SEAF Series Datasheet by Samtec Inc.

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HIGH-SPEED/HIGH-DENSITY OPEN-PlN-FIELD
(1.27 mm) .050" SEAF SERIES
SEAF–30–05.0–S–08–2–A–K–TR
SEAF–20–05.0–S–10–2–A–K–TR
SEAF–30–05.0–S–08–2–A–LP–K–TR
Up to
500 pins
Solder
charges
Low
insertion/
extraction
forces
Due to technical progress, all designs, specifications and components are subject to change without notice.
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
WWW.SAMTEC.COM
Board Mates:
SEAM, SEAMP,
SEAR, SEAMI
Cable Mates:
SEAC*
Standoffs:
JSO
*NOTE:
SEAFC is recommended
to mate to SEAC cable.
Visit www.samtec.com?SEAFC
for specifications.
HIGH-SPEED/HIGH-DENSITY OPEN-PIN-FIELD
LEAD
STYLE A
–05.0 (5.05)
.199
–06.0 (6.05)
.238
–06.5 (6.55)
.258
–07.5 (7.54)
.297
LP
SEAF A K “X”R
PLATING
OPTION
NO. OF
ROWS
LEAD
STYLE
– 04
=Four
Rows
– 05
=Five
Rows
– 06
=Six
Rows
– 08
=Eight
Rows
– 10
=Ten
Rows
TR
= Tape & Reel
–FR
= Full Reel
Tape & Reel
Packaging
(Must order
max. quantities
per reel.
Contact
Samtec for
parts per reel)
– LP
= Latch Post
(–LP required
for SEAC
mate only)
(Available with
–05.0 lead style
and –04, –06, –08
& –10 rows only)
Specify
LEAD
STYLE
from
chart
NO. PINS
PER ROW
–L
= 10 µ"
(0.25 µm)
Gold on
contact
area,
Matte Tin on
solder tail
–S
= 30 µ"
(0.76 µm)
Gold on
contact
area,
Matte Tin on
solder tail
OPTION
NO. OF
ROWS B
–04 (5.66) .223
–05, –06 (8.20) .323
–08 (10.74) .423
–10 (13.28) .523
(1.12 mm)
.044"
NOMINAL
WIPE
SOLDER
TYPE
– 1
= Tin/Lead
Alloy
Solder
Charge
– 2
= Lead-Free
Solder
Charge
–10, –15, 20,
30, –40, –50
(–10 only available
in 04 row)
(–15 only available
in 04 or 10 row with
–05.0 lead style)
No. of positions x
(1.27) .050 + (5.82) .229
No. of positions x
(1.27) .050 + (3.58) .141
A
(0.29)
.009
(1.27) .050
A1
H1
(1.27)
.050
(1.12) .044 DIA
(1.78)
.070
(15.49)
.610
B(1.27)
.050
SPECIFICATIONS
For complete scope of
recognitions see
www.samtec.com/quality
RECOGNITIONS
FILE NO. E111594
Notes:
IPC-A-610F and
IPC J-STD-001F Class 3
solder joint.
Some sizes, styles and
options are non-standard,
non-returnable.
Compatible with
UMPT/UMPS for flexible
two-piece power/signal solutions
POWER/SIGNAL
APPLICATION
For complete specifications and
recommended PCB layouts see
www.samtec.com?SEAF
Insulator Material:
Black LCP
Contact Material:
Copper Alloy
Operating Temp Range:
-55 °C to +125 °C
Current Rating
(7 mm stack height):
2.7 A per pin
(10 adjacent pins powered)
Plating:
Au or Sn over
50 µ" (1.27 µm) Ni
Working Voltage:
240 VAC
RoHS Compliant:
Yes (–2 Solder type only)
Lead-Free Solderable:
Ye s
EXTENDED LIFE
PRODUCT
10 YEAR MFG
WITH 30 µ" GOLD
HIGH MATING
CYCLES
HIGH-SPEED CHANNEL PERFORMANCE
SEAF/SEAM @ 10 mm Mated Stack Height
Rating based on Samtec reference channel.
For full SI performance data visit Samtec.com
or contact SIG@samtec.com
STANDARDS
VITA 47
VITA 57.1 FMC
VITA 57.4 FMC+
VITA 74 VNX
• PISMO2
Visit www.samtec.com/standards
for more information.
DIFFERENTIAL
SIGNAL ROUTING
The above signal routing
configuration allows for
the use of 25 to 125
differential pair counts.
Contact sig@samtec.com
for specific details.
(1.27) .050
(1.27)
.050
F-219 (Rev 08MAY20)

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