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XC2C32A Datasheet

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Datasheet

DS090 (v3.1) September 11, 2008 www.xilinx.com 1
Product Specification
© 2002–2008 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm.
All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.
Features
Optimized for 1.8V systems
- Industry’s fastest low power CPLD
- Densities from 32 to 512 macrocells
Industry’s best 0.18 micron CMOS CPLD
- Optimized architecture for effective logic synthesis
- Multi-voltage I/O operation — 1.5V to 3.3V
Advanced system features
- Fastest in system programming
· 1.8V ISP using IEEE 1532 (JTAG) interface
- On-The-Fly Reconfiguration (OTF)
- IEEE1149.1 JTAG Boundary Scan Test
- Optional Schmitt trigger input (per pin)
- Multiple I/O banks on all devices
- Unsurpassed low power management
· DataGATE external signal control
- Flexible clocking modes
· Optional DualEDGE triggered registers
· Clock divider (÷ 2,4,6,8,10,12,14,16)
· CoolCLOCK
- Global signal options with macrocell control
· Multiple global clocks with phase selection per
macrocell
· Multiple global output enables
· Global set/reset
- Abundant product term clocks, output enables and
set/resets
- Efficient control term clocks, output enables and
set/resets for each macrocell and shared across
function blocks
- Advanced design security
- Open-drain output option for Wired-OR and LED
drive
- Optional bus-hold, 3-state or weak pullup on select
I/O pins
- Optional configurable grounds on unused I/Os
- Mixed I/O voltages compatible with 1.5V, 1.8V,
2.5V, and 3.3V logic levels on all parts
- SSTL2_1,SSTL3_1, and HSTL_1 on 128
macrocell and denser devices
- Hot pluggable
PLA architecture
- Superior pinout retention
- 100% product term routability across function block
Wide package availability including fine pitch:
- Chip Scale Package (CSP) BGA, Fine Line BGA,
TQFP, PQFP, VQFP, and QFN packages
- Pb-free available for all packages
Design entry/verification using Xilinx and industry
standard CAE tools
Free software support for all densities using Xilinx®
WebPACK™ tool
Industry leading nonvolatile 0.18 micron CMOS
process
- Guaranteed 1,000 program/erase cycles
- Guaranteed 20 year data retention
Family Overview
Xilinx CoolRunner™-II CPLDs deliver the high speed and
ease of use associated with the XC9500/XL/XV CPLD fam-
ily with the extremely low power versatility of the XPLA3
family in a single CPLD. This means that the exact same
parts can be used for high-speed data communications/
computing systems and leading edge portable products,
with the added benefit of In System Programming. Low
power consumption and high-speed operation are com-
bined into a single family that is easy to use and cost effec-
tive. Clocking techniques and other power saving features
extend the users’ power budget. The design features are
supported starting with Xilinx ISE® 4.1i WebPACK tool.
Additional details can be found in Further Reading,
page 14.
Table 1 shows the macrocell capacity and key timing
parameters for the CoolRunner-II CPLD family.
0
CoolRunner-II CPLD Family
DS090 (v3.1) September 11, 2008 00Product Specification
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Table 1: CoolRunner-II CPLD Family Parameters
XC2C32A XC2C64A XC2C128 XC2C256 XC2C384 XC2C512
Macrocells 32 64 128 256 384 512
Max I/O 33 64 100 184 240 270
TPD (ns) 3.8 4.6 5.7 5.7 7.1 7.1
TSU (ns) 1.9 2.0 2.4 2.4 2.9 2.6
TCO (ns) 3.7 3.9 4.2 4.5 5.8 5.8
FSYSTEM1 (MHz) 323 263 244 256 217 179
CoolRunner-II CPLD Family
2www.xilinx.com DS090 (v3.1) September 11, 2008
Product Specification
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Ta ble 2 shows key DC characteristics for the CoolRunner-II
family.
Ta ble 3 shows the CoolRunner-II CPLD package offering
with corresponding I/O count. All packages are surface
mount, with over half of them being ball-grid technologies.
The ultra tiny packages permit maximum functional capacity
in the smallest possible area. The CMOS technology used
in CoolRunner-II CPLDs generates minimal heat, allowing
the use of tiny packages during high-speed operation.
With the exception of the Pb-free QF packages, there are at
least two densities present in each package with three in the
VQ100 (100-pin 1.0mm QFP), TQ144 (144-pin 1.4mm
QFP), and FT256 (256-ball 1.0mm spacing FLBGA). The
FT256 is particularly important for slim dimensioned porta-
ble products with mid- to high-density logic requirements.
Ta ble 4 details the distribution of advanced features across
the CoolRunner-II CPLD family. The family has uniform
basic features with advanced features included in densities
where they are most useful. For example, it is very unlikely
that four I/O banks are needed on 32 and 64 macrocell
parts, but very likely they are for 384 and 512 macrocell
parts. The I/O banks are groupings of I/O pins using any
one of a subset of compatible voltage standards that share
Table 2: CoolRunner-II CPLD DC Characteristics
XC2C32A XC2C64A XC2C128 XC2C256 XC2C384 XC2C512
ICC (μA), 0 MHz, 25°C (typical) 16 17 19 21 23 25
ICC (mA), 50 MHz, 70°C (max) 2.5 5 10 27 45 55
1. ICC is dynamic current.
Table 3: CoolRunner-II CPLD Family Packages and I/O Count
XC2C32A XC2C64A XC2C128 XC2C256 XC2C384 XC2C512
QFG32(1)21 - - - - -
VQ44 33 33 - - - -
VQG44(1)33 33 - - - -
QFG48(1)-37- - --
CP56 33 45 - - - -
CPG56(1)33 45 - - - -
VQ100 - 64 80 80 - -
VQG100(1)-648080--
CP132 - - 100 106 - -
CPG132(1)- - 100 106 - -
TQ144 - - 100 118 118 -
TQG144(1)- - 100 118 118 -
PQ208 - - - 173 173 173
PQG208(1)- - - 173 173 173
FT256 - - - 184 212 212
FTG256(1)- - - 184 212 212
FG324 - - - - 240 270
FGG324(1)- - - - 240 270
Notes:
1. The letter "G" as the third character indicates a Pb-free package.
CoolRunner-II CPLD Family
DS090 (v3.1) September 11, 2008 www.xilinx.com 3
Product Specification
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the same VCCIO level. (See Ta bl e 5 for a summary of
CoolRunner-II CPLD I/O standards.)
Architecture Description
CoolRunner-II CPLD is a highly uniform family of fast, low
power CPLDs. The underlying architecture is a traditional
CPLD architecture combining macrocells into Function
Blocks (FBs) interconnected with a global routing matrix,
the Xilinx Advanced Interconnect Matrix (AIM). The FBs use
a Programmable Logic Array (PLA) configuration which
allows all product terms to be routed and shared among any
of the macrocells of the FB. Design software can efficiently
synthesize and optimize logic that is subsequently fit to the
FBs and connected with the ability to utilize a very high per-
centage of device resources. Design changes are easily
and automatically managed by the software, which exploits
the 100% routability of the Programmable Logic Array within
each FB. This extremely robust building block delivers the
industry’s highest pinout retention, under very broad design
conditions. The architecture is explained in more detail with
the discussion of the underlying FBs, logic and intercon-
nect.
The design software automatically manages these device
resources so that users can express their designs using
completely generic constructs without knowledge of these
architectural details. More advanced users can take advan-
tage of these details to more thoroughly understand the
software’s choices and direct its results.
Figure 1 shows the high-level architecture whereby FBs
attach to pins and interconnect to each other within the
internal interconnect matrix. Each FB contains 16 macro-
cells. The BSC path is the JTAG Boundary Scan Control
Tabl e 4 : CoolRunner-II CPLD Family Features
XC2C32A
XC2C64A
XC2C128
XC2C256
XC2C384 XC2C512
IEEE 1532 ✓✓
I/O banks 2 2 2 2 4 4
Clock division - - ✓✓✓
DualEDGE
Registers
✓✓
DataGATE - - ✓✓✓✓
LVTT L ✓✓
LVCMOS33, 25,
18, and 15(1)
✓✓
SSTL2_1 - - ✓✓✓✓
SSTL3_1 - - ✓✓✓✓
HSTL_1 - - ✓✓✓✓
Configurable
ground
✓✓
Quadruple data
security
✓✓
Open drain outputs ✓✓
Hot plugging ✓✓
Schmitt Inputs ✓✓
1. LVCMOS15 requires the use of Schmitt-trigger inputs.
CoolRunner-II CPLD Family
4www.xilinx.com DS090 (v3.1) September 11, 2008
Product Specification
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path. The BSC and ISP block has the JTAG controller and
In-System Programming Circuits.
Function Block
The CoolRunner-II CPLD FBs contain 16 macrocells, with
40 entry sites for signals to arrive for logic creation and con-
nection. The internal logic engine is a 56 product term PLA.
All FBs, regardless of the number contained in the device,
are identical. For a high-level view of the FB, see Figure 2.
At the high level, the product terms (p-terms) reside in a
programmable logic array (PLA). This structure is extremely
flexible, and very robust when compared to fixed or cas-
caded product term FBs.
Classic CPLDs typically have a few product terms available
for a high-speed path to a given macrocell. They rely on
capturing unused p-terms from neighboring macrocells to
expand their product term tally, when needed. The result of
this architecture is a variable timing model and the possibil-
ity of stranding unusable logic within the FB.
The PLA is different — and better. First, any product term
can be attached to any OR gate inside the FB macrocell(s).
Second, any logic function can have as many p-terms as
needed attached to it within the FB, to an upper limit of 56.
Third, product terms can be re-used at multiple macrocell
OR functions so that within a FB, a particular logical product
need only be created once, but can be re-used up to 16
times within the FB. Naturally, this plays well with the fitting
software, which identifies product terms that can be shared.
The software places as many of those functions as it can
into FBs, so it happens for free. There is no need to force
macrocell functions to be adjacent or any other restriction
save residing in the same FB, which is handled by the soft-
ware. Functions need not share a common clock, common
set/reset, or common output enable to take full advantage of
the PLA. Also, every product term arrives with the same
time delay incurred. There are no cascade time adders for
putting more product terms in the FB. When the FB product
term budget is reached, there is a small interconnect timing
penalty to route signals to another FB to continue creating
logic. Xilinx design software handles all this automatically.
Figure 1: CoolRunner-II CPLD Architecture
Function
Block 1
Function
Block n
PLA PLA
I/O Blocks
I/O Blocks
16 16
40 40
16 FB 16 FB
16 16
I/O Pin MC1
MC2
MC16
MC1
MC2
MC16
DS090_01_121201
AIM
I/O Pin
I/O Pin
Direct Inputs
BSC and ISP
Clock and Control Signals
BSC Path
Direct Inputs
I/O Pi
n
I/O Pi
n
I/O Pi
n
JTAG
Figure 2: CoolRunner-II CPLD Function Block
PLA
16
40
3
MC1
Out
To AIM
Global
Clocks
Global
Set/Reset
MC2
MC16
DS090_02_101001
CoolRunner-II CPLD Family
DS090 (v3.1) September 11, 2008 www.xilinx.com 5
Product Specification
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Macrocell
The CoolRunner-II CPLD macrocell is extremely efficient
and streamlined for logic creation. Users can develop sum
of product (SOP) logic expressions that comprise up to 40
inputs and span 56 product terms within a single function
block. The macrocell can further combine the SOP expres-
sion into an XOR gate with another single p-term expres-
sion. The resulting logic expression’s polarity is also
selectable. As well, the logic function can be pure combina-
torial or registered, with the storage element operating
selectably as a D or T flip-flop, or transparent latch. Avail-
able at each macrocell are independent selections of global,
function block level or local p-term derived clocks, sets,
resets, and output enables. Each macrocell flip-flop is con-
figurable for either single edge or DualEDGE clocking, pro-
viding either double data rate capability or the ability to
distribute a slower clock (thereby saving power). For single
edge clocking or latching, either clock polarity can be
selected per macrocell. CoolRunner-II CPLD macrocell
details are shown in Figure 3. Note that in Figure 4, stan-
dard logic symbols are used except the trapezoidal multi-
plexers have input selection from statically programmed
configuration select lines (not shown). Xilinx application
note XAPP376 gives a detailed explanation of how logic is
created in the CoolRunner-II CPLD family.
When configured as a D-type flip-flop, each macrocell has
an optional clock enable signal permitting state hold while a
clock runs freely. Note that Control Terms (CT) are available
to be shared for key functions within the FB, and are gener-
ally used whenever the exact same logic function would be
repeatedly created at multiple macrocells. The CT product
terms are available for FB clocking (CTC), FB asynchro-
nous set (CTS), FB asynchronous reset (CTR), and FB out-
put enable (CTE).
Any macrocell flip-flop can be configured as an input regis-
ter or latch, which takes in the signal from the macrocell’s
I/O pin, and directly drives the AIM. The macrocell combina-
tional functionality is retained for use as a buried logic node
if needed. FToggle is the maximum clock frequency to which
a T flip-flop can reliably toggle.
Advanced Interconnect Matrix (AIM)
The Advanced Interconnect Matrix is a highly connected
low power rapid switch. The AIM is directed by the software
to deliver up to a set of 40 signals to each FB for the cre-
ation of logic. Results from all FB macrocells, as well as, all
pin inputs circulate back through the AIM for additional con-
nection available to all other FBs as dictated by the design
Figure 3: CoolRunner-II CPLD Macrocell
GCK0
GCK1
GCK2
CTC
PTC
PTC
DS090_03_121201
49 P-terms To PTA, PTB, PTC of
other macrocells
CTC, CTR,
CTS, CTE
From AIM
4 P-terms
PTA
Direct Input
from
I/O Block
Feedback
to AIM
PTB
PTC
PLA OR Term
PTA
CTS
GSR
GND
GND
VCC
R
D/T
CE
CK
FIF
Latch
DualEDGE
Q
S
40
To I/O Block
PTA
CTR
GSR
GND
CoolRunner-II CPLD Family
6www.xilinx.com DS090 (v3.1) September 11, 2008
Product Specification
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software. The AIM minimizes both propagation delay and
power as it makes attachments to the various FBs.
I/O Block
I/O blocks are primarily transceivers. However, each I/O is
either automatically compliant with standard voltage ranges
or can be programmed to become so. See XAPP382 for
detailed information on CoolRunner-II I/Os.
In addition to voltage levels, each input can selectively
arrive through Schmitt-trigger inputs. This adds a small time
delay, but substantially reduces noise on that input pin.
Approximately 500 mV of hysteresis is added when
Schmitt-trigger inputs are selected. All LVCMOS inputs can
have hysteresis input. Hysteresis also allows easy genera-
tion of external clock circuits. The Schmitt-trigger path is
best seen in Figure 4. See Ta b l e 5 for Schmitt-trigger com-
patibility with I/O standards.
Outputs can be directly driven, 3-stated or open-drain con-
figured. A choice of slow or fast slew rate output signal is
also available. Ta b l e 5 summarizes various supported volt-
age standards associated with specific part capacities. All
inputs and disabled outputs are voltage tolerant up to 3.3V.
The CoolRunner-II family supports SSTL2-1, SSTL3-1 and
HSTL-1 high-speed I/O standards in the 128-macrocell and
larger devices. Figure 4 details the I/O pin, where it is noted
that the inputs requiring comparison to an external refer-
ence voltage are available. These I/O standards all require
VREF pins for proper operation. The CoolRunner-II CPLD
allows any I/O pin to act as a VREF pin, granting the board
layout engineer extra freedom when laying out the pins.
However, if VREF pin placement is not done properly, addi-
tional VREF pins might be required, resulting in a loss of
potential I/O pins or board re-work. See XAPP399 for
details regarding VREF pins and their placement.
VREF has pin-range requirements that must be observed.
The Xilinx software aids designers in remaining within the
proper pin range.
Ta bl e 5 summarizes the single ended I/O standard support
and shows which standards require VREF values and board
termination. VREF detail is given in specific data sheets.
Figure 4: CoolRunner-II CPLD I/O Block Diagram
Enabled
To Macrocell
Direct Input
To AIM
4
CTE
PTB
GTS[0:3]
CGND
Open Drain From Macrocell
VCCIO
VREF
Disabled
Hysteresis
Available on 128 Macrocell Devices and Larger
Global termination
Pullup/Bus-Hold
DS090_04_121201
Tabl e 5 : CoolRunner-II CPLD I/O Standard Summary
IOSTANDARD
Attribute VCCIO Input VREF
Board Termination Voltage
(VTT) Schmitt-trigger Support
LVTTL 3.3 N/A N/A Optional
LVCMOS33 3.3 N/A N/A Optional
LVCMOS25 2.5 N/A N/A Optional
LVCMOS18 1.8 N/A N/A Optional
LVCMOS15 1.5 N/A N/A Not optional
HSTL_1 1.5 0.75 0.75 Not optional
SSTL2_1 2.5 1.25 1.25 Not optional
SSTL3_1 3.3 1.5 1.5 Not optional
CoolRunner-II CPLD Family
DS090 (v3.1) September 11, 2008 www.xilinx.com 7
Product Specification
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Output Banking
CPLDs are widely used as voltage interface translators. To
that end, the output pins are grouped in large banks. The
XC2C32A, XC2C64A, XC2C128 and XC2C256 devices
support two output banks. With two, the outputs switch to
one of two selected output voltage levels, unless both banks
are set to the same voltage. The larger parts (384 and 512
macrocell) support four output banks split evenly. They can
support groupings of one, two, three, or four separate output
voltage levels. This kind of flexibility permits easy interfacing
to 3.3V, 2.5V, 1.8V, and 1.5V in a single part.
DataGATE
Low power is the hallmark of CMOS technology. Other
CPLD families use a sense amplifier approach to creating
product terms, which always has a residual current compo-
nent being drawn. This residual current can be several hun-
dred milliamps, making them unusable in portable systems.
CoolRunner-II CPLDs use standard CMOS methods to cre-
ate the CPLD architecture and deliver the corresponding
low current consumption, without doing any special tricks.
However, sometimes designers want to reduce their system
current even more by selectively disabling circuitry not
being used.
The patented DataGATE technology to permits a straight-
forward approach to additional power reduction. Each I/O
pin has a series switch that can block the arrival of free run-
ning signals that are not of interest. Signals that serve no
use might increase power consumption, and can be dis-
abled. Users are free to do their design, then choose sec-
tions to participate in the DataGATE function. DataGATE is
a logic function that drives an assertion rail threaded
through the medium and high-density CoolRunner-II CPLD
parts. Designers can select inputs to be blocked under the
control of the DataGATE function, effectively blocking con-
trolled switching signals so they do not drive internal chip
capacitances. Output signals that do not switch are held by
the bus hold feature. Any set of input pins can be chosen to
participate in the DataGATE function. Figure 5 shows the
familiar CMOS ICC versus switching frequency graph. With
DataGATE, designers can approach zero power, should
they choose to, in their designs.
Figure 6 shows how DataGATE basically works. One I/O pin
drives the DataGATE Assertion Rail. It can have any
desired logic function on it. It can be as simple as mapping
an input pin to the DataGATE function or as complex as a
counter or state machine output driving the DataGATE I/O
pin through a macrocell. When the DataGATE rail is
asserted High, any pass transistor switch attached to it is
blocked. Each pin has the ability to attach to the AIM
through a DataGATE pass transistor, and thus be blocked. A
latch automatically captures the state of the pin when it
becomes blocked. The DataGATE Assertion Rail threads
throughout all possible I/Os, so each can participate if cho-
sen. Note that one macrocell is singled out to drive the rail,
and that macrocell is exposed to the outside world through a
pin, for inspection. If DataGATE is not needed, this pin is an
ordinary I/O.
There are two attributes associated with the DataGATE fea-
ture in CoolRunner-II CPLDs. The first attribute specifies if
an input is affected by DataGATE and the second desig-
nates the DataGATE control signal.
The DataGATE feature is selectable on a per pin basis.
Each input pin that uses DataGATE must be assigned a
DATA_GATE attribute.
The DataGATE assertion rail can be driven from either an
I/O pin or internal logic. The DataGATE enable signal is a
dedicated DGE/I/O pin for each package in CoolRunner-II
CPLDs. Upon implementation, the software recognizes a
design using DataGATE and automatically assigns this I/O
pin to the DataGATE enable control function, DGE. Inter-
Figure 5: CMOS ICC vs. Switching Frequency Curve
DS090_05_101001
ICC
Frequency
0
CoolRunner-II CPLD Family
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Product Specification
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nally generated DataGATE control logic can be assigned to
this I/O pin with the BUFG=DATA_GATE attribute.
Global Signals
Global signals, clocks (GCK), sets/resets (GSR), and output
enables (GTS), are designed to strongly resemble each
other. This approach enables design software to make the
best utilization of their capabilities. Each global capability is
supplemented by a corresponding product term version.
Figure 7 shows the common structure of the global signal
trees. The pin input is buffered, then drives multiple internal
global signal traces to deliver low skew and reduce loading
delays. GCK, GSR, and GTS can also be used as general
purpose I/Os if they are not needed as global signals. The
DataGATE assertion rail is also a global signal.
Figure 6: DataGATE Architecture (output drivers not shown)
PLA
MC1
MC2
MC16
DS090_06_111201
PLA
PLA
DataGATE Assertion Rail
PLA
AIM
MC1
MC2
MC16
MC1
MC2
MC16
MC1
MC2
MC16
To AIM
Latch
To AIM
Latch
To AIM
To AIM
Latch
Latch
To AIM
Latch
Figure 7: Global Clocks (GCK), Sets/Resets (GSR), and
Output Enables (GTS)
DS090_07_101001
CoolRunner-II CPLD Family
DS090 (v3.1) September 11, 2008 www.xilinx.com 9
Product Specification
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Additional Clock Options: Division,
DualEDGE, and CoolCLOCK
Clock Divider
A clock divider circuit has been included in the
CoolRunner-II CPLD architecture to divide one externally
supplied global clock by standard values. The allowable val-
ues for the division are 2, 4, 6, 8, 10, 12, 14, and 16 (see
Figure 8). This capability is supplied on the GCK2 pin. The
resulting clock produced has a 50% duty cycle for all possi-
ble divisions. The output of the clock divider is on global
routing. If the clock divider is used, the undivided clock is
available internally. If the undivided clock is required inter-
nally it is input through a separate clock pin.
The clock divider circuit encompasses a synchronous reset
(CDRST) to guarantee no spurious clocks can carry
through on to the global clock nets. When the CDRST signal
is asserted, the clock divider output is disabled after the cur-
rent cycle. When the CDRST signal is deasserted the clock
divider output becomes active upon the first edge of GCK2.
The CDRST pin functions as a reset pin regardless of which
CLK_DIV primitive is used. If a clock divider is used in the
design, the CDRST pin is reserved and if it is driven High
the clock divider is reset. If a reset port of a clock divider is
not used, it is tied Low on the board. The clock divider circuit
includes an active High synchronous reset, referred to as
CDRST.
The CoolRunner-II CPLD clock divider includes a built-in
delay circuit. With the delay feature enabled, the output of
the clock divider is delayed for one full count cycle. When
used, the clock divider does not output a rising clock edge
until after the divider reaches the delay value. The delay fea-
ture is either enabled or disabled upon configuration.
Xilinx Synthesis Technology (XST) allows a clock divider
component to be instantiated directly in the HDL source
code. See XAPP378 for instantiation examples in VHDL,
Verilog, and ABEL.
DualEDGE
Each macrocell has the ability to double its input clock
switching frequency. Figure 9 shows the macrocell flip-flop
with the DualEDGE option (doubled clock) at each macro-
cell. The source to double can be a control term clock, a
product term clock or one of the available global clocks. The
ability to switch on both clock edges, also known as dual
edge triggered (DET), is vital for a number of synchronous
memory interface applications as well as certain double
data rate I/O applications.
CoolRunner-II CPLD DET registers can be used for logic
functions that include shift registers, counters, comparators,
and state machines. Designers must evaluate the desired
performance of the CPLD logic to determine use of DET
registers.
The DET register can be inferred in any ABEL, HDL, or
schematic design. A designer can infer a single-edge trig-
gered (SET) register in any HDL design. The DET register is
available with all macrocells in all devices of the
CoolRunner-II family.
CoolCLOCK
In addition to the DualEDGE flip-flop, power savings can
occur by combining the clock division circuitry with the
DualEDGE circuitry. This capability is called CoolCLOCK
and is designed to reduce clocking power within the CPLD.
Because the clock net can be an appreciable power drain,
the clock power can be reduced by driving the net at half fre-
quency, then doubling the clock rate using DualEDGE trig-
gering at the macrocells. Figure 10 shows how CoolCLOCK
is created by internal clock cascading with the divider and
DualEDGE flip-flop working together.
GCK2 is the only clock network that can be divided, the
CoolCLOCK feature is only available on GCK2. The Cool-
CLOCK feature can be implemented by assigning an
attribute to an input clock. The CoolCLOCK attribute
replaces the need to instantiate the clock divider and infer
DET registers. The CoolCLOCK feature is available on
CoolRunner-II 128 macrocell devices and larger. See
XAPP378 for more detail.
Figure 8: Clock Division Circuitry for GCK2
DS090_08_121201
Clock
In
÷2
÷4
÷6
÷8
÷10
÷12
÷14
÷16
GCK2
CDRST
CDRST
CoolRunner-II CPLD Family
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Product Specification
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Design Security
Designs can be secured during programming to prevent
either accidental overwriting or pattern theft via readback.
Four independent levels of security are provided on-chip,
eliminating any electrical or visual detection of configuration
patterns. These security bits can be reset only by erasing
the entire device. See WP170 for more detail.
Figure 9: Macrocell Clock Chain with DualEDGE Option Shown
Figure 10: CoolCLOCK Created by Cascading Clock Divider and DualEDGE Option
GCK0
GCK1
GCK2
CLK_CT
PTC
PTC
DS090_09_121201
D/T
CE
CK
FIF
Latch
DualEDGE
Q
GCK0
GCK1
GCK2
CTC
PTC
PTC
D/T
CE
CK
FIF
Latch
DualEDGE
Q
Clock
In
÷2
÷4
÷6
÷8
÷10
÷12
÷14
÷16
GCK2
Synch Reset
Synch Rst
CoolRunner-II CPLD Family
DS090 (v3.1) September 11, 2008 www.xilinx.com 11
Product Specification
R
Timing Model
Figure 11 shows the CoolRunner-II CPLD timing model. It
represents one aspect of the overall architecture from a tim-
ing viewpoint. Each little block is a time delay that a signal
incurs if the signal passes through such a resource. Timing
reports are created by tallying the incremental signal delays
as signals progress within the CPLD. Software creates the
timing reports after a design has been mapped onto the
specific part, and knows the specific delay values for a given
speed grade. Equations for the higher level timing values
(i.e., TPD and FSYSTEM) are available. Ta bl e 6 summarizes
the individual parameters and provides a brief definition of
their associated functions. Xilinx application note XAPP375
details the CoolRunner-II CPLD family timing with several
examples.
Figure 11: CoolRunner-II CPLD Timing Model
Note: Always refer to the timing report in ISE Software for accurate timing values for paths.
Tabl e 6 : Timing Parameter Definitions
Symbol Parameter
Buffer Delays
TlN Input Buffer Delay
TDIN Direct data register input delay
TGCK Global clock (GCK) buffer delay
TGSR Global set/reset (GSR) buffer delay
TGTS Global output enable (GTS) buffer delay
TOUT Output buffer delay
TEN Output buffer enable/disable delay
TSLEW Output buffer slew rate control delay
P-term Delays
TCT Control Term delay (single PT or FB-CT)
TLOGI1 Single P-term logic delay
TLOGI2 Multiple P-term logic delay adder
Macrocell Delays
TPDI Macrocell input to output valid
TSUI Macro register setup before clock
THI Macro register hold after clock
TECSU Macro register enable clock setup time
TECHO Macro register enable clock hold time
TCOI Macro register clock to output valid
TAOI Macro register set/reset to output valid
THYS Hysteresis selection delay adder
Feedback Delays
TFFeedback delay
TOEM Macrocell to Global OE delay
Tabl e 6 : Timing Parameter Definitions (Continued)
Symbol Parameter
CoolRunner-II CPLD Family
12 www.xilinx.com DS090 (v3.1) September 11, 2008
Product Specification
R
Programming
The programming data sequence is delivered to the device
using either Xilinx iMPACT software and a Xilinx download
cable, a third-party JTAG development system, a
JTAG-compatible board tester, or a simple microprocessor
interface that emulates the JTAG instruction sequence. The
iMPACT software also outputs serial vector format (SVF)
files for use with any tools that accept SVF format, including
automatic test equipment. See CoolRunner-II CPLD
Application Notes for more information on how to program.
In System Programming
All CoolRunner-II CPLD parts are 1.8V in system program-
mable. This means they derive their programming voltage
and currents from the 1.8V VCC (internal supply voltage)
pins on the part. The VCCIO pins do not participate in this
operation, as they might assume another voltage ranging as
high as 3.3V down to 1.5V (however, all VCCIO, VCCINT
,
VCCAUX, and GND pins must be connected for the device to
be programmed, and operate correctly). A 1.8V VCC is
required to properly operate the internal state machines and
charge pumps that reside within the CPLD to do the nonvol-
atile programming operations. I/O pins are not in user mode
during JTAG programming; they are held in 3-state with a
weak pullup. The JTAG interface buffers are powered by a
dedicated power pin, VCCAUX, which is independent of all
other supply pins. VCCAUX must be connected. Xilinx soft-
ware is provided to deliver the bitstream to the CPLD and
drive the appropriate IEEE 1532 protocol. To that end, there
is a set of IEEE 1532 commands that are supported in the
CoolRunner-II CPLD parts. Programming times are less
than one second for 32 to 256 macrocell parts. Program-
ming times are less than four seconds for 384 and 512 mac-
rocell parts. Programming of CoolRunner-II CPLDs is only
guaranteed when operating in the commercial temperature
and voltage ranges as defined in the device-specific data
sheets.
On-The-Fly Reconfiguration (OTF)
The Xilinx ISE 5.2i tool supports OTF for CoolRunner-II
CPLDs. This permits programming a new nonvolatile pat-
tern into the part while another pattern is currently in use.
OTF has the same voltage and temperature specifications
as system programming. During pattern transition I/O pins
are in high impedance with a weak pullup to VCCIO. Transi-
tion time typically lasts between 50 and 300 μs, depending
on density. See XAPP388 for more information.
JTAG Instructions
Ta bl e 7 shows the commands available to users. These
same commands can be used by third party ATE products,
as well. The internal controllers can operate as fast as
66 MHz.
Power-Up Characteristics
CoolRunner-II CPLD parts must operate under the
demands of both the high-speed and the portable market
places; therefore, they must support hot plugging for the
high-speed world and tolerate most any power sequence to
its various voltage pins. They must also not draw excessive
current during power-up initialization. To those ends, the
general behavior is summarized as follows:
1. I/O pins are disabled until the end of power-up.
2. As supply rises, configuration bits transfer from
nonvolatile memory to SRAM cells.
3. As power up completes, the outputs become as
configured (input, output, or I/O).
4. For specific configuration times and power up
requirements, see XAPP389.
CoolRunner-II CPLD I/O pins are well behaved under all
operating conditions. During power-up, CoolRunner-II
devices employ internal circuitry which keeps the devices in
the quiescent state until the VCCINT supply voltage is at a
safe level (approximately 1.3V). In the quiescent state,
JTAG pins are disabled, and all device outputs are disabled
with the pins weakly pulled High, as shown in Ta b l e 8 . When
the supply voltage reaches a safe level, all user registers
become initialized, and the device is immediately available
for operation, as shown in Figure 12. Best results are
obtained with a smooth VCC rise in less than 4 ms. Final
VCC value should occur within 1 second.
If the device is in the erased state (before any user pattern
is programmed), the device outputs remain disabled with a
weak pull-up. The JTAG pins are enabled to allow the device
Tabl e 7 : JTAG Instructions
Code Instruction Description
00000000 EXTEST Force boundary scan data onto
outputs
00000011 PRELOAD Latch macrocell data into
boundary scan cells
11111111 BYPASS Insert bypass register between
TDI and TDO
00000010 INTEST Force boundary scan data onto
inputs and feedbacks
00000001 IDCODE Read IDCODE
11111101 USERCODE Read USERCODE
11111100 HIGHZ Force output into high
impedance state
11111010 CLAMP Latch present output state
CoolRunner-II CPLD Family
DS090 (v3.1) September 11, 2008 www.xilinx.com 13
Product Specification
R
to be programmed at any time. All devices are shipped in
the erased state from the factory.
Applying power to a blank part might result in a higher cur-
rent flow as the part initializes. This behavior is normal and
might persist for approximately 2 seconds, depending on
the power supply ramp.
If the device is programmed, the device inputs and outputs
take on their configured states for normal operation. The
JTAG pins are enabled to allow device erasure or bound-
ary-scan tests at any time.
I/O Banking
CoolRunner-II CPLD XC2C32A and XC2C64A macrocell
parts support two VCCIO rails that can range from 3.3V
down to 1.5V operation. Two VCCIO rails are supported on
the 128 and 256 macrocell parts where outputs on each rail
can independently range from 3.3V down to 1.5V operation.
Four VCCIO rails are supported on the 384 and 512 macro-
cell parts. Any of the VCCIO rails can assume any one of the
VCCIO values of 1.5V, 1.8V, 2.5V, or 3.3V. Designers should
assign input and output voltages to a bank with VCCIO set at
the voltage range of that input or output voltage. The VCC
(internal supply voltage) for a CoolRunner-II CPLD must be
maintained within 1.8V ±5% for correct speed operation and
proper in system programming.
Mixed Voltage, Power Sequencing, and
Hot Plugging
As mentioned in I/O Banking, CoolRunner-II CPLD parts
support mixed voltage I/O signals. It is important to assign
signals to an I/O bank with the appropriate I/O voltage. Driv-
ing a high voltage into a low voltage bank can result in neg-
ative current flow through the power supply pins. The power
applied to the VCCIO and VCC pins can occur in any order
and the CoolRunner-II CPLD will not be damaged. For best
results, Xilinx recommends that VCCINT be applied before
VCCIO To ensure that the internal logic is correct before the
I/Os are active. CoolRunner-II CPLDs can reside on boards
where the board is inserted into a “live” connector (hot
plugged) and the parts will be well-behaved as if powering
up in a standard way.
Development System Support
Xilinx CoolRunner-II CPLDs are supported by all configura-
tions of Xilinx standard release development software as
well as the freely available ISE WebPACK software avail-
able from www.xilinx.com. Third party development tools
include synthesis tools from Cadence, Exemplar, Mentor
Graphics, Synplicity, and Synopsys.
ATE Support
Third party ATE development support is available for both
programming and board/chip level testing. Vendors provid-
ing this support include Agilent, GenRad, and Teradyne.
Other third party providers are expected to deliver solutions
in the future.
Figure 12: Device Behavior During Power Up
VCCINT
No
Power
3.8 V
(Typ)
0V
No
Power
Quiescent
State
Quiescent
State
User Operation
Initialization Transition of User Array
x382_10
1.3V
(Typ)
Tabl e 8 : I/O Power-Up Characteristics
Device Circuitry Quiescent State Erased Device Operation Valid User Operation
IOB Bus-Hold/Weak Pullup Weak Pull-up Weak Pull-up Bus-Hold/Weak Pullup
Device Outputs Disabled Disabled As Configured
Device Inputs and Clocks Disabled Disabled As Configured
Function Block Disabled Disabled As Configured
JTAG Controller Disabled Enabled Enabled
CoolRunner-II CPLD Family
14 www.xilinx.com DS090 (v3.1) September 11, 2008
Product Specification
R
Absolute Maximum Ratings
Quality and Reliability Parameters
Warranty Disclaimer
THESE PRODUCTS ARE SUBJECT TO THE TERMS OF THE XILINX LIMITED WARRANTY WHICH CAN BE VIEWED
AT http://www.xilinx.com/warranty.htm. THIS LIMITED WARRANTY DOES NOT EXTEND TO ANY USE OF THE
PRODUCTS IN AN APPLICATION OR ENVIRONMENT THAT IS NOT WITHIN THE SPECIFICATIONS STATED ON THE
THEN-CURRENT XILINX DATA SHEET FOR THE PRODUCTS. PRODUCTS ARE NOT DESIGNED TO BE FAIL-SAFE
AND ARE NOT WARRANTED FOR USE IN APPLICATIONS THAT POSE A RISK OF PHYSICAL HARM OR LOSS OF
LIFE. USE OF PRODUCTS IN SUCH APPLICATIONS IS FULLY AT THE RISK OF CUSTOMER SUBJECT TO
APPLICABLE LAWS AND REGULATIONS.
Further Reading
Application Notes
http://www.xilinx.com/support/documenta-
tion/application_notes/xapp784.pdf
(Bulletproof Design Practices)
http://www.xilinx.com/support/documentation/application_no
tes/xapp375.pdf (Timing Model)
http://www.xilinx.com/support/documentation/application_no
tes/xapp376.pdf (Logic Engine)
http://www.xilinx.com/support/documenta-
tion/application_notes/xapp317.pdf
(Power Evaluation Equation for CoolRunner-II CPLDs)
http://www.xilinx.com/support/documentation/application_no
tes/xapp377.pdf (Low Power Design)
http://www.xilinx.com/support/documentation/application_no
tes/xapp378.pdf (Advanced Features)
http://www.xilinx.com/support/documentation/application_no
tes/xapp379.pdf (High Speed Design)
http://www.xilinx.com/support/documentation/application_no
tes/xapp380.pdf (Cross Point Switch)
Symbol Parameter(1) Min. Max. Unit
VCC(2)Supply voltage relative to GND –0.5 2.0 V
VI(3)Input voltage relative to GND –0.5 4.0 V
TAAmbient Temperature (C-grade) 0 70 °C
Ambient Temperature (I-grade) –40 85 °C
TJ(4)Maximum junction temperature –40 150 °C
TSTR Storage temperature –65 150 °C
Notes:
1. Stresses above those listed might cause malfunction or permanent damage to the device. This is a stress rating only. Functional
operation at these or any other condition above those indicated in the operational and programming specification is not implied.
2. The chip supply voltage should rise monotonically.
3. Maximum DC undershoot below GND must be limited to either 0.5V or 10 mA, whichever is easier to achieve. During transitions, the
device pins might undershoot to –2.0V or overshoot to 4.5 V, provided this overshoot or undershoot lasts less than 10 ns and with the
forcing current being limited to 200 mA. The I/O voltage can never exceed 4.0V.
4. For soldering guidelines and thermal considerations, see the Device Packaging information on the Xilinx website. For Pb-free
packages, see XAPP427.
Symbol Parameter Min Max Units
TDR Data retention 20 - Years
NPE Program/erase cycles (Endurance) 1,000 - Cycles
VESD Electrostatic discharge(1) 2,000 - Volts
Notes:
1. ESD is measured to 2000V using the human body model. Pins exposed to this limit can incur additional leakage current to
a maximum of 10 μA when driven to 3.9V.
CoolRunner-II CPLD Family
DS090 (v3.1) September 11, 2008 www.xilinx.com 15
Product Specification
R
http://www.xilinx.com/support/documentation/application_no
tes/xapp381.pdf (Demo Board)
http://www.xilinx.com/support/documentation/application_no
tesxapp382.pdf (I/O Characteristics)
http://www.xilinx.com/support/documentation/application_no
tes/xapp383.pdf (Single Error Correction Double Error
Detection)
http://www.xilinx.com/support/documentation/application_no
tes/xapp384.pdf (DDR SDRAM Interface)
http://www.xilinx.com/support/documentation/application_no
tes/xapp387.pdf (PicoBlaze Microcontroller)
http://www.xilinx.com/support/documentation/application_no
tes/xapp388.pdf (On the Fly Reconfiguration)
http://www.xilinx.com/support/documentation/application_no
tes/xapp389.pdf (Powering CoolRunner-II)
http://www.xilinx.com/support/documentation/application_no
tes/xapp393.pdf (8051 Microcontroller Interface)
http://www.xilinx.com/support/documentation/application_no
tes/xapp394.pdf (Interfacing with Mobile SDRAM)
http://www.xilinx.com/support/documentation/application_no
tes/xapp399.pdf (Assigning CoolRunner-II VREF Pins)
CoolRunner-II CPLD Data Sheets
http://www.xilinx.com/support/documentation/data_sheets/d
s090.pdf (CoolRunner-II Family Data Sheet)
http://www.xilinx.com/support/documentation/data_sheets/d
s310.pdf (XC2C32A Data Sheet)
http://www.xilinx.com/support/documentation/data_sheets/d
s311.pdf (XC2C64A Data Sheet)
http://www.xilinx.com/support/documentation/data_sheets/d
s093.pdf (XC2C128 Data Sheet)
http://www.xilinx.com/support/documentation/data_sheets/d
s094.pdf (XC2C256 Data Sheet)
http://www.xilinx.com/support/documentation/data_sh
eets/ds095.pdf (XC2C384 Data Sheet)
http://www.xilinx.com/support/documentation/data_sheets/d
s096.pdf (XC2C512 Data Sheet)
CoolRunner-II CPLD White Papers
http://www.xilinx.com/support/documenta-
tion/white_papers/wp170.pdf (Secure Applications)
Packages
Package Drawings
Revision History
The following table shows the revision history for this document.
Date Version Revision
01/03/02 1.0 Initial Xilinx release
07/04/02 1.1 Revisions and updates
07/24/02 1.2 Revisions and updates
09/24/02 1.3 Additions to "Power Characteristics" section
01/28/03 1.4 Addition of the "Further Reading" section
02/26/03 1.5 Multiple minor revisions
03/12/03 1.6 Minor revision to "Quality and Reliability Parameters"
10/09/03 1.7 Update Hewlett-Packard to Agilent, OFR to OTF, and other revisions
01/26/04 1.8 Incorporate links to Data Sheets, Application Notes, and Device Packages
02/26/04 1.9 Change to Power-Up Characteristics, page 11. Change TFIN to TDIN. Add Schmitt-trigger
I/O compatibility information. Added TSOL specification.
05/21/04 2.0 Add XC2C32A and XC2C64A devices.
07/30/04 2.1 Pb-free documentation. Changes to TSU and Fsystem to match individual data sheets.
01/10/05 2.2 Added information about programming options, page 11.
03/07/05 2.3 Changes to Table 1, TPD, TSU, TCO, and FSYSTEM1. Removed link to obsolete White Paper.
Modifications to Table 5, IOSTANDARDs. Added Table 2, DC Characteristics.
CoolRunner-II CPLD Family
16 www.xilinx.com DS090 (v3.1) September 11, 2008
Product Specification
R
04/15/05 2.4 Change to FSYSTEM1 for XC2C128.
06/28/05 2.5 Move to Product Specification
03/20/06 2.6 Add Warranty Disclaimer; modified Global Signals section to say that GCK, GSR and GTS
can be used as general purpose I/O.
07/24/06 2.7 Change to Hot Plugging recommendations, page 13 (VCCINT before VCCIO power
sequencing).
12/7/06 2.8 Add description of I/O pin status during JTAG programming, page 12. Add note about power
pins during programming. Add link to application note 389, page 12. Added clarification to
clock divider description, page 9.
02/15/07 2.9 Add greater description to advanced features. Added Ambient Temperature specification.
03/08/07 3.0 Add link to power estimation appnote, page 14.
09/11/08 3.1 Removed reference to XC2C32 and XC2C64 devices. See Product Discontinuation Notice
xcn05017.pdf.
Removed references to PC44 and PCG44 packages. See Product Discontinuation Notice
xcn07022.pdf.
Date Version Revision

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