC. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
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EN-37-1(019)
PRODUCT SPECIFICATION
15.半田こてによる手修正を行なう際、過度の半田やフラックスを使用しないで下さい。半田上がりやフラック
ス上がりにより接触、機能不良に至る場合があります。
When conducting manual repairs using a soldering iron, please do not use more solder and flux than
needed. This may cause solder wicking and flux wicking issues, and it will eventually cause a contact
defect and functional issues.
16.リフロー条件によっては、樹脂部の変色や端子めっき部にヨリが発生する場合がありますが、
製品性能に影響はございません。
Depending on the reflow conditions, there may be the possibility of a color change in the housing. However,
this color change does not have any effect on the products performance.
17.実装機によってコネクタに負荷が加わると変形、破損する場合がありますので事前にご確認下さい。
If there is accidental contact with the connector while it is going through the reflow machine,
there may be deformation or damage caused to the connector. Please check to prevent this.
18.コネクタのみで基板を支えることは避け、コネクタ以外での基板固定対策を行ってください。
Please do not use the connector alone to provide mechanical support for the printed circuit board (PCB).
Please ensure that there is a fixed structure on the phone chassis or other component support for the PCB.
19.嵌合後、コネクタピッチ方向、スパン方向及び回転方向への負荷がかかるような動作またはセットは
しないでください。コネクタ破壊やはんだクラックを引き起こします
After mated the connector, please do not allow the printed circuit boards to apply pressure on the connector in
either the pitch direction or the span direction.It may cause damage to the connector and may crack the
soldering.
20.本製品及び加工工程品(仕掛品)や加工品(ハーネス等)の梱包及び輸送・保管時にはコネクタに負荷が
加わらないようご注意下さい。変形、破損などの原因となり、コネクタの性能不良の原因となります。
Please try to prevent any external forces or shock from being applied to the connector while the cable assembly
is in process, when it is being packaged, or while it is in transportation. This may cause deformation and
damage to the connector and cause a defect in the products performance.
21.ハーネス加工品及びコネクタ嵌合後の電線の引き回しの際、引張りによる力が加わりますと、
接点部、結線部(圧着部)やロック部(端子ロック部)が損傷を受け、接触不良の原因となります。
電線の引回し配線をされる場合、コネクタに無理な外力が加わらないように、電線に緩みを持たせ、
余裕を持たせる処置をして下さい。
The cable assembly should not have a constant stress or pulling force applied on it when it is in the mated
condition. This phenomenon may damage the contact area or wiring area (crimping).
Therefore, when designing the wire positioning, please ensure that there is enough length of wire to avoid
stress on the connector.
22.コネクタに適用できる電線は、原則として錫メッキつき付軟銅撚り線です。
その他の電線の使用については別途ご確認下さい
The applicable wire for this connector, in principle, is tin-plated copper stranded wire.
Please consult us and evaluate it in advance when using other wires.
molex‘ molex‘ C C 50347370200 / 7" / m K ( 50348570000
LANGUAGE
JAPANESE
ENGLISH
REVISE ON PC ONLY
TITLE: 3.7 MULTIPLE CONNECTOR SERIES
製品仕様書
A
SEE SHEET 1 OF 15
THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO
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FILE NAME
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EN-37-1(019)
PRODUCT SPECIFICATION
23.プラグハウジング(503473-0200)に端子(503485-0000)を挿入する際、図1に示した正規の方向から
端子が突き当たるまで挿入して下さい。又、挿入後軽く電線を引張って端子が抜け出さないか確認下さい。
When inserting the terminal (503485-0000) into the receptacle housing (503473-0000),
please ensure that the terminal is inserted completely and touches the end of the receptacle housing. Please
insert the terminal in the correct direction as showing in figure 1. Also, please pull the wire lightly after
inserting the terminal to ensure that the terminal is fully inserted and can not be pulled out.
24.コネクタの嵌合を取り外す際は、必ずロックを解除して行って下さい。
電線はまとめて軽く掴み、指全体で確実にロックを解除し、取り出して下さい。
Please detach the connector lock before unmating the connector.
Please secure all the wires together softly, release the lock completely with a finger, and then unmate the
connector.
25.治具等を使用し、圧着端子を抜いた場合には、ランスが変形し強度が低下し端子を再装着後の
端子保持力が極端に低下します。そのため、圧着端子のリペアの際には新しいハウジング
必ず使用して下さい。
When extracting a crimp terminal from the housing using a jig, it may deform the housing lance and therefore
reduce the terminal retention force after re-inserting of the terminal. Therefore, please ensure to use a new
housing after repairing the crimp terminals.
26.本製品をご使用時には、1PIN当りの定格以上の電流を複数の回路に分岐しての使用は避けて下さい。
When using this product, please ensure that the specification for rated current per circuit is followed. Do not
allow the sum of the current used on several circuits to exceed the maximum allowable current.
PLUG CRIMP TERMINAL
503485-0000
<図2 端子装着状態>
503473-0200
PLUG CRIMP HOUSING
<図1 端子挿入方向>
A ‘ A ‘ molex molex V V on Il‘fiFafi u w 7 /\'7’/'>7
LANGUAGE
JAPANESE
ENGLISH
REVISE ON PC ONLY
TITLE: 3.7 MULTIPLE CONNECTOR SERIES
製品仕様書
A
SEE SHEET 1 OF 15
THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO
MOLEX INC. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
REV.
DESCRIPTION
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FILE NAME
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EN-37-1(019)
PRODUCT SPECIFICATION
27.活電状態の電気回路で、挿入、抜去ができることを前提に作られていません
スパーク等による危険の発生、性能不良につながりますので、活電状態での挿入、抜去はしないで下さい。
This product is not designed for the mating and unmating of the connectors to be performed under the condition
of an active electrical circuit. It may cause a spark and product defect if the connectors are mated and unmated
in this way.
28.ハーネス加工時及びハーネス品梱包時にハウジングとロックの隙間に電線が絡まない様に注意して下さい。
また、ハウジングとロックの隙間に電線が絡んだ場合には電線を無理矢理引張らないで下さい。ロックが変
形する場合が有ります。電線が絡んだ際にはロックに負荷が掛からない様注意して外してください。
Please note that the electric wire doesn't twine round the space of the lock with the housing when the
harness is processed and the harness goods are packed. Please do not hitch forcibly when the electric wire
twines round the space between the housing and the lock. There is a case where the lock is transformed.
Please remove externals where the load doesn't hang in the lock carefully when the electric wire twines.
隙間
ウジン
ック
A ‘ molex
LANGUAGE
JAPANESE
ENGLISH
REV.
REV. RECORD
DATE
EC NO.
WRITTEN:
CHK:
A
RELEASED
2009/7/24
J2010-0155
H.KOBAYASHI
S.SATO
REVISE ON PC ONLY
TITLE: 3.7 MULTIPLE CONNECTOR SERIES
製品仕様書
A
SEE SHEET 1 OF 15
THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO
MOLEX INC. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
REV.
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FILE NAME
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SHEET
15 OF 15
EN-37-1(019)
PRODUCT SPECIFICATION

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