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NFE31PTyyy1E9y Spec Datasheet

Murata Electronics North America

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Datasheet

Spec. No. JENF243E-0002R-01 P1 / 8
MURATA MFG. CO., LTD.
Reference Only
Chip EMIFIL ® LC Combined Type for Large Current
NFE31PT□□□□1E9 Reference Specification
1. Scope
This reference specification applies to Chip EMIFIL ® LC Combined Type for Large Current NFE31P Series.
2. Part Numbering
NF E 31 PT 220 R 1E 9 L
Product ID Structure Dimension Features Capacitance Characteristics Rated Electrode Packaging
(L × W) Voltage Code
(L: Taping / B: Bulk)
3. Rating
Customer
Part Number
Murata
Part Number Capacitance Rated
Voltage
Withstanding
Voltage
Rated
Current
Insulation
Resistance
NFE31PT220R1E9L
22pF ± 30%
25 V
(DC)
62.5 V
(DC)
6 A
(DC)
1000 MΩ
min.
NFE31PT220R1E9B
NFE31PT470C1E9L
47pF ± 50
20 %
NFE31PT470C1E9B
NFE31PT101C1E9L
100pF ± 80
20 %
NFE31PT101C1E9B
NFE31PT221D1E9L
220pF ± 50
20 %
NFE31PT221D1E9B
NFE31PT471F1E9L
470pF ± 50
20 %
NFE31PT471F1E9B
NFE31PT152Z1E9L
1500pF ± 50
20 %
NFE31PT152Z1E9B
NFE31PT222Z1E9L
2200pF ± 50%
NFE31PT222Z1E9B
Operating Temperature: - 40 °C to + 85 °C Storage Temperature: - 55 °C to + 125 °C
4. Standard Testing Condition
<Unless otherwise specified> <In case of doubt>
Temperature: Ordinary Temp. 15 °C to 35 °C Temperature: 20 °C ± 2 °C
Humidity: Ordinary Humidity 25 %(RH) to 85 %(RH) Humidity: 60 %(RH) to 70 %(RH)
Atmospheric pressure: 86kPa to 106kPa
5. Style and Dimensions
Equivalent Circuit
Unit Mass (Typical value)
0.034g
Note : Gap and bend between ceramic capacitor(1) and ferrite bead(2) may come out as illustrated below,
however, these are not affect the performance, mounting and reliability of the products.
Input Output
GND
(1),(3):No Polarity
(1) (3)
(2)
0.3 max.
0.1max. (in mm)
1
2
1
2
1.0±0.2
0.7±0.2 0.7±0.2
3.2±0.35
(1) (2) (3)
(in mm)
1.6±0.15
1.6±0.15
1.6±0.15
Spec. No. JENF243E-0002R-01 P2 / 8
MURATA MFG. CO., LTD.
Reference Only
Insertion Loss Characteristics (I.L.) (Typ.)
6. Marking
No marking
7. Electrical Performance
No. Item Specification Test Method
7.1 Capacitance Meet item 3. Table 1
Capacitance Voltage Frequency
22 (pF) 1 to 5 V(rms) 1MHz ± 10%
47,100,220,470
1500 (pF) 1±0.2 V(rms) 1kHz ± 10%
2200 (pF) 0.1 V(rms) max. 1kHz ± 10%
7.2 Insulation
Resistance(I.R.)
Voltage : 25 V(DC)
Time : 60±5 seconds
7.3 Withstanding
Voltage
Products shall not be damaged. Test Voltage : 62.5 V(DC)
Testing Time : 1 to 5 seconds
Limit the charging current: 10mA max.
8. Mechanical Performance
No. Item Specification Test Method
8.1 Appearance and
Dimensions
Meet item 5. Visual Inspection and measured with Slide
Calipers
8.2 Solderability The electrodes shall be at least 75%
covered with new solder coating.
Flux : Ethanol solution of rosin, 25(wt)%
Pre-heat : 150 ± 10 °C, 60 ~ 90 s
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 240 ± 3 °C
Immersion Time : 3 ± 1 s
Immersion and emersion rates : 25mm / s
8.3 Resistance to
soldering heat
Meet Table 2.
Table 2
Flux : Ethanol solution of rosin, 25(wt)%
Pre-heat : 150 ± 10 °C, 60 ~ 90 s
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 270 ± 5 °C
(for NFE31PT152Z1E9 : 250±5°C)
Immersion Time : 10 ± 1 s
Immersion and emersion rates : 25mm / s
Then measured after exposure the room
condition for 4 to 48 hours.
Appearance No damaged
Cap. Change
22,47,100
220 (pF)
within
±15%
470,1500
2200 (pF)
within
±30%
I.R. meet item 3
Withstanding
Voltage No damaged
Spec. No. JENF243E-0002R-01 P3 / 8
MURATA MFG. CO., LTD.
Reference Only
No. Item Specification Test Method
8.4 Bending
Strength
Meet Table 3.
Table 3
It shall be soldered on the paper-phenol substrate.
(t=1.6mm)
(in mm)
Deflection : 3 mm
Keeping Time : 30 seconds
Appearance No damaged
Cap. Change
22,47,100
220 (pF)
within
±15%
470,1500
2200 (pF)
within
±30%
9. Environment Performance
(It shall be soldered on the substrate.)
No. Item Specification Test Method
9.1 Humidity Meet Table 4.
Table 4
Temperature : 40 ± 2 °C
Humidity : 90 to 95 %(RH)
Time : 500 h (+ 24h , - 0h)
Then measured after exposure in the room
condition for 4 to 48 hours.
Appearance No damaged
Cap. Change
22,47,100
220 (pF)
within
±15%
9.2 Heat Life 470,1500
2200 (pF)
within
±30%
Temperature : 85 ± 2 °C
Test Voltage :
22,47,100,220(pF) : Rated Voltage × 200 %
470,1500,2200(pF) : Rated Voltage × 150 %
Time : 1000 h (+ 48h , - 0h)
Then measured after exposure in the room
condition for 4 to 48 hours.
I.R. 100 MΩ min.
Withstanding
Voltage No damaged
9.3 Temperature
Cycling
Meet Table 2. 1 Cycle
1 step: -55 °C (+ 0°C , - 3°C) / 30 ± 3 min
2 step: Room Temperature / within 5 min
3 step: +125 °C (+ 3°C , - 0°C) / 30 ± 3 min
4 step: Room Temperature / within 5 min
Total of 10 cycles
Then measured after exposure in the room
condition for 4 to 48 hours.
10. Specification of Packaging
10.1. Appearance and Dimensions (8mm-wide plastic tape)
45
R340
F
Deflection
45 Product
Pressure jig
Dimension of the Cavity is
measured at the bottom side.
4.0±0.1 2.0±0.05
0.2±0.1
φ
1.
8.0±0.2
3.5±0.05 1.75±0.1
0.1
0
1.8±0.05
3.6±0.05
1.85±0.14.0±0.1
(in mm)
Sprocket Hole
Direction of feed
Embossed Cavity
0.1
1.8±0.1
Spec. No. JENF243E-0002R-01 P4 / 8
MURATA MFG. CO., LTD.
Reference Only
10.2. Specification of Taping
(1) Packing quantity (standard quantity)
2000 pcs. / reel
(2) Packing Method
Products shall be packaged in the cavity of the plastic tape and sealed with cover tape.
(3) Sprocket Hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Spliced point
The cover tape have no spliced point.
(5) Missing components number
Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater,
and are not continuous. The specified quantity per reel is kept.
10.3. Pull Strength of Plastic Tape and Cover Tape
Plastic tape 5N min.
Cover tape 10N min.
10.4. Peeling off force of cover tape
0.2N to 0.7N (minimum value is typical)
Speed of Peeling off : 300 mm / min
10.5. Dimensions of Leader-tape, Trailer and Reel
There shall be leader-tape (cover tape only and empty tape) and trailer-tape (empty tape) as follows.
(in: mm)
10.6. Marking for reel
Customer part number , MURATA part number , Inspection number(1) , RoHS marking(2) , Quantity , etc
1) « Expression of Inspection No. » □□ OOOO ×××
(1) (2) (3)
(1) Factory Code
(2) Date First digit : Year / Last digit of year
Second digit : Month / Jan. to Sep. 1 to 9, Oct. to Dec. O, N, D
Third, Fourth digit : Day
(3) Serial No.
2) « Expression of RoHS marking » ROHS – Y ()
(1) (2)
(1) RoHS regulation conformity parts.
(2) MURATA classification number
10.7. Marking for Outside package (corrugated paper box)
Customer name , Purchasing Order Number , Customer Part Number , MURATA part number ,
RoHS marking (2) , Quantity , etc
165 to 180 degree FCover tape
Plastic tape
Empty tape
190 min.
Leader
Trailer
Cover tape
2.0±0.5
φ
13.0±0.2
φ
21.0±0.8
φ
180±
φ
60±
13±1.4
1
0
0
3
Direction of feed
210 mi n.
160 min.
1
0
Label
Spec. No. JENF243E-0002R-01 P5 / 8
MURATA MFG. CO., LTD.
Reference Only
10.8. Specification of Outer Case
Outer Case Dimensions
(mm) Standard Reel Quantity in Outer Case
(Reel)
W D H
186 186 93 5
Above Outer Case size is typical. It depends on a quantity of an order.
11. Standard Land Dimensions
The chip EMI filter suppresses noise by conducting the high-frequency noise element to ground.
Therefore, to get enough noise reduction, feed through holes which is connected to ground-plane should be
arranged according to figure to reinforce the ground-pattern.
(Standard land dimensions for reflow)
Side on which chips are mounted
12. ! Caution
Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high
reliability for the prevention of defects which might directly cause damage to the third party’s life, body or property.
(1)Aircraft equipment (2)Aerospace equipment (3)Undersea equipment (4)Power plant control equipment
(5)Medical equipment (6)Transportation equipment(automobiles, trains, ships, etc.) (7)Traffic signal equipment
(8)Disaster prevention / crime prevention equipment (9)Data-processing equipment
(10)Applications of similar complexity or with reliability requirements comparable to the applications listed in the above
13. Notice
Products can only be soldered with reflow.
If it were soldered with flow, cracks might be caused in the ceramic body.
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
13.1. Flux and Solder
Flux Use rosin-based flux, Do not use highly acidic flux (with chlorine content
exceeding 0.2(wt)%).
Do not use water-soluble flux.
Solder Use Sn-3.0Ag-0.5Cu solder
13.2. Note for Assembling
< Thermal Shock >
Pre-heating should be in such a way that the temperature difference between solder and products
surface is limited to 100 °C max. Also cooling into solvent after soldering should be in such a way that the
temperature difference is limited to 100°C max.
Resist
Copper foil pattern
No pattern
1.2
2.2
4.2
1.0
2.6
3.0
Small diamenter thru hole
(
φ
0.4)
0.6
(in mm)
W
D
Label
H
Spec. No. JENF243E-0002R-01 P6 / 8
MURATA MFG. CO., LTD.
Reference Only
13.3. Attention Regarding P.C.B. Bending
The following shall be considered when designing P.C.B.'s and laying out products.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage.
Products direction
Products shall be located in the sideways
direction (Length:a
<
b) to the mechanical stress.
(2) Components location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible
to reduce stress.
Contents of Measures Stress Level
(1) Turn the mounting direction of the component parallel to the board separation surface. A > D *1
(2) Add slits in the board separation part. A > B
(3) Keep the mounting position of the component away from the board separation surface. A > C
*1 A > D is valid when stress is added vertically to the perforation
as with Hand Separation.If a Cutting Disc is used, stress will be
diagonal to the PCB, therefore A > D is invalid.
(3) Mounting Components Near Screw Holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during
the tightening of the screw. Mount the component in a position as far away from the screw holes as possible.
13.4. Reflow Soldering
Standard printing pattern of solder paste.
(1) Solder paste printing for reflow
· Standard thickness of the solder paste should be 150µm to 200μm.
· Use the solder cream printing pattern of the right pattern.
· For the resist and copper foil pattern, use standard land dimensions.
Poor example
Good example
b
a
0.6
2.2
4.2
2.6
0.6
1.0
(in mm)
Spec. No. JENF243E-0002R-01 P7 / 8
MURATA MFG. CO., LTD.
Reference Only
(2) Soldering Conditions
Standard soldering profile and the limit soldering profile is as follows.
The excessive soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of
product quality.
Standard Profile Limit Profile
Pre-heating 150°C ~ 180°C , 90s ± 30s
Heating above 220°C , 30s ~ 60s above 230°C , 60s max.
Peak temperature 245°C ± C 260°C , 10s
Cycle of reflow 2 times 2 times
13.5. Reworking with Soldering iron
The following conditions shall be strictly followed when using a soldering iron.
Pre-heating: 150°C, 1 min Soldering iron output: 30W max.
Tip temperature/ Soldering time: 350°C max. / 3(+1,-0) s (NFE31PT152Z1E9: 280 °C max. / 10 s max. )
Tip diameter: φ3mm max. Times: 2times max.
Note: Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on
the ceramic material due to the thermal shock.
13.6. Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60 °C max. (40° C max. for IPA.)
(2) Ultrasonic cleaning shall comply with the following conditions, with avoiding the resonance phenomenon at the
mounted products and P.C.B.
Power: 20W / l max. Frequency: 28kHz to 40kHz Time: 5 minutes max.
(3) Cleaner
1. Cleaner
· Isopropyl alcohol (IPA)
2. Aqueous agent
· PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order
to remove the cleaner.
(5) Other cleaning
Please contact us.
13.7. Operating Environment
Do not use this product under the following environmental conditions, on deterioration of the performance,
such as insulation resistance may result from the use.
(1) in the corrodible atmosphere (acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.)
(2) in the atmosphere where liquid such as organic solvent, may splash on the products.
Limit Profile
Standard Profile
90s±30s
230°C
260°C
245°C±3°C
220°C
30s
60s
60s max.
180
150
Temp.
Time.(s)
C)
Spec. No. JENF243E-0002R-01 P8 / 8
MURATA MFG. CO., LTD.
Reference Only
13.8. Resin coating
It may affect on the product's performance when using resin for coating / molding products. So please pay your
careful attention in selecting resin. In prior to use, please make the reliability evaluation with the product mounted
in your application set.
13.9. Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to
the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening
screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending Twisting
13.10. Storage condition
(1) Storage period
Use the products within 12 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage environment condition
· Products should be storage in the warehouse on the following conditions.
Temperature : -10 °C to +40 °C
Humidity : 15% to 85% relative humidity No rapid change on temperature and humidity
· Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization of
electrode, resulting in poor solderability.
· Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
· Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
· Products should be stored under the airtight packaged condition.
(3) Delivery
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
14. ! Notes
(1) Please make sure that your product has been evaluated in view of your specifications with our product
being mounted to your product.
(2) You are requested not to use our product deviating from the reference specifications.
(3) The contents of this reference specification are subject to change without advance notice. Please approve our
product specifications or transact the approval sheet for product specifications before ordering.

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