DC6M60xX6 Family Datasheet by NXP USA Inc.

View All Related Products | Download PDF Datasheet
1. Product profile
1.1 General description
The DC6M60xX6 family consists of highly efficient 6 MHz, 650 mA step-down DC-to-DC
converters. The devices convert input voltages between 2.3 V and 5.5 V to fixed output
voltages of 1.2 V, 1.5 V, 1.8 V or 2.85 V.
The devices of DC6M60xX6 family are optimized for battery-driven applications. Their
high efficiency of up to 95 % enables an extended battery life in all portable designs. Buck
operation at a switching frequency of 6 MHz allows using only a small low-cost 470 nH
coil and two capacitors. Besides working with standard chip inductors, the DC6M60xX6
family devices also support Printed-Circuit Board (PCB) coils and air coils.
Product versions with and without automatic mode selection between Pulse Frequency
Modulation (PFM) and Pulse Width Modulation (PWM) are available. Optionally the
devices can be switched to forced PWM mode.
1.2 Features and benefits
Efficiency up to 95 %
Extremely low output ripple in PWM and PFM mode
2 % total DC output voltage accuracy
Soft start function for limiting inrush current
Short circuit and over-temperature protection
Integrated flyback diode
Enable input operates with an active HIGH or with a clock signal
Optional power good indicator output (XSHUTDOWN version)
Wafer-Level Chip-Size Package (WLCSP) with 0.4 mm pitch
1.3 Applications
1.4 Quick reference data
DC6M60xX6 family
6 MHz, 650 mA, ultra small DC-to-DC buck converter
Rev. 2 — 29 January 2013 Product data sheet
Smartphones Tablet PCs
Mobile handsets Mobile Internet Devices (MID)
Digital Still Cameras (DSC) Portable Media Players (PMP)
IO= 650 mA (max) Switching frequency fclk(PWM) =6MHz
VO= 1.2 V, 1.5 V, 1.8 V or 2.85 V VI= 2.3 V to 5.5 V
Supply current ICC =0.2A in standby
mode
9@@ 00@
DC6M60XX6_FAM All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 2 — 29 January 2013 2 of 26
NXP Semiconductors DC6M60xX6 family
6 MHz, 650 mA, ultra small DC-to-DC buck converter
2. Pinning information
[1] Mode function depends on the chosen version of the buck converter as listed in Table 3.
Fig 1. Pin configuration WLCSP6
Table 1. Pin description
Symbol Pin Description
MODE [1] A1 voltage select/mode select/XSHUTDOWN
IN A2 supply input voltage
SW B1 output voltage switch regulator
EN B2 enable
FB C1 control feedback
GND C2 ground
018aaa210
Transparent top view
solder balls facing down
bump A1
index area
A2
B2
C2
IN
EN
GND
MODE
SW
FB
A1
B1
C1
Section 19
DC6M60XX6_FAM All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 2 — 29 January 2013 3 of 26
NXP Semiconductors DC6M60xX6 family
6 MHz, 650 mA, ultra small DC-to-DC buck converter
3. Ordering information
DC6M60xX6 family is available with different modes or output voltages and can be
supplied upon request and acceptance from NXP Semiconductors. For more details, see
Section 19.
[1] Size 1.36 0.96 0.47 mm
3.1 Ordering options
[1] For detail information about options see Section 5, about functional selection see Section 5.6.
[1] For detail information about options see Section 5, about functional selection see Section 5.6.
Table 2. Ordering information
Type number Package
Name Description Version
DC6M60xX6 family WLCSP6 wafer-level chip-size package; 6 bumps (3 2) [1] -
Table 3. Ordering options for DC6M601X6 and DC6M603X6 [1]
Type number Mode option Nominal output
voltage (VO(nom))
DC6M601X6/12S select automatic PWM/PFM or forced PWM mode 1.2 V
DC6M601X6/15S select automatic PWM/PFM or forced PWM mode 1.5 V
DC6M601X6/18S select automatic PWM/PFM or forced PWM mode 1.8 V
DC6M601X6/285S select automatic PWM/PFM or forced PWM mode 2.85 V
DC6M603X6/12A power good (XSHUTDOWN) output; automatic PWM/PFM mode 1.2 V
DC6M603X6/15A power good (XSHUTDOWN) output; automatic PWM/PFM mode 1.5 V
DC6M603X6/18A power good (XSHUTDOWN) output; automatic PWM/PFM mode 1.8 V
Table 4. Ordering options for DC6M602X6 [1]
Type number Mode option Nominal output voltage (VO(nom))
MODE = LOW MODE = HIGH
DC6M602X6/1215A output voltage select; automatic PWM/PFM mode 1.2 V 1.5 V
DC6M602X6/1218A output voltage select; automatic PWM/PFM mode 1.2 V 1.8 V
DC6M602X6/1518A output voltage select; automatic PWM/PFM mode 1.5 V 1.8 V
DC6M602X6/1215F output voltage select; forced PWM mode 1.2 V 1.5 V
DC6M602X6/1218F output voltage select; forced PWM mode 1.2 V 1.8 V
DC6M602X6/1518F output voltage select; forced PWM mode 1.5 V 1.8 V
DC6M602X6/1518A A L $11 aw»o Mode upnun 1 : emu PWM/FF 2 : vo‘lage se‘em 3 : puwer goud (XSHUTDOWN) ompm “3.005049 ass-005050
DC6M60XX6_FAM All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 2 — 29 January 2013 4 of 26
NXP Semiconductors DC6M60xX6 family
6 MHz, 650 mA, ultra small DC-to-DC buck converter
3.1.1 Naming convention
4. Block diagram
Fig 2. Naming convention
'&0;$
)UHTXHQF\
0 0+]
2XWSXWFXUUHQW,
2
 P$
 P$
 P$
0RGHRSWLRQ
 DXWR3:03)0RUIRUF
HG3:0VHOHFW
 YROWDJHVHOHFW
 SRZHUJRRG;6+87'2:1RXWSXW
3DFNDJHLGHQWLILHU
; :/&63
2XWSXWYROWDJH92
 9
 9
 9RU9
0RGXODWLRQRSWLRQ
$ DXWRPRGXODWLRQ3)0RU3
:0
) IRUFHG3:0PRGH
6VHOHFWPRGXODWLRQ
DDD
Fig 3. Block diagram


























DDD
r(Figure4 A2 92 in (:1 i]— ? ans-W505! (Figure 3 m
DC6M60XX6_FAM All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 2 — 29 January 2013 5 of 26
NXP Semiconductors DC6M60xX6 family
6 MHz, 650 mA, ultra small DC-to-DC buck converter
5. Functional description
The step-down converter (Figure 4) generates a regulated constant output voltage behind
an externally connected coil at pin SW. For this operation only the inductor and two filter
capacitors are required. No additional flyback diode is needed. Place the pick-off pin for
FB behind the inductor to sense the output voltage.
The step-down converter starts a switching cycle with an active P-channel MOS (PMOS)
which allows rising the output voltage until a defined value is reached. Then the feedback
circuit turns off the PMOS switch and turns on the N-channel MOS (NMOS) as active
rectification.
The step-down converter (Figure 3) consists of an integrated oscillator. It runs at high
frequency to compare the return path and to control the PWM/PFM logic block and the
break-before-make circuit of the integrated NMOS and PMOS transistor. This allows
reaching constant output voltage with high efficiency and low output ripple.
5.1 Automatic PWM/PFM mode
Battery-driven applications need power-saving options. Therefore the DC-to-DC converter
provides a current-sensing circuit which detects the output current. If the current is below
a certain threshold, the system switches to PFM mode. In this operation, the converter
uses less current and saves battery operation time. This automode can be switched off to
the forced PFM mode (see Section 5.6).
5.2 Inrush current limiter (soft start)
The DC6M60xX6 family has an integrated soft start function to limit the maximum inrush
current and to reduce an input voltage dip. Therefore the system has a turn-on procedure
which starts up step-by-step over 300 s and limits the inrush current via a duty cycle
control up to the maximum current capability.
5.3 Thermal protection
The DC6M60xX6 family products have an integrated thermal protection. The protection
circuit senses the internal temperature of the chip and switches off the integrated PMOS
power switch transistor when a defined maximum temperature is reached. After the
temperature returns to a safe value, the system restarts with a soft start.
Fig 4. Simple application schematic
,1
(1
*1'
02'(
6:
)%
$
%
&
$
%
&
9
,
9
2
/RH[W
&
RH[W
&LH[W
DDD
(W Section 5.1 Table 7
DC6M60XX6_FAM All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 2 — 29 January 2013 6 of 26
NXP Semiconductors DC6M60xX6 family
6 MHz, 650 mA, ultra small DC-to-DC buck converter
5.4 Short-circuit and overcurrent protection
The short-circuit and overcurrent protection senses the current through the integrated
PMOS high-side driver. If the diagnostic circuit detects an overcurrent, the system
switches off the PMOS to break the current flow.
5.5 Enable (EN)
All products have an enable pin EN which enables the device by a constant logic HIGH
signal but also by applying an alternating (clock) signal to the enable pin. All devices start
with a soft start (Section 5.2).
If EN is forced to a LOW level, the system is in Power-down mode. Then the input current
is negligible and the output voltage sets to LOW via a resistor.
It is possible to enable all DC6M60xX6 family products by applying a clock signal which is
used to enable other parts of a certain circuit such as camera modules based on the
Standard Mobile Imaging Architecture (SMIA) specification. The required signal frequency
has to be in the range of 5 MHz to 27 MHz with a duty cycle between 40 % and 60 %.
5.6 Function selection (MODE)
Depending on the product version, three different operation modes are available for the
MODE pin.
5.6.1 Automatic PWM/PFM and forced PWM mode
The default operation mode is the automatic selection mode. This mode switches the
device between PWM and PFM to reduce power consumption as described in
Section 5.1.
The automatic mode of DC6M601X6 can be switched off to use only the PWM mode.
DC6M602X6 does not have this option but is available with fix mode (automatic or forced
PWM).
5.6.2 Output voltage select
DC6M602X6 offers the option to select the output voltage VO depending on the logic level
applied to the MODE pin. Depending on the logic input level either the LOW or the HIGH
output voltage is selected. Table 7 illustrates this behavior.
Table 5. Function selection
EN logic level Description
HIGH or clock signal operation
LOW shut down
Table 6. Function selection DC6M601X6
MODE logic level Description
LOW automatic PWM/PFM mode
HIGH forced PWM mode
Figure 5 Tab‘e 8 ass-005052
DC6M60XX6_FAM All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 2 — 29 January 2013 7 of 26
NXP Semiconductors DC6M60xX6 family
6 MHz, 650 mA, ultra small DC-to-DC buck converter
The MODE input pin has no default level. To prevent undefined states, it has to be applied
with a clear LOW or HIGH level.
5.6.3 Power good output (XSHUTDOWN)
DC6M603X6 has an XSHUTDOWN or power good output. This function is often used
when the converter is turned on by a clock signal (CLK) available at pin MODE.
The basic timing is depicted in Figure 5 and Table 8 where EXTCLK is the clock signal at
the enable input and VO the DC-to-DC converter output voltage. The XSHUTDOWN is the
power good signal and has the same signal output level as VO.
Table 7. Output voltage selection DC6M602X6
MODE logic level Output voltage
LOW low voltage
HIGH high voltage
Fig 5. Timing XSHUTDOWN enable/disable
Table 8. Timing XSHUTDOWN
Symbol Description Min Max Unit
T1 EXTCLK active - VO rising 10 100 s
T2 VO settled - XSHUTDOWN rising 0 100 s
T3 VO down time; Co(ext) = 10 pF; load current IL = 20 mA 0 1000 s
T4 EXTCLK inactive - XSHUTDOWN down 0 100 s
T5 VO rising time (no-load) 30 200 s
(;7&/.
(1
;6
+87'2:1
02'(
7
7
7
7
7
92
DDD
DC6M60XX6_FAM All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 2 — 29 January 2013 8 of 26
NXP Semiconductors DC6M60xX6 family
6 MHz, 650 mA, ultra small DC-to-DC buck converter
6. Limiting values
7. Recommended operating conditions
[1] See Section 10 “Application information.
Table 9. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VIN voltage on pin IN 4 ms transient 0.5 +6.0 V
VIinput voltage on pins EN, MODE, FB 0.5 +5.5 V
VOoutput voltage on pin SW 0.5 +5.5 V
Ptot total power dissipation - 800 mW
Tstg storage temperature 55 +150 C
Tjjunction temperature 30 +125 C
Tamb ambient temperature 40 +85 C
VESD electrostatic discharge
voltage human body model
(JESD22-001)
2+2kV
machine model
(JESD22-A115)
200 +200 V
Table 10. Operating conditions
At recommended operating conditions; Tamb =25
C; voltages are referenced to GND (0 V); unless
otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
VIN voltage on pin IN 2.3 - 5.5 V
VIinput voltage on pins EN, MODE, FB -0.5 - VIN +
0.3 V
IOoutput current 0 - 650 mA
Ci(ext) external input
capacitance
[1] -4.710F
Co(ext) external output
capacitance
[1] 2.2 4.7 - F
Lo(ext) external output
inductance
[1] -0.47-H
DC6M60XX6_FAM All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 2 — 29 January 2013 9 of 26
NXP Semiconductors DC6M60xX6 family
6 MHz, 650 mA, ultra small DC-to-DC buck converter
8. Static characteristics
Table 11. Characteristics
At recommended input voltages and Tamb =
40
C to +85
C; voltages are referenced to GND (ground = 0 V); unless
otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
Input voltage and input current
VIinput voltage VO= 1.2 V 2.3 - 5.5 V
VO= 1.5 V 2.3 - 5.5 V
VO= 1.8 V 2.8 - 5.5 V
VO= 2.85 V 3.7 - 5.5 V
ICC supply current operating; PWM mode;
IO=0A -8-mA
operating; PFM mode;
IO=0A - 180 - A
disabled - 0.2 - A
Output voltage and output current
VOoutput voltage IO15 mA [1] 0.98
VO(nom)
VO(nom) 1.02
VO(nom)
V
0 mA < IO < 15 mA;
auto PWM/PFM mode
[1] 0.98
VO(nom)
VO(nom) 1.04
VO(nom)
V
IO(max) maximum output current 650 - - mA
Vo(ripple)(p-p) peak-to-peak ripple output voltage 0 mA < IO<100mA;
VI=V
O(nom) +1.2V
[1] --10mV
100 mA < IO< 650 mA;
VI=V
O(nom) +1.2V
[1] -715mV
Line regulation
VO/VIoutput voltage variation as a
function of input voltage variation 2.3 V < VI<5.5V;
I=200mA -0.03-%/V
Load regulation
VO/ILoutput voltage variation as a
function of load current variation 0 A < IO< 650 mA - 0.003 - %/mA
Pin EN
VIH HIGH-level input voltage 1 - - V
VIL LOW-level input voltage - - 0.4 V
IIH HIGH-level input current VIH =1.2V - - 1 A
Pin MODE
VIH HIGH-level input voltage 1 - - V
VIL LOW-level input voltage - - 0.4 V
IIH HIGH-level input current VIH =1.2V - - 1 A
VOH HIGH-level output voltage [2] 0.9 VO-1.1 VOV
VOL LOW-level output voltage [2] 0.1 - 0.3 V
Clock frequency and duty cycle
fclk(PWM) PWM clock frequency 5.4 6.0 6.6 MHz
fclk(PFM) PFM clock frequency 0 - 6.6 MHz
DC6M60XX6_FAM All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 2 — 29 January 2013 10 of 26
NXP Semiconductors DC6M60xX6 family
6 MHz, 650 mA, ultra small DC-to-DC buck converter
[1] VO(nom) = nominal output voltage (device specific).
[2] Only for product versions with power good output (DC6M603X6).
9. Dynamic characteristics
9.1 Efficiency
duty cycle forced PWM mode
DC6M601X6/285S 2 - 100 %
all other devices 2 - 92 %
automatic forced PWM /
PFM mode
DC6M601X6/285S 0 - 100 %
all other devices 0 - 92 %
Overtemperature and overcurrent protection
Tsd shutdown temperature - 150 - C
Tsd(hys) shutdown temperature hysteresis - 40 - K
IOlim output current limit 1.0 1.3 - A
Iinrush(lim) inrush current limit - 0.3 - A
Switches
RDSon drain-source on-state resistance P-channel FET; VDS = 3.6 V - 0.15 -
N-channel FET; VDS =3.6V - 0.3 -
Ileak leakage current VDS = 5 V - - 1 A
Table 11. Characteristics …continued
At recommended input voltages and Tamb =
40
C to +85
C; voltages are referenced to GND (ground = 0 V); unless
otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
VO=2.85V V
O=1.8V
Fig 6. DC6M60xX6/285x: Efficiency as a function of
output current Fig 7. DC6M60xX6/18x: Efficiency as a function of
output current
ass-006547 DD‘EHP ans-005292
DC6M60XX6_FAM All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 2 — 29 January 2013 11 of 26
NXP Semiconductors DC6M60xX6 family
6 MHz, 650 mA, ultra small DC-to-DC buck converter
9.2 Output voltage ripple
VO=1.2V
Fig 8. DC6M60xX6/12x: Efficiency as a function of output current
VO=1.8V
Fig 9. DC6M60xX6/18x: Peak-to-peak output voltage ripple as a function of output
current
DDD
     






,2P$
9RULSSOHSS
P9P9
9, 9
9, 9
9, 9
9, 9
ass-006549 \ 2 \ >3 “3.005554 013335215 v. Vo me time (ms)
DC6M60XX6_FAM All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 2 — 29 January 2013 12 of 26
NXP Semiconductors DC6M60xX6 family
6 MHz, 650 mA, ultra small DC-to-DC buck converter
9.3 Output voltage variation
9.4 Line transient response
VI=3.6V
Fig 10. DC6M60xX6/18x: Output voltage as function of output current
IO=10mA
VI=3.3V3.9 V 3.3 V
IO= 200 mA
VI=3.3V3.9 V 3.3 V
Fig 11. DC6M60xX6/18x: Line transient response Fig 12. DC6M60xX6/18x: Line transient response
DDD





WLPHPV
9
,
9
,
99
9
2
9
2
99
9
,
9
,
9
2
9
2
ssssssssssssssssssss J L
DC6M60XX6_FAM All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 2 — 29 January 2013 13 of 26
NXP Semiconductors DC6M60xX6 family
6 MHz, 650 mA, ultra small DC-to-DC buck converter
9.5 Load transient response
VI=3.6V
IO=0mA150 mA 0mA
VI=3.6V
IO=50mA350 mA 50 mA
Fig 13. DC6M60xX6/18x: Load transient response Fig 14. DC6M60xX6/18x: Load transient response
VI=3.6V
IO= 150 mA 500 mA 150 mA
Fig 15. DC6M60xX6/18x: Load transient response
DDD
    
 
 
 
 
 
 
 
WLPHPV
,2
,2
P$P$P$
92
92
999
92
92
,2
,2
DC6M60XX6_FAM All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 2 — 29 January 2013 14 of 26
NXP Semiconductors DC6M60xX6 family
6 MHz, 650 mA, ultra small DC-to-DC buck converter
9.6 Start-up/enable
The start-up sequence is described by time-dependent current and voltage behavior.
IO= 200 mA
(1) VEN
(2) VO
Fig 16. Start-up
018aaa217
time (ms)
-0.4 0.80.40.0
1.5
2.5
0.5
3.5
4.5
V
-0.5
(2)
(1)
32 BI W “3.0051754 mm M
DC6M60XX6_FAM All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 2 — 29 January 2013 15 of 26
NXP Semiconductors DC6M60xX6 family
6 MHz, 650 mA, ultra small DC-to-DC buck converter
10. Application information
The DC-to-DC converter requires an external coil and two decoupling capacitors.
10.1 Recommended inductors
10.2 Input capacitor
To eliminate unwanted voltage transients at the input, place an input decoupling capacitor
of more than 4.7 F as close as possible to the input pin. Use therefore a capacitor with a
low Equivalent Series Resistance (ESR).
10.3 Output capacitor
Use a suppressor capacitor of more that 10 F for the output (Figure 17). Because of the
narrow spread, high temperature stability and low ESR at high frequencies use the
dielectric X7R or X5R.
Fig 17. Application diagram
,1
(1
*1'
02'(
6:
)%
$
%
&
$
%
&
9
,
(1$%/( 9
2
/RH[W
&
RH[W
&LH[W
DDD
Table 12. Recommended inductors (Figure 17)
Manufacture Series Dimensions (mm)
MURATA LQM21PN1R0NGR 2.0 1.2 1.0 maximum height
LQM21PNR54MG0 2.0 1.2 1.0 maximum height
LQM21PNR47MC0 2.0 1.2 0.55 maximum height
LQM21PN1R0MC0 2.0 1.2 0.55 maximum height
FDK MIPSZ2012DOR5 2.0 1.2 1.0 maximum height
MIPS2012D1R0 2.0 1.2 1.0 maximum height
ass-005055
DC6M60XX6_FAM All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 2 — 29 January 2013 16 of 26
NXP Semiconductors DC6M60xX6 family
6 MHz, 650 mA, ultra small DC-to-DC buck converter
11. Marking
Fig 18. Product marking
Table 13. Marking codes
Drawing reference Marking code Product version
A 7 DC6M601X6
8DC6M602X6
9DC6M603X6
B A DC6M60xX6\12x (VO=1.2V)
D DC6M60xX6\15x (VO=1.5V)
G DC6M60xX6\18x (VO=1.8V)
Z DC6M60xX6\285x (VO=2.85V)
AD DC6M602X6\1215x (VO= 1.2 V or 1.5 V)
AG DC6M602X6\1218x (VO=1.2V or 1.8V)
DG DC6M602X6\1518x (VO=1.5V or 1.8V)
C A DC6M602X6/xxxxA, DC6M603X6/xxA
F DC6M602X6/xxxxF
S DC6M601X6/xxS
YYYY part of lot ID for traceability -
WRSYLHZ
VROGHUEDOOVIDFLQJGRZQ
EXPS$
LQGH[DUHD
$%&
<
<<<
DDD
E3©
DC6M60XX6_FAM All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 2 — 29 January 2013 17 of 26
NXP Semiconductors DC6M60xX6 family
6 MHz, 650 mA, ultra small DC-to-DC buck converter
12. Package outline
Fig 19. Package outline WLCSP6
wlcsp6_3x2_po
European
projection
WLCSP6: wafer level chip-size package; 6 bumps (3 x 2)
X
bump A1
index area
D
E
B
A
123
e1
e
e
b
detail X
A
A2
A1
Table 14. Dimensions of WLCSP6 (Figure 19)
Symbol Min Typ Max Unit
D 1.31 1.36 1.41 mm
E 0.91 0.96 1.01 mm
A 0.44 0.47 0.50 mm
A1 0.18 0.20 0.22 mm
A2 0.25 0.27 0.29 mm
e 0.35 0.40 0.45 mm
e1 0.70 0.80 0.90 mm
b 0.21 0.26 0.31 mm
(Figure 20
DC6M60XX6_FAM All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 2 — 29 January 2013 18 of 26
NXP Semiconductors DC6M60xX6 family
6 MHz, 650 mA, ultra small DC-to-DC buck converter
13. Soldering
14. Soldering of WLCSP packages
14.1 Introduction to soldering WLCSP packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering WLCSP (Wafer Level Chip-Size Packages) can be found in application note
AN10439 “Wafer Level Chip Scale Package” and in application note AN10365 “Surface
mount reflow soldering description”.
Wave soldering is not suitable for this package.
All NXP WLCSP packages are lead-free.
14.2 Board mounting
Board mounting of a WLCSP requires several steps:
1. Solder paste printing on the PCB
Fig 20. Soldering footprint WLCSP6
Table 15. Dimensions of soldering footprint WLCSP6 (Figure 20)
Symbol Min Typ Max Unit
D 0.91 0.96 1.01 mm
E 1.31 1.36 1.41 mm
c - 0.25 - mm
e- 0.4- mm
f - 0.325 - mm
ZOFVSB[BIU
VROGHUUHVLVW
RFFXSLHGDUHD
VROGHUSDVWH VROGHUODQG
'LPHQVLRQVLQPP
H
'
(
H
H
F
I
Figure 21 Table 16 Figure 21
DC6M60XX6_FAM All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 2 — 29 January 2013 19 of 26
NXP Semiconductors DC6M60xX6 family
6 MHz, 650 mA, ultra small DC-to-DC buck converter
2. Component placement with a pick and place machine
3. The reflow soldering itself
14.3 Reflow soldering
Key characteristics in reflow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 21) than a PbSn process, thus
reducing the process window
Solder paste printing issues, such as smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature), and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic) while being low enough that the packages and/or boards are not
damaged. The peak temperature of the package depends on package thickness and
volume and is classified in accordance with Table 16.
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 21.
Table 16. Lead-free process (from J-STD-020C)
Package thickness (mm) Package reflow temperature (C)
Volume (mm3)
< 350 350 to 2000 > 2000
< 1.6 260 260 260
1.6 to 2.5 260 250 245
> 2.5 250 245 245
mamum peak hamperature = MSL hymn damage \eve\ mmmum peak |emperature = mwmmum soldenng |emperamre
DC6M60XX6_FAM All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 2 — 29 January 2013 20 of 26
NXP Semiconductors DC6M60xX6 family
6 MHz, 650 mA, ultra small DC-to-DC buck converter
For further information on temperature profiles, refer to application note AN10365
“Surface mount reflow soldering description”.
14.3.1 Stand off
The stand off between the substrate and the chip is determined by:
The amount of printed solder on the substrate
The size of the solder land on the substrate
The bump height on the chip
The higher the stand off, the better the stresses are released due to TEC (Thermal
Expansion Coefficient) differences between substrate and chip.
14.3.2 Quality of solder joint
A flip-chip joint is considered to be a good joint when the entire solder land has been
wetted by the solder from the bump. The surface of the joint should be smooth and the
shape symmetrical. The soldered joints on a chip should be uniform. Voids in the bumps
after reflow can occur during the reflow process in bumps with high ratio of bump diameter
to bump height, i.e. low bumps with large diameter. No failures have been found to be
related to these voids. Solder joint inspection after reflow can be done with X-ray to
monitor defects such as bridging, open circuits and voids.
14.3.3 Rework
In general, rework is not recommended. By rework we mean the process of removing the
chip from the substrate and replacing it with a new chip. If a chip is removed from the
substrate, most solder balls of the chip will be damaged. In that case it is recommended
not to re-use the chip again.
MSL: Moisture Sensitivity Level
Fig 21. Temperature profiles for large and small components
001aac844
temperature
time
minimum peak temperature
= minimum soldering temperature
maximum peak temperature
= MSL limit, damage level
peak
temperature
Table 17 Figure 22
DC6M60XX6_FAM All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 2 — 29 January 2013 21 of 26
NXP Semiconductors DC6M60xX6 family
6 MHz, 650 mA, ultra small DC-to-DC buck converter
Device removal can be done when the substrate is heated until it is certain that all solder
joints are molten. The chip can then be carefully removed from the substrate without
damaging the tracks and solder lands on the substrate. Removing the device must be
done using plastic tweezers, because metal tweezers can damage the silicon. The
surface of the substrate should be carefully cleaned and all solder and flux residues
and/or underfill removed. When a new chip is placed on the substrate, use the flux
process instead of solder on the solder lands. Apply flux on the bumps at the chip side as
well as on the solder pads on the substrate. Place and align the new chip while viewing
with a microscope. To reflow the solder, use the solder profile shown in application note
AN10365 “Surface mount reflow soldering description”.
14.3.4 Cleaning
Cleaning can be done after reflow soldering.
15. Mounting
15.1 PCB design guidelines
It is recommended, for optimum performance, to use a Non-Solder Mask
Defined (NSMD), also known as a copper-defined design, incorporating laser-drilled
micro-vias connecting the ground pads to a buried ground-plane layer. This results in the
lowest possible ground inductance and provides the best high frequency and ElectroStatic
Discharge (ESD) performance. Refer to Table 17 for the recommended PCB design
parameters.
15.2 PCB assembly guidelines for Pb-free soldering
Table 17. Recommended PCB design parameters
Parameter Value or specification
PCB pad diameter 250 m
Micro-via diameter 100 m (0.004 inch)
Solder mask aperture diameter 325 m
Copper thickness 20 m to 40 m
Copper finish AuNi or OSP
PCB material FR4
Table 18. Assembly recommendations
Parameter Value or specification
Solder screen aperture diameter 250 m
Solder screen thickness 100 m (0.004 inch)
Solder paste: Pb-free SnAg (3 % to 4 %); Cu (0.5 % to 0.9 %)
Solder to flux ratio 50 : 50
Solder reflow profile see Figure 22
DC6M60XX6_FAM All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 2 — 29 January 2013 22 of 26
NXP Semiconductors DC6M60xX6 family
6 MHz, 650 mA, ultra small DC-to-DC buck converter
16. References
[1] IEC60134 — Rating systems for electronic tubes and valves and analogous
semiconductor devices
[2] IEC61340-3-1 — Method for simulation of electrostatic effects - Human body model
(HBM) electrostatic discharge test waveforms
[3] JESD22-A115C — Electrostatic discharge (ESD) Sensitivity Testing Machine Model
(MM)
[4] NX2-00001 — NXP Semiconductors Quality and Reliability Specification
[5] AN10365 — NXP Semiconductors application note ”Surface mount reflow soldering
description”
The device is capable of withstanding at least three reflows at this profile.
Fig 22. Pb-free solder reflow profile
Table 19. Characteristics
Symbol Parameter Conditions Min Typ Max Unit
Treflow(peak) peak reflow temperature 230 - 260 C
t1time 1 soak time 60 - 180 s
t2time 2 time during T 250 C--30s
t3time 3 time during T 230 C10-50s
t4time 4 time during T > 217 C 30 - 150 s
t5time 5 - - 540 s
dT/dt rate of change of
temperature cooling rate - - 6C/s
preheat 2.5 - 4.0 C/s
001aai943
Treflow(peak)
250
230
217
T
(°C)
cooling rate
preheat
t1
t5
t4
t3
t2t (s)
Section 1 “Product Qrofile" Table 11 Section 9 “Dynamic characteristics"
DC6M60XX6_FAM All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 2 — 29 January 2013 23 of 26
NXP Semiconductors DC6M60xX6 family
6 MHz, 650 mA, ultra small DC-to-DC buck converter
17. Revision history
Table 20. Revision history
Document ID Release date Data sheet status Change notice Supersedes
DC6M60XX6_FAM v.2 20130129 Product data sheet - DC6M60XX6_FAM v.1
Modifications: Section 1 “Product profile: updated
Table 11: output voltage VO and drain-source on-state resistance RDSon updated
Section 9 “Dynamic characteristics: updated
DC6M60XX6_FAM v.1 20120921 Preliminary data sheet - -
DC6M60XX6_FAM All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 2 — 29 January 2013 24 of 26
NXP Semiconductors DC6M60xX6 family
6 MHz, 650 mA, ultra small DC-to-DC buck converter
18. Legal information
18.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
18.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
18.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.
: hitE:I/www.nxg.com salesaddresses®nx9£0m
DC6M60XX6_FAM All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 2 — 29 January 2013 25 of 26
NXP Semiconductors DC6M60xX6 family
6 MHz, 650 mA, ultra small DC-to-DC buck converter
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
18.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
19. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
NXP Semiconductors DC6M60xX6 family
6 MHz, 650 mA, ultra small DC-to-DC buck converter
© NXP B.V. 2013. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 29 January 2013
Document identifier: DC6M60XX6_FAM
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
20. Contents
1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1
2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 3
3.1 Ordering options. . . . . . . . . . . . . . . . . . . . . . . . 3
3.1.1 Naming convention. . . . . . . . . . . . . . . . . . . . . . 4
4 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4
5 Functional description . . . . . . . . . . . . . . . . . . . 5
5.1 Automatic PWM/PFM mode . . . . . . . . . . . . . . . 5
5.2 Inrush current limiter (soft start) . . . . . . . . . . . . 5
5.3 Thermal protection . . . . . . . . . . . . . . . . . . . . . . 5
5.4 Short-circuit and overcurrent protection . . . . . . 6
5.5 Enable (EN) . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
5.6 Function selection (MODE). . . . . . . . . . . . . . . . 6
5.6.1 Automatic PWM/PFM and forced PWM mode . 6
5.6.2 Output voltage select . . . . . . . . . . . . . . . . . . . . 6
5.6.3 Power good output (XSHUTDOWN). . . . . . . . . 7
6 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 8
7 Recommended operating conditions. . . . . . . . 8
8 Static characteristics. . . . . . . . . . . . . . . . . . . . . 9
9 Dynamic characteristics . . . . . . . . . . . . . . . . . 10
9.1 Efficiency . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
9.2 Output voltage ripple. . . . . . . . . . . . . . . . . . . . 11
9.3 Output voltage variation . . . . . . . . . . . . . . . . . 12
9.4 Line transient response . . . . . . . . . . . . . . . . . 12
9.5 Load transient response. . . . . . . . . . . . . . . . . 13
9.6 Start-up/enable . . . . . . . . . . . . . . . . . . . . . . . . 14
10 Application information. . . . . . . . . . . . . . . . . . 15
10.1 Recommended inductors . . . . . . . . . . . . . . . . 15
10.2 Input capacitor . . . . . . . . . . . . . . . . . . . . . . . . 15
10.3 Output capacitor . . . . . . . . . . . . . . . . . . . . . . . 15
11 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
12 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 17
13 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
14 Soldering of WLCSP packages. . . . . . . . . . . . 18
14.1 Introduction to soldering WLCSP packages . . 18
14.2 Board mounting . . . . . . . . . . . . . . . . . . . . . . . 18
14.3 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 19
14.3.1 Stand off . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
14.3.2 Quality of solder joint . . . . . . . . . . . . . . . . . . . 20
14.3.3 Rework . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
14.3.4 Cleaning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
15 Mounting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
15.1 PCB design guidelines. . . . . . . . . . . . . . . . . . 21
15.2 PCB assembly guidelines for Pb-free soldering. .
21
16 References. . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
17 Revision history . . . . . . . . . . . . . . . . . . . . . . . 23
18 Legal information . . . . . . . . . . . . . . . . . . . . . . 24
18.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 24
18.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
18.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . 24
18.4 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 25
19 Contact information . . . . . . . . . . . . . . . . . . . . 25
20 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

Products related to this Datasheet

IC REG BUCK 1.2V 650MA 6WLCSP
Available Quantity: 0
Unit Price: 0
IC REG BUCK 1.5V 650MA 6WLCSP
Available Quantity: 0
Unit Price: 0
IC REG BUCK 1.8V 650MA 6WLCSP
Available Quantity: 0
Unit Price: 0
IC REG BUCK PROG 650MA 6WLCSP
Available Quantity: 0
Unit Price: 0
IC REG BUCK PROG 650MA 6WLCSP
Available Quantity: 0
Unit Price: 0
IC REG BUCK PROG 650MA 6WLCSP
Available Quantity: 0
Unit Price: 0
IC REG BUCK PROG 650MA 6WLCSP
Available Quantity: 0
Unit Price: 0
IC REG BUCK PROG 650MA 6WLCSP
Available Quantity: 0
Unit Price: 0
IC REG BUCK PROG 650MA 6WLCSP
Available Quantity: 0
Unit Price: 0
IC REG BUCK 1.2V 650MA 6WLCSP
Available Quantity: 0
Unit Price: 0
IC REG BUCK 1.5V 650MA 6WLCSP
Available Quantity: 0
Unit Price: 0
IC REG BUCK 1.8V 650MA 6WLCSP
Available Quantity: 0
Unit Price: 0
IC REG BUCK 2.85V 650MA 6WLCSP
Available Quantity: 0
Unit Price: 0
SWITCHING REGULATOR
Available Quantity: 4,500
Unit Price: 0
SWITCHING REGULATOR
Available Quantity: 7,800
Unit Price: 0
SWITCHING REGULATOR
Available Quantity: 4,500
Unit Price: 0
SWITCHING REGULATOR
Available Quantity: 4,500
Unit Price: 0