VOL617A Datasheet

Vishay Semiconductor Opto Division

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Datasheet

Option Information
www.vishay.com Vishay Semiconductors
Rev. 2.0, 24-Aug-15 1Document Number: 83713
For technical questions, contact: optocoupleranswers@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Option Information
Optocoupler lead-bend configurations are available as
options. In addition, partial discharge testing as per
VDE / IEC is also available as an option.
See the order information section in the data sheet to
determine if and which options are available to a specific
product. Contact the Vishay sales office for other option
configurations.
The options are:
Option 1 VDE option
Option 6 400 mil (10.16 mm) lead spread DIP configuration
Option 7 Surface mount, gull wing DIP configuration with
standoff
Option 8 Surface mount, gull wing DIP configuration with
increased clearance
Option 9 Surface mount, gull wing DIP configuration
ORDERING OPTIONS
A specific option or combination of options can be ordered
by add the options definition field following the base part
number and CTR range (if applicable) as presented in the
following example:
This field is always 4 characters long and commences with
the character X. In the case of surface mounted products in
tape and reel format, the tape and reel option character “T”
will follow this field.
The possible combinations for these fields (1) are:
X001, X006, X007, X008, X009, X001T
(2), X007T, X008T,
X009T, X016, X017, X018, X019, X017T, X018T, X019T
Notes
(1) Not all options are available for all product types.
(2) The X001T option is only available on products that are available on the following SMD products SFH6106, SFH6156, SFH6186, SFH6206,
and SFH6286 series, e.g. SFH6106-3X001T .
OPTION 1
OPTOCOUPLERS FOR SAFE ELECTRICAL INSULATION PER DIN EN 60747-5-5 (VDE 0884) (1)
The optocoupler listed are suitable for safe electrical
insulation only within the safety maximum ratings.
Compliance with the safety maximum ratings must be
ensured by protective circuits.
The partial discharge measurement ensures that no partial
discharge occurs during operation at maximum permissible
operating insulation voltage (VIORM). Permanent partial
discharge affects the insulating materials and can result in a
high voltage breakdown.
It is recommended that tests with the insulation test voltage
(VISOL) should not be made, otherwise partial discharge may
occur impairing the insulation characteristics. Thus partial
discharges also may occur at the maximum permissible
operating insulation voltage.
The insulation test per DIN EN 60747-5-5 (VDE 0884) is
carried out after all the other tests
18482
SFH615A-3X0
9T
Prefix Base Part Number CTR Ranges Options Definition Tape and
Reel Option
BRT
Il
ILD
ILQ
SFH6
VO
1 = 40 % to 80 %
2 = 63 % to 125 %
3 = 100 % to 200 %
4 = 160 % to 320 %
5 =
or 50 % to 150 % (1)
6 = 100 % to 300 % (1)
7 = 80 % to 160 % (1)
8 = 130 % to 260 % (1)
9 = 200 % to 400 % (1)
250 % to 500 %
Option 1 Optocouplers for safe electr ical
Insulation per DIN VDE 0884
Option 6 Optocouplers with 10.16 mm (0.4")
through hole lead spread
Option 7 Optocouplers with SMD lead form bend,
0.9 mm maximum standoff height
Option 8 Optocouplers with 10.16 mm (0.4") SMD
lead form bend
Option 9 Optocouplers with SMD lead form bend,
0.25 mm maximum standoff height
Option 1 may be combined with the other
lead forming options.
Option T may only be combined with
Options 7, 8, and 9
CNY17F-2X017T
4N35-X016
SFH615-3X001
VO615A-9X007T
Examples:
Note
(1) Used on selected products, consult data sheet for details
0
Option Information
www.vishay.com Vishay Semiconductors
Rev. 2.0, 24-Aug-15 2Document Number: 83713
For technical questions, contact: optocoupleranswers@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Fig. 1 - Time Voltage Diagram per DIN EN 60747-5-5
DESCRIPTION SYMBOL SYSTEM 1 UNIT
DIP4 DIP8 DIP16
SFH610A-.. ILCT6 ILQ1/2/5/74
SFH615A-.. ILD1/2/5/74 ILQ30/31/55
SFH615AA-.. ILD30/31/55 ILQ32
SFH615AGB-.. ILD32 ILQ66-..
SFH615AGR-.. ILD66-.. ILQ615-..
SFH617A-.. ILD250/1/2 ILQ620-..
SFH618A-.. ILD255 ILQ620GB-..
SFH620A-.. ILD621GB-.. ILQ621-..
SFH620AA-.. ILD621-.. ILQ621GB-..
SFH620AGB-.. ILD621GB-..
SFH628A-.. ILD755-..
SFH6106-.. ILD766-..
SFH6116-.. MCT6
SFH6156-..
SFH6186-..
SFH6206-..
SFH6286-..
Installation category (DIN VDE 0110)
For rated line voltages 300 VRMS I to IV
For rated line voltages 600 VRMS I to IV
For rated line voltages 1000 VRMS
IEC climatic category (DIN IEC 60068 Part 1/9.80) 55/100/21
Pollution degree (DIN VDE 0110 Part 1/1.89) 2
Maximum operation insulating voltage (1) VIORM 890 Vpeak
Test voltage input/output, procedure b (1) VPr = 1.875 x VIORM,
routine 100 % test, tp = 1 s, partial discharge < 5 pC VPr 1669 Vpeak
Test voltage input/output, procedure a (1) VPr = 1.6 x VIORM,
type and sampling test tp = 60 s, partial discharge < 5 pC VPr 1424 Vpeak
Maximum permissible overvoltage (transient overvoltage) VIOTM 10 000 Vpeak
Partial discharge test voltage (1) VINITIAL 8000 Vpeak
Safety maximum ratings (maximum permissible ratings
in case of a fault, also refer to d diagram)
Package temperature
Current (input current IF, PSi = 0, TA = 25 °C)
Derating with higher ambient temperature
Power (output or total power dissipation, TA = 25 °C)
Derating with higher ambient temperature
Tsi
Isi
ISi
PSi
PSi
175
275
-1.83
400
-2.67
°C
mA
mA/K
mW
mW/K
Insulation resistance at TSi VI/O = 500 V RIS > 109W
V
INITIA L
0. 1t o 1 kV/µs
V
Pr
V
IORM
10 s
tp=
60 s
12 s
1.0 s
1s
t
V V
Pr
V
IORM
tp = 1 .0 s
0.1 s 0.1 s
1. 2s
V
t
tp: measuring time for par tial dischage
Procedure a.
Type and sampling tests, destructive tests
tp: measuring time for partial dischage
Procedure b.
Routine tests, non-destructive tests 17928-1
Option Information
www.vishay.com Vishay Semiconductors
Rev. 2.0, 24-Aug-15 3Document Number: 83713
For technical questions, contact: optocoupleranswers@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
DESCRIPTION SYMBOL SYSTEM 2 UNIT
4N25/26/27/28 IL250 MCT5210
4N35/36/37/38/39 IL251 MCT5211
4N32/33 IL252 SFH600-..
CNY17-.. IL255-.. SFH601-..
CNY17F-.. IL400 SFH608-..
H11A-.. IL755-.. SFH640-..
H11AA1-.. IL755B-.. MOC8050
H11B-.. IL766-.. IL56B-..
H11B1-.. IL766B-.. MOC8021
H11C-.. MCA230/231 MOC8112
H11D-.. MCA255 MOC8102/03/04/05
IL1/2/5/74 MCT2/2E VO610A...
IL2B-.. MCT270/271 VO615A...
IL30/31/55 MCT272 VO617A...
IL55B-.. MCT273/274 VO618A...
IL66-.. MCT275 VO615C...
IL66B-.. MCT276/277 VO617C...
IL201/202/203
Installation category (DIN VDE 0110)
For rated line voltages 300 VRMS I to IV
For rated line voltages 600 VRMS I to IV
For rated line voltages 1000 VRMS
IEC climatic category (DIN IEC 60068 Part 1/9.80) 55/100/21
Pollution degree (DIN VDE 0110 Part 1/1.89) 2
Maximum operation insulating voltage (1) VIORM 890 Vpeak
Test voltage input/output, procedure b (1)
VPr = 1.875 x VIORM, routine 100 % test,
tp = 1 s, partial discharge < 5 pC
VPr 1669 Vpeak
Test voltage input/output, procedure a (1)
VPr = 1.6 x VIORM, type and sampling test tp = 60 s,
partial discharge < 5 pC
VPr 1424 Vpeak
Maximum permissible overvoltage (transient overvoltage) VIOTM 8000 Vpeak
Partial discharge test voltage (1) VINITIAL 8000 Vpeak
Safety maximum ratings
(maximum permissible ratings in case of a fault,
also refer to diagram)
Package temperature
Current
(input current IF, PSi = 0, TA = 25 °C)
Derating with higher ambient temperature
Power (output or total power dissipation, TA = 25 °C)
Derating with higher ambient temperature
Tsi
Isi
DISi
PSi
PSi
175
400
-2.67
700
-4.67
°C
mA
mA/K
mW
mW/K
Insulation resistance at TSi VI/O = 500 V RIS > 10 9 W
Option Information
www.vishay.com Vishay Semiconductors
Rev. 2.0, 24-Aug-15 4Document Number: 83713
For technical questions, contact: optocoupleranswers@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Notes
All voltages referred to are peak values except otherwise specified.
(1) See time-test voltage diagram
(2) In preparation
Testing input / output voltage requires all input pins and all output pins to be shorted
Option 1: Tested per DIN EN 60747-5-2 (VDE 0884) / DIN EN 60747-5-5 (pending)
Option 6: Wide lead spacing (10.16 mm creepage / clearance distances > 8 mm)
Option 7: Surface mount leads (creepage / clearance distances > 8 mm)
Option 8: Surface mount leads
Option 9: Surface mount leads
See CECC 00802, edition 1, for soldering conditions for SMT devices (option 7 and 9).
“-..” means dash selections
DESCRIPTION SYMBOL SYSTEM 4 (2) SYSTEM 5 SYSTEM 7 UNIT
IL410 6N135 IL300
IL420 6N136 IL300E
IL4116 SFH6135 IL300F
IL4117 SFH6136 IL300EF
IL4118 6N138 IL300DEFG
IL4216 SFH6138
IL4217 SFH6139
IL4218 6N139
SFH6345
6N137...
VO2601...
VO2611...
VO2630...
VO2631...
VO4661...
Installation category (DIN VDE 0110)
For rated line voltages 300 VRMS I to IV I to IV I to IV
For rated line voltages 600 VRMS I to III I to IV I to IV
For rated line voltages 1000 VRMS
IEC climatic category (DIN IEC 60068 Part 1/9.80) 55/100/21 55/100/21 55/100/21
Pollution degree (DIN VDE 0110 Part 1/1.89) 2 2 2
Maximum operation insulating voltage (1) VIORM 890 890 890 Vpeak
Test voltage input/output, procedure b (1)
VPr = 1.875 x VIORM, routine 100 % test, tp = 1 s,
partial discharge < 5 pC
VPr 1669 1669 1669 Vpeak
Test voltage input/output, procedure a (1)
VPr = 1.6 x VIORM, type and sampling Test tp = 60 s,
partial discharge < 5 pC
VPr 1424 1424 1424 Vpeak
Maximum permissible overvoltage (transient
overvoltage) VIOTM 8000 8000 8000 Vpeak
Partial discharge test voltage (1) VINITIAL 8000 8000 8000 Vpeak
Safety maximum ratings
(maximum permissible ratings in case of a fault,
also refer to diagram)
Package temperature
Current
(input current IF, PSi = 0, TA = 25 °C)
Derating with higher ambient temperature
Power (output or total power dissipation, TA = 25 °C)
Derating with higher ambient temperature
Tsi
Isi
DISi
PSi
PSi
175
250
-1.65
500
-3.33
175
300
-2
500
-3.33
165
235
-1.57
465
-3.1
°C
mA
mA/K
mW
mW/K
Insulation resistance at TSi VI/O = 500 V RIS > 109> 109> 109W
Option Information
www.vishay.com Vishay Semiconductors
Rev. 2.0, 24-Aug-15 5Document Number: 83713
For technical questions, contact: optocoupleranswers@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
OPTION 6
DIP OPTOCOUPLERS WITH 0.4" (10.16 mm) LEAD SPREAD
The leads of the optocouplers are bent according to a
spacing of 0.4" (10.16 mm). Dimensions deviating from the
standard type are:
Lead spacing 10.16 mm (0.4")
Creepage distance > 8 mm
Clearance > 8 mm
This version additionally complies with the following
standards:
IEC 60950 DIN VDE 0805/05 90 (System 2 and 3 only)
Reinforced insulation up to an operating voltage of 400
VRMS or DC
Clearance-creepage distance = 8 mm min.
See standard version for pin configuration
OPTION 7
LEAD BENDS FOR SURFACE MOUNT OPTOCOUPLERS
These optocouplers are suitable for surface mounting.
Dimensions deviating from the standard type are:
Creepage distance > 8 mm
Clearance distance > 8 mm
This version additionally complies with the following
standards:
IEC 60950 DIN VDE 0805/05 90 (system 2 and 3 only)
Reinforced insulation up to an operating voltage of
400 VRMS or DC
During the soldering process, the package should not be
wetted with tin-lead solder to prevent the impairment of the
isolation features. Apart from iron soldering, only reflow
soldering methods (vapor phase, infrared and hot gas) are
permissible.
Permissible soldering conditions for SMD bending options:
please see reflow soldering profile.
The soldering process may be repeated two times at the
most. Attention must be paid to the cooling down of the
device to 25 °C between the soldering processes.
Clearance and creepage distances must be considered for
the solder pad design.
Clearance-creepage distance = 8 mm min.
See standard version for pin configuration.
20802-5 10.16 typ.
7.62 typ.
3.5 ± 0.3
2.55 ± 0.25
0.1 min.
8 min.
7.62 typ.
4.6
4.1
8.4 min.
10.3 max.
0.7 min.
DIP 6
DIP 4, DIP 8, DIP 16
8.41 min.
3.81
3.30
10.3 max.
0.90
0.51
7.62 typ.
11.0 max.
9.00 ± 0.15
12.30 ± 0.30
0.25 ± 0.05
0.75 ± 0.25
1.00 ± 0.15
10.16 min.
Lead
coplanarity:
max. 0.10
Wide Body, Option 7
Option Information
www.vishay.com Vishay Semiconductors
Rev. 2.0, 24-Aug-15 6Document Number: 83713
For technical questions, contact: optocoupleranswers@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
OPTION 8
LEAD BENDS FOR SURFACE MOUNT OPTOCOUPLERS
These optocouplers are suitable for surface mounting.
Dimensions deviating from the standard type are:
Creepage distance > 8 mm
Clearance distance > 8 mm
This version additionally complies with the following
standards:
IEC 60950 DIN VDE 0805/05 90 (system 2 and 3 only)
Reinforced insulation up to an operating voltage of
400 VRMS or DC
During the soldering process, the package should not be
wetted with tin-lead solder to prevent the impairment of the
isolation features. Apart from iron soldering, only reflow
soldering methods (vapor phase, infrared and hot gas) are
permissible.
Permissible soldering conditions for SMD bending options:
please see reflow soldering profile.
The soldering process may be repeated two times at the
most. Attention must be paid to the cooling down of the
device to 25 °C between the soldering processes.
Clearance and creepage distances must be considered for
the solder pad design.
Clearance-creepage distance = 8 mm min.
See standard version for pin configuration.
OPTION 9
LEAD BENDS FOR SURFACE MOUNT OPTOCOUPLERS
During the soldering process, the package should not be
wetted with tin-lead solder to prevent the impairment of the
isolation features. Apart from iron soldering, only reflow
soldering methods (vapor phase, infrared and hot gas) are
permissible.
Permissible soldering conditions for SMD bending options:
please see reflow soldering profile.
The soldering process may be repeated two times at the
most. Attention must be paid to the cooling down of the
device to 25 °C between the soldering processes.
DIP 4
DIP 6
7.62 typ.
3.81
3.30
12 max.
9.27 min.
12 max.
9.27 min.
0.50
0.00
7.62 typ.
3.81
3.30
0.50
0.00
17932-1
0.51
1.02
7.62 ref.
9.53
10.03
0.30 typ.
0.102
0.249
15° max.
17933-1
Option Information
www.vishay.com Vishay Semiconductors
Rev. 2.0, 24-Aug-15 7Document Number: 83713
For technical questions, contact: optocoupleranswers@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
MARKINGS
Product marking is defined in the datasheets. In the cases
where marking is not defined in the datasheet, the following
table defines the option information that is marked on the
product.
Note
(1) X1 is used on the SOP and SOIC-8 where there are space
constraints.
Note
The information in this document provides generic information on
options but for specific information on a product the appropriate
product datasheet should be used.
OPTION TYPE MARKING
X001, X001T X001, X1 (1)
X006 No mark
X007, X007T X007
X008, X008T X008
X009, X009T No mark
X016 X001
X017, X017T X017
X018, X018T X018
X019, X019T X001

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