STPS1L40-Y Datasheet by STMicroelectronics

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E] hieaugmented
October 2016
DocID018247 Rev 2
1/13
This is information on a product in full production.
www.st.com
STPS1L40-Y
Automotive low drop power Schottky rectifier
Datasheet - production data
Features
AEC-Q101 qualified
Very small conduction losses
Negligible switching losses
Low forward voltage drop
Surface mount miniature packages
Avalanche capability specified
PPAP capable
Description
Single chip Schottky rectifiers suited to switched
mode power supplies and high frequency DC to
DC converters.
Packaged in SOD123Flat, SMA and SMB, this
device is especially intended for surface
mounting and used in low voltage, high frequency
inverters, free-wheeling and polarity protection in
automotive applications.
Table 1: Device summary
Symbol
IF(AV)
1 A
VRRM
40 V
VF (typ.)
0.37 V
Tj (max.)
175 °C
K
A
SMBSMA
K
A
K
A
SOD123Flat
A
K
Characteristics
STPS1L40-Y
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DocID018247 Rev 2
1 Characteristics
Table 2: Absolute ratings (limiting values at 25 °C, unless otherwise specified)
Symbol
Parameter
Value
Unit
VRRM
Repetitive peak reverse voltage
Tj = -40 °C to +175 °C
40
V
IF(AV)
Average forward current
δ = 0.5, square wave
SMA/SMB: TL = 155 °C
1
A
SOD123Flat: TL = 160 °C
IFSM
Surge non repetitive forward current,
tp = 10 ms sinusoidal
SMA/SMB
60
A
SOD123Flat
50
PARM
Repetitive peak avalanche power
tp = 10 µs, Tj = 125 °C
65
W
Tstg
Storage temperature range
-65 to +175
°C
Tj
Operating junction temperature range(1)
-40 to +175
Notes:
(1)(dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink.
Table 3: Thermal parameters
Symbol
Parameter
Max. value
Unit
Rth(j-l)
Junction to lead
SMA
30
°C/W
SMB
25
SOD123Flat
20
Table 4: Static electrical characteristics
Symbol
Parameter
Test conditions
Min.
Typ.
Max.
Unit
IR(1)
Reverse leakage current
Tj = 25 °C
VR = VRRM
-
35
µA
Tj = 125 °C
-
6
10
mA
VF(2)
Forward voltage drop
Tj = 25 °C
IF = 1 A
-
0.50
V
Tj = 125 °C
-
0.37
0.42
Notes:
(1)Pulse test: tp = 5 ms, δ < 2%
(2)Pulse test: tp = 380 µs, δ < 2%
To evaluate the conduction losses, use the following equation:
P = 0.23 x IF(AV) + 0.19 x IF2(RMS)
For more information, please refer to the following application notes related to the power
losses.
AN604 (Calculation of conduction losses in a power rectifier)
AN4021 (Calculation of reverse losses in a power diode)
STPS1L40-Y
Characteristics
DocID018247 Rev 2
3/13
1.1 Characteristics (curves)
Figure 1: Average forward power dissipation
versus average forward current
Figure 2: Average forward current versus ambient
temperature (δ = 0.5)
Figure 3: Average forward current versus ambient
temperature (δ = 0.5)
Figure 4: Average forward current versus ambient
temperature (δ = 0.5)
Figure 5: Normalized avalanche power derating
versus pulse duration (Tj = 125 °C)
Figure 6: Relative variation of thermal impedance
junction to ambient versus pulse duration
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6
δ= 0.05 δ= 0.1 δ= 0.2 δ= 0.5 δ= 1
T
δ= tp/T tp
IF(AV)(A)
PF(AV)(W)
IF(AV)(A)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
0 25 50 75 100 125 150 175
Rth(j-a) = Rth(j-l)
T
δ= tp/T tp
SMA
TambC)
IF(AV)(A)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
0 25 50 75 100 125 150 175
Rth(j-a) = Rth(j-l)
T
= tp/T tp
δ
SMB
Tamb(°C)
0
1
2
3
4
5
0 25 50 75 100 125 150 175
Rth(j-a) = Rth(j-l)
T
δ= tp/T tp
SOD123 flat
Tamb(°C)
IF(AV)(A)
P (tp)
P (10 µs)
ARM
ARM
0.001
0.01
0.1
1
1 10 100 1000
t (µs)
p
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
tP(s)
Single pulse
SMA
Zth(j-a)/Rth(j-a)
Epoxy printed circuit board,
copper thickness = 35 µm, 
recommended pad layout
Em mo m an ‘FLAJ am no D102 03 04 us up an as mg m m 12
Characteristics
STPS1L40-Y
4/13
DocID018247 Rev 2
Figure 7: Relative variation of thermal impedance
junction to ambient versus pulse duration
Figure 8: Relative variation of thermal impedance
junction to lead versus pulse duration
Figure 9: Reverse leakage current versus reverse
voltage applied (typical values)
Figure 10: Junction capacitance versus reverse
voltage applied (typical values)
Figure 11: Forward voltage drop versus forward
current (typical values)
Figure 12: Thermal resistance junction to ambient
versus copper surface under each lead
(typical values)
Zth(j-a)/Rth(j-a)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
SMB
tP(s)
Single pulse
Epoxy printed circuit board,
copper thickness = 35 µm, 
recommended pad layout
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01
Single pulse
SOD123Flat
Zth(j-l)/Rth(j-l)
tp(s)
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
0 5 10 15 20 25 30 35 40
Tj= 150 °C
Tj= 125 °C
Tj= 25 °C
Tj= 100 °C
Tj= 75 °C
Tj= 50 °C
IR(mA)
VR(V)
10
100
1000
1 10 100
F = 1 MHz
VOSC = 30 mVRMS
Tj= 25 °C
C(pF)
VR(V)
Rth(j-a)(°C/W)
0
50
100
150
200
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
SMA
SCu(cm²)
Epoxy printed board FR4, eCu = 35 µm
STPS1L40-Y
Characteristics
DocID018247 Rev 2
5/13
Figure 13: Thermal resistance junction to ambient
versus copper surface under each lead
(typical values)
Figure 14: Thermal resistance junction to ambient
versus copper surface under each lead
(typical values)
Rth(j-a)(°C/W)
0
50
100
150
200
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
SMB
SCu(cm²)
Epoxy printed board FR4, eCu = 35 µm
0
50
100
150
200
250
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
SOD123Flat
SCu(cm²)
Rth(j-a)(C/W)
Epoxy printed board FR4, eCu = 35 µm
Package information
STPS1L40-Y
6/13
DocID018247 Rev 2
2 Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Epoxy meets UL94, V0
Cooling method: by conduction (C)
2.1 SMA package information
Figure 15: SMA package outline
Table 5: SMA package mechanical data
Ref.
Dimensions
Millimeters
Inches
Min.
Max.
Min.
Max.
A1
1.90
2.45
0.075
0.097
A2
0.05
0.20
0.002
0.008
b
1.25
1.65
0.049
0.065
c
0.15
0.40
0.006
0.016
D
2.25
2.90
0.089
0.114
E
4.80
5.35
0.189
0.211
E1
3.95
4.60
0.156
0.181
L
0.75
1.50
0.030
0.059
E
CL
E1
D
A1
A2 b
\%
STPS1L40-Y
Package information
DocID018247 Rev 2
7/13
Figure 16: SMA recommended footprint in mm (inches)
2.63
(0.103)
5.43
(0.214)
1.4
1.64
(0.064)
1.4
)550.0()550.0(
rm LE 4
Package information
STPS1L40-Y
8/13
DocID018247 Rev 2
2.2 SMB package information
Figure 17: SMB package outline
Table 6: SMB package mechanical data
Ref.
Dimensions
Millimeters
Inches
Min.
Max.
Min.
Max.
A1
1.90
2.45
0.0748
0.0965
A2
0.05
0.20
0.0020
0.0079
b
1.95
2.20
0.0768
0.0867
c
0.15
0.40
0.0059
0.0157
D
3.30
3.95
0.1299
0.1556
E
5.10
5.60
0.2008
0.2205
E1
4.05
4.60
0.1594
0.1811
L
0.75
1.50
0.0295
0.0591
STPS1L40-Y
Package information
DocID018247 Rev 2
9/13
Figure 18: SMB recommended footprint
millimeters
(inches)
1.62
0.064 1.62
0.064
2.60
(0.102)
5.84
(0.230)
2.18
(0.086)
Package information
STPS1L40-Y
10/13
DocID018247 Rev 2
2.3 SOD123Flat package information
Figure 19: SOD123Flat package outline
Table 7: SOD123Flat package mechanical data
Ref.
Dimensions
Millimeters
Min.
Typ.
Max.
A
0.86
0.98
1.10
b
0.80
0.90
1.00
c
0.08
0.15
0.25
c1
0.00
0.10
D
2.50
2.60
2.70
E
1.50
1.60
1.80
HD
3.30
3.50
3.70
L
0.45
0.65
0.85
C1
C
L
L
E
b
A
D
HD
STPS1L40-Y
Package information
DocID018247 Rev 2
11/13
Figure 20: SOD123Flat footprint dimensions (mm)
1.30 1.60
1.40
Ordering information
STPS1L40-Y
12/13
DocID018247 Rev 2
3 Ordering information
Table 8: Ordering information
Order code
Marking
Package
Weight
Base qty.
Delivery mode
STPS1L40AY
GB4Y
SMA
68 mg
5000
Tape and reel
STPS1L40UY
GC4Y
SMB
107 mg
2500
Tape and reel
STPS1L40ZFY
1Y4
SOD123Flat
12.5 mg
3000
Tape and reel
4 Revision history
Table 9: Document revision history
Date
Revision
Changes
21-Oct-2011
1
First issue.
01-Oct-2016
2
Added SOD123Flat package.
STPS1L40-Y
DocID018247 Rev 2
13/13
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