LQM18FNyyyy00D Spec Sheet

Murata Electronics North America

View All Related Products | Download PDF Datasheet

Datasheet

1. Standard Land Pattern Dimensions
A high Q value is achieved when the PCB electrode land pattern is designed so that it does not project beyond the chip
inductor (chip coil) electrode.
(in mm)
a
c
b
Standard Land DimensionsSeries
LQH44P
LQH5BP
LQH55D/66S
LQW15C_00
LQW15C_10
LQW18C
3.0
4.1
3.5
0.6
0.66
1.0
4.4
5.5
8.0
1.4
1.4
2.2
1.3
1.8
2.0
0.4
0.4
0.7
LQM21D/21F/21P
LQM2MP
LQM2HP
LQM31P
LQM32P
LQH2MC
LQH31C
LQH32P
LQM18F
/18P 0.7
1.0
1.8
1.5
1.2
2.7
1.0
1.5
2.0
2.2-2.6
1.8-2.0
3.0-4.0
2.4
3.0
4.2-5.2
3.6
2.6
4.5
3.8
0.7
1.2
0.8
1.6
2.0
1.9
0.8
1.0
1.3
LQM18F/18P
LQM21D/21F/21P
LQM2MP
LQM2HP
LQM31P
LQM32P
LQH2MC
LQH31C
LQH32P
LQH44P
LQH5BP
LQH55D/66S
LQW15C_00
LQW15C_10
LQW18C
LQH32C
LQH2HP
Part Number abc
Land Pattern
Land Pattern
+ Solder Resist
Solder Resist
5.5
1.0
2.0
1.0
1.3 1.0
Flow
Reflow
LQH55P
2.9
6.7
1.6
45˚
7.5
1.5
3.0
1.5
1.5 1.5
LQH43C
LQH43P
2.4
0.75 0.75
3.3
1.0
1.15 1.15
0.45 0.45
0.7 0.7
3.3
LQH3NP
Attention should be paid to potential magnetic coupling effects when using the inductor (coil) as a resonator.
Soldering and Mounting
Inductor for Power Lines (Power Inductor)
Continued on the following page.
1.4
3.0
0.8
2. Standard Soldering Conditions
(1) Soldering method
Chip inductor (Chip coils) can be flow or reflow soldered.
Please contact Murata regarding other soldering
methods.
As for LQH2MC/2HP/3NP/32P/44P/5BP/55D/55P/66S,
LQM32P, LQW15C/18C series, please use reflow
soldering.
Solder: Use Sn-3.0Ag-0.5Cu solder.
Flux: Use rosin-based flux, but not strongly acidic flux (with
chlorine content exceeding 0.2wt%).
Do not use water-soluble flux.
The flux used for LQW15C/18C series should use the
rosin-based flux that includes middle activator
equivalent to 0.06wt% to 0.1wt% chlorine.
For additional mounting methods, please contact Murata.
"Reflow Soldering profile
(Sn-3.0Ag-0.5Cu solder)
Series
Standard Profile Limit Profile
Temp. (T1) Time. (t1)
Heating
220°C 30 to 60s 245±3°C 2 times
max. 230°C 260°C/10s 2 times
max.
60s max.
Cycle
of reflow
Peak
temperature
(T2) Temp. (T3) Time. (t2)
Heating Cycle
of reflow
Peak
temperature
(T4)
150
180
T2
T4
T3
T1
Temperature (°C)
90±30s time (s)
t2
t1
Limit Profile
Standard Profile
Pre-heating
LQM18F/18P
LQM21D/21F/21P/2MP/2HP
LQM31P/32P
LQH2MC, LQH2HP
LQH31C
LQH3NP/32P/43P/44P/5BP/55P
LQW15C/18C
LQH32C
LQH43C
LQH55D, LQH66S
220°C 30 to 60s 245±3°C 2 times
max. 230°C 260°C/10s 1 time60s max.
(2) Soldering profile
"Flow Soldering profile
(Sn-3.0Ag-0.5Cu solder)
Series Pre-heating Standard Profile Limit Profile
Heating
Temp. (T1) Temp. (T2)
Time. (t1)
150°C 60s min. 250°C 4 to 6s 2 times
max. 5s max. 2 times
max.
265±3°C
Time. (t2)
Heating
Cycle
of flow Temp. (T3) Time. (t2)
Cycle
of flow
T1
T3
T2
Temperature (°C)
Pre-heating
time (s)
t2
Heating Limit Profile
Standard Profile
t1
150°C 60s min. 250°C 4 to 6s 2 times
max. 5s max. 1 times
265±3°C
LQM18F/18P
LQM21D/21F/21P/2MP/2HP
LQM31P
LQH31C
LQH32C
LQH43C/43P
Continued on the following page.
Inductor for Power Lines (Power Inductor) Soldering and Mounting
(3) Reworking with Soldering Iron
Preheating at 150°C for 1 minute is required. Do not
directly touch the ceramic element with the tip of the
soldering iron. The reworking soldering conditions are as
follows:
Soldering iron power output: 80W max.
Temperature of soldering iron tip: 350°C
Diameter of soldering iron end: 3.0mm max.
Soldering time: within 3 s
3. Mounting Instructions
(4) PCB Warping
PCB should be designed so that products are not
subjected to the mechanical stress caused by warping
the board.
Poor example
except LQH3NP/44P/5BP
Products should be located in the sideways direction
(Length: a<b) to the mechanical stress.
Good example
a
b
Poor example
LQH3NP/44P/5BP
The electrode part of the product should be located
like the picture to the mechanical stress.
Good example
(1) Land Pattern Dimensions
Large lands reduce Q of the mounted chip. Also, large
protruding land areas (bordered by lines having
dimensions 'c' and 'd' shown) cause floating and
electrode leaching.
(2) Land Pattern Designing (LQH series)
Please follow the recommended patterns.
Otherwise, their performance which includes electrical
performance or solderability may be affected, or result to
“position shift” in soldering process.
(3) Magnetic Coupling
Since some chip inductors (chip coils) are constructed
like an open magnetic circuit, narrow spacing between
inductors (coils) may cause magnetic coupling.
LQM, LQH66S and LQH_P series have a magnetically
shielded structure. The structure makes their coupling
coefficient smaller than that of conventional chip
inductors (chip coils).
d
c
Magnetic Coupling
Land Solder Resist
electrode
electrode
Continued on the following page.
Inductor for Power Lines (Power Inductor) Soldering and Mounting
LQH_C/H/M/N LQM
LQM18F/18P
LQM21D/21F/21P/2MP
LQM2HP/31P
LQH31C
LQH32C
LQH43C
0.06-0.07
0.20-0.25
0.25-0.30
0.20-0.25
0.27-0.35
0.60-0.80
(6) Amount of Adhesive
If too much adhesive is applied, then it may overflow into
the land or termination areas and yield poor solderability.
In contrast, if insufficient adhesive is applied, or if the
adhesive is not sufficiently hardened, then the chip may
become detached during flow soldering. Apply the
adhesive in accordance with the conditions shown in
chart.
Typical Application Amount (in:mg)
Part Number
IR-100
The following conditions should be observed when
cleaning chip inductors (chip coils):
(1) Cleaning Temperature: 60°C max. (40°C max. for
alcohol cleaning agents)
(2) Ultrasonic
Output: 20W/l max.
Duration: 5 minutes max.
Frequency: 28 to 40kHz
Care should be taken not to cause resonance of the
PCB and mounted products.
(3) Cleaning agent
The following cleaning agents have been tested on
individual components. Evaluation in complete assembly
should be done prior to production.
(a) Alcohol cleaning agents
Isopropyl alcohol (IPA)
(b) Aqueous cleaning agents
Pine Alpha ST-100S
LQH66S series: Aqueous agents should not be used
because they may cause quality deterioration or
damage to appearance.
(4) Ensure that flux residue is completely removed.
Component should be thoroughly dried after aqueous
agents have been removed with deionized water.
For additional cleaning methods, please contact Murata.
LQM
LQH_C/D/H/N/P LQH_S
(5) Amount of Solder Paste
Excessive solder causes electrode corrosion, while
insufficient solder causes low electrode bonding strength.
Adjust the amount of solder paste as shown on the right
so that solder is applied.
" Guideline of solder paste thickness
· LQW15C: 50 to 100μm
· LQM, LQW18C, LQH2MC/2HP, LQH3NP/32P,
LQH44P/5BP/55P: 100 to 150μm
· LQH31C/32C, LQH43C/43P, LQH55D,
LQH66S: 200 to 300μm
4. Cleaning
LQW_C
Inductor for Power Lines (Power Inductor) Soldering and Mounting

Products

FIXED IND 10UH 50MA 900 MOHM SMD
Available Quantity90866
Unit Price0.23
FIXED IND 10UH 100MA 600 MOHM
Available Quantity25720
Unit Price0.26
FIXED IND 2.2UH 600MA 340 MOHM
Available Quantity52295
Unit Price0.44
FIXED IND 1UH 800MA 190 MOHM SMD
Available Quantity37341
Unit Price0.44
FIXED IND 1.5UH 700MA 260 MOHM
Available Quantity6178
Unit Price0.44
FIXED IND 2.2UH 800MA 230 MOHM
Available Quantity27059
Unit Price0.56
FIXED IND 4.7UH 800MA 288 MOHM
Available Quantity20202
Unit Price0.56
FIXED IND 10UH 225MA 1.2 OHM SMD
Available Quantity29722
Unit Price0.57
FIXED IND 3.3UH 800MA 240 MOHM
Available Quantity76755
Unit Price0.6
FIXED IND 2.2UH 1.2A 110 MOHM
Available Quantity16565
Unit Price0.6
FIXED IND 4.7UH 1.1A 175 MOHM
Available Quantity14661
Unit Price0.6
FIXED IND 1UH 1.2A 120 MOHM SMD
Available Quantity9249
Unit Price0.6
FIXED IND 4.7UH 800MA 230 MOHM
Available Quantity63312
Unit Price0.62
FIXED IND 2.2UH 1.2A 138 MOHM
Available Quantity11978
Unit Price0.63
FIXED IND 2.2UH 750MA 375 MOHM
Available Quantity15141
Unit Price0.63
FIXED IND 4.7UH 620MA 550 MOHM
Available Quantity12582
Unit Price0.63
FIXED IND 1UH 2.05A 45 MOHM SMD
Available Quantity70744
Unit Price0.62
FIXED IND 4.7UH 1A 180 MOHM SMD
Available Quantity22146
Unit Price0.62
FIXED IND 1UH 2.45A 30 MOHM SMD
Available Quantity9487
Unit Price0.65
FIXED IND 10UH 1.17A 160 MOHM
Available Quantity7682
Unit Price0.65