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DLW43SHyyyXK2y Spec Sheet

Murata Electronics North America

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Spec No. JEFL243C-9101M-01 P1/9
MURATA MFG.CO., LTD
Reference Only
4.5±0.2
(
0.3
)
(
0.8
)
2.0.2
(0.6) : 100uH
(
0.7
)
: 11,22,51uH
:Elect
r
ode
( ) :Re
f
e
r
en ce Va lu e
( in mm)
3.2±0.2
Wire Wound Chip Common Mode Choke Coil
DLW43SH□□□XK2 Murata Standard reference Specification [AEC-Q200]
1. Scope
This reference specification applies to Wire Wound Chip Common Mode Choke Coil DLW43SH_XK Series
for Automotive Electronics based on AEC-Q200.
2. Part Numbering
(ex.) DL W 43 S H 101 X K 2 L
(1) (2) (3) (4) (5) (6) (7) (8) (9) (10)
(1) Chip Common Mode Choke Coil
(2) Structure (W : Winding Type)
(3) Dimension (L×W)
(4) Type
(5) Category
3. Rating
Customer
Part Number
Murata
Part Number
Common Mode Inductance
(Under Standard Testing
Condition)
Rated
Voltage
V(DC)
Withstanding
Voltage
V(DC)
Rated
Current
(mA)
DC
Resistance
(Ω max.)
Insulation
Resistance
(MΩ min.)
ESD
Rank
6:25kV
DLW43SH110XK2L
11uH (-30%/+50%)
at 0.1MHz
50 125
360 0.5
10 6
DLW43SH110XK2K
DLW43SH110XK2B
DLW43SH220XK2L
22uH (-30%/+50%)
at 0.1MHz 310 0.6
DLW43SH220XK2K
DLW43SH220XK2B
DLW43SH510XK2L
51uH (-30%/+50%)
at 1MHz 230 1.0
DLW43SH510XK2K
DLW43SH510XK2B
DLW43SH101XK2L
100uH(-30%/+50%)
at 1MHz 200 2.0
DLW43SH101XK2K
DLW43SH101XK2B
Operating Temperature : -40 to +125°C Storage Temperature : -40 to +125°C
4.Standard Testing Condition
<Unless otherwise specified> <In case of doubt>
Temperature : Ordinary Temperature 15 to 35°C Temperature : 20 ± 2°C
Humidity : Ordinary Humidity 25 to 85%(RH) Humidity : 60 to 70%(RH)
Atmospheric Pressure : 86 to106kPa
5. Style and Dimensions Equivalent Circuits
Unit Mass (Typical value)
0.17g
6. Marking
No Marking.
(1)
(4)
(2)
(3)
No polarity
(6) Inductance
(7) Circuit
(8) Features
(9) Number of Line
(10) Packaging Code L : Taping (Φ180mm/reel)
K : Taping (Φ330mm/reel)
B : Bulk
Spec No. JEFL243C-9101M-01 P2/9
MURATA MFG.CO., LTD
Reference Only
7. Electrical Performance
No. Item Specification Test Method
7.1 Common Mode
Inductance (Lc)
Meet item 3. Measuring Equipment : KEYSIGHT 4294A or the
equivalent
Measuring Frequency:0.1MHz / 11uH, 22uH
1MHz / 51uH, 100uH (ref.item 9.1)
7.2 Insulation
Resistance (I.R.)
Measuring voltage : Rated Voltage
Measuring time : 1 minute max. (ref.item 9.3)
7.3 Withstanding
Voltage
Products shall not be damaged. Test Voltage : 2.5 times for Rated Voltage
Time : 1 to 5 seconds
Charge Current : 1 mA max. (ref.item 9.2)
7.4 DC Resistance
(Rdc)
Meet item 3. Measuring current : 10mA max. (ref.item 9.4)
(In case of doubt in the above mentioned standard
condition, measure by 4 terminal method.)
8. Q200 Requirement
8.1.Performance (based on Table 13 for Ferrite EMI SUPPRESSORS/FILTERS)
AEC-Q200 Rev.D issued June 1. 2010
AEC-Q200 Murata Specification / Deviation
No. Item Specification
3 High Temperature
Exposure
1000hours at 125 deg C
Set for 24hours at room
temperature, then measured.
Meet Table A after testing.
Table A
4 Temperature Cycling 1000cycles
-40 deg C to +125 deg C
Set for 24hours at room
temperature, then measured.
Meet Table A after testing.
5 Destructive
Physical Analysis
Per EIA469
No electrical tests
Not Applicable
7 Biased Humidity
1000hours at 85 deg C, 85%RH
Apply max rated current.
Meet Table A after testing.
(ref.item 9.5)
8 Operational Life
Apply 125 deg C1000hours
Set for 24hours at room
temperature, then measured.
Meet Table A after testing.
Apply rated current.
(ref.item 9.6)
9 External Visual Visual inspection No abnormalities
10 Physical Dimension Meet ITEM 4
Style and Dimensions
No defects
12 Resistance to
Solvents
Per MIL-STD-202 Method 215 Not Applicable
13 Mechanical Shock
Per MIL-STD-202 Method 213
Conditon F:
1500g’s(14.7N)/0.5ms/Half sine
Meet Table A after testing.
Appearance No damage
Common Mode Inductance
(at 0.1MHz / 11uH, 22uH
at 1MHz / 51uH, 100uH)
Meet item 3.
Spec No. JEFL243C-9101M-01 P3/9
MURATA MFG.CO., LTD
Reference Only
AEC-Q200 Murata Specification / Deviation
No. Stress Test Method
14 Vibration 5g's(0.049N) for 20 minutes,
12cycles each of 3 oritentations
Test from 10-2000Hz.
12cycles each of 3 oritentations
Meet Table A after testing.
15 Resistance
to Soldering Heat
No-heating
Solder temperature
260C+/-5 deg C
Immersion time 10s
Pre-heating150 to 180C / 90±30s
Meet Table A after testing.
17 ESD
Per AEC-Q200-002 Meet Table A after testing.
ESD Rank: Refer to Item 3. Rating.
18 Solderbility
Per J-STD-002 Method b : Not Applicable
90% of the terminations is to be soldered.(except partly-exposed wire)
Flux:Ethanol solution of rosin,25(wt)% includes activator equivalent to
0.06 to 0.10(wt)% chlorine
19 Electrical
Characterization
Measured :
Common mode Inductance
No defects
20 Flammability Per UL-94 Not Applicable
21 Board Flex Epoxy-PCB(1.6mm)
Deflection 2mm(min)
60 sec minimum holding time
Meet Table A after testing.
22 Terminal Strength
Per AEC-Q200-006
A force of 17.7N for 60sec
No defects
30 Electrical
Transient
Conduction
Per ISO-7637-2 Not Applicable
9. Terminal to be Tested.
When measuring and supplying the voltage, the following terminal is applied.
No. Item Terminal to be Tested
9.1 Common Mode Inductance
(Measurement Terminal)
9.2 Withstanding Voltage
(Measurement Terminal)
9.3 Insulation Resistance
(Measurement Terminal)
9.4 DC Resistance
(Measurement Terminal)
9.5 Biased Humidity
(Supply Terminal)
9.6 Operational Life
(Supply Terminal)
Terminal Terminal
Terminal
Terminal
Terminal
Terminal
Terminal
Terminal
Terminal
Terminal
Spec No. JEFL243C-9101M-01 P4/9
MURATA MFG.CO., LTD
Reference Only
2.7±0.1
0.3±0.05
8.0±0.1
4.0±0.1
φ
1.5±
4.9±0.1
5.5
12.0±0.2
2.0±0.05
0.1
0
3.6±0.1
1.75±0.1
±0.05
(in mm)
Direction of feed
10. P.C.B., Flux, Solder and Soldering condition
Test shall be done using P.C.B., Flux, Solder and Soldering condition which are
specified in item 13 except the case of being specified special condition.
11. Specification of Packaging
11.1 Appearance and Dimensions ( 12mm-wide,Plastic tape)
*Dimension of the Cavity is measured
at the bottom side.
11.2. Specification of Taping
(1) Packing quantity (Standard quantity) φ 180 mm reel : 500 pcs. / reel φ 330 mm reel : 2500 pcs. / reel
(2) Packing Method
Products shall be packaged in each embossed cavity of plastic tape and sealed with cover tape.
(3) Sprocket Hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Spliced point
The cover tape have no spliced point.
(5) Missing components number
Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater,
and are not continuous. The specified quantity per reel is kept.
11.3. Pull Strength of Plastic Tape
Plastic Tape 5 N min.
Cover Tape 10 N min.
11.4. Peeling off force of Cover Tape
0.2N to 0.7N (minimum value is typical.)
Speed of Peeling off : 300 mm / min
11.5. Dimensions of Leader-tape, Trailer and Reel
There shall be leader-tape (cover tape only and empty tape) and trailer-tape (empty tape) as follows.
« Packaging Code : L (Φ180mm reel) »
« Packaging Code : K (Φ330mm reel) »
165 to 180 degree FCover tape
Plastic tape
160 min. 210 min.
190 min.
φ
13.0±0.2
φ
21.0±0.8
φ
180±
φ
60±
13±
17±1.4
1
0
0
3
Direction of feed
Trailer
1
0
Leader
Empty Tape Cover tape
(in mm)
Label
2.0±0.5
2.0±0.5
φ
13.0±0.5
φ
21.0±0.8
φ
330±2.0
φ
50 min.
14±1.5
2.0±0.5
(in mm)
210 min.
190 min.
Leader
Empty Tape Cover tape
Direction of feed
Trailer
160 min.
Label
Spec No. JEFL243C-9101M-01 P5/9
MURATA MFG.CO., LTD
Reference Only
11.6 Marking for reel
Customer part number, MURATA part number, Inspection number(1), RoHS marking(2), Quantity, etc
1) « Expression of Inspection No. » □□ OOOO ×××
(1) (2) (3)
(1) Factory Code
(2) Date First digit : Year / Last digit of year
Second digit : Month / Jan. to Sep. 1 to 9, Oct. to Dec. O,N,D
Third, Fourth digit : Day
(3) Serial No.
2) « Expression of RoHS marking » ROHS – Y ()
(1) (2)
(1) RoHS regulation conformity parts.
(2) MURATA classification number
11.7 Marking for Outside package
Customer name Purchasing Order Number, Customer Part Number, MURATA part number,
RoHS marking (2), Quantity, etc
11.8 Specification of Outer Case
*Above Outer Case size is typical. It depends on a quantity of an order.
12.
!Caution
12.1 Mounting Direction
Mount products in right direction.
Wrong direction which is 90°rotated from right direction causes not only open or short circuit but also
flames or other serious trouble.
12.2 Limitation of Applications
Please contact us before using our products for the applications listed below which require especially
high reliability for the prevention of defects which might directly cause damage to the third party's life,
body or property.
(1) Aircraft equipment (6) Transportation equipment (trains, ships, etc.)
(2) Aerospace equipment (7) Traffic signal equipment
(3) Undersea equipment (8) Disaster prevention / crime prevention equipment
(4) Power plant control equipment (9) Data-processing equipment
(5) Medical equipment (10) Applications of similar complexity and / or reliability requirements
to the applications listed in the above.
12.3 Caution(Rating)
Do not exceed maximum rated current of the product. Thermal stress may be transmitted to the product and
short/open circuit of the product or falling off the product may be occurred.
12.4 Fail-safe
Be sure to provide an appropriate fail-safe function on your product to prevent a second damage that may be
caused by the abnormal function or the failure of our product.
13. Notice
Products can only be soldered with reflow.
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
13.1 Flux and Solder
Flux Use rosin-based flux,(with converting chlorine content 0.06 to 0.1(wt)%. ),
but not highly acidic flux
(with Halogen content exceeding 0.2(wt)% conversion to chlorine).
Do not use water-soluble flux.
Solder Use Sn-3.0Ag-0.5Cu solder
Standard thickness of the solder paste should be 150µm.
Reel
Outer Case Dimensions
(mm)
Standard Reel
Quantity in
Outer Case
(Reel)
W D H
φ180mm 186 186 93 4
φ330mm 340 340 85 4
Z Z
right direction wrong direction
W
D
Label
H
Spec No. JEFL243C-9101M-01 P6/9
MURATA MFG.CO., LTD
Reference Only
13.2 Assembling
<Exclusive use of Reflow soldering>
Flow soldering may cause deterioration in insulation resistance.
So, reflow soldering shall be applied for this product.
13.3 Cleaning Conditions
Do not clean after soldering. Some cleaning agents may degrade bonding strength,and
characteristics of products by detaching. If cleaning,please contact us.
13.4 Resin coating
The inductance value may change due to high cure-stress of resin to be used for coating/molding products. An open
circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating
condition etc. Some resin contains some impurities or chloride possible to generate chlorine by hydrolysis under
some operating condition may cause corrosion of wire of coil, leading to open circuit. So, please pay your careful
attention when you select resin in case of coating/molding the products with the resin. Prior to use the coating resin,
please make sure no reliability issue is observed by evaluating products mounted on your board.
13.5 Attention regarding P.C.B. bending
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to
warping the board.
Products direction
Products shall be location the sideways
Direction (Length : a<b) to the mechanical
Stress.
(2) Components location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible
to reduce stress.
Contents of Measures Stress Level
(1) Turn the mounting direction of the component parallel to the board separation surface. A > D *1
(2) Add slits in the board separation part. A > B
(3) Keep the mounting position of the component away from the board separation surface. A > C
*1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
(3) Mounting Components Near Screw Holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during
the tightening of the screw. Mount the component in a position as far away from the screw holes as possible.
Poor example
Good example
b
a
Screw Hole Recommended
Perforation
Slit
A
B
C
D
Spec No. JEFL243C-9101M-01 P7/9
MURATA MFG.CO., LTD
Reference Only
Pick- up nozzle
Support pin
P.C.B.
Product
A
5.9
3.4
1.6
*
3
(in mm)
Resist
Copper foil pattern
No Pattern
*
1
*
2
13.6 Attention Regarding P.C.B. Design
< The Arrangement of Products >
P.C.B. shall be designed so that products are
far from the portion of perforation.
The portion of perforation shall be designed
as narrow as possible, and shall be designed
so as not to be applied the stress in the
case of P.C.B. separation.
Products shall not be arranged on the line
of a series of holes when there are big
holes in P.C.B.
(Because the stress concentrate on the
line of holes.)
< Products Placing >
Support pins shall be set under P.C.B .
to prevent causing a warp to P.C.B.
during placing the products on the other
side of P.C.B.
< P.C.B. Separation >
P.C.B. shall not be separated with hand.
P.C.B. shall be separated with the fixture so as not to cause P.C.B. bending.
13.7 Standard Land Dimensions (Reflow)
1 If the pattern is made with wider than 3.4mm. It will result to let component turn around,
because melting speed is different. In the worst case, short circuit between lines may be occured.
2 If the pattern is made with less than 1.6mm , in the worst case , short circuit between lines may be
occurred due to the spread of soldering paste or mount placing accuracy.
3 If the pattern is made with wider, the strength of bending will be reduced.
Moreover, if the pattern is made with less than "A" dimension , in the worst case short circuit may
be occurred.
4 Do not use gilded pattern. A copper wire may cause open by dissolution of metallization.
13.8 Standard Soldering Condition
1.Reflow Soldering
(1) Soldering Temperature
Temperature difference between soldering and surface of components must be within 150°C,
in preheating. When components are immersed in liquid after soldering, temperature difference
should be within 100°C. If preheating is not enough, components may be cracked and cause deterioration in
insulation resistance.
(2) Soldering Condition
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting
in the deterioration of product quality.
×
×
P.C.B.
Portion of
Perforation
Portion of
Perforation
Product
Product
P.C.B.
Hole
×
Part Number A
DLW43SH110XK2
DLW43SH220XK2
DLW43SH510XK2 3.0
DLW43SH101XK2 3.2
Spec No. JEFL243C-9101M-01 P8/9
MURATA MFG.CO., LTD
Reference Only
T
1/3T
t
T (T:Thickness of electrode)
Upper limit
Recommendable
Soldering Profile for Lead Free solder (Sn-3.0Ag-0.5Cu solder )
Standard Profile Limit Profile
Pre-heating 150180°C 90s±30s
Heating above 220°C30s60s above 240°C30s max.
Peak temperature 245±3°C 260°C10s
Cycle of reflow 2 times 2 times
2. Reworking with Soldering iron
The following conditions must be strictly followed when using a soldering iron after being
mounted by reflow soldering.
· Pre-heating: 150°C, 1 min · Soldering iron output: 30W max.
· Tip temperature: 350°C max. · Tip diameter:φ3mm max.
· Soldering time : 3(+1,-0) seconds. · Times : 2times max.
Notes : Do not touch the products directly with the soldering iron.
3. Solder Volume
Solder shall be used not to be exceeded the upper limits as shown below.
Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
In case if the solder volume is much, we recommend to make the size of the solder paste
with less than the land pattern.
4.Solder fillet
Solder fillet in lateral direction is not formed in some case because of product's structure,
but it is not something that affects product's performance and reliability.
13.9 Caution for use
When you hold products with a tweezer, please hold
like a figure of the right side, and sharp material,
such as a pair of tweezers, shall not be touched to
the winding portion to prevent the breaking of wire.
Mechanical shock should not be applied to the products
mounted on the board to prevent the breaking
tweezer
150
90s±30s Time(s)
245±3°C
Tem
p
.
(°C)
220°C
3060s
180
260°C
240°C
30s max.
Limit Profile
Standard Profile
Spec No. JEFL243C-9101M-01 P9/9
MURATA MFG.CO., LTD
Reference Only
of the core.
13.10 Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to
the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening
screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending Twisting
13.11 Brushing of neighborhood of products
When you clean the neighborhood of products such as connector pins, bristles of cleaning brush shall
not be touched to the winding portion to prevent the breaking of wire.
13.12 Operating Environment
Do not use this product under the following environmental conditions, on deterioration
of the performance, such as insulation resistance may result from the use.
(1) in corrosive gases (acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.)
(2) in the atmosphere where liquid such as organic solvent, may splash on the products.
13.13 Storage Condition
(1) Storage period
Use the products within 12 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage environment conditions
·Products should be stored in the warehouse on the following conditions.
Temperature -10 ~ +40°C
Humidity 15 to 85% relative humidity No rapid change on temperature and humidity.
· Products should not be stored in corrosive gases, such as sulfureous, acid gases, alkaline gases,
to prevent the following deterioration.
Poor solderability due to the oxidized electrode.
· Products should be stored on the palette for the prevention of the influence from humidity,dust and so on.
· Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
· Products should not be stored under the air tights packaged condition.
(3) Delivery
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
14! Note
(1)Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2)You are requested not to use our product deviating from the reference specifications.
(3)The contents of this reference specification are subject to change without advance notice. Please approve our
product specifications or transact the approval sheet for product specifications before ordering.

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