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Z01 Series Datasheet

STMicroelectronics

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Datasheet

GA2
A1
A2
A1
A2
A2
A1
G
G
A2
A1
G
SOT-223 TO-92
SMBflat-3L
Features
On-state rms current, IT(RMS) 1 A
Repetitive peak off-state voltage, VDRM/VRRM 600 or 800 V
Triggering gate current, IGT (Q1) 3 to 25 mA
Applications
AC switching
Home appliances
Description
The Z01 series is suitable for general purpose AC switching applications. These
devices are typically used in applications such as home appliances (electrovalve,
pump, door lock, small lamp control), fan speed controllers,...
Different gate current sensitivities are available, allowing optimized performance
when driven directly through microcontroller.
Product status link
Z01
Product summary
IT(RMS) 1 A
VDRM/VRRM 600, 800 V
IGTstandard 3 to 25 mA
Standard 1 A Triacs
Z01
Datasheet
DS2116 - Rev 11 - May 2019
For further information contact your local STMicroelectronics sales office.
www.st.com
1Characteristics
Table 1. Absolute maximum ratings
Symbol Parameters Value Unit
IT(RMS) RMS on-state current (full sine wave)
SOT-223 Ttab = 90 °C
1 A
TO-92 TL = 50 °C
SMBflat-3L Ttab = 107 °C
ITSM
Non repetitive surge peak on-state current
(full cycle, Tj initial = 25 °C)
F = 50 Hz tp = 20 ms 8
A
F = 60 Hz tp = 16.7 ms 8.5
I2t I2t value for fusing tp = 10 ms 0.35 A2s
dl/dt
Critical rate of rise of on-state current
IG = 2 x IGT , tr ≤ 100 ns F = 120 Hz Tj = 125 °C 20 A/µs
IGM Peak gate current tp = 20 µs Tj = 125 °C 1 A
PG(AV) Average gate power dissipation Tj = 125 °C 1 W
Tstg Storage junction temperature range -40 to +150 °C
TjOperating junction temperature range -40 to +125 °C
Table 2. Electrical characteristics (Tj = 25 °C, unless otherwise specified)
Symbol Parameters Quadrant
Value
UnitZ01
03 07 09 10
IGT(1)
VD = 12 V, RL = 30 Ω
I - II - III
Max.
3 5 10 25
mA
IV 5 7 10 25
VGT All Max. 1.3 V
VGD VD = VDRM, RL = 3.3 kΩ, Tj = 125 °C All Min. 0.2 V
IH(2) IT = 50 mA Max. 7 10 10 25 mA
ILIG = 1.2 IGT
I - III - IV Max. 7 10 15 25
mA
II Max. 15 20 25 50
dV/dt(2) VD = 67 % VDRM gate open, Tj = 110 °C Min. 10 20 50 100 V/µs
(dV/dt)c(2) (dI/dt)c = 0.44 A/ms, Tj = 110 °C Min. 0.5 1 2 5 V/µs
1. Minimum IGT is guaranteed at 5 % of IGT max.
2. For both polarities of A2 referenced to A1
Z01
Characteristics
DS2116 - Rev 11 page 2/16
Table 3. Static electrical characteristics
Symbol Test conditions TjValue Unit
VT(1) ITM = 1.4 A, tp = 380 µs 25 °C Max. 1.60 V
VTO(1) Threshold on-state voltage 125 °C Max. 0.95 V
RdDynamic resistance 125 °C Max. 400
IDRM
IRRM
VDRM = VRRM
25 °C
Max.
5 µA
125 °C 0.5 mA
1. For both polarities of A2 referenced to A1
Table 4. Thermal resistance
Symbol Parameters Max.
value Unit
Rth(j-t) Max. junction to tab (AC)
SOT-223 25
°C/W
SMBflat-3L 14
Rth(j-l) Max. junction to lead (AC) TO-92 60
Rth(j-a)
Junction to ambient (S(1) = 5 cm²)
SOT-223 60
SMBflat-3L 75
Junction to ambient TO-92 150
1. Copper surface under tab.
Z01
Characteristics
DS2116 - Rev 11 page 3/16
1.1 Characteristics (curves)
Figure 1. Maximum power dissipation versus on-state
RMS current (full cycle)
P(W)
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
0.00
0.25
0.50
0.75
1.00
1.25
1.50
I(A)
T(RMS)
α =180 °
180°
Figure 2. RMS on-state current versus lead (TO-92) or tab
(SOT-223, SMBflat-3L) temperature (full cycle)
0 25 50 75 100 125
0.0
0.2
0.4
0.6
0.8
1.0
1.2
I (A)
T(RMS)
SOT-223
TO-92
(°C)
Tlead or Ttab
SMBflat-3L
Figure 3. On-state rms current versus ambient
temperature(free air convection full cycle)
I (A)
T(RMS)
0 25 50 75 100 125
0.0
0.2
0.4
0.6
0.8
1.0
1.2
R = 60°C/W
(SOT-223)
th(j-a)
R = 150°C/W
(TO-92)
th(j-a)
T (°C)
amb
Rth (j -a) = 100°C/W
(SMBflat-3L)
Figure 4. Relative variation of thermal impedance versus
pulse duration (Zth(j-a))
0.01
0.10
1.00
1.0E-03 1.0E-02 1.0E-01 1.0E+00 1.0E+01 1.0E+02 1.0E+03
Z01xxMUF
Copper surface area
= 5cm²
Z01xxA
Z01xxN
K=[Z /R
th(j-a) th(j-a) ]
t (s)
p
Z01
Characteristics (curves)
DS2116 - Rev 11 page 4/16
Figure 5. Relative variation of holding current and
latching current versus junction temperature (typ. values)
I , I [T ] /
H L j I , I [T =25°C]
H L j
0.0
0.5
1.0
1.5
2.0
2.5
-50 -25 0 25 5 0 7 5 100 125
IH
IL
T (°C)
j
Figure 6. Relative variation of gate trigger current (IGT)
and voltage (VGT) versus junction temperature
0.0
0.5
1.0
1.5
2.0
2.5
3.0
-50 -25 0 25 5 0 7 5 100 125
Tj(°C)
IGT, V GT[Tj] / IGT, V GT[T j=25 °C]
IGT Q1-Q2
VGT Q1-Q2-Q3-Q4
IGT Q3
IGT Q4
Figure 7. Surge peak on-state current versus number of
cycles
0
1
2
3
4
5
6
7
8
9
1 1 0 100 1000
Number of cycles
Repetitive
T = 95 °C
amb
Non repetitive
T initial = 25 °C
j
I (A)
TSM
One cy cle
T = 20 ms
Figure 8. Non-repetitive surge peak on-state current and
corresponding value of I2t sinusoidal pulse width
0. 01 0. 10 1. 00 10. 00
0. 1
1. 0
10. 0
100. 0
t (ms )
p
I (A), I t (A s )
TSM 2 2
I t
2
dI/dt limi tati on:
20A/µs
T initial = 25°C
j
ITSM
Figure 9. On-state characteristics (maximum values) (ITM
= f(VTM)
I (A)
TM
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
0.1
1.0
10.0
V (V)
TM
T = max.
jTj
T = 25°C
j
T =max.
j
V =0.95 V
R =400 m
t0
d
Figure 10. Relative variation of critical rate of decrease of
main current (dI/dt) versus junction temperature
0.1 1 .0 10.0 100.0
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
2.2
2.4
2.6
Z0103
Z0107 Z0110
Z0109
(dI/dt)c [(dV/dt )c] / Specifie d (dI/dt)c
(dV/dt)c (V/µs)
Z01
Characteristics (curves)
DS2116 - Rev 11 page 5/16
Figure 11. Relative variation of critical rate of decrease of
main current (dI/dt) versus junction temperature
0 25 5 0 75 100 125
0
1
2
3
4
5
6
(dI/dt)c [T ] / S pecifie d]
j(dI/dt)c [Tj
T (°C)
j
Figure 12. SOT-223 and SMBflat-3L thermal resistance
junction to ambient versus copper surface under case
50
60
70
80
90
100
110
120
130
140
SOT223
150
160
170
0 1 2
R ( °C/W)
th(j-a )
S (cm²)
CU
SMBflat-3L
345
Figure 13. Relative variation of static dV/dt immunity versus junction temperature (gate open)
0
1
2
3
4
5
6
25 50 75 100 125
Tj(°C)
dV/dt [ Tj] / dV/dt [ T j=125 °C]
VD=VR=402V
Z01
Characteristics (curves)
DS2116 - Rev 11 page 6/16
2Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages,
depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product
status are available at: www.st.com. ECOPACK is an ST trademark.
2.1 SOT-223 package information
Epoxy meets UL94, V0
Lead free plating + halogen-free molding resin
Figure 14. SOT-223 package outline
A
A1
e1
D
B1
HE
e
1 2
4
3
B
Vc
Z01
Package information
DS2116 - Rev 11 page 7/16
Table 5. SOT-223 package mechanical data
Ref.
Dimensions
Millimeters Inches(1)
Min. Typ. Max. Min. Typ. Max.
A 1.80 0.0709
A1 0.02 0.10 0.0008 0.0039
B 0.60 0.70 0.85 0.024 0.0276 0.0335
B1 2.90 3.00 3.15 0.114 0.1181 0.1240
c 0.24 0.26 0.35 0.009 0.0102 0.0138
D 6.30 6.50 6.70 0.248 0.2559 0.2638
e 2.3 0.0906
e1 4.6 0.1811
E 3.30 3.50 3.70 0.130 0.1378 0.1457
H 6.70 7.00 7.30 0.264 0.2756 0.2874
V 10° max.
1. Inches only for reference
Figure 15. SOT-223 footprint (dimensions in mm)
3.25
1.32
7.80
5.16
1.32
2.30 0.95
Z01
SOT-223 package information
DS2116 - Rev 11 page 8/16
2.2 TO-92 package information
Epoxy meets UL94, V0
Lead free plating + halogen-free molding resin
Figure 16. TO-92 package outline
A
F
C
B
a
D E
b
c
Table 6. TO-92 package mechanical data
Ref.
Dimensions
Millimeters Inches(1)
Min. Typ. Max. Min. Typ. Max.
A 1.35 0.0531
B 4.70 0.1850
C 2.54 0.1000
D 4.40 0.1732
E 12.70 0.5000
F 3.70 0.1457
a 0.50 0.0197
b 1.27 0.500
c 0.48 0.0189
1. Inches dimensions given for information
Z01
TO-92 package information
DS2116 - Rev 11 page 9/16
2.3 SMBflat-3L package information
Epoxy meets UL94, V0
Lead-free package
Figure 17. SMBflat-3L package outline
D
A
L 2x
LL2
L1
L1
L2 2 x
EE 1
b4
c
e
b 2x
Table 7. SMBflat-3L mechanical data
Ref.
Dimensions
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A 0.90 1.10 0.035 0.044
b 0.35 0.65 0.014 0.026
b4 1.95 2.20 0.070 0.087
c 0.15 0.40 0.005 0.016
D 3.30 3.95 0.129 0.156
E 5.10 5.60 0.200 0.221
E1 4.05 4.60 0.159 0.182
L 0.75 1.50 0.029 0.060
L1 0.40 0.016
L2 0.60 0.024
e 1.60 0.063
Z01
SMBflat-3L package information
DS2116 - Rev 11 page 10/16
Figure 18. Footprint recommendations, dimensions in mm (inches)
milli meters
(inc hes )
1.20
(0.047)
2.07
(0.082)
0.51
(0.020)
0.51
(0.020)
1.20
(0.047)
3.44
(0.136)
5.84
(0.230)
2.07
(0.082)
Figure 19. Footprint and connectors for SOT-223 or SMBflat-3L (dimensions in mm)
SOT-223
SOT-223
SOT-223
SOT-223
SMBF3L
SMBF3L
SMBF3L
3.42
1.50
3.25
1.32
2.92
1.19
1.32
0.95
7.80
2.30
1.10
0.85
2.07
1.20
0.51
1.20
1.95
2.22
1.08
1.35
1.08
1.30
0.46
0.61
1.19
1.47
5.84
2.07
Solder resist
Solder lands
Solder paste
Connector lin e
Z01
SMBflat-3L package information
DS2116 - Rev 11 page 11/16
3Ordering information
Figure 20. Ordering information scheme
Z 01 03 M A [BLANK] 1AA2
Triac series
Current
Sensitivity
Voltage
Package
Packing mode
01 = 1 A
03 = 3 mA
07 = 5 mA
09 = 10 mA
10 = 25 mA
M = 600 V
N = 800 V
A = TO-92
N = SOT-223
UF = SMBflat-3L
1AA2 = TO-92 bulk
2AL2 = TO-92 ammopack
5AL2 = TO-92 tape and reel
5AA4 = SOT-223 tape and reel
Blank = SMBflat-3L tape and reel 13”
7”
6AA4 = SOT-223 tape and reel 13”
BLANK = Check Table 9. Ordering information
Z01
Ordering information
DS2116 - Rev 11 page 12/16
3.1 Product selector
Table 8. Product selector
Part Number
Sensitivity Type Package
600 800
Z0103MA Z0103NA
3 mA
Standard
TO-92
Z0103MN Z0103NN SOT-223
Z0107MA Z0107NA
5 mA
TO-92
Z0107MN Z0107NN SOT-223
Z0109MA Z0109NA
10 mA
TO-92
Z0109MN Z0109NN SOT-223
Z0110MA Z0110NA
25 mA
TO-92
Z0110MN Z0110NN SOT-223
Z0103MUF 3 mA
SMBflat-3LZ0107MUF 5 mA
Z0109MUF 10 mA
Z01
Product selector
DS2116 - Rev 11 page 13/16
3.2 Ordering information
Table 9. Ordering information
Order code(1) Marking(1) Package Weight Base qty. Delivery mode
Z01xxyA 1AA2
Z01xxyA TO-92 0.2 g
2500 Bulk
Z01xxyA 2AL2 2000 Ammopack
Z01xxyA 5AL2 2000
Tape and reel
Z0103yN 5AA4 Z3y
SOT-223 0.12 g
1000
Z0103MN 6AA4 Z3M 4000
Z0107yN 5AA4 Z7y 1000
Z0107MN 6AA4 Z7M 4000
Z0109yN 5AA4 Z9y 1000
Z0109NN6AA4 Z9N 4000
Z0103MUF Z3M
SMBflat-3L 46.78 mg
5000
Z0107MUF Z7M 5000
Z0109MUF Z9M 5000
1. xx = sensitive, y = voltage, and check Figure 20. Ordering information scheme.
Z01
Ordering information
DS2116 - Rev 11 page 14/16
Revision history
Table 10. Document revision history
Date Revision Changes
Oct-2001 4 Last update.
10-Feb-2005 5 Package: TO-92 tape and reel delivery mode 5AL2 added.
09-May-2005 6
Table 4 on page 2: typo. mistake corrected
1. (dV/dt)c instead of (dI/dt)c
2. V/μs unit instead of A/ms
21-Apr-2006 7 Reformatted to current standard. Table 2 on page 2: Typo corrected. Values
for IGT split into two separate rows.
10-Oct-2010 8 Table 2: modified test conditions for (dV/dt)c. Changed “ambient” to “lead or
tab” in Figure 2.
20-Oct-2010 9 Package: SOT-223 13” tape and reel added = 6AA4.
14-Dec-2010 10 Added package SMBflat-3L. Updated dimensions in Table 6.
Updated Figure 3 and Figure 12. Updated Table 5: Product Selector.
02-May-2019 11 Updated Table 9. Ordering information.
Minor text changed.
Z01
DS2116 - Rev 11 page 15/16
IMPORTANT NOTICE – PLEASE READ CAREFULLY
STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST
products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST
products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement.
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of
Purchasers’ products.
No license, express or implied, to any intellectual property right is granted by ST herein.
Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.
ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service
names are the property of their respective owners.
Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
© 2019 STMicroelectronics – All rights reserved
Z01
DS2116 - Rev 11 page 16/16

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