S606 Datasheet by t-Global Technology

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Thermal Compound
Version 1.280318
Thermal Compound
TG-S606 is a silicone based thermal grease that has been designed for high
performance CPUs and similar applications. It has a thermal conductivity of 3.6 W/
mK, superior wetting characteristics, resulting in a very low thermal resistance and
excellent long term reliability.
Good thermal conductivity
Easy to assemble
High stability
Does not harden with time
Electronic components: IC, CPU, MOS
LED, M/B, P/S, Heat Sink
LCD TV, Notebook PC, PC Telecom Device, Wireless Hub, etc.
DDR II Module, DVD Applications, Hand-set applications, etc.
REACH Compliant
ROHS Compliant
T-Global Technology Limited
1 & 2 Cosford Business Park, Central Park,
Lutterworth, Leicestershire LE17 4QU U.K.
Tel: +44 (0)1455 553 510
Email: sales@tglobaltechnology.com
Web: www.tglobaltechnology.com
Skype: tglobal.technology
VAT #: GB 116 662 714
Property TG-S606 Unit Test Method
Colour White - Visual
Thermal Conductivity 3.6 W/mK ASTM D5470
Weight Loss <0.5 % ASTM E595
Density 2.3 g/cm³ ASTM D792
Working Temperature -40 to180 ºC -
Volume Resistance >10¹² Ohm-cm ASTM D257
Standard Packaging
Packaging Weight (gr)
Pot 30g
Pot 50g
Pot 1 kg
TG-S606 has a self-life of eighteen (18) months from the date of manufac-
ture, as indicated by the lot number, when stored in the original, unopened
contained at, or below 25˚C.
NOTICE: The information contained herein is to the best of our knowledge true and accurate. How-
ever, since the varied conditions of potential use are beyond our control, all recommendations or
suggestions are presented without guarantee or responsibility on our part and users should make
their own test to determine the suitability of our products in any specific situation. This product is
sold without warranty either expressed or implied, of fitness for a particular purpose or otherwise,
except that this product shall be of standard quality, and except to the extent otherwise stated in
T-Global Technology Europe and North America’s invoice, quotation, or order acknowledgment. We
disclaim any and all liabilities incurred in connection with the use of information contained herein, or
otherwise. All risks of such are assumed by the user. Furthermore, nothing contained herein shall
be construed as a recommendation to use any process or to manufacture or to use any product in
conflict with existing or future patents covering any product or material or its use.

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