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C Series, Soft Termination Datasheet

TDK Corporation

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Datasheet

SPECIFICATION SPEC. No. C-SoftC-c
D A T E : 2016 Nov.
To
Upon the acceptance of this spec.
previous spec. (C2014-0057) shall
be abolished.
CUSTOMER’S PRODUCT NAME TDK'S PRODUCT NAME
Multilayer Ceramic Chip Capacitors
C series/ Commercial grade
Soft Termination
Please return this specification to TDK representatives with your signature.
If orders are placed without returned specification, please allow us to judge that specification is
accepted by your side.
RECEIPT CONFIRMATION
DATE: YEAR MONTH DAY
TDK Corporation
Sales Engineering
Electronic Components
Sales & Marketing Group
Electronic Components Business Company
Ceramic Capacitors Business Group
APPROVED Person in charge APPROVED CHECKED Person in charge
Non-Controlled Copy
— 1 —
1. SCOPE
This specification is applicable to chip type multilayer ceramic capacitors with a priority over the
other relevant specifications.
Production places defined in this specification shall be TDK Corporation Japan,
TDK(Suzhou)Co.,Ltd and TDK Components U.S.A. Inc.
EXPLANATORY NOTE:
This specification warrant the quality of the ceramic chip capacitor. The chips should be evaluated
or confirmed a state of mounted on your product.
If the use of the chips go beyond the bounds of this specification, we can not afford to guarantee.
2. CODE CONSTRUCTION
(Example)
Catalog Number: C7563 X7S 1C 107 M 280 L E
(Web) (1) (2) (3) (4) (5) (6) (7) (8)
Item Description: C7563 X7S 1C 107 M T xxxS
(1) (2) (3) (4) (5) (9) (10)
(1) Type
Symbol Type
(EIA style) Symbol Type
(EIA style)
C1005 CC0402 C4520 CC1808
C1608 CC0603 C4532 CC1812
C2012 CC0805 C5750 CC2220
C3216 CC1206 C7563 CC3025
C3225 CC1210
*As for dimensions of each product, please refer to detailed information on TDK web.
(2) Temperature Characteristics
(Details are shown in table 1 No.6 and No.7 at 8.PERFORMANCE.)
(3) Rated Voltage Symbol Rated Voltage Symbol Rated Voltage
1 A DC 10 V 2 E DC 250 V
1 C DC 16 V 2 W DC 450 V
1 E DC 25 V 2 J DC 630 V
1 V DC 35 V 3 A DC 1000 V
1 H DC 50 V 3 D DC 2000 V
2 A DC 100 V 3 F DC 3000 V
L
B
G
BW
T
Terminal electrode
Ceramic dielectric
Internal electrode
— 2 —
(4) Rated Capacitance
Stated in three digits and in units of pico farads (pF).
The first and Second digits identify the first and second
significant figures of the capacitance, the third digit
identifies the multiplier.
Symbol Rated
Capacitance
101 100pF
225 2,200,000pF
(=2.2μF)
(5) Capacitance tolerance
*M tolerance shall be TDK standard for
Over 10μF parts.
Symbol Tolerance
J ± 5 %
K ± 10 %
M* ± 20 %
(6) Thickness code (Only catalog number)
(7) Package code (Only catalog number)
(8) Special code (Only catalog number)
Symbol Description
E Soft termination
(9) Packaging (Only item description)
(Bulk is not applicable for C1005 [CC0402] type.)
Symbol Packaging
B Bulk
T Taping
(10) TDK internal code (Only item description)
xxx S
S: Soft termination
These TDK internal codes are subject to change without notice.
3. RATED CAPACITANCE AND TOLERANCE
3.1 Standard combination of rated capacitance and tolerances
Class Temperature
Characteristics Capacitance tolerance Rated capacitance
1 C0G J (± 5 %)
K (± 10 %) E – 6 series
2
X7R
X7S
X7T
X8R
Cap
10μF
K (± 10 %)
M (± 20 %) E – 6 series
Cap
10μF M (± 20 %) E – 3 series
3.2 Capacitance Step in E series
E series Capacitance Step
E- 3 1.0 2.2 4.7
E- 6 1.0 1.5 2.2 3.3 4.7 6.8
— 3 —
4. OPERATING TEMPERATURE RANGE
T.C. Min. operating
Temperature Max. operating
Temperature
Reference
Temperature
C0G,
X7R,X7S,X7T -55°C 125°C 25°C
X8R -55°C 150°C 25°C
5. STORING CONDITION AND TERM
5 to 40°C at 20 to 70%RH
6 months Max.
6. P.C. BOARD
When mounting on an aluminum substrate, large case size such as C3225 [CC1210]~
C7563 [CC3025] types are more likely to be affected by heat stress from the substrate.
Please inquire separate specification for the large case sizes when mounted on the substrate.
7. INDUSTRIAL WASTE DISPOSAL
Dispose this product as industrial waste in accordance with the Industrial Waste Law.
— 4 —
8. PERFORMANCE
table 1
No. Item Performance Test or inspection method
1 External Appearance No defects which may affect
performance.
Inspect with magnifying glass (3×)
2 Insulation Resistance
10,000M or 500M·μF min.
(As for the capacitors of rated
voltage 16V DC and,10,000 M or
100M·μF min.,) whichever smaller.
Apply rated voltage for 60s.
As for the capacitor of rated voltage 630V DC
and above, apply 500V DC.
3 Voltage Proof Withstand test voltage without
insulation breakdown or other
damage.
Class Rated voltage
(RV) Apply voltage
1
RV100V 3 × rated voltage
100VRV500V 1.5 × rated voltage
630V 1.3 × rated voltage
630VRV 1.2 × rated voltage
2
RV100V 2.5 × rated voltage
100VRV500V 1.5 × rated voltage
630V 1.3 × rated voltage
630VRV 1.2 × rated voltage
Above DC voltage shall be applied for 1s.
Charge/ discharge current shall not
exceed 50mA.
4 Capacitance Within the specified tolerance.
Class Capacitance Measuring
frequency
Measuring
voltage
1
Cap1000pF 1MHz±10%
0.5 - 5 Vrms.
Cap1000pF 1kHz±10%
2
Cap10μF 1kHz±10% 1.0±0.2Vrms
Cap10μF 120Hz±20% 0.5±0.2Vrms
For information which product has which
measuring voltage, please contact with our
sales representative.
5 Q
(Class1)
As for spec of each product, please
refer to detailed information on TDK
web.
See No.4 in this table for measuring
condition.
Dissipation Factor
(Class2)
6 Temperature
Characteristics
of Capacitance
(Class1)
Temperature coefficient shall be calculated
based on values at 25°C and 85°C
temperature.
Measuring temperature below 20°C shall
be -10°C and -25°C.
T. C. Temperature Coefficient
C0G 0 ± 30 (ppm/°C)
Capacitance drift within ± 0.2% or
± 0.05pF, whichever larger.
— 5 —
(continued)
No. Item Performance Test or inspection method
7
Temperature
Characteristics
of Capacitance
(Class2)
Capacitance Change (%) Capacitance shall be measured by the
steps shown in the following table after
thermal equilibrium is obtained for each
step.
C be calculated ref. STEP3 reading
No voltage applied
X7R: ±15
X7S: ±22
X7T: +22,-33
X8R: ±15 Step Temperature(°C)
1 25 ± 2
2 -55 ± 3
3 25 ± 2
4* Max. operating Temp. ± 2
*X7R, X7S, X7T: 125°C
X8R: 150°C
8 Robustness of
Terminations
No sign of termination coming off,
breakage of ceramic, or other
abnormal signs.
Reflow solder the capacitors on a P.C.
board shown in Appendix2 and apply a
pushing force of 5N with 10±1s.
(2N is applied for C1005 [CC0402] type)
9 Bending No mechanical damage. Reflow solder the capacitors on a P.C.
board shown in Appendix1 and bend
it for 5mm. (2mm is applied for C4520
[CC1808] ~ C5750 [CC2220] parts, 1mm
is applied for C7563 [CC3025] parts)
(Unit : mm)
10 Solderability New solder to cover over 75% of
termination.
25% may have pin holes or rough
spots but not concentrated in one
spot.
Ceramic surface of A sections
shall not be exposed due to
melting or shifting of termination
material.
Completely soak both terminations
in solder at the following conditions.
Solder : Sn-3.0Ag-0.5Cu or Sn-37Pb
Temperature: 245±5°C (Sn-3.0Ag-0.5Cu)
235±5°C (Sn-37Pb)
Soaking time: 3±0.3s (Sn-3.0Ag-0.5Cu)
2±0.2s (Sn-37Pb)
Flux: Isopropyl alcohol (JIS K 8839)
Rosin (JIS K 5902) 25% solid
solution.
5
20
50 F
R230
45 45
A section
Pushing force
P.C. board
Capacitor
— 6 —
(continued)
No. Item Performance Test or inspection method
11 Resistance
to solder
heat
External
appearance
No cracks are allowed and
terminations shall be covered at
least 60% with new solder.
Completely soak both terminations in
solder at the following conditions.
260±5°C for 10±1s.
Preheating condition
Temp.: 110 - 140°C
Time : 30 - 60s.
Solder : Sn-3.0Ag-0.5Cu or Sn-37Pb
Flux : Isopropyl alcohol (JIS K 8839)
Rosin (JIS K 5902) 25% solid
solution.
Leave the capacitors in ambient
condition for 6 to 24h (Class1) or
24±2h (Class2) before measurement.
Capacitance
Characteristics Change from the
value before test*
Class1/
C0G ± 2.5 %
Class2/
X7R, X7S,
X7T, X8R
± 7.5 %
Q
(Class1)
Meet the initial spec.
D.F.
(Class2)
Meet the initial spec.
Insulation
Resistance
Meet the initial spec.
Voltage
proof
No insulation breakdown or
other damage.
12 Vibration External
appearance
No mechanical damage. Reflow solder the capacitors on a P.C.
board shown in Appendix2 before
testing.
Vibrate the capacitors with amplitude of
1.5mm P-P changing the frequencies
from 10Hz to 55Hz and back to 10Hz in
about 1min.
Repeat this for 2h each in 3
perpendicular directions.
Capacitance
Characteristics Change from the
value before test*
Class1/
C0G ± 2.5 %
Class2/
X7R, X7S,
X7T, X8R
± 7.5 %
Q
(Class1)
Meet the initial spec.
D.F.
(Class2)
Meet the initial spec.
*Typical SPEC.
— 7 —
(continued)
No. Item Performance Test or inspection method
13 Temperature
cycle
External
appearance
No mechanical damage. Reflow solder the capacitors on a P.C.
board shown in Appendix2 before
testing.
Expose the capacitors in the condition
step1 through step 4 and repeat 5 times
consecutively.
Leave the capacitors in ambient
condition for 6 to 24h (Class1) or 24±2h
(Class2) before measurement.
*C0G, X7R, X7S, X7T: 125°C
X8R: 150°C
Capacitance
Characteristics Change from the
value before test*
Class1/
C0G ± 2.5 %
Class2/
X7R, X7S,
X7T, X8R
± 7.5 %
Q
(Class1)
Meet the initial spec.
D.F.
(Class2)
Meet the initial spec.
Insulation
Resistance
Meet the initial spec.
Voltage
proof
No insulation breakdown or
other damage.
14 Moisture
Resistance
(Steady
State)
External
appearance
No mechanical damage. Reflow solder the capacitors on
a P.C. board shown in Appendix2
before testing.
Leave at temperature 40±2°C,
90 to 95%RH for 500 +24,0h.
Leave the capacitors in ambient
condition for 6 to 24h (Class1) or
24±2h (Class2) before measurement.
Capacitance
Characteristics Change from the
value before test*
Class1/
C0G ± 5 %
Class2/
X7R, X7S,
X7T, X8R
± 12.5 %
Q
(Class1)
350 min.
D.F.
(Class2)
200% of initial spec. max.
Insulation
Resistance
1,000M or 50M·μF min.
(As for the capacitors of rated
voltage 16V DC, 1,000 M or
10M·μF min.,) whichever
smaller.
*Typical SPEC.
Step Temperature(°C) Time (min.)
1 -55 ±3 30 ± 3
2 25 2 - 5
3* Max. operating
Te mp . ± 2 30 ± 2
4 25 2 - 5
— 8 —
(continued)
No. Item Performance Test or inspection method
15 Moisture
Resistance
External
appearance
No mechanical damage. Reflow solder the capacitors on a P.C.
board shown in Appendix2 before testing.
Apply the rated voltage at temperature
40±2°C and 90 to 95%RH for 500 +24,0h.
Charge/ discharge current shall not
exceed 50mA.
Leave the capacitors in ambient condition
for 6 to 24h (Class1) or 24±2h (Class2)
before measurement.
Voltage conditioning (only for Class2)
Voltage treat the capacitors under testing
temperature and voltage for 1 hour.
Leave the capacitors in ambient condition
for 24±2h before measurement.
Use this measurement for initial value.
Capacitance
Characteristics Change from the
value before test*
Class1/
C0G ± 7.5 %
Class2/
X7R, X7S,
X7T, X8R
± 12.5 %
Q
(Class1)
200 min.
D.F.
(Class2)
200% of initial spec. max.
Insulation
Resistance
500M or 25M·μF min.
(As for the capacitors of rated
voltage 16V DC, 500 M or
5M·μF min.,) whichever smaller.
16 Life External
appearance
No mechanical damage. Reflow solder the capacitors on a P.C.
board shown in Appendix2 before testing.
Below the voltage shall be applied at
Max. operating Temp. ±2°C for 1,000
+48,0h.
Applied Voltage
Rated voltage x2
Rated voltage x1.5
Rated voltage x1.2
Rated voltage x1
As for applied voltage, please contact
with TDK representative.
Charge/ discharge current shall not
exceed 50mA.
Leave the capacitors in ambient condition
for 6 to 24h (Class1) or 24±2h (Class2)
before measurement.
Voltage conditioning (only for Class2)
Voltage treat the capacitors under testing
temperature and voltage for 1 hour.
Leave the capacitors in ambient condition
for 24±2h before measurement.
Use this measurement for initial value.
Capacitance
Characteristics Change from the
value before test*
Class1/
C0G ± 3 %
Class2/
X7R, X7S,
X7T, X8R
± 15 %
Q
(Class1)
350 min.
D.F.
(Class2)
200% of initial spec. max.
Insulation
Resistance
1,000M or 50M·μF min.
(As for the capacitors of rated
voltage 16V DC,1,000 M or
10M·μF min.,) whichever
smaller.
*Typical SPEC.
**As for the initial measurement of capacitors (Class2) on number 7,11,12,13 and 14 leave capacitors
at 150 –10,0°C for 1 hour and measure the value after leaving capacitors for 24±2h in ambient condition.
— 9 —
Appendix1
P.C. board for bending test
C1005 [CC0402] C1608 [CC0603] ~ C7563 [CC3025]
Appendix2
P.C. Board for reliability test
(It is recommended to provide a slit on P.C. board for C3225 [CC1210] ~ C7563 [CC3025].)
Unitmm
Type Dimensions
TDK(EIA style) a b c
C1005 [CC0402] 0.4 1.5 0.5
C1608 [CC0603] 1.0 3.0 1.2
C2012 [CC0805] 1.2 4.0 1.65
C3216 [CC1206] 2.2 5.0 2.0
C3225 [CC1210] 2.2 5.0 2.9
C4520 [CC1808] 3.5 7.0 2.5
C4532 [CC1812] 3.5 7.0 3.7
C5750 [CC2220] 4.5 8.0 5.6
C7563 [CC3025] 5.5 9.1 6.9
1. Material : Glass Epoxy(As per JIS C6484 GE4) Copper (Thickness:0.035mm)
Solder resist
2. Thickness : Appendix 1 0.8mm (C1005 [CC0402])
1.6mm (C1608 [CC0603] ~ C7563 [CC3025])
: Appendix 2 1.6mm
100
c
a
b
40
Copper
Solder resist
Slit
1.0
c
40
a
b
100
Copper
Solder resist
1.0
40
b
Solder resist
c
a
Copper
100
— 10 —
9. INSIDE STRUCTURE AND MATERIAL
No. NAME MATERIAL
Class1 Class2
1 Dielectric CaZrO3 BaTiO3
2 Electrode Nickel (Ni)
3
Termination
Copper (Cu)
4 Conductive resin (Filler: Ag)
5 Nickel (Ni)
6 Tin (Sn)
10. PACKAGING
Packaging shall be done to protect the components from the damage during transportation and storing,
and a label which has the following information shall be attached.
1) Total number of components in a plastic bag for bulk packaging : 1000pcs
2) Tape packaging is as per 14. TAPE PACKAGING SPECIFICATION.
(C1005 [CC0402] types are applicable only to tape packaging.)
1) Inspection No.
2) TDK P/N
3) Customer's P/N
4) Quantity
*Composition of Inspection No.
Example F 6 AΟΟΟΟΟ
(a) (b) (c) (d) (e)
a) Line code
b) Last digit of the year
c) Month and A for January and B for February and so on. (Skip I)
d) Inspection Date of the month.
e) Serial No. of the day
11. RECOMMENDATION
As for C3225 [CC1210] and larger, it is recommended to provide a slit (about 1mm width)
in the board under the components to improve washing Flux. And please make sure to dry
detergent up completely before.
12. SOLDERING CONDITION
As for C1005 [CC0402], C3225 [CC1210] and larger, reflow soldering only.
3
4
5
1 2
6
— 11 —
13. Caution
No. Process Condition
1 Operating
Condition
(Storage,
Transportation)
1-1. Storage
1)
2)
3)
4)
5)
The capacitors must be stored in an ambient temperature of 5 to 40°C with a
relative humidity of 20 to 70%RH. The products should be used within 6 months
upon receipt.
The capacitors must be operated and stored in an environment free of dew
condensation and these gases such as Hydrogen Sulphide, Hydrogen Sulphate,
Chlorine, Ammonia and sulfur.
Avoid storing in sun light and falling of dew.
Do not use capacitors under high humidity and high and low atmospheric pressure
which may affect capacitors reliability.
Capacitors should be tested for the solderability when they are stored for long time.
1-2. Handling in transportation
In case of the transportation of the capacitors, the performance of the capacitors
may be deteriorated depending on the transportation condition.
(Refer to JEITA RCR-2335C 9.2 Handling in transportation)
2 Circuit design
Caution
2-1. Operating temperature
Operating temperature should be followed strictly within this specification, especially
be careful with maximum temperature.
1)
2)
3)
Do not use capacitors above the maximum allowable operating temperature.
Surface temperature including self heating should be below maximum operating
temperature.
(Due to dielectric loss, capacitors will heat itself when AC is applied. Especially at
high frequencies around its SRF, the heat might be so extreme that it may damage
itself or the product mounted on. Please design the circuit so that the maximum
temperature of the capacitors including the self heating to be below the maximum
allowable operating temperature. Temperature rise at capacitor surface shall be
below 20°C)
The electrical characteristics of the capacitors will vary depending on the
temperature. The capacitors should be selected and designed in taking the
temperature into consideration.
2-2. Operating voltage
1) Operating voltage across the terminals should be below the rated voltage.
When AC and DC are super imposed, V0-P must be below the rated voltage.
— (1) and (2)
A
C or pulse with overshooting, VP-P must be below the rated voltage.
— (3), (4) and (5)
When the voltage is started to apply to the circui
t
or it is stopped applying, the
irregular voltage may be generated for a transit period because of resonance or
switching. Be sure to use the capacitors within rated voltage containing these
Irregular voltage.
Voltage (1) DC voltage (2) DC+AC voltage (3) AC voltage
Positional
Measurement
(Rated voltage)
V0-P
0
V0-P
0
VP-P
Voltage (4) Pulse voltage (A) (5) Pulse voltage (B)
Positional
Measurement
(Rated voltage)
VP-P
VP-P
0
0
0
— 12 —
No. Process Condition
2 Circuit design
Caution
2)
3)
Even below the rated voltage, if repetitive high frequency AC or pulse is applied, the
reliability of the capacitors may be reduced.
The effective capacitance will vary depending on applied DC and AC voltages.
The capacitors should be selected and designed in taking the voltages into
consideration.
2-3. Frequency
When the capacitors (Class 2) are used in AC and/or pulse voltages, the
capacitors may vibrate themselves and generate audible sound.
3 Designing
P.C. board
The amount of solder at the terminations has a direct effect on the reliability of the
capacitors.
1)
2)
3)
The greater the amount of solder, the higher the stress on the chip capacitors,
and the more likely that it will break. When designing a P.C. board, determine the
shape and size of the solder lands to have proper amount of solder on the
terminations.
Avoid using common solder land for multiple terminations and provide individual
solder land for each terminations.
Size and recommended land dimensions.
Flow soldering (mm)
Type
Symbol
C1608
[CC0603]
C2012
[CC0805)
C3216
[CC1206]
A 0.7 - 1.0 1.0 - 1.3 2.1 - 2.5
B 0.8 - 1.0 1.0 - 1.2 1.1 - 1.3
C 0.6 - 0.8 0.8 - 1.1 1.0 - 1.3
Reflow soldering (mm)
Type
Symbol
C1005
[CC0402]
C1608
[CC0603]
C2012
[CC0805]
C3216
[CC1206]
A 0.3 - 0.5 0.6 - 0.8 0.9 - 1.2 2.0 - 2.4
B 0.35 -
0.45 0.6 - 0.8 0.7 - 0.9 1.0 - 1.2
C 0.4 - 0.6 0.6 - 0.8 0.9 - 1.2 1.1 - 1.6
Type
Symbol
C3225
[CC1210]
C4520
[CC1808]
C4532
[CC1812]
C5750
[CC2220]
C7563
[CC3025]
A 2.0 - 2.4 3.1 – 3.7 3.1 - 3.7 4.1 - 4.8 5.2 - 5.8
B 1.0 - 1.2 1.2 - 1.4 1.2 - 1.4 1.2 - 1.4 1.7 - 1.9
C 1.9 - 2.5 1.5 - 2.0 2.4 - 3.2 4.0 - 5.0 6.4 - 7.4
A
B
C
Chip capacitors Solder land
Solder resis
t
— 13 —
No. Process Condition
3 Designing
P.C. board
4) Recommended chip capacitors layout is as following.
Disadvantage against
bending stress
Advantage against
bending stress
Mounting
face
Perforation or slit
Break P.C. board with
mounted side up.
Perforation or slit
Break P.C. board with
mounted side down.
Chip
arrangement
(Direction)
Mount perpendicularly to
perforation or slit
Perforation or slit
Mount in parallel with
perforation or slit
Perforation or slit
Distance
from slit
Closer to slit is higher stress
1
( 1 < 2 )
Away from slit is less stress
2
( 1 < 2 )
— 14 —
No. Process Condition
3 Designing
P.C. board
5) Mechanical stress varies according to location of chip capacitors on the P.C. board.
The stress in capacitors is in the following order.
A > B = C > D > E
6) Layout recommendation
Example Use of common
solder land
Soldering with
chassis
Use of common
solder land with
other SMD
Need to
avoid
Recommen-
dation
Solder resist
2 > 1
2
Chassis
1
Excessive solde
r
Solder
land
Excessive solder
Missing
solder
S
o
ld
er
l
an
d
Lead wire
Solder resist
Solder resist
Lead wire
Solde
r
chip
Solder land
Adhesive
PCB
A
C
D
B
E
Sli
t
Perforation
— 15 —
No. Process Condition
4 Mounting 4-1. Stress from mounting head
If the mounting head is adjusted too low, it may induce excessive stress in the chip
capacitors to result in cracking. Please take following precautions.
1)
2)
3)
Adjust the bottom dead center of the mounting head to reach on the P.C. board
surface and not press it.
Adjust the mounting head pressure to be 1 to 3N of static weight.
To minimize the impact energy from mounting head, it is important to provide
support from the bottom side of the P.C. board.
See following examples.
Not recommended Recommended
Single sided
mounting
Double-sides
mounting
When the centering jaw is worn out, it may give mechanical impact on the capacitors
to cause crack. Please control the close up dimension of the centering jaw and
provide sufficient preventive maintenance and replacement of it.
4-2. Amount of adhesive
Example : C2012 [CC0805], C3216 [CC1206]
a 0.2mm min.
b 70 - 100μm
c Do not touch the solder land
Crac
k
Solde
r
peeling Crac
k
Support pin
Support pin
aa
b
cc
— 16 —
No. Process Condition
5 Soldering 5-1. Flux selection
Although highly-activated flux gives better solderability, substances which increase
activity may also degrade the insulation of the chip capacitors. To avoid such
degradation, it is recommended following.
1)
2)
3)
It is recommended to use a mildly activated rosin flux (less than 0.1wt% chlorine).
Strong flux is not recommended.
Excessive flux must be avoided. Please provide proper amount of flux.
When water-soluble flux is used, enough washing is necessary.
5-2. Recommended soldering profile by various methods
*As for peak temperature of manual soldering, please refer5-6. Solder repair by solder iron.
5-3. Recommended soldering peak temp and peak temp duration
Temp./Duration
Solder
Wave soldering Reflow soldering
Peak temp(°C) Duration(sec.) Peak temp(°C) Duration(sec.)
Sn-Pb Solder 250 max. 3 max. 230 max. 20 max.
Lead Free Solder 260 max. 5 max. 260 max. 10 max.
Recommended solder compositions
Sn-37Pb (Sn-Pb solder)
Sn-3.0Ag-0.5Cu (Lead Free Solder)
APPLICATION
As for C1608 [CC0603] ~ C3216 [CC1206],
applied to wave soldering and reflow
soldering.
As for C1005 [CC0402] and
C3225 [CC1210] ~ C7563 [CC3025], applied
only to reflow soldering.
0
T
Over 60 sec.
Natural cooling
Preheating Soldering
Reflow soldering
P
ea
k
Temp
Tem p .. (°C)
Peak Temp time
0
Peak Temp time
Over 60 sec.
Over 60 sec.
Tem p . (° C )
T
P
ea
k
Temp
Natural cooling
Soldering
Preheating
Wave soldering
T
Preheatin
g
3sec. (As short as possible)
0
Tem p .. (°C)
P
ea
k
Temp
Manual soldering
(Solder iron)
— 17 —
No. Process Condition
5 Soldering 5-4. Avoiding thermal shock
1) Preheating condition
Soldering Type Temp. (°C)
Wave
soldering C1608 [CC0603], C2012 [CC0805], C3216 [CC1206] T 150
Reflow
soldering
C1005 [CC0402], C1608 [CC0603], C2012 [CC0805],
C3216 [CC1206] T 150
C3225 [CC1210], C4520 [CC1808), C4532 [CC1812],
C5750 [CC2220), C7563 [CC3025] T 130
Manual
soldering
C1005 [CC0402], C1608 [CC0603], C2012 [CC0805],
C3216 [CC1206] T 150
C3225 [CC1210], C4520 [CC1808), C4532 [CC1812],
C5750 [CC2220), C7563 [CC3025] T 130
2) Cooling condition
Natural cooling using air is recommended. If the chips are dipped into a solvent
for cleaning, the temperature difference (T) must be less than 100°C.
5-5. Amount of solder
Excessive solder will induce higher tensile force in chip capacitors when
temperature changes and it may result in chip cracking. In sufficient solder may
detach the capacitors from the P.C. board.
Excessive
solder
Higher tensile force in
chip capacitors to cause
crack
Adequate
Insufficient
solder
Low robustness may
cause contact failure or
chip capacitors come off
the P.C. board.
5-6. Solder re
p
air b
y
solder iron
1) Selection of the soldering iron tip
Tip temperature of solder iron varies by its type, P.C. board material and solder
land size. The higher the tip temperature, the quicker the operation. However,
heat shock may cause a crack in the chip capacitors.
Please make sure the tip temp. before soldering and keep the peak temp and
time in accordance with following recommended condition. (Please preheat the
chip capacitors with the condition in 5-4 to avoid the thermal shock.)
Recommended solder iron condition (Sn-Pb Solder and Lead Free Solder)
Type Temp. (°C) Duration (sec.) Wattage (W) Shape (mm)
C1005 [CC0402]
C1608 [CC0603]
C2012 [CC0805]
C3216 [CC1206]
350 max.
3 max. 20 max. Ø 3.0 max.
C3225 [CC1210]
C4520 [CC1808]
C4532 [CC1812]
C5750 [CC2220]
C7563 [CC3025]
280 max.
Maximum amount
Minimum amount
— 18 —
No. Process Condition
5 Soldering
2) Direct contact of the soldering iron with ceramic dielectric of chip capacitors may
cause crack. Do not touch the ceramic dielectric and the terminations by solder
iron.
3) It is not recommended to reuse dismounted capacitors.
5-7. Sn-Zn solder
Sn-Zn solder affects product reliability.
Please contact TDK in advance when utilize Sn-Zn solder.
5-8. Countermeasure for tombstone
The misalignment between the mounted positions of the capacitors and the land
patterns should be minimized. The tombstone phenomenon may occur especially
the capacitors are mounted (in longitudinal direction) in the same direction of the
reflow soldering.
(Refer to JEITA RCR-2335C Annex A (Informative) Recommendations to prevent the
tombstone phenomenon)
6 Cleaning 1)
2)
If an unsuitable cleaning fluid is used, flux residue or some foreign articles may
stick to chip capacitors surface to deteriorate especially the insulation resistance.
If cleaning condition is not suitable, it may damage the chip capacitors.
2)-1. Insufficient washing
(1)
(2)
(3)
Terminal electrodes may corrode by Halogen in the flux.
Halogen in the flux may adhere on the surface of capacitors, and lower the
insulation resistance.
Water soluble flux has higher tendency to have above mentioned
problems (1) and (2).
2)-2. Excessive washing
When ultrasonic cleaning is used, excessively high ultrasonic energy output
can affect the connection between the ceramic chip capacitor's body and the
terminal electrode. To avoid this, following is the recommended condition.
Power : 20 W/
max.
Frequency : 40 kHz max.
Washing time : 5 minutes max.
2)-3. If the cleaning fluid is contaminated, density of Halogen increases, and it may
bring the same result as insufficient cleaning.
— 19 —
No. Process Condition
7 Coating and
molding of the
P.C. board
1)
2)
3)
When the P.C. board is coated, please verify the quality influence on the product.
Please verify carefully that there is no harmful decomposing or reaction gas
emission during curing which may damage the chip capacitors.
Please verify the curing temperature.
8 Handling after
chip mounted
Caution
1)
Please pay attention not to bend or distort the P.C. board after soldering
in handling otherwise the chip capacitors may crack.
Bend Twist
2) Printed circuit board cropping should not be carried out by hand, but by using the
proper tooling. Printed circuit board cropping should be carried out using a board
cropping jig as shown in the following figure or a board cropping apparatus to
prevent inducing mechanical stress on the board.
(1)Example of a board cropping jig
Recommended example: The board should be pushed from the back side,
close to the cropping jig so that the board is not bent and the stress applied to
the capacitor is compressive.
Unrecommended example: If the pushing point is far from the cropping jig and
the pushing direction is from the front side of the board, large tensile stress is
applied to the capacitor, which may cause cracks.
Outline of jig Recommended Unrecommended
Printed
circuit
board V-groove
Board
cropping jig
Slot
Printed
circuit
board
Slot
V-groove
Load point
Components
Direction of
load Direction
of load
Components
Printed
circuit
board
Load point
Slot
V-groove
— 20 —
No. Process Condition
8 Handling after
chip mounted
Caution
(2)Example of a board cropping machine
An outline of a printed circuit board cropping machine is shown below. The
top and bottom blades are aligned with one another along the lines with the
V-grooves on printed circuit board when cropping the board.
Unrecommended example: Misalignment of blade position between top and
bottom, right and left, or front and rear blades may cause a crack in the
capacitor.
Outline of machine Principle of operation
Recommended
Unrecommended
Top-bottom
misalignment
Left-right
misalignment
Front-rear
misalignment
Top blade
Board
Bottom blade
Top blade
Bottom blade
Top blade
Bottom blade
Top blade
Bottom blade
3)
When functional check of the P.C. board is performed, check pin pressure tends
to be adjusted higher for fear of loose contact. But if the pressure is excessive
and bend the P.C. board, it may crack the chip capacitors or peel the
terminations off. Please adjust the check pins not to bend the P.C. board.
Item Not recommended Recommended
Board
bending
Cross-section diagram
Printed circuit board
V-groove Bottom blade
Top blade
Check pin
Termination
peeling Support pin
Check pin
Printed circuit board
Top
blade
V-groove Bottom blade
Top blade
Printed circuit board
— 21 —
No. Process Condition
9 Handling of loose
chip capacitors
1) If dropped the chip capacitors may crack. Once dropped do not use it. Especially,
the large case sized chip capacitors are tendency to have cracks easily, so please
handle with care.
2) Piling the P.C. board after mounting for storage or handling, the corner of the P.C.
board may hit the chip capacitors of another board to cause crack.
10 Capacitance aging
The capacitors (Class 2) have aging in the capacitance. They may not be used in
precision time constant circuit. In case of the time constant circuit, the evaluation
should be done well.
11 Estimated life and
estimated failure
rate of capacitors
A
s per the estimated life and the estimated failure rate depend on the temperature
and the voltage. This can be calculated by the equation described in JEITA
RCR-2335C Annex F (Informative) Calculation of the estimated lifetime and the
estimated failure rate ( Voltage acceleration coefficient : 3 multiplication rule,
Temperature acceleration coefficient : 10°C rule)
The failure rate can be decreased by reducing the temperature and the voltage but
they will not be guaranteed.
Crack
Floor
P.C.board
Crack
— 22 —
No. Process Condition
12 Caution during
operation of
equipment
1)
2)
3)
A capacitor shall not be touched directly with bare hands during operation in
order to avoid electric shock.
Electric energy held by the capacitor may be discharged through the human
body when touched with a bare hand.
Even when the equipment is off, a capacitor may stay charged. The capacitor
should be handled after being completely discharged using a resistor.
The terminals of a capacitor shall not be short-circuited by any accidental
contact with a conductive object. A capacitor shall not be exposed to a
conductive liquid such as an acid or alkali solution. A conductive object or liquid,
such as acid and alkali, between the terminals may lead to the breakdown of a
capacitor due to short circuit
Confirm that the environment to which the equipment will be exposed during
transportation and operation meets the specified conditions. Do not to use the
equipment in the following environments.
(1) Environment where a capacitor is spattered with water or oil
(2) Environment where a capacitor is exposed to direct sunlight
(3) Environment where a capacitor is exposed to Ozone, ultraviolet rays or
radiation
(4) Environment where a capacitor exposed to corrosive gas(e.g. hydrogen
sulfide, sulfur dioxide, chlorine. ammonia gas etc.)
(5) Environment where a capacitor exposed to vibration or mechanical shock
exceeding the specified limits.
(6) Atmosphere change with causes condensation
13 Others
Caution
The products listed on this specification sheet are intended for use in general
electronic equipment (AV equipment, telecommunications equipment, home
appliances, amusement equipment, computer equipment, personal equipment, office
equipment, measurement equipment, industrial robots) and automotive application
under a normal operation and use condition.
The products are not designed or warranted to meet the requirements of the
applications listed below, whose performance and/or quality require a more stringent
level of safety or reliability, or whose failure, malfunction or trouble could cause
serious damage to society, person or property. Please understand that we are not
responsible for any damage or liability caused by use of the products in any of the
applications below or for any other use exceeding the range or conditions set forth in
this specification sheet. If you intend to use the products in the applications listed
below or if you have special requirements exceeding the range or conditions set forth
in this specification, please contact us.
(1) Aerospace/Aviation equipment
(2) Transportation equipment (electric trains, ships, etc.)
(3) Medical equipment (Excepting Pharmaceutical Affairs Law classification Class1, 2)
(4) Power-generation control equipment
(5) Atomic energy-related equipment
(6) Seabed equipment
(7) Transportation control equipment
(8) Public information-processing equipment
(9) Military equipment
(10) Electric heating apparatus, burning equipment
(11) Disaster prevention/crime prevention equipment
(12) Safety equipment
(13) Other applications that are not considered general-purpose applications
When designing your equipment even for general-purpose applications, you are
kindly requested to take into consideration securing protection circuit/device or
providing backup circuits in your equipment.
— 23 —
14. TAPE PACKAGING SPECIFICATION
1. CONSTRUCTION AND DIMENSION OF TAPING
1-1. Dimensions of carrier tape
Dimensions of paper tape shall be according to Appendix 3, 4.
Dimensions of plastic tape shall be according to Appendix 5, 6, 7.
1-2. Bulk part and leader of taping
1-3. Dimensions of reel
Dimensions of Ø178 reel shall be according to Appendix 8, 9.
Dimensions of Ø330 reel shall be according to Appendix 10, 11, 12 .
1-4. Structure of taping
(a) Paper (b) Plastic
2. CHIP QUANTITY
As for chip quantity and taping material of each product, please refer to detailed
information on TDK web.
Drawing direction Leade
r
400mm min
Bulk
160mm min.
Chi
p
sBulk
160mm min.
Paper carrier tape
To
p
cover ta
p
e
Bottom cover tape
(Bottom cover tape is not always applied.)
Plastic carrier tape
Top cover tape
Pitch hole
— 24 —
3. PERFORMANCE SPECIFICATIONS
3-1. Fixing peeling strength (top tape)
0.05 - 0.7N. (See the following figure.)
Paper
Plastic
3-2. Carrier tape shall be flexible enough to be wound around a minimum radius
of 30mm with components in tape.
3-3. The missing of components shall be less than 0.1%
3-4. Components shall not stick to fixing tape.
3-5. The fixing tapes shall not protrude beyond the edges of the carrier tape
not shall cover the sprocket holes.
015°
Carrier tape
Top cover tape
Direction of pulling
Direction of pulling
Paper tape should not adhere to top
cover tape when pull the cover tape.
015°
Carrier tape
Top cover tape
Direction of pulling
Direction of cover tape pulling
— 25 —
Appendix 3
Paper Tape
(Unit : mm)
Symbol
Type A B C D E F
C1005
[CC0402] ( 0.65 ) ( 1.15 ) 8.00 ± 0.30 3.50 ± 0.05 1.75 ± 0.10 2.00 ± 0.05
Symbol
Type G H J T
C1005
[CC0402] 2.00 ± 0.05 4.00 ± 0.10 Ø 1.50 +0.10
0 0.60 ± 0.15
( ) Reference value.
Cavity (Chip insert)
T
A
J
Pitch hole
HGF
B
E
D C
— 26 —
Appendix 4
Paper Tape
(Unit : mm)
Symbol
Type A B C D E F
C1608
[CC0603] ( 1.10 ) ( 1.90 )
8.00 ± 0.30 3.50 ± 0.05 1.75 ± 0.10 4.00 ± 0.10
C2012
[CC0805] ( 1.50 ) ( 2.30 )
C3216
[CC1206] ( 1.90 ) ( 3.50 )
Symbol
Type G H J T
C1608
[CC0603]
2.00 ± 0.05 4.00 ± 0.10 Ø 1.50 +0.10
0 1.20 max.
C2012
[CC0805]
C3216
[CC1206]
( ) Reference value.
T HG F
A
C
E
D
Pitch hole J
B
Cavity (Chip insert)
— 27 —
Appendix 5
Plastic Tape
(Unit : mm)
Symbol
Type A B C D E F
C2012
[CC0805] ( 1.50 ) ( 2.30 )
8.00 ± 0.30
* 12.00 ± 0.30
3.50 ± 0.05
* 5.50 ± 0.05
1.75 ± 0.10 4.00 ± 0.10
C3216
[CC1206] ( 1.90 ) ( 3.50 )
C3225
[CC1210] ( 2.90 ) ( 3.60 )
Symbol
Type G H J K t Q
C2012
[CC0805]
2.00 ± 0.05 4.00 ± 0.10 Ø 1.50 +0.10
0
2.50 max.
0.60 max. Ø 0.50 min.
C3216
[CC1206]
C3225
[CC1210] 3.40 max.
( ) Reference value.
Exceptionally no hole in the cavity is applied. Please inquire if hole in cavity is mandatory.
* Applied to 2.5mm thickness products.
t
K
HGF
A
C
E
D
Pitch hole J
B
Q
Cavity(Chip insert)
— 28 —
Appendix 6
Plastic Tape
(Unit : mm)
Symbol
Type A B C D E F
C4520
[CC1808] (2.50) (5.10)
12.00 ± 0.30 5.50 ± 0.05 1.75 ± 0.10 8.00 ± 0.10
C4532
[CC1812] ( 3.60 ) ( 4.90 )
C5750
[CC2220] ( 5.40 ) ( 6.10 )
Symbol
Type G H J K t Q
C4520
[CC1808]
2.00 ± 0.05 4.00 ± 0.10 Ø 1.50 +0.10
0 6.50 max. 0.60 max. Ø 1.50 min.
C4532
[CC1812]
C5750
[CC2220]
( ) Reference value.
t
K
HGF
A
C
E
D
Pitch hole J
B
Q
Cavity(Chip insert)
— 29 —
Appendix 7
Plastic Tape
(Unit : mm)
Symbol
Type A B C D E F
C7563
[CC3025] ( 6.9 ) ( 8.0 ) 16.0 ± 0.3 7.5 ± 0.1 1.75 ± 0.1 12.0 ± 0.1
Symbol
Type G H J K t
C7563
[CC3025] 2.00 ± 0.05 4.00 ± 0.10 Ø 1.5 +0.10
0 6.50 max. 0.60 max.
( ) Reference value.
t
K
HGF
A
C
E
D
Pitch hole J
B
— 30 —
Appendix 8
C1005 [CC0402] ~ C3225 [CC1210]
(As for C3225 type, any thickness of the item except 2.5mm)
(Material: Polystyrene)
(Unit : mm)
Symbol A B C D E W1
Dimension Ø178 ± 2.0 Ø60 ± 2.0 Ø13 ± 0.5 Ø21 ± 0.8 2.0 ± 0.5 9.0 ± 0.3
Symbol W2 r
Dimension 13.0 ± 1.4 1.0
Appendix 9
C3225 [CC1210] ~ C5750 [CC2220]
(As for CGA6 type, applied to 2.5mm thickness products)
(Material: Polystyrene)
(Unit : mm)
Symbol A B C D E W1
Dimension Ø178 ± 2.0 Ø60 ± 2.0 Ø13 ± 0.5 Ø21 ± 0.8 2.0 ± 0.5 13.0 ± 0.3
Symbol W2 r
Dimension 17.0 ± 1.4 1.0
B
W1
A
E
C
D
r
W2
B
W1
A
E
C
D
r
W2
— 31 —
Appendix 10
C1005 [CC0402] ~ C3225 [CC1210]
(As for CGA6 type, any thickness of the item except 2.5mm)
(Material: Polystyrene)
(Unit : mm)
Symbol A B C D E W
Dimension
Ø382 max.
(Nominal
Ø330)
Ø50 min. Ø13 ± 0.5 Ø21 ± 0.8 2.0 ± 0.5 10.0 ± 1.5
Symbol t r
Dimension 2.0 ± 0.5 1.0
Appendix 11
C3225 [CC1210] ~ C5750 [CC2220]
(As for CGA6 type, applied to 2.5mm thickness products)
(Material: Polystyrene)
(Unit : mm)
Symbol A B C D E W
Dimension
Ø382 max.
(Nominal
Ø330)
Ø50 min. Ø13 ± 0.5 Ø21 ± 0.8 2.0 ± 0.5 14.0 ± 1.5
Symbol t r
Dimension 2.0 ± 0.5 1.0
B
W
A
EC
D
r
t
B
W
A
E
C
D
r
t
— 32 —
Appendix 12
C7563 [CC3025]
(Material : Polystyrene)
(Unit : mm)
Symbol A B C D E W
Dimension
Ø382 max.
(Nominal
Ø330)
Ø50 min. Ø13 ± 0.5 Ø21 ± 0.8 2.0 ± 0.5 17.5 ± 1.5
Symbol t r
Dimension 2.0 ± 0.5 1.0
B
W
A
E
C
D
r
t

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