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DLW31SNyyySQ2y Spec Sheet

Murata Electronics North America

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Spec No. JEFL243C-0002U-01 P 1/9
MURATA MFG.CO.,LTD
Reference Only
Wire Wound Chip Common Mode Choke Coil
DLW31SN□□□SQ2 Reference Specification
1. Scope
This reference specification applies to Chip Common Mode Choke Coil DLW31SN Series.
2. Part Numbering
(ex.) DL W 31 S N 222 S Q 2 L
(1) (2) (3) (4) (5) (6) (7) (8) (9) (10)
(1) Chip Common Mode Choke Coil
(2) Structure (W : Winding Type)
(3) Dimension (L×W)
(4) Type
(5) Category
3. Rating
Customer
Part Number
Murata
Part Number
Common Mode Impedance
(at 100MHz, Under
Standard Testing Condition)
(Ω ± 25%)
Rated
Voltage
V(DC)
Withstanding
Voltage
V(DC)
Rated
Current
(mA)
DC
Resistance
(Ω max.)
Insulation
Resistance
(MΩ min.)
DLW31SN222SQ2L 2200
50 125
200 1.2
10
DLW31SN222SQ2B
DLW31SN102SQ2L 1000 230 1.0
DLW31SN102SQ2B
DLW31SN601SQ2L 600 260 0.8
DLW31SN601SQ2B
DLW31SN261SQ2L 260 310 0.5
DLW31SN261SQ2B
DLW31SN161SQ2L 160 340 0.4
DLW31SN161SQ2B
DLW31SN900SQ2L 90 370 0.3
DLW31SN900SQ2B
Operating Temperature : -40 to +85°C Storage Temperature : -40 to +85°C
4. Standard Testing Condition
<Unless otherwise specified> <In case of doubt>
Temperature : Ordinary Temperature 15 to 35°C Temperature : 20 ± 2°C
Humidity : Ordinary Humidity 25 to 85%(RH) Humidity : 60 to 70%(RH)
Atmospheric Pressure : 86 to106kPa
5. Style and Dimensions Equivalent Circuits
Unit Mass (Typical value)
0.039g
6. Marking
No Marking.
(1)
(4)
(2)
(3)
No polarity
(0.6)
3.2±0.2
(2)
(3)
(4)
(1)
(0.6)
Electrode
1.6±0.2
( ): Reference value
(in mm)
1.9±0.2
(6) Impedance (Typ. at 100MHz)
(7) Circuit
(8) Features
(9) Number of Line
(10) Packaging Code L : Taping / B : Bulk
Spec No. JEFL243C-0002U-01 P 2/9
MURATA MFG.CO.,LTD
Reference Only
7. Electrical Performance
No. Item Specification Test Method
7.1 Common Mode
Impedance (Zc)
Meet item 3. Measuring Equipment : KEYSIGHT 4291A or the
equivalent
Measuring Frequency :100±1MHz(ref.item 10,11)
7.2 Withstanding
Voltage
Products shall not be
damaged.
Test Voltage : 2.5 times for Rated Voltage
Time : 1 to 5 seconds
Charge Current : 1 mA max. (ref.item 10)
7.3 DC Resistance
(Rdc)
Meet item 3. Measuring current : 100mA max. (ref.item 10)
(In case of doubt in the above mentioned standard
condition, measure by 4 terminal method.)
7.4 Insulation
Resistance (I.R.)
Measuring voltage : Rated Voltage
Measuring time : 1 minute max. (ref.item 10)
8. Mechanical Performance
No. Item Specification Test Method
8.1 Appearance and
Dimensions
Meet item 5.
Visual Inspection and measured with
Slide Calipers.
8.2 Bonding
Strength
No evidence of coming off
substrate.
Products shall not be mechanical
damaged.
It shall be soldered on the substrate.
Applying Force(F) : 9.8N
Applying Time : 5±1 seconds
8.3 Bending
Strength
Meet Table 1.
Table 1
It shall be soldered on the Glass-epoxy subst
r
ate
Deflection : 2mm (t=1.0mm)
Keeping time : 30 seconds
Speed of Applying Force : 0.5mm/s
8.4 Drop It shall be dropped on concrete or steel board.
Method : free fall
Height : 75 cm
The Number of Times : 3 times
8.5 Vibration It shall be soldered on the substrate.
Oscillation Frequency : 10 to 55 to 10Hz for 1 minute
Total Amplitude : 1.5mm
Testing Time : A period of 2 hours in each of 3
mutually perpendicular directions. (Total 6 hours)
8.6 Solderabilit
y
The electrodes shall be at least
90% covered with new solder
coating.
Flux : Ethanol solution of rosin,25(wt)% includes
activator equivalent to 0.06 to 0.10(wt)% chlorine
Pre-Heating : 80 to 120°C 1minute
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 245±3°C
Immersion Time : 4±1 s
Immersion and emersion rates : 25mm / s
8.7 Resistance to
Soldering Heat
Meet Table 1.
Flux : Ethanol solution of rosin,25(wt)% includes
activator equipment to 0.06 to 0.10(wt)% chlorine
Pre-Heating : 80 to 120°C ,1minute
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 260±5°C
Immersion Time : 5±0.5 seconds
Immersion and emersion rates : 25mm / s
Then measured after exposure in the room condition
for 4 to 48 hours.
Appearance No damaged
Common Mode
Impedance
Change
within ±20%
I.R. 10MΩ min.
Withstanding
Voltage
No damaged
45
R230
F
Deflection
45 Product
Pressure jig
Please hold product
except these part.
Stainless tweezers
Pressure
Product
Test board fixture
Substrate
Spec No. JEFL243C-0002U-01 P 3/9
MURATA MFG.CO.,LTD
Reference Only
9. Environmental Performance(Products shall be soldered on the substrate.)
No. Item Specification Test Method
9.1 Temperature
Cycle
Meet Table 1. 1 Cycle
Step 1 -40°C(+0°C,-3°C) / 30±3 min
Step 2 Ordinary Temp. / 10 to 15 minutes
Step 3 +85°C(+3°C,-0°C) / 30±3 min
Step 4 Ordinary Temp. / 10 to 15 minutes
Total of 10 cycles
Then measured after exposure in the
room condition for 4 to 48 hours
9.2 Humidit
y
Temperature : 40±2°C
Humidity : 90~95%(RH)
Time : 1000(+48 hours,-0 hours)
Then measured after exposure in the
room condition for 4 to 48 hours.
9.3 Heat life Temperature : 85±2°C
Applying Voltage : 2times for Rated Voltage
Time : 1000(+48 hours,-0 hours)
Then measured after exposure in the
room condition for 4 to 48 hours.
9.4 Cold Resistance Temperature : -40± 2°C
Time : 1000(+48 hours,-0 hours)
Then measured after exposure in the
room condition for 4 to 48 hours.
10. Terminal to be Tested.
When measuring and supplying the voltage,the following terminal is applied.
No. Item Terminal to be Tested
10.1 Common Mode Impedance
(Measurement Terminal)
10.2 Withstanding Voltage
(Measurement Terminal)
10.3 DC Resistance
(Measurement Terminal)
10.4 Insulation Resistance
(Measurement Terminal)
10.5 Heat Life(Supply Terminal)
11. Measuring method for common mode impedance.
Measured common mode impedance may be included measurement error due to stray capacitance,
residual inductance of test fixture.
To correct this error, the common mode impedance should be calculate as follows;
(1) Measure admittance of the fixture(opened), Go Bo.
(2) Measure impedance of the fixture(shorted), Rs Xs.
(3) Measure admittance of the specimen, Gm Bm.
(4) Calculate corrected impedance Z using the formula below.
Z = (Rx2+Xx2) 1/2
Where
Rx = Gm-GO
(Gm-Go)2 + (Bm-Bo)2 - Rs
Xx = -(Bm- Bo)
(Gm-Go) 2 + (Bm-Bo)2 - Xs
12. P.C.B., Flux, Solder and Soldering condition
Test shall be done using P.C.B., Flux, Solder and Soldering condition which are specified in item 16 except
the case of being specified special condition.
Terminal Terminal
Terminal
Terminal
Terminal
Terminal
Terminal
Terminal
Terminal
Terminal
Spec No. JEFL243C-0002U-01 P 4/9
MURATA MFG.CO.,LTD
Reference Only
13. Impedance Frequency Characteristics(Typical)
14. Specification of Packaging
14.1 Appearance and Dimensions ( 8mm-wide,Plastic tape)
14.2 Specification of Taping
(1)Packing quantity(Standard quantity) 2000 pcs. / reel
(2)Packing Method
Products shall be packaged in each embossed cavity of plastic tape and sealed with cover tape.
(3) Spliced point
The cover tape have no spliced point.
(4) Sprocket Hole
The sprocket holes are to the right as the tape is pulled toward the user.
(5)Missing components number
Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater,and are not
continuous.The specified quantity per reel is kept.
14.3 Pull Strength of Plastic Tape
Plastic Tape 5N min.
Cover Tape 10N min.
14.4 Peeling off force of Cover Tape
0.2 to 0.7N(Minimum value is Typical)
Speed of Peeling off : 300 mm / min
14.5 Dimensions of Leader-tape, Trailer and Reel
(in:mm)
165to180degree FCover tape
Plastic tape
(in mm)
2.1±0.1
0.3±0.05
Sprocket Hole
Direction of feed
Cavity
3.6±0.1
4.0±0.1
2.0±0.1
3.5±0.05
8.0±0.2
2.0±0.05
4.0±0.1
φ
1.
0.1
0
1.75±0.1
Empty tape
190 min.
Leader
Trailer
Top tape
2.0±0.5
φ
13.0±0.2
φ
21.0±0.8
φ
180±
φ
60±
13±1.4
1
0
0
3
Direction of feed
210 min.
160 min.
1
0
Label
1
10
100
1000
10000
1 10 100 1000
f (MHz)
Common Mode
Differential Mode
DLW31SN222SQ2
DLW31SN161SQ2
DLW31SN261SQ2
DLW31SN601SQ2
DLW31SN102SQ2
DLW31SN900SQ2
DLW31SN900SQ2
DLW31SN102SQ2
DLW31SN601SQ2
DLW31SN261SQ2
DLW31SN161SQ2
DLW31SN222SQ2
| Z | ( Ω )
*Dimension of the Cavity is measured
at the bottom side.
Spec No. JEFL243C-0002U-01 P 5/9
MURATA MFG.CO.,LTD
Reference Only
14.6 Marking for reel
Customer part number, MURATA part number, Inspection number(1), RoHS Marking(2), Quantity, etc
1) « Expression of Inspection No. » □□ OOOO ×××
(1) (2) (3)
(1) Factory Code
(2) Date First digit : Year / Last digit of year
Second digit : Month / Jan. to Sep. 1 to 9, Oct. to Dec. O,N,D
Third, Fourth digit : Day
(3) Serial No.
2) « Expression of RoHS Marking » ROHS – Y ()
(1) (2)
(1) RoHS regulation conformity parts.
(2) MURATA classification number
14.7 Marking for Outside package
Customer name Purchasing Order Number, Customer Part Number, MURATA part number,
RoHS Marking(2), Quantity, etc
14.8 Specification of Outer Case
Outer Case Dimensions
(mm) Standard Reel Quantity in Outer Case
(Reel)
W D H
186 186 93 5
Above Outer Case size is typical. It depends on a quantity of an order.
15.
!Caution
15.1 Mounting Direction
Mount products in right direction.
Wrong direction which is 90°rotated from right direction causes not only open or short circuit but also
flames or other serious trouble.
15.2 Limitation of Applications
Please contact us before using our products for the applications listed below which require especially
high reliability for the prevention of defects which might directly cause damage to the third party's life,body
or property.
(1) Aircraft equipment (6) Transportation equipment (vehicles, trains, ships, etc.)
(2) Aerospace equipment (7) Traffic signal equipment
(3) Undersea equipment (8) Disaster prevention / crime prevention equipment
(4) Power plant control equipment (9) Data-processing equipment
(5) Medical equipment (10) Applications of similar complexity and /or reliability requirements
to the applications listed in the above
16. Notice
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
16.1 Flux and Solder
Flux
Use rosin-based flux,(with converting chlorine content 0.06 to 0.1(wt)%. ),
but not highly acidic flux
(with Halogen content exceeding 0.2(wt)% conversion to chlorine).
Do not use water-soluble flux.
Solde
r
Use Sn-3.0Ag-0.5Cu solde
r
16.2 Assembling
<Exclusive use of Reflow soldering>
Products can only be soldered with reflow.
Flow soldering may cause deterioration in insulation resistance.
So,reflow soldering shall be applied for this product.
Z Z
right direction wrong direction
W
D
Label
H
Spec No. JEFL243C-0002U-01 P 6/9
MURATA MFG.CO.,LTD
Reference Only
16.3 Claening Conditions
Do not clean after soldering. Some cleaning agents may degrade bonding strength,and
characteristics of products by detaching. If cleaning,please contact us.
16.4 Resin coating
The impedance value may change due to high cure-stress of resin to be used for coating/molding products.
An open circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or
operating condition etc. Some resin contains some impurities or chloride possible to generate chlorine by
hydrolysis under some operating condition may cause corrosion of wire of coil, leading to open circuit. So,
please pay your careful attention when you select resin in case of coating/molding the products with the
resin.
Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products
mounted on your board.
16.5 Attention regarding P.C.B. bending
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to
warping the board.
Products direction
Products shall be location the sideways
Direction (Length : a<b) to the mechanical
Stress.
(2)Components location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as
possible to reduce stress.
Contents of Measures Stress Level
(1) Turn the mounting direction of the component parallel to the board separation surface. A > D *1
(2) Add slits in the board separation part. A > B
(3) Keep the mounting position of the component away from the board separation surface. A > C
*1 A > D is valid when stress is added vertically to the perforation as with
Hand Separation.
If a Cutting Disc is used, stress will be diagonal to the PCB,
therefore A > D is invalid.
(3) Mounting Components Near Screw Holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during
the tightening of the screw. Mount the component in a position as far away from the screw holes as possible.
Poor example
Good example
b
a
Perforation
Slit
A
B
C
D
Screw Hole Recommended
Spec No. JEFL243C-0002U-01 P 7/9
MURATA MFG.CO.,LTD
Reference Only
Pick- up nozzle
Support pin
P.C.B.
Product
16.6 Attention Regarding P.C.B. Design
< The Arrangement of Products >
P.C.B. shall be designed so that products are
far from the portion of perforation.
The portion of perforation shall be designed
as narrow as possible, and shall be designed
so as not to be applied the stress in the
case of P.C.B. separation.
Products shall not be arranged on the line
of a series of holes when there are big
holes in P.C.B.
(Because the stress concentrate on the
line of holes.)
< Products Placing >
Support pins shall be set under P.C.B .
to prevent causing a warp to P.C.B.
during placing the products on the other
side of P.C.B.
< P.C.B. Separation >
P.C.B. shall not be separated with hand.
P.C.B. shall be separated with the fixture so as not to cause P.C.B. bending.
16.7 Standard Land Dimensions (Reflow)
1 If the pattern is made with wider than 1.6mm. It will result to let component turn around,
because melting speed is different. In the worst case, short circuit between lines may be occured.
2 If the pattern is made with wider than 1.6mm, the strength of bending will be reduced.
3 Do not use gilded pattern. A copper wire may cause open by dissolution of metallization.
16.8 Standard Soldering Condition
1.Reflow Soldering
(1) Standard printing pattern of solder paste
Standard thickness of the solder paste should be 100 to 150 µm.
Use the solder paste printing pattern of the right pattern.
For the resist and copper foil pattern, use standard
land dimensions.
Use the Solder Sn-3.0Ag-0.5Cu for pattern printing.
Spread of soldering paste between lines may cause
short circuit of lines.
(2) Soldering Temperature
Temperature difference between soldering and surface of components must be within 150°C,
in preheating. When components are immersed in liquid after soldering, temperature difference
should be within 100°C. If preheating is not enough, components may be cracked and cause deterioration
in insulation resistance.
×
×
P.C.B.
Portion of
Perforation
Portion of
Perforation
Product
Product
P.C.B.
Hole
×
1.6
3.7
1.6
0.4
(in mm)
1.6
3.7
1.6
0.4
1
2
(in mm)
Resist
Copper foil pattern
No Pattern
Spec No. JEFL243C-0002U-01 P 8/9
MURATA MFG.CO.,LTD
Reference Only
(3) Soldering Condition
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting
in the deterioration of product quality.
Standard Profile Limit Profile
Pre-heating 150180°C 90s±30s
Heating above 220°C30s60s above 230°C60s max.
Peak temperature 245±3°C 260°C10s
Cycle of reflow 2 times 2 times
2. Reworking with Soldering iron
The following conditions must be strictly followed when using a soldering iron after being
mounted by reflow soldering.
· Pre-heating: 150°C, 1 min · Soldering iron output: 30W max.
· Tip temperature: 350°C max. · Tip diameter:φ3mm max.
· Soldering time : 3(+1,-0) seconds. · Times : 2times max.
Notes : Do not touch the products directly with the soldering iron.
3. Solder Volume
Solder shall be used not to be exceeded the upper limits as shown below.
Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
16.9 Caution for use
When you hold products with a tweezer, please hold
like a figure of the right side, and sharp material,
such as a pair of tweezers, shall not be touched to
the winding portion to prevent the breaking of wire.
Mechanical shock should not be applied to the products
mounted on the board to prevent the breaking
of the core.
tweezer
T
1/3T
t
T (T:Thickness of electrode)
Upper limit
Recommendable
150
90s±30s Time(s)
245±3℃
Tem
p
.
(℃)
220℃
30~60s
180
260℃/10s
230℃
60s max.
Limit Profile
Standard Profile
Spec No. JEFL243C-0002U-01 P 9/9
MURATA MFG.CO.,LTD
Reference Only
16.10 Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to
the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening
screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending Twisting
16.11 Brushing of neighborhood of products
When you clean the neighborhood of products such as connector pins, bristles of cleaning brush
shall not be touched to the winding portion to prevent the breaking of wire.
16.12 Operating Environment
Do not use this product under the following environmental conditions, on deterioration
of the performance, such as insulation resistance may result from the use.
(1) in corrosive gases (acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.)
(2) in the atmosphere where liquid such as organic solvent, may splash on the products.
16.13 Storage Condition
(1) Storage period
Use the products within 12 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage environment conditions
·Products should be stored in the warehouse on the following conditions.
Temperature .-10 ~ +40°C
Humidity 15 to 85% relative humidity No rapid change on temperature and humidity.
· Products should not be stored in corrosive gases, such as sulfureous, acid gases, alkaline gases,
to prevent the following deterioration.
Poor solderability due to the oxidized electrode.
· Products should be stored on the palette for the prevention of the influence from humidity,dust and so on.
· Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
· Products shoud not be stored under the air tights packaged condition.
(3) Delivery
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
17.
!Note
(1)Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2)You are requested not to use our product deviating from the reference specifications.
(3)The contents of this reference specification are subject to change without advance notice. Please approve our
product specifications or transact the approval sheet for product specifications before ordering.

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