BLM31xSN1 Series Spec Sheet

Murata Electronics North America

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Datasheet

Spec. No. JENF243A-0006W-01 P.1/9
MURATA MFG.CO., LTD.
Reference Only
Chip Ferrite Bead BLM31□□□□□SN1 Reference Specification
1. Scope
This reference specification applies to Chip Ferrite Bead BLM31_SN Series.
2. Part Numbering
(ex.) BL M 31 PG 601 S N 1 L
(1) (2) (3) (4) (5) (6) (7) (8) (9)
(1)Product ID (6)Performance
(2)Type (7)Category
(3)Dimension (L×) (8)Numbers of Circuit
(4)Characteristics (9)Packaging (L:Taping / B:Bulk)
(5)Typical Impedance at 100MHz
3. Rating
Customer
Part Number
MURATA
Part Number
Impedance
(Ω)
(at 100MHz, Under Standard
Testing Condition)
Rated
Current
(mA)
(Note1)
DC
Resistance
(Ω) max. Remark
at 85 at 125 Initial
Values
Values
After
Testing
BLM31PG330SN1L 33±25% 6000 3500 0.009 0.018
For DC power line
BLM31PG330SN1B
BLM31PG500SN1L 35 min. 3500 2300 0.015 0.03
BLM31PG500SN1B
BLM31PG121SN1L 120±25% 3500 2000 0.02 0.04
BLM31PG121SN1B
BLM31PG391SN1L 390±25% 2000 1250 0.05 0.10
BLM31PG391SN1B
BLM31PG601SN1L 600±25% 1500 1000 0.08 0.16
BLM31PG601SN1B
BLM31SN500SN1L 50±12.5 12000 10000 0.0016 0.0021
BLM31SN500SN1B
Operating Temperature: -55°C to +125°C Storage Temperature: -55°C to +125°C
Note1Rated Current is derated as right figure
depending on the operating temperature.
4. Style and Dimensions
Equivalent Circuit
Unit Mass (Typical value)
Operating Temperature (°C)
x
1
85 125
0
Rated Current (A)
Describe the Rated current as x[A]
in case of more than 1A.
85℃
125℃
Resistance element becomes
dominant at high frequencies.
()
(in mm)
0.025 g
:電
3.2±0.2 1.6±0.2
0.7±0.3
1.1±0.2
Spec. No. JENF243A-0006W-01 P.2/9
MURATA MFG.CO., LTD.
Reference Only
5.Marking
No marking.
6. Standard Testing Conditions
< Unless otherwise specified > < In case of doubt >
Temperature : Ordinary Temp. (15 °C to 35 °C ) Temperature : 20°C±2 °C
Humidity : Ordinary Humidity (25%(RH) to 85%(RH)) Humidity : 60%(RH) to 70%(RH)
Atmospheric pressure : 86kPa to 106kPa
7. Specifications
7-1. Electrical Performance
No. Item Specification Test Method
7-1-1 Impedance Meet item 3. Measuring Frequency : 100MHz±1MHz
Measuring Equipment : KEYSIGHT4291A or the equivalent
Test Fixture : KEYSIGHT16192A or the equivalent
7-1-2 DC Resistance Meet item 3.
Measuring Equipment : Digital multi meter
*Except resistance of the Substrate and Wire
7-2. Mechanical Performance
No. Item Specification Test Method
7-2-1 Appearance and
Dimensions
Meet item 4. Visual Inspection and measured with Slide Calipers.
7-2-2 Bonding
Strength
Meet Table 1.
Table 1
It shall be soldered on the substrate.
Applying Force(F) : 9.8N
Applying Time : 5s±1s
Applied direction:Parallel to substrate
7-2-3 Bending
Strength
It shall be soldered on the substrate.
Substrate: Glass-epoxy 100mm×40mm×1.6mm
Deflection: 1.0mm
Speed of Applying Force : 0.5mm/s
Keeping Time : 30s
Appearance No damage
Impedance
Change
(at 100MHz)
Within ±30%
DC
Resistance Meet item 3.
45mm
R340
F
Deflection
45mm Product
Pressure jig
R0.5
Substrate
Side view
Spec. No. JENF243A-0006W-01 P.3/9
MURATA MFG.CO., LTD.
Reference Only
No. Item Specification Test Method
7-2-4 Vibration Meet Table 1. It shall be soldered on the substrate.
Oscillation Frequency : 10Hz to 55Hz to 10Hz for 1 min
Total Amplitude : 1.5mm
Testing Time : A period of 2 hours in each of 3 mutually
perpendicular directions. (Total 6 h)
7-2-5 Resistance
to Soldering
Heat
Meet Table 2.
Table 2
Pre-Heating : 150°C±10°C, 60s90s
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 270°C±5°C
Immersion Time : 10s±0.5s
Immersion and emersion rates : 25mm/s
Then measured after exposure in the room condition
for 48h±4h.
7-2-6 Drop Products shall be no failure after
tested.
It shall be dropped on concrete or steel board.
Method : free fall
Height : 75cm
Attitude from which the product is dropped : 3 direction
The number of times : 3 times for each direction
(Total 9 times)
7-2-7 Solderability The electrodes shall be at least
95% covered with new solder
coating.
Flux : Ethanol solution of rosin,25(wt)%
Pre-Heating : 150°C±10°C, 60s90s
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 240°C±5°C
Immersion Time : 4s±1s
Immersion and emersion rates : 25mm/s
7-3. Environmental Performance
It shall be soldered on the substrate.
No. Item Specification Test Method
7-3-1 Temperature
Cycle
Meet Table 2. 1 cycle:
1 step: -55 °C(+0 °C,-3 °C) / 30min±3min
2 step: Ordinary temp. / 10min to 15min
3 step: +125 °C(+3 °C,-0 °C) / 30min±3min
4 step: Ordinary temp. / 10min to 15min
Total of 100 cycles
Then measured after exposure in the room condition
for 48h±4h.
7-3-2 Humidity Temperature : 40°C±2°C
Humidity : 90%(RH) to 95%(RH)
Time : 1000h(+48h,-0h)
Then measured after exposure in the room condition
for 48h±4h.
7-3-3 Heat Life Temperature : 85°C±3°C
Applying Current : Rated Current
Time : 1000h(+48h,-0h)
Then measured after exposure in the room condition
for 48h±4h.
7-3-4 Cold Resistance Temperature : -55±2°C
Time : 1000h(+48h,-0h)
Then measured after exposure in the room condition
for 48h±4h.
Appearance No damage
Impedance
Change
(at 100MHz)
Within ±30%
(for BLM31SN
within ±50%)
DC
Resistance Meet item 3.
Spec. No. JENF243A-0006W-01 P.4/9
MURATA MFG.CO., LTD.
Reference Only
8. Specification of Packaging
8-1. Appearance and Dimensions (8mm-wide plastic tape)
*Dimension of the Cavity is measured at the bottom side.
(1) Taping
Products shall be packaged in the each embossed cavity of 8mm-wide, 4mm-pitch and plastic tape
continuously and sealed by cover tape.
(2) Sprocket hole : The sprocket holes are to the right as the tape is pulled toward the user.
(3) Spliced point : The cover tape has no spliced point.
(4) Missing components number
Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater,
and are not continuous. The specified quantity per reel is kept.
8-2. Tape Strength
(1)Pull Strength
Plastic tape 5N min.
Cover tape 10N min.
(2) Peeling off force of Cover tape
0.2N to 0.7N (Minimum value is typical.)
*Speed of Peeling off:300mm/min
8-3. Taping Condition
(1) Standard quantity per reel
Quantity per 180mm reel : 3000 pcs. / reel
(2) There shall be leader-tape (cover tape only and empty tape ) and trailer- tape (empty tape) as follows.
(3) Marking for reel
The following items shall be marked on a label and the label is stuck on the reel.
(Customer part number, MURATA part number, Inspection number (1), RoHS marking (2) , Quantity, etc)
1) « Expression of Inspection No. » □□ OOOO ×××
(1) (2) (3)
(1) Factory Code
(2) Date First digit : Year / Last digit of year
Second digit : Month / Jan. to Sep. 1 to 9, Oct. to Dec. O, N, D
Third, Fourth digit : Day
(3) Serial No.
2) « Expression of RoHS marking » ROHS – Y ()
(1) (2)
(1) RoHS regulation conformity parts.
(2) MURATA classification number
(4) Outside package
These reels shall be packed in the corrugated cardboard package and the following items shall be marked
on a label and the label is stuck on the box.
(Customer name, Purchasing order number, Customer part number, MURATA part number,
RoHS marking (2), Quantity, etc)
165 to 180 degree FCover tape
Plastic tape
0.2±0.1
φ
1.5
Direction of feed
4.0±0.1 4.0±0.1
3.5±0.1
2.0±0.05
3.5±0.05 1.75±0.1
8.0±0.3
+0.1
-0
1.9±0.1
φ
1.0
+0.3
-
0
1.3±0.1
(in mm)
1.3±0.1
Spec. No. JENF243A-0006W-01 P.5/9
MURATA MFG.CO., LTD.
Reference Only
(5) Dimensions of reel and taping (leader-tape, trailer-tape)
(in mm)
8-4. Specification of Outer Case
Outer Case Dimensions
(mm) Standard Reel Quantity in Outer Case
(Reel)
W D H
186 186 93 5
Above Outer Case size is typical. It depends on a quantity of an order.
9. Caution
9-1. Surge current
Excessive surge current (pulse current or rush current) than specified rated current applied to the product may cause a
critical failure, such as an open circuit, burnout caused by excessive temperature rise.
Please contact us in advance in case of applying the surge current.
9-2. Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high
reliability for the prevention of defects which might directly cause damage to the third party's life, body or property.
(1)Aircraft equipment (6)Disaster prevention / crime prevention equipment
(2)Aerospace equipment (7)Traffic signal equipment
(3)Undersea equipment (8)Transportation equipment (vehicles,trains,ships,etc.)
(4)Power plant control equipment (9) Data-processing equipment
(5)Medical equipment (10)Applications of similar complexity and /or reliability requirements
to the applications listed in the above
10. Notice
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
10-1. Land pattern designing
Standard land dimensions (Flow and Reflow soldering)
(in mm)
*The excessive heat by land pads may cause
deterioration at joint of products with substrate.
2.0
4.2to5.2
Chip Ferrite Bead
Solder Resist
Pattern
a
1.2
Empty tape
190 min.
Leader
Trailer
2.0±0.5
φ
13.0±0.2
φ
21.0±0.8
φ
180
φ
60
9.0
13.0±1.4
+1
-
0
+0
-3
Direction of feed
210 min.
160 min.
Cover tape
+1
-0
Label
W
D
Label
H
Type
Rated
Current
(A)
Land pad thickness and
dimension a
18µm 35µm 70µm
BLM31PG
1.5/2 1.2 1.2 1.2
3.5 2.4 1.2 1.2
6 6.4 3.3 1.65
BLM31SN 1012 - 9.8 4.9
Spec. No. JENF243A-0006W-01 P.6/9
MURATA MFG.CO., LTD.
Reference Only
Land dimensions on Flow soldering for 2.5mm pitch mounting
*Taking land pad thickness and rated current into
account.
a b c d e
2.0 4.2 to 5.2 1.2 1.3 1.35
(in mm)
*The pattern shall be designed to above drawing to
prevent causing the solder bridge when products
are mounted by 2.5mm pitch flow soldering.
10-2. Soldering Conditions
Products can be applied to reflow and flow soldering.
(1) Flux,Solder
Flux Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. )
Do not use water-soluble flux.
Solder Use Sn-3.0Ag-0.5Cu solder
Standard thickness of solder paste : 100 µm to 200 μm
(2) Soldering conditions
Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited
to 150 max. Also cooling into solvent after soldering should be in such a way that the temperature difference
is limited to 100 max.
Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality.
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the
deterioration of product quality.
(3) soldering profile
Flow soldering profile
Standard Profile Limit Profile
Pre-heating 150℃、60s min.
Heating 250℃、46s 265℃±3℃、5s max.
Cycle of flow 2 times 2 times
d
e
a
bc
a
bd
e
c
e
e
2.5mm pitch
Chip Ferrite Bead
Solder Resist
Pattern
250
Heating Time
150
Limit Profile
Standard Profile
(s)Time.
Temp.
(℃)
60s min.
265℃±3℃
Spec. No. JENF243A-0006W-01 P.7/9
MURATA MFG.CO., LTD.
Reference Only
Reflow soldering profile
Standard Profile Limit Profile
Pre-heating 150180°C 90s±30s
Heating above 220°C30s60s above 230°C60s max.
Peak temperature 245±3°C 260°C,10s
Cycle of reflow 2 times 2 times
10-3. Reworking with soldering iron
Pre-heating: 150°C, 1 min Soldering iron output: 80W max.
Tip temperature: 350°C max. Tip diameter:φ3mm max.
Soldering time : 3(+1,-0) seconds. Times : 2times max.
Note :Do not directly touch the products with the tip of the soldering iron in order to prevent the crack
on the ferrite material due to the thermal shock.
10-4. Solder Volume
Solder shall be used not to be exceed as shown below.
1/3TtT
(T:Chip thickness)
Accordingly increasing the solder volume, the mechanical stress to product is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
10-5. Attention regarding P.C.B. bending
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage.
<Products direction>
Products shall be located in the sideways
direction (Length:a<b) to the mechanical
stress.
Recommendable
Upper Limit
t
Poor example
Good example
b
a
Limit Profile
Standard Profile
90s±30s
230
260℃
245℃±3℃
220
30s~60s
60s max.
180
150
Temp.
(s)
(℃)
Time.
Spec. No. JENF243A-0006W-01 P.8/9
MURATA MFG.CO., LTD.
Reference Only
(2)Components location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible
to reduce stress.
Contents of Measures Stress Level
(1) Turn the mounting direction of the component parallel to the board separation surface. A > D *1
(2) Add slits in the board separation part. A > B
(3) Keep the mounting position of the component away from the board separation surface. A > C
*1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
(3) Mounting Components Near Screw Holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during
the tightening of the screw. Mount the component in a position as far away from the screw holes as possible.
10-6. Mounting density
Add special attention to radiating heat of products when mounting the inductor near the products with heating.
The excessive heat by other products may cause deterioration at joint of this product with substrate.
10-7. Operating Environment
Do not use this product under the following environmental conditions, on deterioration of the Insulation
Resistance of the Ferrite material and/or corrosion of Inner Electrode may result from the use.
(1) in the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc
(the sea breeze, Cl2, H2S, NH3, SO2, NO2,etc)
(2) in the atmosphere where liquid such as organic solvent, may splash on the products.
(3) in the atmosphere where the temperature / humidity changes rapidly and it is easy to dew.
10-8. Resin coating
The impedance value may change and/or it may affect on the product's performance due to high cure-stress of
resin to be used for coating / molding products. So please pay your careful attention when you select resin. In prior
to use, please make the reliability evaluation with the product mounted in your application set.
Perforation
Slit
A
B
C
D
Screw Hole Recommended
Spec. No. JENF243A-0006W-01 P.9/9
MURATA MFG.CO., LTD.
Reference Only
10-9. Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max. (40°C max. for IPA.)
(2) Ultrasonic cleaning shall comply with the following conditions, avoiding the resonance phenomenon
at the mounted products and P.C.B.
Power:20W/ max. Frequency:28kHz to 40kHz Time:5 min max.
(3) Cleaner
1.Alternative cleaner
Isopropyl alcohol (IPA)
2.Aqueous agent
PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water
in order to remove the cleaner.
(5) Other cleaning
Please contact us.
10-10. Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the
substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to
the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending Twisting
10-11. Storage Conditions
(1) Storage period
Use the products within 6 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage conditions
Products should be stored the warehouse on the following conditions.
Temperature : -10°C to 40°C
Humidity : 15% to 85% relative humidity
No rapid change on temperature and humidity
Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization
of electrode, resulting in poor solderability.
Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
Products should be stored under the airtight packaged condition.
(3) Delivery
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
11. ! Note
(1)Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2)You are requested not to use our product deviating from the reference specifications.
(3)The contents of this reference specification are subject to change without advance notice. Please approve our
product specifications or transact the approval sheet for product specifications before ordering.

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