0878320406 Drawing

Molex, LLC

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Datasheet

PRODUCT SPECIFICATION
REVISION:
ECR/ECN INFORMATION:
TITLE:
MILLIGRID 2MM DUAL ROW
SHROUDED HEADERS
SHEET No.
A3
EC No:
S2014-0174
1
of
4
DATE:
2013/07/18
DOCUMENT NUMBER: CREATED / REVISED BY: CHECKED BY: APPROVED BY:
PS
-
87831
-
027
AT SEE 2013/07/18 SK Ang 2013/08/16 ML Ong 2013/08/16
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.1).DOC
1.0 SCOPE
This specification covers the performance requirements for Milli-Grid 2mm Dual Row Shrouded
Headers.
2.0 PRODUCT DESCRIPTION
2.1 Product covered by this specification are for series number
Product Name Part Number
MGrid Headers (Vertical) 87831 Series
MGrid Headers (SMT) 87832 Series
MGrid Headers (R/A) 87833 Series
These series mate with Molex :
a. Milli-Grid 2mm Grid Wire to Board Connector,
Crimp Receptacle Housing, 51110 series and Crimp Terminal, 50394 series.
b. 2mm Milli-Grid Dual Row IDT, 87568 series.
2.2 For dimensions, materials & plating, refer to the appropriate product drawings.
2.3 Safety Agency Approvals:
UL File Number : E29179
CSA File Number : LR19980
3.0 APPLICABLE DOCUMENTS AND SPECIFICATIONS
The following documents are part of this specification to the extent specified herewith.
In the event of conflict between the requirements of this specification and the product
drawing, the product drawing shall take precedence.
In the event of conflict between the requirements of this specification and reference
documents, this specification shall take the precedence.
MIL-STD-202 Test Methods for Electrical and Electronic Component Parts.
MIL-STD-1344 Test Methods of Electrical Connector
Reference Product Specifications
PS-51110-001 Milli-Grid 2mm Grid Wire to Board Connector
PS-87568-004 2mm Milli-Grid Dual Row IDT Receptacle
PRODUCT SPECIFICATION
REVISION:
ECR/ECN INFORMATION:
TITLE:
MILLIGRID 2MM DUAL ROW
SHROUDED HEADERS
SHEET No.
A3
EC No:
S2014-0174
2
of
4
DATE:
2013/07/18
DOCUMENT NUMBER: CREATED / REVISED BY: CHECKED BY: APPROVED BY:
PS
-
87831
-
027
AT SEE 2013/07/18 SK Ang 2013/08/16 ML Ong 2013/08/16
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.1).DOC
4.0 RATINGS
4.1 Voltage : 125
4.2 Current : 2.00 Amp MAXIMUM
4.3 Operating Temperature : -55°C to +105°C
Non-operating Temperature : -55°C to +105°C
5.0 PERFORMANCE
ELECTRICAL REQUIREMENTS
ITEM
DESCRIPTION
TEST CONDITION
REQUIREMENT
1
Insulation
Resistance
Apply 500 VDC for 1 minute per
MIL-STD-1344A, METHOD 3003.1
1000 Megaohms
Minimum
2
Dielectric Strength
1000 Vrms for 1 minute between
adjacent terminals.
No breakdown
5.2 MECHANICAL REQUIREMENTS
ITEM
DESCRIPTION
TEST CONDITION
REQUIREMENT
3
Pin/ Terminal
Retention Force
(in Housing)
Apply an axial load on the terminal in the
housing to dislodge the terminals from the
connector at a rate of 0.50 inch per minute
Retention Force: 850 g
Min per pin.
(Before heat soldering)
PRODUCT SPECIFICATION
REVISION:
ECR/ECN INFORMATION:
TITLE:
MILLIGRID 2MM DUAL ROW
SHROUDED HEADERS
SHEET No.
A3
EC No:
S2014-0174
3
of
4
DATE:
2013/07/18
DOCUMENT NUMBER: CREATED / REVISED BY: CHECKED BY: APPROVED BY:
PS
-
87831
-
027
AT SEE 2013/07/18 SK Ang 2013/08/16 ML Ong 2013/08/16
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.1).DOC
5.3 ENVIROMENT REQUIREMENTS
6.0 Packaging
Product shall be packed in either Tube or Tape & Reel and protected against damage
during handling, transportation and storage.
4.
Solderability
Solder Time: 5 +/-0.5 secs.
Solder Temperature: 260+/- 5°C
95% of the immersed area
must show no voids, pin
holes.
5.
Resistance to
Soldering Heat
(Through Hole)
Solder tail to be dipped in flux as per MIL-
STD-202F method 210 condition B.
Solder Temperature: 260 +/- 5°C
Solder Time: 10 +/- 1 secs
No damage in appearance of
the connector
6.
Resistance to IR
reflow heat
(SMT)
Pass product through IR machine for 3
cycles of the following reflow profile:
Average Ramp Rate 3°C/sec max.
Preheat Temp. (Min.) 150°C
Preheat Temp. (Max.) 200°C
Preheat Time 60 – 180 sec
Ramp to Peak 3°C/sec max.
Time over liquidus (217°C) 60 – 150 sec
Peak Temperature 260 +0/-5°C
Time within 5°C of peak 20 – 40 sec.
Ramp – Cool Down 6°C/sec max.
Time 25°C to Peak 8 mins max.
No damage in appearance of
the connector
Reflow Temperature Profile
PRODUCT SPECIFICATION
REVISION:
ECR/ECN INFORMATION:
TITLE:
MILLIGRID 2MM DUAL ROW
SHROUDED HEADERS
SHEET No.
A3
EC No:
S2014-0174
4
of
4
DATE:
2013/07/18
DOCUMENT NUMBER: CREATED / REVISED BY: CHECKED BY: APPROVED BY:
PS
-
87831
-
027
AT SEE 2013/07/18 SK Ang 2013/08/16 ML Ong 2013/08/16
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.1).DOC
7.0 Special Instructions for High-temperature Reflow Processing Only
Background
The products covered in this specification are molded with a high-temperature thermoplastic
resin that can withstand the effects of elevated temperatures as seen in today’s reflow soldering
processes. This high temperature resin, like many used in the electronics industry, is
hygroscopic in nature, meaning it can absorb/desorb moisture readily.
Depending on the degree of elevated ambient temperature and relative humidity, the connectors
may absorb an increased percentage of moisture. This increase in percentage of absorption is
also dependent on the exposure time once connectors are removed from the sealed moisture
barrier bags. Higher levels of moisture absorption are typically non-detrimental in most
situations but when combined with the elevated peak temperatures and dwell times seen in
reflow solder processes trapped gasses and moisture can sometimes result in blistering of the
plastic housing.
Floor Life
In view of the hygroscopic nature of the resin, proper handling and storage are required if
connectors will be processed or exposed to the higher temperatures of reflow soldering. Storage
exposure time begins once connectors have been removed from sealed moisture barrier bags.
Greater exposure time, storage and processing temperatures, ambient humidity and part
geometry are influencing factors. As such, if connectors are used in a reflow soldering
environment, it is recommended that upon removal from the moisture barrier bag, they should
be consumed within 48 hours with a temperature and humidity level of not more than 30°C and
60% RH respectively. For unused quantity, it is recommended to repack within 24 hours into the
moisture barrier bag and vacuum sealed prior to storage for future use.
Precautions and Remedy
To minimize moisture absorption, connectors are supplied in sealed moisture barrier bags with
desiccant pouches. It is recommended that the connectors remain sealed in moisture barrier
bags until they are ready to be consumed, following the above storage guideline. However, in
the event the connectors are removed from the moisture barrier bag and have been exposed to
conditions beyond the storage guideline, it is recommended that the connectors to be baked to
remove moisture. Exposed connectors may be baked at 125°C for 3 to 5 hours and thereafter,
they should be good for reflow soldering.

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