MC74AC(T)14 Datasheet by onsemi

J ‘ 0N Semiconductnr® www.0nsemi.com H H H H H N H @ DSUFFIX 14 CASE‘ISIA 0 ‘ H H H H H H H 14 H H H H H xxx TSSOP—M ‘4 D1 SUFFIX ALYW- CASEQAEG o - ‘ HHHHH xxx =AC ovACT A = Assembly Localion WLarL =Wa¢erLoI Y =Year ww or w = Work Week a or - = PbiFvee Package “mmmmmmm >{>o{>o >090 mmmmmmmm (Top View) Figure 1. Pinom: 14—Lead Packages Conduclors FUNCTION TABLE Input Output A o L H H L ORDERING INFORMATION See named omenng and smppmg mmrmauan m we package mmensmns sechan on page 5 av (ms dam sham Fuh‘icatian Oldel Number. MC74ACI 41D
© Semiconductor Components Industries, LLC, 2015
January, 2015 − Rev. 10 1Publication Order Number:
MC74AC14/D
MC74AC14, MC74ACT14
Hex Inverter Schmitt
Trigger
High−Performance Silicon−Gate CMOS
The MC74AC14/74ACT14 contains six logic inverters which
accept standard CMOS Input signals (TTL levels for MC74ACT14)
and provide standard CMOS output levels. They are capable of
transforming slowly changing input signals into sharply defined,
jitter−free output signals. In addition, they have a greater noise margin
then conventional inverters.
The MC74AC14/74ACT14 has hysteresis between the
positive−going and negative−going input thresholds (typically 1.0 V)
which is determined internally by transistor ratios and is essentially
insensitive to temperature and supply voltage variations.
Features
Schmitt Trigger Inputs
Outputs Source/Sink 24 mA
MC74ACT14 Has TTL Compatible Inputs
NLV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
www.onsemi.com
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
ORDERING INFORMATION
1314 12 11 10 9 8
21 34567
GND
VCC
(Top View)
Figure 1. Pinout: 14−Lead Packages
Conductors
FUNCTION TABLE
Input
A
Output
O
L
HH
L
MARKING
DIAGRAMS
xxx = AC or ACT
A = Assembly Location
WL or L = Wafer Lot
Y = Year
WW or W = Work Week
G or G= Pb−Free Package
TSSOP−14
DT SUFFIX
CASE 948G
xxx
14
ALYWG
G
1
14
SOIC−14
D SUFFIX
CASE 751A
1
14
1
14
xxx14G
AWLYWW
1
14
(Note: Microdot may be in either location)
MC74AC14, MC74ACT14
www.onsemi.com
2
MAXIMUM RATINGS
Symbol Parameter Value Unit
VCC DC Supply Voltage *0.5 to )7.0 V
VIDC Input Voltage *0.5 v VI v VCC )0.5 V
VODC Output Voltage (Note 1) *0.5 v VO v VCC )0.5 V
IIK DC Input Diode Current $20 mA
IOK DC Output Diode Current $50 mA
IODC Output Sink/Source Current $50 mA
ICC DC Supply Current per Output Pin $50 mA
IGND DC Ground Current per Output Pin $50 mA
TSTG Storage Temperature Range *65 to )150 °C
TLLead temperature, 1 mm from Case for 10 Seconds 260 °C
TJJunction temperature under Bias )150 °C
qJA Thermal Resistance (Note 2) SOIC
TSSOP 125
170
°C/W
PDPower Dissipation in Still Air at 85°C SOIC
TSSOP 125
170 mW
MSL Moisture Sensitivity Level 1
FRFlammability Rating Oxygen Index: 30% − 35% UL 94 V−0 @ 0.125 in
VESD ESD Withstand Voltage Human Body Model (Note 3)
Machine Model (Note 4)
Charged Device Model (Note 5)
> 2000
> 200
> 1000
V
ILatch−Up Latch−Up Performance Above VCC and Below GND at 85°C (Note 6) $100 mA
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. IO absolute maximum rating must be observed.
2. The package thermal impedance is calculated in accordance with JESD51−7.
3. Tested to EIA/JESD22−A114−A.
4. Tested to EIA/JESD22−A115−A.
5. Tested to JESD22−C101−A.
6. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol Parameter Min Typ Max Unit
VCC Supply Voltage AC 2.0 5.0 6.0 V
ACT 4.5 5.0 5.5
Vin, Vout DC Input Voltage, Output Voltage (Ref. to GND) 0 − VCC V
tr, tfInput Rise and Fall Time (Note 1)
AC Devices except Schmitt Inputs
VCC @ 3.0 V − 150 −
VCC @ 4.5 V 40 − ns/V
VCC @ 5.5 V − 25
tr, tfInput Rise and Fall Time (Note 2)
ACT Devices except Schmitt Inputs
VCC @ 4.5 V 10 ns/V
VCC @ 5.5 V − 8.0 −
TJJunction Temperature (PDIP) 140 °C
TAOperating Ambient Temperature Range −40 25 85 °C
IOH Output Current − High −24 mA
IOL Output Current − Low 24 mA
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
1. Vin from 30% to 70% VCC; see individual Data Sheets for devices that differ from the typical input rise and fall times.
2. Vin from 0.8 V to 2.0 V; see individual Data Sheets for devices that differ from the typical input rise and fall times.
u \4N : v CC
MC74AC14, MC74ACT14
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3
DC CHARACTERISTICS
Symbol Parameter VCC
(V)
74AC 74AC
Unit Conditions
TA = +25°C TA = −40°C to +85°C
Typ Guaranteed Limits
VOH Minimum High Level Output Voltage 3.0 2.99 2.9 2.9 IOUT = −50 mA
4.5 4.49 4.4 4.4 V
5.5 5.49 5.4 5.4
V
*VIN = VIL or VIH
3.0 − 2.56 2.46 −12 mA
4.5 − 3.86 3.76 IOH −24 mA
5.5 − 4.86 4.76 −24 mA
VOL Maximum Low Level Output Voltage 3.0 0.002 0.1 0.1 IOUT = 50 mA
4.5 0.001 0.1 0.1 V
5.5 0.001 0.1 0.1
V
*VIN = VIL or VIH
3.0 − 0.36 0.44 12 mA
4.5 − 0.36 0.44 IOL 24 mA
5.5 − 0.36 0.44 24 mA
IIN Maximum Input Leakage Current 5.5 ±0.1 ±1.0 mAVI = VCC, GND
IOLD †Minimum Dynamic Output Current 5.5 75 mA VOLD = 1.65 V Max
IOHD 5.5 − −75 mA VOHD = 3.85 V Min
ICC Maximum Quiescent Supply Current 5.5 − 4.0 40 mAVIN = VCC or GND
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
*All outputs loaded; thresholds on input associated with output under test.
Maximum test duration 2.0 ms, one output loaded at a time.
NOTE: IIN and ICC @ 3.0 V are guaranteed to be less than or equal to the respective limit @ 5.5 V VCC.
AC CHARACTERISTICS
Symbol Parameter VCC*
(V)
74AC 74AC
Unit Figure
No.
TA = +25°C CL = 50 pF TA = −40°C to
+85°C CL = 50 pF
Min Typ Max Min Max
tPLH Propagation Delay 3.3 1.5 9.5 13.5 1.5 15.0 ns 3−5
5.0 1.5 7.0 10.0 1.5 11.0
tPHL Propagation Delay 3.3 1.5 7.5 11.5 1.5 13.0 ns 3−5
5.0 1.5 6.0 8.5 1.5 9.5
*Voltage Range 3.3 V is 3.3 V ±0.3 V. Voltage Range 5.0 V is 5.0 V ±0.5 V.
u VW :V cc
MC74AC14, MC74ACT14
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4
INPUT CHARACTERISTICS (unless otherwise specified)
Symbol Parameter VCC
(V) 74AC 74ACT Test Conditions
Maximum Positive Threshold
3.0 2.2
Vt +4.5 3.2 2.0 V TA = Worst Case
5.5 3.9 2.0
Minimum Negative Threshold
3.0 0.5
Vt 4.5 0.9 0.8 V TA = Worst Case
5.5 1.1 0.8
3.0 1.2
Vh(max) Maximum Hysteresis 4.5 1.4 1.2 V TA = Worst Case
5.5 1.6 1.2
3.0 0.3
Vh(min) Minimum Hysteresis 4.5 0.4 0.4 V TA = Worst Case
5.5 0.5 0.4
DC CHARACTERISTICS
Symbol Parameter VCC
(V)
74ACT 74ACT
Unit Conditions
TA = +25°C TA = −40°C to +85°C
Typ Guaranteed Limits
VOH Minimum High Level Output Voltage 4.5 4.49 4.4 4.4 VIOUT = −50 mA
5.5 5.49 5.4 5.4
*VIN = VIL or VIH
4.5 3.86 3.76 V IOH −24 mA
5.5 − 4.86 4.76 −24 mA
VOL Maximum Low Level Output Voltage 4.5 0.001 0.1 0.1 VIOUT = 50 mA
5.5 0.001 0.1 0.1
*VIN = VIL or VIH
4.5 0.36 0.44 V IOL 24 mA
5.5 − 0.36 0.44 24 mA
IIN Maximum Input Leakage Current 5.5 ±0.1 ±1.0 mAVI = VCC, GND
DICCT Additional Max. ICC/Input 5.5 0.6 1.5 mA VI = VCC − 2.1 V
IOLD †Minimum Dynamic Output Current 5.5 75 mA VOLD = 1.65 V Max
IOHD 5.5 − −75 mA VOHD = 3.85 V Min
ICC Maximum Quiescent Supply Current 5.5 − 4.0 40 mAVIN = VCC or GND
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
*All outputs loaded; thresholds on input associated with output under test.
Maximum test duration 2.0 ms, one output loaded at a time.
AC CHARACTERISTICS
Symbol Parameter VCC*
(V)
74ACT 74ACT
Unit Figure
No.
TA = +25°C CL = 50 pF TA = −40°C to
+85°C CL = 50 pF
Min Typ Max Min Max
tPLH Propagation Delay 5.0 1.5 11.5 1.0 12.5 ns 3−5
tPHL Propagation Delay 5.0 1.5 10.0 1.0 11.0 ns 3−5
*Voltage Range 5.0 V is 5.0 V ±0.5 V.
CAPACITANCE
Symbol Parameter Value Typ Unit Test Conditions
CIN Input Capacitance 4.5 pF VCC = 5.0 V
CPD Power Dissipation Capacitance 25 pF VCC = 5.0 V
MC74AC14, MC74ACT14
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5
ORDERING INFORMATION
Device Package Shipping
MC74AC14DG
SOIC−14
(Pb−Free)
55 Units / Rail
MC74AC14DR2G 2500 / Tape & Reel
NLV74AC14DR2G* 2500 / Tape & Reel
MC74AC14DTR2G TSSOP−14
(Pb−Free) 2500 / Tape & Reel
MC74ACT14DG SOIC−14
(Pb−Free)
55 Units / Rail
MC74ACT14DR2G 2500 / Tape & Reel
MC74ACT14DTR2G TSSOP−14
(Pb−Free) 2500 / Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable.
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SOIC14 NB
CASE 751A03
ISSUE L
DATE 03 FEB 2016
SCALE 1:1
1
14
GENERIC
MARKING DIAGRAM*
XXXXXXXXXG
AWLYWW
1
14
XXXXX = Specific Device Code
A = Assembly Location
WL = Wafer Lot
Y = Year
WW = Work Week
G = PbFree Package
*This information is generic. Please refer to
device data sheet for actual part marking.
PbFree indicator, “G” or microdot “ G”,
may or may not be present.
STYLES ON PAGE 2
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF AT
MAXIMUM MATERIAL CONDITION.
4. DIMENSIONS D AND E DO NOT INCLUDE
MOLD PROTRUSIONS.
5. MAXIMUM MOLD PROTRUSION 0.15 PER
SIDE.
H
14 8
71
M
0.25 B M
C
h
X 45
SEATING
PLANE
A1
A
M
_
S
A
M
0.25 B S
C
b
13X
B
A
E
D
e
DETAIL A
L
A3
DETAIL A
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
D8.55 8.75 0.337 0.344
E3.80 4.00 0.150 0.157
A1.35 1.75 0.054 0.068
b0.35 0.49 0.014 0.019
L0.40 1.25 0.016 0.049
e1.27 BSC 0.050 BSC
A3 0.19 0.25 0.008 0.010
A1 0.10 0.25 0.004 0.010
M0 7 0 7
H5.80 6.20 0.228 0.244
h0.25 0.50 0.010 0.019
__ __
6.50
14X
0.58
14X
1.18
1.27
DIMENSIONS: MILLIMETERS
1
PITCH
SOLDERING FOOTPRINT*
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
0.10
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
98ASB42565B
DOCUMENT NUMBER:
DESCRIPTION:
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Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
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SOIC14 NB
© Semiconductor Components Industries, LLC, 2019 www.onsemi.com
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SOIC14
CASE 751A03
ISSUE L
DATE 03 FEB 2016
STYLE 7:
PIN 1. ANODE/CATHODE
2. COMMON ANODE
3. COMMON CATHODE
4. ANODE/CATHODE
5. ANODE/CATHODE
6. ANODE/CATHODE
7. ANODE/CATHODE
8. ANODE/CATHODE
9. ANODE/CATHODE
10. ANODE/CATHODE
11. COMMON CATHODE
12. COMMON ANODE
13. ANODE/CATHODE
14. ANODE/CATHODE
STYLE 5:
PIN 1. COMMON CATHODE
2. ANODE/CATHODE
3. ANODE/CATHODE
4. ANODE/CATHODE
5. ANODE/CATHODE
6. NO CONNECTION
7. COMMON ANODE
8. COMMON CATHODE
9. ANODE/CATHODE
10. ANODE/CATHODE
11. ANODE/CATHODE
12. ANODE/CATHODE
13. NO CONNECTION
14. COMMON ANODE
STYLE 6:
PIN 1. CATHODE
2. CATHODE
3. CATHODE
4. CATHODE
5. CATHODE
6. CATHODE
7. CATHODE
8. ANODE
9. ANODE
10. ANODE
11. ANODE
12. ANODE
13. ANODE
14. ANODE
STYLE 1:
PIN 1. COMMON CATHODE
2. ANODE/CATHODE
3. ANODE/CATHODE
4. NO CONNECTION
5. ANODE/CATHODE
6. NO CONNECTION
7. ANODE/CATHODE
8. ANODE/CATHODE
9. ANODE/CATHODE
10. NO CONNECTION
11. ANODE/CATHODE
12. ANODE/CATHODE
13. NO CONNECTION
14. COMMON ANODE
STYLE 3:
PIN 1. NO CONNECTION
2. ANODE
3. ANODE
4. NO CONNECTION
5. ANODE
6. NO CONNECTION
7. ANODE
8. ANODE
9. ANODE
10. NO CONNECTION
11. ANODE
12. ANODE
13. NO CONNECTION
14. COMMON CATHODE
STYLE 4:
PIN 1. NO CONNECTION
2. CATHODE
3. CATHODE
4. NO CONNECTION
5. CATHODE
6. NO CONNECTION
7. CATHODE
8. CATHODE
9. CATHODE
10. NO CONNECTION
11. CATHODE
12. CATHODE
13. NO CONNECTION
14. COMMON ANODE
STYLE 8:
PIN 1. COMMON CATHODE
2. ANODE/CATHODE
3. ANODE/CATHODE
4. NO CONNECTION
5. ANODE/CATHODE
6. ANODE/CATHODE
7. COMMON ANODE
8. COMMON ANODE
9. ANODE/CATHODE
10. ANODE/CATHODE
11. NO CONNECTION
12. ANODE/CATHODE
13. ANODE/CATHODE
14. COMMON CATHODE
STYLE 2:
CANCELLED
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
98ASB42565B
DOCUMENT NUMBER:
DESCRIPTION:
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Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
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SOIC14 NB
© Semiconductor Components Industries, LLC, 2019 www.onsemi.com
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TSSOP14 WB
CASE 948G
ISSUE C
DATE 17 FEB 2016
SCALE 2:1
1
14
*This information is generic. Please refer to
device data sheet for actual part marking.
PbFree indicator, “G” or microdot “ G”,
may or may not be present.
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A4.90 5.10 0.193 0.200
B4.30 4.50 0.169 0.177
C−−− 1.20 −−− 0.047
D0.05 0.15 0.002 0.006
F0.50 0.75 0.020 0.030
G0.65 BSC 0.026 BSC
H0.50 0.60 0.020 0.024
J0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L6.40 BSC 0.252 BSC
M0 8 0 8
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL
IN EXCESS OF THE K DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE W.
____
S
U0.15 (0.006) T
2X L/2
S
U
M
0.10 (0.004) V S
T
LU
SEATING
PLANE
0.10 (0.004)
T
SECTION NN
DETAIL E
JJ1
K
K1
DETAIL E
F
M
W
0.25 (0.010)
8
14
7
1
PIN 1
IDENT.
H
G
A
D
C
B
S
U0.15 (0.006) T
V
14X REFK
N
N
GENERIC
MARKING DIAGRAM*
XXXX
XXXX
ALYWG
G
1
14
A = Assembly Location
L = Wafer Lot
Y = Year
W = Work Week
G= PbFree Package
7.06
14X
0.36 14X
1.26
0.65
DIMENSIONS: MILLIMETERS
1
PITCH
SOLDERING FOOTPRINT
(Note: Microdot may be in either location)
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
98ASH70246A
DOCUMENT NUMBER:
DESCRIPTION:
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
TSSOP14 WB
© Semiconductor Components Industries, LLC, 2019 www.onsemi.com
a a e lrademavks av Semxcunduclm Cnmvnnems In "sine \ghlsmanumhernlpalems \rademavks Dav www menu cumrsuerguwaxem Mavkmg gm 9 www nnserm cum
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1
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