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LTC6090, LTC6090-5 Datasheet

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Datasheet

LTC6090/LTC6090-5
1
6090fe
For more information www.linear.com/LTC6090
TYPICAL APPLICATION
FEATURES DESCRIPTION
140V CMOS Rail-to-Rail
Output, Picoamp Input
Current Op Amp
The LTC
®
6090/LTC6090-5 are high voltage, precision
monolithic operational amplifiers. The LTC6090 is unity
gain stable. The LTC6090-5 is stable in noise gain con-
figurations of 5 or greater. Both amplifiers feature high
open loop gain, low input referred offset voltage and noise,
and pA input bias current and are ideal for high voltage,
high impedance buffering and/or high gain configurations.
The amplifiers are internally protected against over-
temperature conditions. A thermal warning output, TFLAG,
goes active when the die temperature approaches 150°C.
The output stage may be turned off with the output disable
pin OD. By tying the OD pin to the thermal warning output
(TFLAG), the part will disable the output stage when it is
out of the safe operating area. These pins easily interface
to any logic family.
Both amplifiers may be run from a single 140V or spit
±70V power supplies and are capable of driving up to
200pF of load capacitance. They are available in either an
8-lead SO or 16-lead TSSOP package with exposed pad
for low thermal resistance.
140VP-P Sine Wave Output
APPLICATIONS
n Supply Range: ±4.75V to ±70V (140V)
n 0.1Hz to 10Hz Noise: 3.5μVP-P
n Input Bias Current: 50pA Maximum
n Low Offset Voltage: 1.25mV Maximum
n Low Offset Drift: ±5µV/°C Maximum
n CMRR: 130dB Minimum
n Rail-to-Rail Output Stage
n Output Sink and Source: 50mA
n 12MHz Gain Bandwidth Product
n 21V/µs Slew Rate
n 11nV/√Hz Noise Density
n Thermal Shutdown
n Available in Thermally Enhanced SOIC-8E or
TSSOP-16E Packages
n ATE
n Piezo Drivers
n Photodiode Amplifier
n High Voltage Regulators
n Optical Networking
High Voltage DAC Buffer Application
VOUT = ±70V
6090 TA01a
+
LTC6090
453k
10pF
70V
3V
–70V
16.2k
10k
470pF
16.9k
VREF
2.5V
LTC2641DIN
16
25µs/DIV
80
60
40
20
0
–20
–40
–60
–80 6090 TA01b
OUTPUT VOLTAGE (V)
L, LT, LTC, LTM, Linear Technology and the Linear logo are registered trademarks of Linear
Technology Corporation. All other trademarks are the property of their respective owners.
LTC6090/LTC6090-5
2
6090fe
For more information www.linear.com/LTC6090
PIN CONFIGURATION
ABSOLUTE MAXIMUM RATINGS
Total Supply Voltage (V+ to V) ............................... 150V
COM ................................................................... V to V+
Input Voltage
OD ...................................................... V to V+ + 0.3V
+IN, –IN, ..................................V 0.3V to V+ + 0.3V
OD to COM .................................................. –3V to 7V
Input Current
+IN, –IN ...........................................................±10mA
TFLAG Output
TFLAG ......................................V – 0.3V to V+ + 0.3V
TFLAG to COM ............................................ –3V to 7V
(Note 1)
1
2
3
4
8
7
6
5
TOP VIEW
9
V
OD
V+
OUT
TFLAG
COM
–IN
+IN
V
S8E PACKAGE
8-LEAD PLASTIC SO
TJMAX = 150°C, θJC = 5°C/W
EXPOSED PAD (PIN 9) IS V, MUST BE SOLDERED TO PCB
FE PACKAGE
16-LEAD PLASTIC TSSOP
1
2
3
4
5
6
7
8
TOP VIEW
16
15
14
13
12
11
10
9
COM
GUARD
GUARD
–IN
+IN
GUARD
GUARD
V
17
V
OD
GUARD
V+
GUARD
OUT
GUARD
GUARD
TFLAG
TJMAX = 150°C, θJC = 10°C/W
EXPOSED PAD (PIN 17) IS V, MUST BE SOLDERED TO PCB
ORDER INFORMATION
LEAD FREE FINISH TAPE AND REEL PART MARKING* PACKAGE DESCRIPTION JUNCTION TEMPERATURE RANGE
LTC6090CS8E#PBF LTC6090CS8E#TRPBF 6090 8-Lead Plastic SO 0°C to 70°C
LTC6090IS8E#PBF LTC6090IS8E#TRPBF 6090 8-Lead Plastic SO –40°C to 85°C
LTC6090HS8E#PBF LTC6090HS8E#TRPBF 6090 8-Lead Plastic SO –40°C to 125°C
LTC6090CFE#PBF LTC6090CFE#TRPBF 6090FE 16-Lead Plastic TSSOP 0°C to 70°C
LTC6090IFE#PBF LTC6090IFE#TRPBF 6090FE 16-Lead Plastic TSSOP –40°C to 85°C
LTC6090HFE#PBF LTC6090HFE#TRPBF 6090FE 16-Lead Plastic TSSOP –40°C to 125°C
Output Current
Continuous (Note 2).................................... 50mARMS
Operating Junction Temperature Range
(Note 3) ...................................................40°C to 125°C
Specified Junction Temperature Range (Note 4)
LTC6090C ................................................ C to 70°C
LTC6090I .............................................40°C to 8C
LTC6090H .......................................... 40°C to 125°C
Junction Temperature (Note 5) ............................. 150°C
Storage Temperature Range .................. 6C to 150°C
Lead Temperature (Soldering, 10 sec) ...................300°C
LTC6090/LTC6090-5
3
6090fe
For more information www.linear.com/LTC6090
ELECTRICAL CHARACTERISTICS
The l denotes the specifications which apply over the full operating
temperature range, otherwise specifications and all typical values are at TJ = 25°C. Test conditions are V+ = 70V, V = –70V, VCM =
VOUT = 0V, VOD = Open unless otherwise noted.
ORDER INFORMATION
C-, I-SUFFIXES H-SUFFIX
SYMBOL PARAMETER CONDITIONS MIN TYP MAX MIN TYP MAX UNITS
VOS Input Offset Voltage
l
±330
±330 ±1000
±1250 ±330
±330 ±1000
±1250 μV
μV
∆VOS /∆T Input Offset Voltage Drift TA = 25°C, ∆TJ = 70°C –5 ±3 5 –5 ±3 5 µV/°C
IBInput Bias Current (Note 6) Supply Voltage = ±70V
Supply Voltage = ±15V
Supply Voltage = ±15V
l
3
0.3
50
3
0.3
800
pA
pA
pA
IOS Input Offset Current (Note 6) Supply Voltage = ±15V
l
0.5
30 0.5
120 pA
pA
enInput Noise Voltage Density f = 1kHz
f = 10kHz 14
11 14
11 nV/√Hz
nV/√Hz
Input Noise Voltage 0.1Hz to 10Hz 3.5 3.5 µVP-P
inInput Noise Current Density 1 1 fA/√Hz
VCM Input Common Mode Range Guaranteed by CMRR
l
V+3V ±68
V+3V
V+3V ±68
V+3V V
V
CIN Common Mode Input
Capacitance 9 9 pF
CDIFF Differential Input Capacitance 5 5 pF
CMRR Common Mode Rejection Ratio VCM = –67V to 67V
l
130
126 >140 130
126 >140 dB
dB
PSRR Power Supply Rejection Ratio VS = ±4.75V to ±70V
l
112
106 >120 112
106 >120 dB
dB
VOUT Output Voltage Swing High (VOH)
(Referred to V+)No Load
ISOURCE = 1mA
ISOURCE = 10mA
l
l
l
10
50
450
25
140
1000
10
50
450
25
140
1000
mV
mV
mV
Output Voltage Swing Low (VOL)
(Referred to V)No Load
ISINK = 1mA
ISINK = 10mA
l
l
l
10
40
250
25
80
600
10
40
250
25
80
600
mV
mV
mV
AVOL Large-Signal Voltage Gain RL = 10k,
VOUT from –60V to 60V
l
1000
1000 >10000 1000
1000 >10000 V/mV
V/mV
LEAD FREE FINISH TAPE AND REEL PART MARKING* PACKAGE DESCRIPTION JUNCTION TEMPERATURE RANGE
LTC6090CS8E-5#PBF LTC6090CS8E-5#TRPBF 60905 8-Lead Plastic SO 0°C to 70°C
LTC6090IS8E-5#PBF LTC6090IS8E-5#TRPBF 60905 8-Lead Plastic SO –40°C to 85°C
LTC6090HS8E-5#PBF LTC6090HS8E-5#TRPBF 60905 8-Lead Plastic SO –40°C to 125°C
LTC6090CFE-5#PBF LTC6090CFE-5#TRPBF 6090FE-5 16-Lead Plastic TSSOP 0°C to 70°C
LTC6090IFE-5#PBF LTC6090IFE-5#TRPBF 6090FE-5 16-Lead Plastic TSSOP –40°C to 85°C
LTC6090HFE-5#PBF LTC6090HFE-5#TRPBF 6090FE-5 16-Lead Plastic TSSOP –40°C to 125°C
Consult LTC Marketing for parts specified with wider operating temperature ranges. *The temperature grade is identified by a label on the shipping container.
For more information on lead free part marking, go to: http://www.linear.com/leadfree/
For more information on tape and reel specifications, go to: http://www.linear.com/tapeandreel/. Some packages are available in 500 unit reels through
designated sales channels with #TRMPBF suffix.
LTC6090/LTC6090-5
4
6090fe
For more information www.linear.com/LTC6090
ELECTRICAL CHARACTERISTICS
The l denotes the specifications which apply over the full operating
temperature range, otherwise specifications and all typical values are at TJ = 25°C. Test conditions are V+ = 70V, V = –70V, VCM =
VOUT = 0V, VOD = Open unless otherwise noted.
C-, I-SUFFIXES H-SUFFIX
SYMBOL PARAMETER CONDITIONS MIN TYP MAX MIN TYP MAX UNITS
ISC Output Short-Circuit Current
(Source and Sink) Supply Voltage = ±70V
Supply Voltage = ±15V
l
50 90
50 90 mA
mA
SR Slew Rate AV = –4, RL = 10k
LTC6090
LTC6090-5
l
l
10
18
21
37
9
16
21
37
V/μs
V/μs
GBW Gain-Bandwidth Product fTEST = 20kHz, RL = 10k
LTC6090
LTC6090-5
l
l
5.5
11
12
24
5
10
12
24
MHz
MHz
ΦMPhase Margin RL = 10k, CL = 50pF 60 60 Deg
FPBW Full Power Bandwidth VO = 125VP–P
LTC6090
LTC6090-5
l
l
20
34
40
68
18
32
40
68
kHz
kHz
tSSettling Time 0.1% ∆VOUT = 1V
LTC6090, AV = 1V/V
LTC6090-5, AV = 5V/V
2
2.5
2
2.5
µs
µs
ISSupply Current No Load
l
2.8 3.9
4.3 2.8 3.9
4.3 mA
mA
VSSupply Voltage Range Guaranteed by the PSRR Test l9.5 140 9.5 140 V
ODH
ODL
OD Pin Voltage, Referenced to
COM Pin VIH
VIL
l
l
COM+1.8V
COM+0.65VCOM+1.8V
COM+0.65VV
V
Amplifier DC Output
Impedance, Disabled DC, OD = COM >10 >10
COMCM COM Pin Voltage Range lVV+ – 5 VV+ – 5 V
COMVCOM Pin Open Circuit Voltage l17 21 25 17 21 25 V
COMRCOM Pin Resistance l500 665 850 500 665 850
TEMPFDie Temperature Where TFLAG
Is Active 145 145 °C
TEMPHYS TFLAG Output Hysteresis 5 5 °C
ITFLAG TFLAG Pull-Down Current TFLAG Output Voltage = 0V l70 200 330 70 200 330 µA
Note 1: Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 2: The LTC6090/LTC6090-5 is capable of producing peak output
currents in excess of 50mA. Current density limitations within the IC require
the continuous RMS current supplied by the output (sourcing or sinking)
over the operating lifetime of the part be limited to under 50mA (Absolute
Maximum). Proper heat sinking may be required to keep the junction
temperature below the absolute maximum rating. Refer to Figure 7, the
Power Dissipation section, and the Safe Operating Area section of the data
sheet for more information.
Note 3: The LTC6090C/LTC6090I are guaranteed functional over the
operating junction temperature range –40°C to 85°C. The LTC6090H
is guaranteed functional over the operating junction temperature range
–40°C to 125°C. Specifying the junction temperature range as an operating
condition is applicable for devices with potentially significant quiescent
power dissipation.
Note 4: The LTC6090C is guaranteed to meet specified performance from
0°C to 70°C. The LTC6090C is designed, characterized, and expected
to meet specified performance from –40°C to 85°C but is not tested or
QA sampled at these temperatures. The LTC6090I is guaranteed to meet
specified performance from –40°C to 85°C. The LTC6090H is guaranteed
to meet specified performance from –40°C to 125°C.
Note 5: This device includes over temperature protection that is intended
to protect the device during momentary overload conditions. Operation
above the specified maximum operating junction temperature is not
recommended.
Note 6: Input bias and offset current is production tested with ±15V
supplies. See Typical Performance Characteristics curves of actual typical
performance over full supply range.
LTC6090/LTC6090-5
5
6090fe
For more information www.linear.com/LTC6090
TYPICAL PERFORMANCE CHARACTERISTICS
FREQUENCY (kHz)
CMRR (dB)
6090 G02
120
80
0
20
40
60
100
0.1 1000101 100
VS = ±70V
LTC6090-5
LTC6090
LTC6090
LTC6090
LTC6090-5
LTC6090-5
FREQUENCY (kHz)
PSRR (dB)
6090 G03
140
120
60
0
20
40
100
80
0.1 1000101 100
PSRR–
PSRR+
AV = 1V/V
FREQUENCY (kHz)
GAIN (dB)
PHASE (DEG)
6090 G01
120
100
40
–20
14
0
20
80
60
100
40
–40
–20
0
20
80
60
0.1 10000100101 1000
PHASE
GAIN
LTC6090-5
LTC6090
TCVOS (µV/°C)
NUMBER OF UNITS
6090 G05
350
200
0
50
100
150
300
250
–6 –4 20–2 64
VS = ±70V
TA = 25°C
∆TJ = 70°C
VCM = 0V
INPUT COMMON MODE VOLTAGE (V)
CHANGE IN OFFSET VOLTAGE (µV)
6090 G06
20
–20
–10
0
10
–75 0–25–50 755025
SPECIFIED COMMON
MODE RANGE= ±67V
VS = ±70V
125°C
85°C
25°C
–50°C
TEMPERATURE (°C)
50
–500
VOLTAGE OFFSET (µV)
–400
–200
–100
0
500
200
050 75 100
6090 G07
–300
300
400
100
25 25 125
VS = ±70V
VCM = 0V
5 SAMPLES
TOTAL SUPPLY VOLTAGE (V)
5
–500
OFFSET VOLTAGE (µV)
–300
–100
100
30 55 80 105
6090 G08
130
300
500
–400
–200
0
200
400 TA = 25°C
5 SAMPLES
V+ = – V
VCM = 0V
TOTAL SUPPLY VOLTAGE (V)
5
CHANGE IN OFFSET VOLTAGE (µV)
–25
0
25
810
6090 G09
–50
–75
–100 6 7 9
50
75
100
125°C
85°C
25°C
–50°C
VOS (µV)
NUMBER OF UNITS
6090 G04
200
120
100
0
20
40
80
60
180
160
140
–1000 10005000–500
VS = ±70V
TA = 25°C
VCM = 0V
Open Loop Gain and Phase
vs Frequency CMRR vs Frequency PSRR vs Frequency
VOS Distribution TCVOS Distribution
Change in Offset Voltage
vs Input Common Mode Voltage
Offset Voltage vs Temperature
Offset Voltage
vs Total Supply Voltage Minimum Supply Voltage
LTC6090/LTC6090-5
6
6090fe
For more information www.linear.com/LTC6090
TYPICAL PERFORMANCE CHARACTERISTICS
FREQUENCY (kHz)
10
VOLTAGE NOISE DENSITY (nV/√Hz)
100
0.001 0.1 1 10010
6090 G13
10.010
1000
FREQUENCY (kHz)
10
0
INTEGRATED NOISE (µVRMS)
150
200
250
100 1000 10000
6090 G14
100
50
FREQUENCY (kHz)
GAIN (dB)
6090 G15
20
–5
5
0
15
10
1 10000100010010
LTC6090
LTC6090-5
RF = 40.2k
RI = 10k
CF = 2pF
FREQUENCY (kHz)
GAIN (dB)
6090 G16
25
20
–10
5
0
–5
15
10
1 10000100010010
RF = 40.2k
RI = 10k
CF = 2pF
CF = 1pF
CF = 0pF
FREQUENCY (kHz)
0
GAIN (dB)
20
40
50
1 100 1000 10000
6090 G17
–20 10
30
10
–10 AV = 101V/V
AV = 11V/V
AV = 1V/V
FREQUENCY (kHz)
GAIN (dB)
6090 G18
50
–10
40
20
10
30
0
1 10000100010010
5V/V
11V/V
33V/V
101V/V
TEMPERATURE (°C)
–50
SUPPLY CURRENT (mA)
2.8
2.9
3.0
25 75
6090 G10
2.7
2.6
–25 0 50 100 125
2.5
2.4
VS = ±70V
VS = ±4.75V
SUPPLY VOLTAGE (V)
0
0
SUPPLY CURRENT (mA)
0.5
1.0
1.5
2.0
3.0
25 50 75 100
6090 G11
125 150
2.5
TA = 25°C
TOTAL SUPPLY VOLTAGE (V)
0
OUTPUT DISABLE CURRENT (µA)
400
6090 G12
200
050 100
25 75 125
600
800
300
100
500
700
125°C
85°C
25°C
–50°C
Integrated Noise vs Frequency Small Signal Frequency Response
LTC6090-5 Small Signal
Frequency Response
vs Feedback Capacitance
LTC6090 Small Signal Frequency
Response vs Closed Loop Gain
LTC6090-5 Small Signal
Frequency Response
vs Closed Loop Gain
Voltage Noise Density
vs Frequency
Supply Current vs Temperature
Supply Current
vs Total Supply Voltage
Output Disable Supply Current
vs Total Supply Voltage
LTC6090/LTC6090-5
7
6090fe
For more information www.linear.com/LTC6090
TYPICAL PERFORMANCE CHARACTERISTICS
FREQUENCY (kHz)
0.1
OUTPUT IMPEDACNE (Ω)
1
10
100
1000
1 100 1000 100000
6090 G19
0.01 10 10000
AV = 101V/V
AV = 11V/V
AV = 1V/V
FREQUENCY (kHz)
1
1
OUTPUT IMPEDANCE (kΩ)
10
100
1000
10 100
6091 G20
1000
CL = 10pF
COMMON MODE VOLTAGE (V)
10
INPUT BIAS CURRENT (|pA|)
100
–80 0 40
6090 G21
1
–40–60 20 60–20 80
125°C
VS = ±70V
100°C
80°C
50°C
DIRECTION OF THE CURRENT
IS OUT OF THE PIN
25°C
5°C
0.1
1000
10000
COMMON MODE VOLTAGE (V)
1
INPUT BIAS CURRENT (|pA|)
100
1000
–15 5 15
6090 G22
0.1 –5–10 100
10
125°C
100°C
VS = ±15V
50°C
25°C
85°C
DIRECTION OF THE CURRENT
IS OUT OF THE PIN
OUTPUT, INPUT (V)
0
20
40
6090 G23
–20
–40
–80 5µs/DIV
–60
80
60
INPUT
OUTPUT
AV = –10V/V
VS = ±70V
OUTPUT, INPUT (V)
0
20
40
6090 G24
–20
–40
–80 5µs/DIV
–60
80
60
INPUT
OUTPUT
AV = –10V/V
VS = ±70V
RF = 100kΩ
RI = 10kΩ
CF = 2pF
INPUT
50mV/DIV
OUTPUT
50mV/DIV
6090 G16
1µs/DIV
AV = 1V/V
INPUT STEP (0.5V/DIV)
OUTPUT STEP (20mV/DIV)
500ns/DIV 6090 G26
AV = 1V/V
INPUT
OUTPUT
INPUT STEP (0.5V/DIV)
OUTPUT STEP (20mV/DIV)
500ns/DIV 6090 G27
AV = 1V/V
INPUT
OUTPUT
LTC6090-5 Large Signal Transient
Response
Small Signal Transient Response
LTC6090 Falling Edge
Settling Time
LTC6090 Rising Edge
Settling Time
Input Bias Current vs Common
Mode Voltage and Temperature
Input Bias Current vs Common
Mode Voltage and Temperature
LTC6090 Large Signal Transient
Response
Output Impedance vs Frequency
Output Impedance vs Frequency
with Output Disabled (OD = COM)
LTC6090/LTC6090-5
8
6090fe
For more information www.linear.com/LTC6090
TYPICAL PERFORMANCE CHARACTERISTICS
0.1Hz to 10Hz Voltage Noise
Supply Current vs OD Pin Voltage
OD Pin Input Current
vs OD Pin Voltage
Output Voltage Swing High (VOH)
vs Load Current and Temperature
LTC6090-5 Falling Edge
Settling Time
Output Disable (OD) Response
Time
Output Voltage Swing
vs Frequency
LTC6090-5 Small Signal
Transient Response
LTC6090-5 Rising Edge
Settling Time
1µs/DIV
INPUT
25mV/DIV
OUTPUT
100mV/DIV
6090 G28
AV = 5V/V
RF = 40.2kΩ
RI = 10kΩ
CF = 2pF
500ns/DIV
INPUT (100mV/DIV)
OUTPUT (50mV/DIV)
6090 G29
AV = 5V/V
RF = 40.2kΩ
RI = 10kΩ
CF = 2pF
INPUT
OUTPUT
500ns/DIV
INPUT (100mV/DIV)
OUTPUT (50mV/DIV)
6090 G30
INPUT
OUTPUT
AV = 5V/V
RF = 40.2kΩ
RI = 10kΩ
CF = 2pF
6090 G31
20µs/DIV
OD-COM
OD-COM
= 0V
2V/DIV
OUTPUT
ENABLED
OUTPUT
DISABLED
VOUT
= 0V
AV = –10V/V
VIN = –0.5V
VOUT
FREQUENCY (kHz)
VOUT (VP-P)
6090 G32
160
0
140
100
80
60
40
120
20
1 100010010
LTC6090-5
LTC6090
AV = –10V/V
VS = ±70V
RF = 100kΩ
RI = 10kΩ
CF = 2pF
TIME (1s/DIV)
OUTPUT
NOISE
2µV/DIV
6090 G33
OD-COM (V)
0.5
0
SUPPLY CURRENT (mA)
0.5
1.0
1.5
2.0
3.0
0.8 1.0 1.3 1.5
6090 G34
1.8 2.0
2.5
125°C
85°C
25°C
–50°C
VS = ±70V
VCOM = 0V
OD-COM (V)
0 1
–50
OD INPUT CURRENT (µA)
0
–25
26
75
50
25
345 7
6090 G35
125°C
85°C
25°C
–50°C
VS = ±70V
VCOM = 0V
ISOURCE (mA)
0
VOH (mV)
300
400
500
610
6090 G36
200
100
02 4 8
600
700
800 125°C
85°C
25°C
–50°C
LTC6090/LTC6090-5
9
6090fe
For more information www.linear.com/LTC6090
TYPICAL PERFORMANCE CHARACTERISTICS
Output Voltage Swing Low (VOL)
vs Load Current and Temperature
Open Circuit Voltage of COM,
OD, TFLAG
LTC6090 Distortion vs Frequency
Open Loop Gain
Thermal Shutdown Hysteresis
Open Loop Gain
vs Load Resistance
ISOURCE (mA)
0
VOL (mV)
150
200
250
610
6090 G37
100
50
02 4 8
300
400
350
500
450
125°C
85°C
25°C
–50°C
FREQUENCY (kHz)
DISTORTION (dBc)
6090 G38
–20
–120
–110
–100
–90
–50
–40
–30
–80
–70
–60
10 100
VS = ±70V
AV = 10
VOUT = 10VP-P
RL = 10k
2ND
3RD
JUNCTION TEMPERATURE (°C)
SUPPLY CURRENT (mA)
6090 G39
3.0
0
0.5
1.0
2.5
2.0
1.5
162 178170166164 168 176174172
TOTAL SUPPLY VOLTAGE (V)
PIN VOLTAGE (V)
6090 G40
100
0
20
40
80
60
0 140804020 60 120100
OD
COM
TFLAG
V = 0V
OUTPUT VOLTAGE (V)
CHANGE IN VOLTAGE OFFSET (µV)
6090 G41
40
–40
–30
10
20
30
–20
–10
0
–70 –50 –25 0 25 50 75
VS = ±70V
RLOAD = 10k
TA = 25°C
10 SAMPLES
OUTPUT VOLTAGE (V)
CHANGE IN VOLTAGE OFFSET (µV)
6090 G42
40
–40
–30
10
20
30
–20
–10
0
–70 –50 –25 0 25 50 75
RLOAD = 100k
RLOAD = 10k
RLOAD = 500k
LTC6090/LTC6090-5
10
6090fe
For more information www.linear.com/LTC6090
PIN FUNCTIONS
COM (Pin 1/Pin 1): COM Pin is used to interface OD and
TFLAG pins to voltage control circuits. Tie this pin to the
low voltage ground, or let it float.
–IN (Pin 2/Pin 4): Inverting Input Pin. Input common
mode range is V + 3V to V+ – 3V. Do not exceed absolute
maximum voltage range.
+IN (Pin 3/Pin 5): Noninverting Input Pin. Input common
mode range is V + 3V to V+ – 3V. Do not exceed absolute
maximum voltage range.
V (Pin 4, Exposed Pad Pin 9/Pin 8, Exposed Pad
Pin 17): Negative Supply Pin. Connect to V Only. To
achieve low thermal resistance connect this pin to the
V power plane. The V power plane connection removes
heat from the device and should be electrically isolated
from all other power planes.
TFLAG (Pins 5, 9/Pins 9, 17): Temperature Flag Pin. The
TFLAG pin is an open drain output that sinks current when
the die temperature exceeds 145°C.
OUT (Pin 6/Pin 12): Output Pin. If this rail-to-rail output
goes below V , the ESD protection diode will forward
bias. If OUT goes above V+, then output device diodes
will forward bias. Avoid forward biasing the diodes on the
OUT pin. Excessive current can cause damage.
V+ (Pin 7/Pin 14): Positive Supply Pin.
OD (Pin 8/Pin 16): Output Disable Pin. Active low input
disables the output stage. If left open, an internal pull-up
resistor enables the amplifier. Input voltage levels are
referred to the COM pin.
GUARD (NA/Pins 2, 3, 6, 7, 10, 11, 13, 15): Guard pins
increase clearance and creepage between other pins.
Pins 3 and 6 can be used to build guard rings around the
inputs.
(S8E/FE)
LTC6090/LTC6090-5
11
6090fe
For more information www.linear.com/LTC6090
BLOCK DIAGRAM
6090 BD
TJ > 175°C
TJ > 145°C
+
V+
10k
2M
V+
2M
COM
–IN
+IN
V
V
2M
10k
V
DIFFERENTIAL
DRIVE
GENERATOR
OUTPUT
ENABLE
500Ω
V
V
V
6k
TO COM PIN
6k
DIE
TEMPERATURE
SENSOR
INPUT STAGE
V+
125Ω
125Ω
OD
TFLAG
V+
OUT
V
ESD
ESD
ESD
ESD
ESD
ESD
1.2V
LTC6090/LTC6090-5
12
6090fe
For more information www.linear.com/LTC6090
General
The LTC6090 high voltage operational amplifier is designed
in a Linear Technology proprietary process enabling a rail-
to-rail output stage with a 140V supply while maintaining
precision, low offset, and low noise.
Power Supply
The LTC6090 works off single or split supplies. Split sup-
plies can be balanced or unbalanced. For example, two
±70V supplies can be used, or a 100V and –40V supply
can be used. For single supply applications place a high
quality surface mount ceramic 0.1µF bypass capacitor
between the supply pins close to the part. For dual supply
applications use two high quality surface mount ceramic
capacitors between V+ to ground, and V to ground located
close to the part. When using split supplies, supply se-
quencing does not cause problems.
Input Protection
As shown in the block diagram, the LTC6090 has a com-
prehensive protection network to prevent damage to the
input devices. The current limiting resistors and back to
back diodes are to keep the inputs from being driven apart.
The voltage-current relationship combines exponential
and resistive until the voltage difference between the pins
reach 12V.
At that point the Zeners turn on. Additional current into
the pins will snap back the input differential voltage to 9V.
In the event of an ESD strike between an input and V, the
voltage clamps and ESD device fire providing a current
path to V protecting the input devices.
The input pin protection is designed to protect against
momentary ESD events. A repetitive large fast input swing
(>5.5V and <20ns rise time) will cause repeated stress on
the MOSFET input devices. When in such an application,
anti-parallel diodes (1N4148) should be connected between
the inputs to limit the swing.
Feedback Resistor Selection
To get the most accuracy, the feedback resistor should be
chosen carefully. Consider an amplifier with AV = –50 and
a 5k feedback resistor. A 1V input will cause the output to Figure 1. Low Voltage Interface
APPLICATIONS INFORMATION
rise to 50V, causing 10mA to flow through the feedback
resistor. The power dissipated in the output stage will
create thermal feedback to the input stage potentially
causing shifts in offset voltage. A better choice is a 50k
feedback resistor reducing the current in the feedback
resistor to 1mA.
Interfacing to Low Voltage Circuits
The COM pin is provided to set a common signal ground
for communication to a microprocessor or other low volt-
age logic circuit. The COM pin should be tied to the low
voltage ground as shown in Figure 1. If left floating, the
internal resistive voltage divider will cause the COM pin
to rise 30% above mid-supply. The COM, OD, and TFLAG
pins are protected from overvoltage by internal Zener
diodes and current limiting resistors. Extra care should
be taken to observe the absolute maximum voltage limits
between (OD and COM) and between (TFLAG and COM).
Voltage limits between these pins must remain between
–3V and 7V.
6090 F01
OD
COM
LTC6090
TFLAG
10k
LOW VOLTAGE
SUPPLY
TIE TO LOW
VOLTAGE GROUND
TO LOW
VOLTAGE
CONTROL
TO LOW
VOLTAGE
CONTROL
6k
200k
V+
V
V
2M
V+
2M
2M
10k
6k 500Ω
LTC6090/LTC6090-5
13
6090fe
For more information www.linear.com/LTC6090
APPLICATIONS INFORMATION
Figure 2. Starting Up
Figure 3. LTC6090 Output Disable Function
1ms/DIV 6090 F02
OUT
10V/DIV
V+
2.5ms/DIV 6090 F03
OUT
2V/DIV
OD
2V/DIV
Output Disable
The OD pin is an active low disable with an internal 2
resistor that will pull up the OD pin enabling the output
stage if left open. The OD pin voltage is limited by an
internal Zener diode. When the OD pin is brought low to
within 0.65V of the COM pin, the output stage is disabled,
leaving the bias and input circuits enabled. This results in
580μA (typical) standby current through the device. The
OD pin can be directly connected to the low voltage logic
or an open drain NMOS device as shown in Figure 1.
For simplest shutdown operation, float the COM pin, and
tie the OD pin to the TFLAG pin. This will float the low
voltage control pins, and the overtemperature circuit will
safely shutdown the output stage if the die temperature
reaches 145°C.
Extra care should be taken to observe the absolute maxi-
mum voltage limits between (OD and COM) and between
(TFLAG and COM). Voltage limits between these pins must
remain between –3V and 7V.
When coming out of shutdown the LTC6090 bias circuits
and input stage are already powered up leaving only the
output stage to turn on and drive to the proper output
voltage. Figures 2 and 3 show the part starting up and
coming out of shutdown, respectively.
Thermal Shutdown
The TFLAG pin is an open drain output pin that sinks 200µA
(typical) when the die temperature exceeds 145°C. The
temperature sensor hasC of hysteresis requiring the
part to cool to 140°C before disabling the TFLAG pin. Extra
care should be taken to observe the absolute maximum
voltage limits between (OD and COM) and between (TFLAG
and COM). Voltage limits between these pins must remain
between –3V and 7V.
Tying the the TFLAG pin to the OD pin will automatically
shut down the output stage as shown in Figure 4. This will
ensure the junction temperature does not exceed 150°C.
For safety, an independent second overtemperature
threshold shuts down the output stage if the internal die
temperature rises to 175°C. There is hysteresis in the
thermal shutdown circuit requiring the die temperature
to coolC. Once the device has cooled sufficiently, the
output stage will enable. Degradation can occur or reli-
ability may be affected when the junction temperature
of the device exceeds 150°C.
Figure 4. Automatic Thermal Output
Disable Using the TFLAG Pin
6090 F04
OD
TFLAG
10k
COM
OPTIONAL
(CAN BE LEFT
FLOATING)
6k
V+
V
2M
LTC6090
LTC6090/LTC6090-5
14
6090fe
For more information www.linear.com/LTC6090
APPLICATIONS INFORMATION
Board Layout
The LTC6090 is a precision low offset high gain ampli-
fier that requires good analog PCB layout techniques to
maintain high performance. Start with a ground plane
that is star connected. Pull back the ground plane from
any high voltage vias. Critical signals such as the inputs
should have short and narrow PCB traces to reduce stray
capacitance which also improves stability. Use high quality
surface mount ceramic capacitors to bypass the supply(s).
In addition to the typical layout issues encountered with
a precision operational amplifier, there are the issues of
high voltage and high power. Important consideration for
high voltage traces are spacing, humidity and dust. High
voltage electric fields between adjacent conductors attract
dust. Moisture is absorbed by the dust and can contribute
to board leakage and electrical breakdown.
It is important to clean the PCB after soldering down the
part. Solder flux will accumulate dust and become a leak-
age hazard. It is recommended to clean the PCB with a
solvent, or simply use soap and water to remove residue.
Baking the PCB will remove left over moisture. Depending
on the application, a special low leakage board material
may be considered.
The TSSOP package has guard pins for applications that
require a guard ring. An example schematic diagram and
PCB layout is shown in Figures 5a and 5b, respectively,
of a circuit using a guard ring to protect theIN pin.
The guard ring completely encloses the high impedance
nodeIN. To simplify the PCB layout avoid using vias on
this node. In addition, the solder mask should be pulled
back along the guard ring exposing the metal. To help
the spacing between nodes, one of the extra pins on the
TSSOP package is used to route the guard ring behind
the –IN pin. The PCB should be thoroughly cleaned after
soldering to ensure there is no solder paste between the
exposed pad (Pin 17) and the guard ring.
6090 F05a
+
LTC6090
R2
C2
R1
GUARD RING
Figure 5a. Circuit Diagram Showing Guard Ring
Figure 5b. TSSOP Package PCB Layout with Guard Ring
6090 F05b
R2
C2
R1
–IN
+IN
OUT
LTC6090/LTC6090-5
15
6090fe
For more information www.linear.com/LTC6090
APPLICATIONS INFORMATION
Power Dissipation
With a supply voltage of 140V it doesn’t take much current
to consume a lot of power. Consider that 10mA at 140V
consumes 1.4W of power and needs to be dissipated in a
small plastic SO package. To aid in power dissipation both
LTC6090 packages have exposed pads for low thermal
resistance. The amount of metal connected to the exposed
pad will lower the θJA of a package. An optimal amount
of PCB metal connected to the SO package will lower the
junction to ambient thermal resistance down to 33°C/W.
If minimal metal is used, the θJA could more than double
(see Table 1). If the exposed pad has no metal beneath it,
θJA could be as high 120°C/W.
It’s recommended that the exposed pad have as much PCB
metal connected to it as reasonably available. The more PCB
TOP LAYER A TOP LAYER B TOP LAYER C TOP LAYER D
EXAMPLE A EXAMPLE B EXAMPLE C EXAMPLE D
BOTTOM LAYER A
θJA = 43°C/W
θJC = 5°C/W
θCA = 38°C/W
θJA = 50°C/W
θJC = 5°C/W
θCA = 45°C/W
θJA = 57°C/W
θJC = 5°C/W
θCA = 52°C/W
θJA = 54°C/W
θJC = 5°C/W
θCA = 49°C/W
θJA = 57°C/W
θJC = 5°C/W
θCA = 52°C/W
θJA = 58°C/W
θJC = 5°C/W
θCA = 53°C/W
θJA = 72°C/W
θJC = 5°C/W
θCA = 67°C/W
BOTTOM LAYER B BOTTOM LAYER C
MINIMUM BOTTOM LAYER A MINIMUM BOTTOM LAYER B MINIMUM BOTTOM LAYER C
BOTTOM LAYER D
Table 1. Thermal Resistance as PCB Area of Exposed Pad Varies
metal connected to the exposed pad, the lower the thermal
resistance. Use multiple vias from the exposed pad to the
V supply plane. The exposed pad is electrically connected
to the V pin. In addition, a heat sink may be necessary
if operating near maximum junction temperature. See
Table 1 for guidance on how thermal resistance changes
as a function of metal area connected to the exposed pad.
The LTC6090 is specified to source and sink 10mA at 140V.
If the total supply voltage is dropped across the device,
1.4W of power will need to be dissipated. If the quiescent
power is included (140V • 2.8mA = 0.4W), the total power
dissipated is 1.8W. The internal die temperature will rise
59° using an optimal layout in a SO package. A sub-optimal
layout could more than double the amount of temperature
increase due to power dissipation.
LTC6090/LTC6090-5
16
6090fe
For more information www.linear.com/LTC6090
APPLICATIONS INFORMATION
In order to avoid damaging the device, the absolute
maximum junction temperature should not be exceeded
(TJMAX = 150°C). Junction temperature is determined
using the expression:
TJ = PD • θJA + TA
where PD is the power dissipated in the package, θJA is the
package thermal resistance from ambient to junction and
TA is the ambient temperature. For example, if the part has
a 140V supply voltage with 2.8mA of quiescent current
and the output is 20V above the negative rail sourcing
10mA, the total power dissipated in the device is (120V
10mA) + (140V • 2.8mA) = 1.6W. Under these conditions
the ambient temperature should not exceed:
TA = TJMAX – (PDθJA) = 150°C – (1.6W • 33°C/W) = 97°C.
Safe Operating Area
The safe operating area, or SOA, illustrates the voltage,
current, and temperature conditions where the device can
be reliably operated. Shown below in Figure 6 is the SOA
for the LTC6090. The SOA takes into account ambient
temperature and the power dissipated by the device. This
includes the product of the load current and difference
between the supply and output voltage, and the quiescent
current and supply voltage.
The LTC6090 is safe when operated within the boundaries
shown in Figure 6. Thermal resistance junction to case,
θJC, is rated at a constantC/W. Thermal resistance
junction to ambient, θJA, is dependent on board layout
Figure 8. Closed Loop Response with
Various Feedback Capacitors
Figure 7. LTC6090 with Feedback Capacitance
to Reduce Peaking
Figure 6. Safe Operating Area
6090 F07
+
LTC6090
100k
CF
10k
PARASITIC INPUT
CAPACITANCE
JUNCTION
TEMPERATURE
LIMITED
SUPPLY VOLTAGE – LOAD VOLTAGE (V)
LOAD CURRENT (mA)
6090 F06
100
10
1101 1000100
CURRENT DENSITY LIMITED
θJA = 33°C/W
θJA = 60°C/W
θJA = 100°C/W
θJA = 33°C/W
θJA = 60°C/W
θJA = 100°C/W
TA = 25°C
TA = 90°C
FREQUENCY (kHz)
GAIN (dB)
6090 F08
25
20
15
10 1 100010010
CF = 4pF
CF = 2pF
CF = 0pF
and any additional heat sinking. The six SOA curves in
Figure 6 show the direct effect of θJA on SOA.
Stability with Large Resistor Values
A large feedback resistor along with the intrinsic input
capacitance will create an additional pole that affects
stability and causes peaking in the closed loop response.
To mitigate the peaking a small feedback capacitor placed
around the feedback resistor, as shown in Figure 7, will
reduce the peaking and overshoot. Figure 8 shows the
closed loop response with various feedback capacitors.
Additionally stray capacitance on the input pins should
be kept to a minimum. With pA input current, the PCB
traces should be routed as short and narrow as possible.
LTC6090/LTC6090-5
17
6090fe
For more information www.linear.com/LTC6090
APPLICATIONS INFORMATION
Slew Enhancement
The LTC6090 includes a slew enhancement circuit which
boosts the slew rate to 21V/μs making the part capable
of slewing rail-to-rail across the 140V output range in
less thans. To optimize the slew rate and minimize
settling, stray capacitance should be kept to a minimum.
A feedback capacitor reduces overshoot and nonlinearities
associated with the slew enhancement circuit. The size of
the feedback capacitor should be tailored to the specific
board, supply voltage and load conditions.
Slewing is a nonlinear behavior and will affect distortion.
The relationship between slew rate and full power band-
width is given in the relationship below.
SR = VO • ω
Where VO is the peak output voltage and ω is frequency in
radians. The fidelity of a large sine wave output is limited
by the slew rate. The graph in Figure 9 shows distortion
versus frequency for several output levels.
Multiplexer Application
Several LTC6090s may be arranged to act as a high volt-
age analog multiplexer as shown in Figure 10. When using
this arrangement, it is possible for the output to affect the
source on the disabled amplifier’s noninverting input. The
inverting and noninverting inputs are clamped through
resistors and back to back diodes. There is a path for
current to flow from the multiplexer output through the
disabled amplifier’s feedback resistor, and through the
inputs to the noninverting input’s source. For example, if
the enabled amplifier has a –70V output, and the disabled
amplifier has a 5V input, there is 75V across the two resis-
tors and the input pins. To keep this current below 1mA
the combined resistance of the RIN and feedback resistor
needs to be about 75k.
The output impedance of the disabled amplifier is greater
than 10MΩ at DC. The AC output impedance is shown in
the Typical Performance Characteristics section.
Figure 10. Multiplexer Application
Figure 9. Distortion vs Frequency for Large Output Swings
FREQUENCY (Hz)
TOTAL HARMONIC DISTORTION + NOISE (%)
6090 F09
10
0.1
1
0.01
0.00110 100000100 1000 10000
VS = ±70V
AV = 5
RL = 10k
CF = 30pF
VOUT = 100VP-P
VOUT = 50VP-P
VOUT = 10VP-P
6090 F10
CH1 10k OD
OD
10k
10k 100k
10k 100k
CH2
SELECT
+
+
LTC6090
LTC6090
COM
MUX
OUT
COM
LTC6090/LTC6090-5
18
6090fe
For more information www.linear.com/LTC6090
TYPICAL APPLICATIONS
Gain of 20 Amplifier with a 40mA Protected Output Driver Gain of 10 with Protected Output Current Doubler
12V to ±70V Isolated Flyback Converter for Amplifier Supply
6090 TA04
LT3511
VIN
VIN
12V
VCGND BIAS
RFB
RREF
SWTC
2.2nF
24.9k
10k
BAV20W
BZX100A
EN/UVLO
4.7µF
100k
1M
562k
CRM1U-06M
CRM1U-06M
0.47µF
100V
0.47µF
100V
2.2µF
VOUT1+
VOUT2
+
LTC6090
70V
–70V
750311692
1:1:5
6090 TA05
VIN
9V
100k
22k
CMMR1U-2
750311692
1:1:5 CMMR1U-2 CMHZ5266B
F
100V
F
130V
+
LTC6090
65V
–65V
5
4
1
2
3
4.7µF
4
3
130k
EN/UVLO
GND
RFB
VIN
SW
LT8300
8
6
7
5
9V to ±65V Isolated Flyback Converter for Amplifier Supply
6090 TA03
+
LTC6090
70V
–70V
200k
1%
200k
TF OD
22.1k
1%
VIN
100Ω
1%
+
LTC6090
70V
–70V
TF OD
100Ω
1%
±70V
AT ±20mA
6090 TA02
+
604Ω
6
8
1
5
7
4
2
3
9
47pF
BAV99
BAV99
LTC6090
70V
–70V
12.1Ω
40.2k
TF
OD VOUT
CZT5401
1k
1k
CZT5551
2k
2k40.2k
VIN
LTC6090/LTC6090-5
19
6090fe
For more information www.linear.com/LTC6090
TYPICAL APPLICATIONS
Audio Power Amplifier
FREQUENCY (Hz)
TOTAL HARMONIC DISTORTION PLUS NOISE (%)
6090 TA06b
0.100
0
0.001
0.010
10 100 100000100001000
8Ω AT 50W
4Ω AT 100W
Total Harmonic Distortion Plus Noise
Analyzer Passband 10Hz to 80kHz
LT1166
VTOP SENSE+
VBOTTOM
SENSE–
VIN VOUT
ILIM+
100k
1k
100pF
ILIM
+
LTC6090
100pF
100k
10Ω
1k
0.1Ω
IXTH50N20
IXTH24P20
6090 TA06a
OUT
0.1Ω
33.2k
40.2Ω
1nF
2.49k
1k
CZT5551
1N4148
CZT5401
1N4148
* USE SEVERAL SERIES RESISTORS TO REDUCE DISTORTION (i.e. 5 × 2kΩ).
33.2k
10k*
1nF
100pF
1N41481N4148
39.2Ω
20k
IN
499Ω
4
499Ω
1nF 91
758
6
2
3
–50V
50V
100pF
1k
F
F
1N4148
1N4148
22nF
H
LTC6090/LTC6090-5
20
6090fe
For more information www.linear.com/LTC6090
TYPICAL APPLICATIONS
High Current Pulse Amplifier
60V Step Response Into 10Ω
5µs/DIV
VOLTS
6090 TA07b
10
20
30
–20
–10
0
40
+
LTC6090
6090 TA07
OUT
499Ω
499Ω
10k
IN
491
75
6
8
2
3
499Ω
–70V
70V
2SK1057
2SJ161
10k
75pF
1k
100Ω
IHSM-3825
H
LTC6090/LTC6090-5
21
6090fe
For more information www.linear.com/LTC6090
+
LTC6090
6090 TA08a
OUT
499Ω
10k
IN
49
6
1
758
2
3
100Ω
100nF
100nF
499Ω
–50V
50V
2SK1057
2SJ1612SJ161
2k 2k 2k
50pF
2k 2k
IHSM-3825
H
2SK1057
100Ω
SET QUIESCENT SUPPLY CURRENT AT ABOUT 200mA WITH BIAS ADJUSTMENT.
SET QUIESCENT CURRENT TO 100mA IF PARALLEL MOSFETs ARE NOT USED (FOR 8Ω OR HIGHER).
100k
100k
6.8k
BIAS
10k
6.8k
1k
1k
FREQUENCY (Hz)
TOTAL HARMONIC DISTORTION PLUS NOISE (%)
6090 TA08b
1
0.0001
0.001
0.01
0.1
10k1k100
8Ω AT 50W
4Ω AT 100W
TYPICAL APPLICATIONS
Simple 100W Audio Amplifier
Total Harmonic Distortion Plus
Noise vs Frequency
LTC6090/LTC6090-5
22
6090fe
For more information www.linear.com/LTC6090
TYPICAL APPLICATIONS
Wide Common Mode Range 10x Gain Instrumentation Amplifier
Typically <1mV Input-Referred Error
+
LTC6090
205k
10k*
22pF
49
6
1
758
3
2
+
LTC6090
49
6
1
758
3
2
24.9k
100k
100k
–70V
70V
–70V
70V
* THESE RESISTORS CAN BE 0Ω IF INPUT SIGNAL SOURCE IMPEDANCES ARE <20MΩ.
22pF
10k*
+
LTC6090
100k
LT5400-2
100k
100k
100k 49
6
1
758
3
2
1
2
3
4
8
7
6
5
922pF
22pF
+IN
–IN
70V
–70V
LTC6090 TA09
49.9Ω
OUT
–3dB at 45kHz
CM FREQUENCY (kHz)
CMRR (dB)
6090 TA09b
90
40
50
60
70
80
1 10 100
LTC6090/LTC6090-5
23
6090fe
For more information www.linear.com/LTC6090
PACKAGE DESCRIPTION
Please refer to http://www.linear.com/product/LTC6090#packaging for the most recent package drawings.
FE16 (BA) TSSOP REV K 0913
0.09 – 0.20
(.0035 – .0079)
0° 8°
0.25
REF
0.50 – 0.75
(.020 – .030)
4.30 – 4.50*
(.169 – .177)
1 3 4 5678
10 9
4.90 – 5.10*
(.193 – .201)
16 1514 13 12 11
1.10
(.0433)
MAX
0.05 – 0.15
(.002 – .006)
0.65
(.0256)
BSC
2.74
(.108)
2.74
(.108)
0.195 – 0.30
(.0077 – .0118)
TYP
2
MILLIMETERS
(INCHES) *DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.150mm (.006") PER SIDE
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
2. DIMENSIONS ARE IN
RECOMMENDED SOLDER PAD LAYOUT
3. DRAWING NOT TO SCALE
0.45 ±0.05
0.65 BSC
4.50 ±0.10
6.60 ±0.10
1.05 ±0.10
2.74
(.108)
2.74
(.108)
SEE NOTE 4
4. RECOMMENDED MINIMUM PCB METAL SIZE
FOR EXPOSED PAD ATTACHMENT
6.40
(.252)
BSC
FE Package
16-Lead Plastic TSSOP (4.4mm)
(Reference LTC DWG # 05-08-1663 Rev K)
Exposed Pad Variation BA
LTC6090/LTC6090-5
24
6090fe
For more information www.linear.com/LTC6090
PACKAGE DESCRIPTION
Please refer to http://www.linear.com/product/LTC6090#packaging for the most recent package drawings.
.016 – .050
(0.406 – 1.270)
.010 – .020
(0.254 – 0.508)× 45°
0°– 8° TYP
.008 – .010
(0.203 – 0.254)
S8E 1015 REV C
.053 – .069
(1.346 1.752)
.014 – .019
(0.355 – 0.483)
TYP
.004 – .010
(0.101 0.254)
0.0 – 0.005
(0.0 – 0.130)
.080 – .099
(2.032 – 2.530)
.118 – .139
(2.997 – 3.550)
.050
(1.270)
BSC
1234
.150 – .157
(3.810 – 3.988)
NOTE 3
87
.005 (0.13) MAX
65
.189 – .197
(4.801 – 5.004)
NOTE 3
.228 – .244
(5.791 – 6.197)
.160 ±.005
(4.06 ±0.127)
.118
(2.99)
REF
RECOMMENDED SOLDER PAD LAYOUT
.045 ±.005
(1.143 ±0.127)
.050
(1.27)
BSC
INCHES
(MILLIMETERS)
NOTE:
1. DIMENSIONS IN
2. DRAWING NOT TO SCALE
3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .010" (0.254mm)
4. STANDARD LEAD STANDOFF IS 4mils TO 10mils (DATE CODE BEFORE 542)
5. LOWER LEAD STANDOFF IS 0mils TO 5mils (DATE CODE AFTER 542)
S8E Package
8-Lead Plastic SOIC (Narrow .150 Inch) Exposed Pad
(Reference LTC DWG # 05-08-1857 Rev C)
.089
(2.26)
REF
.030 ±.005
(0.76 ±0.127)
TYP
.245
(6.22)
MIN
45
LTC6090/LTC6090-5
25
6090fe
For more information www.linear.com/LTC6090
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
REVISION HISTORY
REV DATE DESCRIPTION PAGE NUMBER
A 11/12 Added ESD Statement. 2
B 9/13 Corrected schematics 16, 17, 18
C 6/14 Added LTC6090-5, Improved specs. All
D 5/15 Removed ESD statement to reflect improved ESD performance.
Changed internal TFLAG circuit resistor values.
Updated Thermal Shutdown description.
Corrected application circuit resistor value.
2
11, 12
13
19, 20, 21
E 11/15 Corrected resistor values 20, 21
LTC6090/LTC6090-5
26
6090fe
For more information www.linear.com/LTC6090
Linear Technology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
LINEAR TECHNOLOGY CORPORATION 2012
LT 1115 REV E • PRINTED IN USA
(408) 432-1900 FAX: (408) 434-0507 www.linear.com/LTC6090
RELATED PARTS
TYPICAL APPLICATION
PART NUMBER DESCRIPTION COMMENTS
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LT1990 ±250V Input Range G = 1, 10, Micropower,
Difference Amplifier Pin Selectable Gain of 1 or 10
LT1991 Precision, 100µA Gain Selectable Amplifier Pin Configurable as a Difference Amplifier, Inverting and Noninverting Amplifier
Matched Resistors
LT5400 Quad Matched Resistor Network Excellent Matching Specifications Over the Entire Temperature Range
Digital to Analog Converters
LTC2641/LTC2642 16-Bit VOUT DACs in 3mm × 3mm DFN Guaranteed Monotonic Over Temperature
LTC2756 Serial 18-Bit SoftSpan IOUT DAC 18-Bit Settling Time: 2.1µs
Maximum 18-Bit INL Error: ±1 LSB Over Temperature
Flyback Controllers
LT3511 Monolithic High Voltage Isolated Flyback Converter 4.5V to 100V Input Voltage Range, No Opto-Coupler Required
LT8300 100VIN Micropower Isolated Flyback Converter
with 150V/260mA Switch 6V to 100V Input Voltage Range. VOUT Set with a Single External Resistor
Extended Dynamic Range 1MΩ Transimpedance Photodiode Amplifier
6090 TA10
+
200k
1%
100mW
22.1k
1%
1
4
2
3LTC6090
PHOTODIODE
SFH213
125V
0.3pF
–3V
–3V
10M
1%
VOUT
VOUT = IPD • 1M
OUTPUT NOISE = 21µVRMS (1kHz – 40kHz)
OUTPUT OFFSET = 150µV MAXIMUM
BANDWIDTH = 40kHz (–3dB)
OUTPUT SWING = 0V TO 12V
IPD 7
85
6

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