DLP11SNyyyyL2y Spec Datasheet

Murata Electronics North America

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Datasheet

1. Standard Land Pattern Dimensions
Soldering and Mounting
Chip Common Mode Choke Coil
DLp
DLM11S
DLM11G
DLP0QS
DLP0NS
DLP11S
DLP11R
DLP11T
DLP1ND
DLP2AD
DLP31S
DLP31D
DLW21S
DLW21H
DLW31SN
DLW43S
DLW44S
DLW5A
DLW5B
oReflow and Flow
oReflow Soldering
DLP31S DLP31D
DLW5A/5B (Except for DLW5AT_MQ2)
1: If the pattern is made with wider than 1.2mm (DLW21) /
1.6mm (DLW31S) it may result in components turning
around, because melting speed is different. In the worst
case, short circuit between lines may occur.
2: If the pattern is made with less than specified dimensions,
in the worst case, short circuit between lines may occur
due to spread of soldering paste or mount placing
accuracy.
3: If the pattern is made with wider than 0.8mm (DLW21) /
1.6mm (DLW31SN), the bending strength will be reduced.
Do not use gild pattern; excess soldering heat may dissolve
metal of a copper wire.
1.0 0.6 1.0
0.7 0.7
2.1
2.8
0.8 Pitch 0.4
2.2-2.6
0.8
Land Pattern
Land Pattern
+ Solder Resist
Solder Resist (in mm)
DLM11G
0.5
1.5
1.1
0.3
DLP2AD
1.75
0.25
0.5
1.5
0.4
DLW21S/21H/31SN/43S
a3
b
c2
d1
0.9
2.9
5.5
1.3
3.3
4.7
DLP1ND
1.4
0.2
0.4
0.9
0.3
DLW44S
0.8
2.5
5.6
0.9
1.9
3.9
DLW21S/H
DLW31SN
DLW43SH110/220/510
DLW43SH101
0.8
1.6
3.0
3.2
0.4
0.4
1.6
1.6
Series a
1.2
1.6
3.4
3.4
d
2.6
3.7
5.9
5.9
bc
0.55 0.55
1.95 1.55
0.3
0.85
0.3
0.85
0.90
0.30
0.50
0.80
0.3
0.55
0.55
(4)
(1)
(3)
(2)
(4)
(1)
(3)
(2)
DLP11S/DLM11S DLP11R/11TDLP0NSDLP0QS
0.80
0.20
0.71
0.23
DLp Chip Common Mode Choke Coil Soldering and Mounting
o PCB Warping
PCB should be designed so that products are not
subjected to the mechanical stress caused by warping
the board.
Poor example
Products should be located in the sideways direction
(Length: a<b) to the mechanical stress.
Good example
a
b
DLW5AT_MQ2
oReflow Soldering Chip Mounting Side
DLW5AT_MQ2
oFlow Soldering Chip Mounting Side
0.9
2.9
5.5
1.3
3.3
4.7
DLW5AT_MQ2
1.9
6.9
1.3
6.0
Land Pattern
Land Pattern
+ Solder Resist
Solder Resist (in mm)
2. Solder Paste Printing and Adhesive Application
(in mm)
When reflow soldering the chip common mode choke
coils, the printing must be conducted in accordance with
the following cream solder printing conditions.
If too much solder is applied, the chip will be prone to
damage by mechanical and thermal stress from the PCB
and may crack.
Standard land dimensions should be used for resist and
copper foil patterns.
When flow soldering the chip common mode choke coils,
apply the adhesive in accordance with the following
conditions.
If too much adhesive is applied, then it may overflow into
the land or termination areas and yield poor solderability.
In contrast, if insufficient adhesive is applied, or if the
adhesive is not sufficiently hardened, then the chip may
become detached during flow soldering process.
DLP
DLW
DLM
oGuideline of solder paste thickness:
80-100μm: DLP0QS
100-150μm: DLW21S/21H/31S, DLP0NS/11S/11R/11T/1ND/2AD/
DLM11S/11G
150μm: DLW43S
150-200μm: DLP31D/31S, DLW44S/5A/5B
*Solderability is subject to reflow conditions and thermal conductivity.
Please make sure that your product has been evaluated in view of your
specifications with our product being mounted to your product.
DLP31S/DLP31D/
DLW5AT_MQ2
Apply 0.3mg of bonding
agent at each chip.
Series Solder Paste Printing Adhesive Application
DLP31S
DLP31D
Coating Position of
Bonding Agent
Coating Position of
Bonding Agent
aba
d
DLW21S/21H/31S
DLP0QS/0NS/11S/11R/11T/31S/DLM11S/11G
a
b
c
d
DLP1ND/2AD/31D
d
c
a ab
DLP0QS
DLP0NS
DLM11S/DLP11S
DLP11R/T
DLP31S
DLM11G
0.3
0.3
0.7
0.5
1.0
0.5
0.23
0.3
0.3
0.3
0.7
0.4
Series a
0.48
0.5
0.55
0.55
2.1
0.7
d
0.2
0.3
0.55
0.55
0.6
0.5
bc
DLW21S/H
DLW31S
0.8
1.6
0.5
0.4
Series a
1.2
1.6
d
2.6
3.7
bc
DLP1ND
DLP2AD
DLP31D
0.3
0.55
1.0
0.2
0.25
0.4
Series a
0.4
0.5
0.8
d
0.3
0.4
0.8
bc
DLp Chip Common Mode Choke Coil Soldering and Mounting
c
DLW44S/5A/5B
c
b
a
d
e
f
DLW5AT_MQ2
Coating Position of
Bonding Agent
DLW43S
a
b
c
d
DLW44S
DLW5A/5B
0.8
0.9
5.6
5.5
Series a
0.9
1.3
d
2.5
2.9
bc
1.9
3.3
e
3.9
4.7
f
DLW43S 3.0 (110/220/510)
3.2 (101) 1.6
Series a
3.4
d
5.9
bc
3. Standard Soldering Conditions
DLp Chip Common Mode Choke Coil Soldering and Mounting
(1) Soldering Methods
Use flow and reflow soldering methods only.
Use standard soldering conditions when soldering chip
common mode choke coils.
In cases where several different parts are soldered, each
having different soldering conditions, use those
conditions requiring the least heat and minimum time.
Solder: Use Sn-3.0Ag-0.5Cu solder. Use of Sn-Zn based
solder will deteriorate performance of products.
If using DLP/DLM series with Sn-Zn based solder,
please contact Murata in advance.
Flux:
o Use Rosin-based flux.
In case of DLW21/31 series, use Rosin-based flux with
converting chlorine content of 0.06 to 0.1wt%.
In case of using RA type solder, products should be
cleaned completely with no residual flux.
o Do not use strong acidic flux (with chlorine content
exceeding 0.20wt%)
o Do not use water-soluble flux.
For additional mounting methods, please contact Murata.
oFlow Soldering Profile
(Sn-3.0Ag-0.5Cu Solder)
Series Pre-heating Standard Profile Limit Profile
Heating
Temp. (T1) Temp. (T2)
Time. (t1)
150°C 60s min. 250°C 4 to 6s 2 times
max. 5s max. 2 times
max.
265±3°C
Time. (t2)
Heating
Cycle
of Flow Temp. (T3) Time. (t2)
Cycle
of Flow
T1
T3
T2
Temperature (°C)
Pre-heating
Time (s)
t2
Heating Limit Profile
Standard Profile
t1
(2) Soldering Profile
oReflow Soldering Profile
(Sn-3.0Ag-0.5Cu Solder)
DLM/DLP
DLW21/31
DLW43S
Series
Standard Profile Limit Profile
Temp. (T1) Time. (t1)
Heating
220°C min. 30 to 60s 245±3°C 2 times
max. 230°C min. 260°C/10s 2 times
max.
60s max.
220°C min. 30 to 60s 245±3°C 2 times
max. 240°C min. 260°C/10s 2 times
max.
30s max.
Cycle
of Reflow
Peak
Temperature
(T2) Temp. (T3) Time. (t2)
Heating Cycle
of Reflow
Peak
Temperature
(T4)
DLW44S/5A/5B 220°C min. 30 to 60s 250±3°C 2 times
max. 230°C min. 260°C/10s 2 times
max.
60s max.
150
180
T2
T4
T3
T1
Temperature (°C)
90s±30s time (s)
t2
t1
Limit Profile
Standard Profile
Pre-heating
DLW5AT_MQ2
DLP31D/31S
DLp Chip Common Mode Choke Coil Soldering and Mounting
(3) Reworking with Solder Iron
The following conditions must be strictly followed when
using a soldering iron.
Pre-heating: 150°C 60s min.
Soldering iron power output / Tip diameter:
30W max. / ø3mm max.
Temperature of soldering iron tip / Soldering time / Times:
350°C max. / 3-4s / 2 times*1
*1 DLP0QS, DLP0NS, DLP11S, DLP11T, DLP1ND,
DLP2AD: 380°C max. / 3-4s / 2 times
DLW43S: 350°C max. / 3s / 2 times
Do not allow the tip of the soldering iron to directly
contact the chip.
For additional methods of reworking with a soldering iron,
please contact Murata engineering.
Following conditions should be observed when cleaning
chip EMI filter.
(1) Cleaning Temperature: 60°C max. (40°C max. for
alcohol type cleaner)
(2) Ultrasonic
Output: 20W/liter max.
Duration: 5 minutes max.
Frequency: 28 to 40kHz
(3) Cleaning agent
The following list of cleaning agents have been tested on
the individual components. Evaluation of final assembly
should be completed prior to production.
Do not clean DLW (Except for DLW21H) series.
Before cleaning, please contact Murata engineering.
(a) Alcohol cleaning agent
Isopropyl alcohol (IPA)
(b) Aqueous cleaning agent
Pine Alpha ST-100S
(4) Ensure that flux residue is completely removed.
Component should be thoroughly dried after aqueous
agent has been removed with deionized water.
4. Cleaning

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