0ZCK Series Datasheet by Bel Fuse Inc.

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o 9 till ““0 9 Surface Mount PTC OZCK Series ® OZCK Series -0805 Chip RoHS 6 Compliant & Halogen-Free Application Aii highrdensity boards Product Features 0005 Chip Size, Fast Trip Time, Low DCR Resistance Operating (Hold Current) Range 1UUrnA , 1A Maximum Voiiage 5 , 15V (per table) Temperature Range 40°C to 0500 Agency Approval TUV (Std. EN60735-1-1, Cert R5010211 7) UL Component (Std. UL1434. File E305051) UL Conditions or Acceptebiiity: 1 These deViCeS have been investigated far use in safety Circuits and are suitable as a liniiling deVice. 2. These deVices have been caiibraled to iimit the current to 8 amps within 5 seconds. per ANSI/NFPA 70. “National Electricai Oode" LEAD FREE : ® HALOGEN FREE : El Electrical Characteristics (23"0) Hold mp Rated Maximum Typical Max Time to Trip Resistance Tolerance Agency Approvals Part Number CUM“ Current Voltage Current Power Current Time Rmin 01 max A iii. A 1T. A vinax. Vdc linex. A Pd. w x Sec ohms chins 101: A 020K0010FE20 0.10 0 30 15 100 0.5 0.50 1.50 0,700 8.000 V v B 020K0020FF2G 0.20 0.50 9 100 0.5 0.00 0.02 0.400 3.500 Y Y C 020K0035FF2G 0.35 0 75 6 100 0.5 8.00 0.10 0.250 1.200 Y v 020K0050FF2E 0.50 1.00 6 100 0.5 3.00 0.10 0.150 0.050 V v NEWR 253itlt020K0050Al=2E 0.50 1.00 9 100 0.5 8.00 0.10 0.150 0.550 Y Y E 020K0075FF2E 0.75 1 50 6 40 0.6 8.00 0.20 0.090 0.350 Y v F 020K0100EE2E 1.00 1.95 6 40 0.0 3.00 0.30 0.030 0.210 V v IH Hold Currentemaxlmum current at which the device Will not trip in still air at 23°C. IT Trip currenteminirrlum current at which the device will always trip in still air at 2300. Imax Maximum lauit current device can withstand without damage at rated voltage (Vmax), Vmax Maximum voltage device can withstand without damage at its rated current. Pd Typicei power dissipated by device when in tripped state in 2300 stiii airenvironment. Rmirl Minimum device resistance at 230C. R1max Maximum device resistance at 23°C, 1 hour arter initial device trip, or arter being soldered to PCB in end appiication. POWER be' sow-House PROTECTION Bei Fuse irlc. 206 Van VDrsl Street 0 bei group Jersey City. NJ 07302 USA © 2016 Bei Fuse, irlc SDBCIliCaliens subiect to change withaut notice +1 201.432.0463 techhelp®beilsoni belfuse.com OZCK Nov20161 M
Surface Mount PTC OZCK Series -® OZCK Series -0805 Chip RoHS 6 Compliant 8t Halogen-Free PTC's — Basic Theory of Operation / ‘Tripped~ Resistance Explanation Fundamentally, a Bel PTC consists of a block of polymeric material containing conductive filler and bonded between two conductive, planar terminations, At currents below the device IHOLD rating, AND at temperatures below 1000, the PTC maintains a resistance value below its R1 MAX rating. As the device's temperature approaches 1300, either due to an increase in ambient temperature or a current exceeding its ITFlIP rating. volumetric expansion of the filled polymer breaks apart the majority of conductive pathways across the terminals:1 created by chain contact of adjacent filler particles or device resistance increases sharply by several orders of magnitu er At the much higher “Tripped” resistance, there is just enough leakage current to allow internal heating to “hold" the device in its tripped state (around 125C) until power is inlerrupted. Once power is removed, the PTC's core cools and contracts allowing conductive chains to reform and return the device to its low resistance state. The catalog data for each device specifies a "Typical Power" value. This is the power required to exactly match the heat lost by the tripped device to its ambient surroundings at 230. By Ohm's Law, power can be stated as: W : E/‘Z/R. Thus the approximate resistance of a “Tripped' PTC can be determined by: R : EA2/W, where "E" is the voltage appearing across the PTC (usually the supply's open circuit voltage). and "W" is the Typical Power value for the particular PTC, Since the PPTC acts to maintain a constant Internal temperature. Its apparent resistance will change based upon applied voltage and. to a lesser degree, ambient conditions Consider the following examplem. A PTC with a Typical Power of 1 watt protecting a circuit using a 60V supply will demonstrate an apparent, tripped resistance "R" of: R : BUA2/1 : 3,600 Ohms This same tripped device when used to protect a 12v circuit would now present an apparent resistance of: R :12A2/1 : 144 ohms The value for Typical Power is "typical" because any physical factors that alfect heat loss (such as ambient temperature or air convection) will somewhat alter the level of power that the PTC needs to maintain its internal temperature, In short, PTCs do not exhibit a constant, quantifiable tripped resistance value Tvpe Time - To » Trip at 23°C lSee Eiec. Characteristics Table tor P/N , Curve correlation) A B c D E F ion in Time - To - Trip (S) Di cm or in 1 Fault current 1A) Specifications subject to change without notice b | 28mm 5 e PROTECTION Bel Fuse inc. +1 201432.046?) 205 Van Vorst Street techhelp®beilcom 0 be‘ 9WD Jersey City, NJ 07302 USA belfuse.com © 2016 Bel Fuse, inc OZCK Nov2016 2 / A
Surface Mount PTC OZCK Series ® OZCK Series -0805 Chip [mm 6 Compliant & Halogen-Free Pod Layout PTC Marking The dimensions in the table below provide the recommended pad layout. m“b". IH code. I Part Number In code W F s w N irroi No insl No 'ruri “10””me D mm Inch mm Inch min Inch OZGKDOZOFFZG F -34- p. 3% i.2a nun ion om 1.50 am ”“0”“er J nZCKuDsuFFzE M Termination Pad Materials 0ZCK0050AF2E N Matte Tin - Plated Copper nZGKDD75FF2E P Mechanical Dimensions 026K0100FF2E 1 (0.20-0.50mm) All dimensions in mm. D4 F s (0.100.45mm) c T Part Number Mm MIX fi1.20-1.50mm) OZCKOOIOFFQG 0.30 1.00 l UZCKDOZUFFZG 0.30 1.00 A UZCKDUSSFFZG 0.25 0.75 12.007230mm) OZCKDOSUFFZE 0.55 1.25 “'9 '"° E°“°"‘ V'“ .L 026K0050AF2E 0.40 0.90 ':——‘ )r uzcmorsFFzF. 0.55 1.25 Slfle VI." I: UZCKO100FF2E 0.75 1.50 Thermal Deraling Curve Comrdmry Notes Hold & Trip Currentand Thermal Derating Curve Lapemidn beyond inespecified maximum ruimsrsov Immune! use may ream In dmmqe and possible mm eleoirieol ereing end/er ilurne 2. These Polymer PTC (PMS) devices are intended for pmeflion calms! ocuuio I verourrem/ ovemmperoiure louii ednd ons and may noi be surieeie idr use in aopiiomrdrs where repealed end/or prolonged fault cundilions 5m Bfl'lclplled 3. Avoid ooriieoi of PTC device wllh chemical solvent. Prolonged cam my adversely lmneoi me FTC performance. r. These FTC devices rruy noi he suitable idr use in eireuiis with a large induoronoo. so in. Pro iris. oen generous eirouii voltage spikes uhovettie FTC ruled veliuge. 5 These devlces ore i ended cor use in no voirzge upplieeiions only. Use in AC voiiege appllontians should be iirsi discussed wnn Eel Fuse engrneenng. ema n I o r s' I a a e 5. Nat recommended ior use on owned or cunlumiul ooeied Pca's Restriction oi iree air ildw could afiecl eleoirieal periorrnonoe and/er resuii in device Iuilure. i 20 w 60 so Consult ael Fuse engineering. Ambie m Tempe Tamra (‘C ) 1. In the “lndetefmirrate Periormonoe I grey zdne‘. inpeing nioy occur eui cannot be mliod upon. For i _ Hold Current _ Tri p Current special irournsienoes considering use wimin mis 2er. "’ \ Device 20w. rfur ism. rum. and Trip Current firm I Percentage of Hold Current 4o 720 region. consult Eel Fuse Engrneenng. 5. ML - 25 iAeeordnu tn IPC Jsrdrazn). Specltibauons suoreci ro change wnhour norrce b | 28mm 8 e PROTECTION Bel Fuse lric. +1 201.432.0463 205 Van Versi Street technelp®bellcom 0 be‘ 9WD Jersey Ciry, NJ 07302 USA belfuse.com © 20l6 Bel Fuse, lrlc OZCK Nor/2016 3 / A
Surface Mount PTC OZCK Series ® OZCK Series -0805 Chip RoHS ocompliant & Halogen-Free Solder Reflow and Rework Recommendations Prolile Feature Po—Free Assembly mm Average Ramp-Up Hate (Tsmax to Tpl 3“C/seoond max 1] Preheat : Temperature Min (Tsmin) 150°C 2 Temperature Max (Tsrnax) 200°C 5 Time (tsmin to tsmaxj 60—130 seconds ; Tlme "lalnlall'led above: a Temperatureml 217.0 E Time (til 30-150 seconds .5 Peak/Classification Temperatureflol : 260°C Time Within 5“C of actual Peak : Temperature (to) 2040 seconds .7 l as.c w p." , ‘1 Ramp-Down Rate 1 sac/second max. Tlllll :> Time 25°C to Peak Temperature . 5 minutes max Solder Reflow Due to " lead lree / ROHS 6 " construction 0' these FTC devices , the required Temperature and Dwell Time in the " Soldering " zone ol the rel'low profile are greater than those used for nonrRoHS devices 1. Recommended reflow methods ; IR, vapor phase oven. hot air oven. 2. Not Recommended For Wave Solder/ Direct Immersion. 3. Recommended paste thickness range — 0.20 — 0.25mm. 4. Devices are compatible with standard industry cleaning solvents and methods. 5. MSL: 2a (According to lPC J-Std-D2D). Caution ll rellow temperature / dwell times exceed the recommended profile, the elemrical performance of the FTC may be affected. Rework : MIL-STD-EUZG Method 21oF, Test Condition A. Standard Packaging P/N Explanation and Ordering Information Pm Number T emeel g .4000 or soon luses in 7 CK oxxx X x xx ozoKomoFFzG m::‘;:' 5:: :12: PTO _ — — i , series 02%;?“er 4'00" per ElA-481(equivalent DZCKJJBDS Size lEc-zse part 3). | HOLD Hating — DZCKOD5DFF2E iiererta Pan mirth... are re New in eieemeei Characterising use an iii 11““ 3-0“ Electrical Characteristics 02mm 110sz r e slanozm Damn Mo 7 (except Pi = Shamal. nirstemeispec. now am. etc Mechanical Features r = standard Design [no 2 (except n = Sneolal. oustnmarspec. lezd iermm. etc. Tape 8t Heel Qty See eianuere when; specilicatians subiect to change Wltheut notlce b | garment, e e PROTECTION Bel Fuse lrlc. +1 201.432.0463 205 Van Vorst Street lechhelp@bell.conl 0 tel group Jersey City, NJ 07302 USA beliuse.com © 2016 Bel Fuse. inc OZCK N0\'2016 4 / 4

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