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ZXBM5210-S(P)-13

Diodes Incorporated

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Datasheet

ZXBM5210
Document number: DS36765 Rev. 1 - 2
1 of 17
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December 2013
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NEW PRODUCT
ZXBM5210
REVERSIBLE DC MOTOR DRIVE WITH SPEED CONTROL
Description
The ZXBM5210 is a single chip solution for driving a single-coil
reversible direct current (DC) fans and motors. The integrated full-
bridge driver output stage is designed to minimize audible switching
noise and electromagnetic interference (EMI) providing a low noise
solution
For system flexibility, the device has four modes of operation:
Forward, Reverse, Brake and Standby selected via FWD and REV
pins. The Forward and Reverse modes provide the motor rotation
direction control, the Brake mode allows quick stop and the Standby
mode helps system efficiency by powering down most of the internal
circuits to consume less than 32uA typical. The motor speed can be
adjusted by changing the duty ratio of the PWM signal on the FWD or
REV pins in the PWM mode or alternatively by adjusting DC voltage
input signal to the VREF pin in the VREF speed control mode.
To help protect the IC and the motor coil the ZXBM5210 includes
under voltage, over voltage, over current and over temperature
protections. Once the safe operating range has been exceeded the
device shuts down the output drive to help prevent over stress on the
IC or the coil. The device internal current protection threshold is 1.5A
typical.
The ZXBM5210 is available in the standard SO8 and thermally
enhanced SO8-EP packages.
Features
Supports single-coil reversible DC motor applications
Operating voltage: 3V to 18V
Four modes of operations: Forward, Reverse, Brake and
Standby
Low quiescent current of 0.85mA typical in normal operation
and 32µA in standby mode
Internal over current protection
Under voltage lockout and over voltage protection
Over temperature protection
-40°C to +85°C /105°C operating temperature
6kV ESD withstand capability
Standard SO-8 and thermally enhanced SO-8EP
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Pin Assignments
SO-8
SO-8EP
Applications
5V / 9V/ 12V / 15V DC reversible motors and actuators
Home appliances
• Handheld power tools
Valve open and close
Remote control motorized toys
Medium Voltage/ Low Power DC Motors
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
ZXBM5210
Document number: DS36765 Rev. 1 - 2
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NEW PRODUCT
ZXBM5210
Typical Applications Circuit
Note: 4. C1 is for power stabilization and to strengthen the noise immunity, the recommended capacitance is 100nF to 1µF or more.
C2 is a re-circulating capacitor for back rush voltage and recommended capacitance is 100nF for low current applications to 10µF or more for large
current applications. See application note section
Pin Descriptions
Package: SO-8
Pin # Pin Name Function
1 OUT1 Driver output
2 VM Power Supply Voltage
3 VDD Power Supply Voltage
4 FWD Forward Control Input (logic level, 5.5V max)
5 REV Reverse Control Input (logic level, 5.5V max)
6 VREF Input reference voltage to set the internal PWM oscillator duty ratio
7 OUT2 Driver Output
8 GND Ground
Package: SO8-EP
Pin # Pin Name Function
1 OUT1 Driver output
2 VM Power Supply Voltage
3 VDD Power Supply Voltage
4 FWD Forward Control Input (logic level, 5.5V max)
5 REV Reverse Control Input (logic level, 5.5V max)
6 VREF Input reference voltage to set the internal PWM oscillator duty ratio
7 OUT2 Driver Output
8 GND Ground
Pad Pad
The exposed pad is for thermal dissipation and it is internally connected to the ground.
On the PCB layout, it can be connected to GND or left open circuit.
ZXBM5210
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Functional Block Diagram
Absolute Maximum Ratings (Note 5) @TA = +25°C, unless otherwise specified.)
Symbol Characteristic Values Unit
VM and VDD, Supply voltage (Note 6) 24 V
VOUT1, VOUT2
VREF All other pins except FWD and REV pins 24 V
VFWD and VREV FWD and REV pin voltage 7 V
VREVERSE Reverse supply Voltage on all pins -0.3 V
IOUTPUT Output current (source and sink)- Peak 1500 mA
PD Package power dissipation SO8 (Note 7) 1043 mW
SO8-EP (Note 8) 2980 mW
Ts Storage temperature range -65 to +150 °C
TJ Maximum junction temperature 150 °C
ESD HBM Human Body Model ESD withstand
capability
VDD, VM, VREF, FWD, REV,
GND and OUT1 OUT2 pins 6 kV
Notes: 5. Stresses greater than the 'Absolute Maximum Ratings' specified above, may cause permanent damage to the device. These are stress ratings
only; functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device
reliability may be affected by exposure to absolute maximum rating conditions for extended periods of time
6. The absolute maximum supply voltage of 24V is a transient stress rating and is not meant as a functional operating condition. It is not recommended
to operate the device at the absolute maximum rated conditions for any period of time.
7. SO-8 soldered to minimum recommended landing pads (see Package Outline Dimension section) on a 1”x1” two-layer 2oz.copper FR4 PCB
(1.6mm thickness) without any via or copper flood on the bottom layer. See thermal de-rating curves in the thermal performance section.
8. SO-8EP exposed pad soldered to minimum recommended landing pads (see Package Outline Dimension section) on a 2”x2” two-layer 2oz.copper
FR4 PCB (1.6mm thickness) with four thermal vias in the exposed PAD to the copper flood on the bottom layer. See thermal de-rating curves in the
thermal performance section.
Recommended Operating Conditions
Symbol Characteristic Conditions Min Max Unit
VDD Supply Voltage Operating 3 18 V
TA Operating Temperature Range Operating, SO8 package -40 +85 °C
Operating, SO8-EP package -40 +105 °C
ZXBM5210
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Electrical Characteristics (Note 9)(@TA = +25°C, VDD = 12V, unless otherwise specified.)
Symbol Characteristics Conditions Min Typ Max Unit
IDD Supply Current No Load 0.85 2.5 mA
IDD_STNDBY Standby Supply Current FWD=REV=LOW (GND) 32 45 uA
VUV_TH Under Voltage lock Out Threshold Voltage Decreasing 2.6 — V
VUVLO_R Under Voltage Lock Out Release Threshold Voltage Increasing 2.8 3.0 V
VUV_HYS Under Voltage Hysteresis Voltage Increasing 200 — mV
VOV_TH Overvoltage Threshold Voltage Increasing 20.7 24 V
VOV_RLTH Overvoltage Release Threshold Voltage Decreasing 17.0 19 V
VOH Output Voltage High
IOUT = 300mA,
TA = -40°C to +105°C VDD - 0.25 VDD - 0.15 — V
IOUT =500mA
TA = -40°C to +105°C VDD - 0.43 VDD - 0.25 — V
VOL Output Voltage Low
IOUT = 300mA,
TA = -40°C to +105°C — 0.15 0.25 V
IOUT = 500mA,
TA = -40°C to +105°C — 0.25 0.43 V
VOH+ VOL Output voltage of N- and PMOS and bond
wire voltage drop combined
IOUT = 300mA,
TA = -40°C to +105°C — 0.3 0.5 V
IOUT = 500mA,
TA = -40°C to +105°C — 0.5 0.86 V
IOUT = 300mA, VDD = 3V
TA = -40°C to +105°C 0.39 0.66 V
RON_Total Combined N- and PMOS RDSON including
bond wire resistance
IOUT = 500mA,
TA = -40°C to +105°C — 1 1.72
Ω
IOUT = 300mA, VDD = 3V
TA = -40°C to +105°C — 1.3 2.2
Ω
ILIM_TH Over current protection threshold 1.2 1.5 A
VREF VREF voltage range
( DC voltage speed control mode) 3 VDD
(18V max) V
IVREF VREF bias current
( DC voltage speed control mode) VREF = VDD -15 0 15 μA
FOUT Output PWM switching frequency
(Internal PWM oscillator)
VREF control mode 20 26.5 35 kHz
PWM speed control mode 20 100 kHz
FFWD_REV Input PWM frequency of speed control
signal PWM control mode 20 100 kHz
TDEAD Dead time between current reversal VDD = 3V to 18V
TA = -40°C to +105°C 2.1 3 3.9 μs
tSDN_DELAY
Shutdown delay – Internal circuits active
after FWD = REV = L
(except from brake mode)
FWD = GND
REV = GND 125 180 μs
VFWDH FWD Input H Level 2 5.5 V
VFWDL FWD Input L Level 0 0.8 V
IFWDH FWD pin current – H Level FWD pin: VFWD = 5V — 50 μA
IFWDL FWD pin current – L Level FWD pin: VFWD = 0V — 50 μA
VREVH REV Input H Level 2 5.5 V
VREVL REV Input L Level 0 0.8 V
IREVH REV pin current – H Level REV pin: VRVS = 5V — 50 μA
IREVL REV pin current – L Level REV pin: VRVS = 0V — 50 μA
DPWM_MIN Output minimum duty ratio 0% 100 %
Tj_SDN_TH IC junction temperature thermal shutdown
threshold 165
oC
Tj_SDN_HYST IC junction temperature thermal shutdown
hysteresis 25
oC
Note: 9. Typical data is at TA = +25°C, VDD = 12V. The maximum and minimum parameters values over the operating temperature range are not tested in
production, they are guaranteed by design, characterization and process control.
ZXBM5210
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Application Note
Rotation Control and Standby Modes
The device has FWD and REV pins for controlling the motor rotation directions. The device has four motor operation modes: 1) Standby mode,
2) Forward mode, 3) Reverse mode and 4) Brake mode. The four modes are controlled by the FWD and REV logic pins.
FWD REV VREF OUT1 OUT2 Operating mode
L L x Open Open Standby mode – All switches are off
H L
3V to VDD H L
Forward mode – Current flows from OUT1 to OUT2; VREF duty control
L H
3V to VDD L H
Reverse mode – Current flows from OUT2 to OUT1; VREF duty control
H H x L L Brake mode – Short circuit brake with low side switches on
PWM L VDD H PWM
Forward mode – Current flows from OUT1 to OUT2; PWM control mode
L PWM VDD PWM H
Reverse mode – Current flows from OUT2 to OUT1; PWM control mode
H H x L L Brake mode – Short circuit brake with low side switches on
In the brake mode, switches S2 and S4 are ON allowing the motor to stop quickly. All the internal control circuits are fully operational.
In the standby mode all the output drive switches are off and additionally, the internal circuits are also turned off to minimize power consumption.
The power consumption in the standby mode is less than in the brake mode. If running motor enters the Standby mode, due to the body diodes
the motor free wheels to idle state. Whenever the motor enters the standby mode from any mode (except the brake mode) the control logic will
remain active in previous mode for at least 125µs before shutting down the internal circuits. To prevent device entering the standby mode during
operating mode changes, the mode change signals should be completed within 125µs.
In the forward mode, with switches S1-S2 ON and S3-S4 OFF, OUT1 is high and OUT2 is low. The motor current flows from OUT1 to OUT2. In
the reverse mode, switches S1-S4 are ON while S1-S2 are OFF to allow motor current flow from OUT2 to OUT1.
In the forward or reverse mode, for VREF speed control, the output drive duty ratio is generated internally based on the voltage on the VREF pin.
For PWM speed control, external PWM signals applied to the FWD or REV pins control the PWM switching of the low side S2 (forward mode)
or S4 (reverse mode). See application section for further details.
The ZXBM5210 has three modes of speed control: VREF speed control mode, PWM speed control mode and by adjusting the supply voltage
M
S1
S2S4
Off Off
Off
Standby mode
GND
S3
Off
Supply
OUT1 OUT2
S1
S2
S3
S4
On On
OffOff
Brake mode
M
Supply
GND
OUT2
OUT1
ZXBM5210
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Application Note (cont.)
Motor Speed Control with DC Voltage on VREF Pin
Motor speed can be controlled by adjusting the DC voltage into the VREF pin. The output drive PWM duty ratio is defined by the ratio of the VREF
voltage to the supply VDD voltage.
In VREF speed control mode, FWD and REV pins are only used for direction control and therefore high frequency PWM control signal should not
be applied to the FWD and REV pins. If repetitive direction changes required, it is recommended to keep direction change frequency of below
400Hz.
The speed and direction control is given by:
FWD REV VREF OUT1 OUT2 Operating mode
L L x Open Open Standby mode – All switches are off
H L VDD H L
Forward mode – Current flows from OUT1 to OUT2; 100% duty
H L
3V to VDD H L
Forward mode – Current flows from OUT1 to OUT2; VREF duty control
L H VDD L H
Reverse mode – Current flows from OUT2 to OUT1; 100% duty
L H
3V to VDD L H
Reverse mode – Current flows from OUT2 to OUT1; VREF duty control
H H x L L Brake mode – Short circuit brake with low side switches on
Motor Speed Control with a PWM Input Signal
Motor speed can be controlled by adjusting the duty cycle of the PWM speed control signal into the FWD or REV while keeping the VDD pin at
the nominal motor voltage. In this mode the input voltage on the VREF pin must be greater than or equal to VDD.
In PWM speed control mode the high side switches S1 and S3 are kept fixed while the low side switches S2 or S4 are switched. In the forward
mode, S1 is kept switched on, S2 is switched in accordance with the PWM signal and S3 and S4 are switched off. In reverse mode, S3 is
switched on, S4 is switched in accordance with the PWM signal and S1 and S2 are switched off.
The speed and direction control is given by:
FWD REV VREF OUT1 OUT2 Operating mode
L L x Open Open Standby mode – All switches are off
H L VDD H L
Forward mode – Current flows from OUT1 to OUT2; 100% duty
L H
VDD L H
Reverse mode – Current flows from OUT2 to OUT1; 100% duty
H H x L L Brake mode – Short circuit brake with low side switches on
PWM L VDD H PWM
Forward mode – Current flows from OUT1 to OUT2;
PWM control mode
L PWM
VDD PWM H
Reverse mode – Current flows from OUT2 to OUT1
PWM control mode
H H x L L Brake mode – Short circuit brake with low side switches on
The motor speed is proportional to the input PWM signal duty. For example, for a 12V motor the VDD pin is maintained at 12V while varying the
PWM control signal duty to adjust the motor speed linearly. The timing diagram below shows the output O1 and O2 in relation to PWM speed
control signal at PWM pin.
Frequency of PWM speed control signal can be between 8kHz to 100kHz. Recommended typical PWM signal frequency is 25kHz to keep
switching frequency away from the audible band.
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Application Note (cont.)
Motor Speed Control with a PWM Input Signal (cont.)
Depending on the motor design and its inertia the minimum start-up PWM duty required can be typically between 30% - 50%. While the motor is
rotating minimum PWM duty can generally be reduced down to 20%. How small the PWM duty can be without stalling the motor depends on the
motor mechanical and coil design parameters and not limited by the output capability of the device. If voltage at VDD is lower than the nominal
motor voltage, both start-up PWM duty and minimum running PWM duty required will be higher.
Motor Speed Control by DC Supply Voltage
Motor speed can be controlled by varying the VDD supply voltage while the FWD and REV pins are set to either a logic high or low depending on
forward or reverse direction needed. The VREF must be equal to VDD in this mode. For example, if the VDD for a 12V motor is changed from
12V to 3V the speed will be reduced from 100% to 25%.
Re-Circulating Capacitor
During motor operation when the low side switch is turned off the bridge or the motor voltage may overshoot to high levels if there is no current
path for the energy in the motor to flow. Such high voltages can damage the IC. A current path can be provided by adding a bypass capacitor
from the VDD or VM to the GND. The value of the bypass capacitor depends on the motor coil design, motor current, motor voltage and the
IC voltage limits. This could be in the range of 0.47µF for low current applications to 10uF or more for large current applications.
Dead-Time
During motor current reversal (for motor rotation direction reversal), switch position changes between S1-S2 and S3-S4. Such change may result
in cross conduction between high side and low side MOSFETS, e.g. S1 and S4 or S2 and S3. To prevent cross conduction the IC provides a
dead time 3µs typical during current reversal or fast turn on of the low side MOSFETs.
Back-Rush Voltage
Depending on motor characteristics, the environment and the ambient conditions back-rush voltage (at the bridge) may fluctuate during brush
commutation and PWM switching. Due to the energy in the coil this back-rush voltage can reach high levels if no adequate alternative current
path is provided when inductor current path is interrupted. The back-rush voltage overshoot should not be allowed to go beyond the operating
voltage range of the IC. This backrush voltage overshoot can be minimized by using a re-circulating bypass capacitor at the VDD and VM pins.
The value of the re-circulating bypass capacitor depends on the motor coil design, motor current, motor voltage and the IC voltage limits. This
could be 0.47µF for low current applications to 10uF or more for large current applications.
Under Voltage Lockout
To make sure the minimum voltage needed to operate the driver is supplied, the driver has an under voltage lock out. At start up the device will
only start if the supply voltage is typically 2.8 or greater. During normal operation, the device will switch off all the output switches and power
down if the supply voltage drops below 2.6V typical.
Over Voltage Protection
When the supply voltage exceeds 20.7V (typical) the driver will turn-off all the output switches. The driver will return to normal condition if the
supply voltage drops below 19V (typical) provided no other fault condition or signals are preventing it to enter normal operation.
In-Rush Current
It is recommended to use the PWM duty cycle to control the average voltage supplied to the motor during power up, standby mode, brake mode
or during motor direction reversal. If a PWM signal is not available it is recommended to use a current limiting resistor or other protection
devices if needed.
Over-Current Setting and Protection
The internal over current protection (OCP) threshold is 1.5A typical at 12V supply +25°C.
When the motor current exceeds the OCP threshold for longer than 10µs typical on any of the H-Bridge switches, the device will switch of all the
output switches and remain off for 5ms typical. The IC returns to normal operation after the 5ms if over current condition has gone away. If the
motor current is still higher than the OCP threshold, the device will enter another 5ms standby mode.
Thermal Shutdown
The device has an internal thermal shutdown to prevent a thermal run-away scenario. The thermal shutdown is triggered when the junction
temperature of the device reaches +165°C. It will remain in standby mode until the junction temperature falls by +25°C.
Reverse Voltage Protection
If reverse protection is needed this can be achieved by adding an external diode to the VDD and VM pins.
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Application Note (cont.)
Motor Electromagnetic and Audible Noise
To help reduce electromagnetic and audible nose, capacitor can be connected from OUT1 to GND and OUT2 to GND pins. Alternatively, a
capacitor can be connected between OUT1 and OUT2 with diodes between the output pins and GND as shown below. To prevent large currents
it is recommended to keep any capacitor used at the output pins as small as possible and less than 1µF.
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Typical Operating Characteristics
Supply Current
Standby Current
Under Voltage Lockout (UVLO) Over Voltage Protection (OVP)
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
2468101214161820
Supply Current I
DD
(mA)
Supply Voltage (V)
Supply Current vs. Supply Voltage
T
A
= +25 °C
0.0
0.5
1.0
1.5
2.0
-50 -25 0 25 50 75 100 125
Supply Current I
DD
(mA)
Temperature (°C)
Supply Current vs. Temperature
12V
3V
18V
0
10
20
30
40
50
60
2468101214161820
Stanby Current I
DD_STNDBY
(uA)
Supply Voltage (V)
Standby Supply Current vs. Supply Voltage
T
A
= +25 °C
0.0
10.0
20.0
30.0
40.0
50.0
60.0
70.0
80.0
-50-25 0 255075100125
Standby Current I
DD
(mA)
Temperature (°C)
Standby Supply Current vs. Temperature
12V
3V
18V
2.0
2.3
2.5
2.8
3.0
3.3
3.5
-50 -25 0 25 50 75 100 125
UVLO Thresholds (V)
Temperature (°C)
UVLO Trigger and Release Thresholds vs Temperature
UVLO Release Threshold
UVLO Trigger Threshold
15.0
17.0
19.0
21.0
23.0
25.0
-50 -25 0 25 50 75 100 125
OVP Thresholds (V)
Temperature (°C)
OVP Trigger and Release Thresholds vs Temperature
OVP Release Threshold
OVP Trigger Threshold
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Typical Operating Characteristics
Output PWM Duty in PWM Speed Control Mode Output PWM Duty in VREF Speed Control Mode
PWM Oscillator Frequency
0
10
20
30
40
50
60
70
80
90
100
0 102030405060708090100
Output PWM Duty (%)
Input PWM Duty (%)
Output PWM Duty vs Input PWM Duty
12V
3V
18V
T
A
= 25
o
C, Mode A PWM, Input PWM Frequency 25kHz
0
10
20
30
40
50
60
70
80
90
100
0 0.2 0.4 0.6 0.8 1
Output PWM Duty (%)
V
REF
/V
DD
Ratio
OutputPWM Duty vs V
REF
/V
DD
Ratio
12V
3V
18V
T
A
= 25
o
C, VREF Mode, No Load
20
22
24
26
28
30
2 4 6 8 10 12 14 16 18 20
Frequency (kHz)
Supply Voltage (V)
PWM Oscillator Frequency vs. Supply Voltage
T
A
= 25
o
C
20
22
24
26
28
30
-50 -25 0 25 50 75 100 125
Frequency (kHz)
Temperature (°C)
PWM Oscillator Frequency vs. Temperature
12V
3V
18V
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Typical Operating Characteristics
Low Side Switch On Voltage (VOL)
High Side Switch On Voltage (VDD -
V
OH)
0.0
0.1
0.2
0.3
0.4
0.5
0 2 4 6 8 101214161820
Low Side Swicth ON Voltae (V)
Supply Voltage (V)
Low Side Switch ON Voltage V
OL
vs. Supply Voltage
IOUT = 300mA TA= +25 °C
0.0
0.1
0.2
0.3
0.4
0.5
0 2 4 6 8 101214161820
Low Side Swicth ON Voltae (V)
Supply Voltage (V)
Low Side Switch ON Voltage V
OL
vs. Supply Voltage
I
OUT
= 500mA T
A
= +25 °C
0.0
0.1
0.2
0.3
0.4
0.5
-50-25 0 255075100125
Low Side Switch ON Voltage (V)
Temperature (°C)
Low Side Switch On Voltage V
OL
vs. Temperature
12V
3V
18V
IOUT = 300mA
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
-50-25 0 255075100125
Low Side Switch ON Voltage (V)
Temperature (°C)
Low Side Switch On Voltage V
OL
vs. Temperature
12V
3V
18V
I
OUT
= 500mA
0.0
0.1
0.2
0.3
0.4
0.5
0 2 4 6 8 101214161820
High Side Switch ON Voltae (V)
Supply Voltage (V)
High Side Switch ON Voltage (V
DD
-V
OH
) vs Supply Voltage
I
OUT
= 300mA T
A
= +25 °C
0.0
0.1
0.2
0.3
0.4
0.5
0 2 4 6 8 101214161820
High Side Switch ON Voltae (V)
Supply Voltage (V)
High Side Switch ON Voltage (V
DD
-V
OH
) vs Supply Voltage
IOUT = 500mA TA= +25 °C
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Typical Operating Characteristics
High Side Switch On Voltage (VDD -
V
OH) (cont.)
H-Bridge Resistance
Total Resistance On (RDSON
_
TOTAL) of the High and the Low Side Switches
0.0
0.1
0.2
0.3
0.4
0.5
-50-25 0 255075100125
High Side Switch ON Voltage (V)
Temperature (°C)
HighSide Switch On Voltage (V
DD
-V
OL
) vs. Temperature
12V
3V
18V
I
OUT
= 300mA
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
-50 -25 0 25 50 75 100 125
High Side Switch ON Voltage (V)
Temperature (°C)
HighSide Switch On Voltage (V
DD
-V
OL
) vs. Temperature
12V
3V
18V
I
OUT
= 500mA
0.0
0.5
1.0
1.5
2.0
2.5
3.0
02468101214161820
RDS_ON_TOTAL (Ω)
Supply Voltage (V)
High+Low Side Resistance R
DSON_TOTAL
vs. Voltage
IOUT = 300mA
0.0
0.5
1.0
1.5
2.0
2.5
3.0
02468101214161820
R
DS_ON_TOTAL
(Ω)
Supply Voltage (V)
High+Low Side Resistance R
DSON
_
TOTAL
vs. Voltage
I
OUT
= 500mA
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
-50-25 0 255075100125
R
DSON_TOTAL
(Ω)
Temperature (°C)
High+Low Side ON Resistance R
DSON_TOTAL
vs. Temperature
12V
3V
18V
I
OUT
= 300mA
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
-50 -25 0 25 50 75 100 125
R
DSON_TOTAL
(Ω)
Temperature (°C)
High+Low Side ON Resistance R
DSON_TOTAL
vs. Temperature
12V
3V
18V
I
OUT
= 500mA
ZXBM5210
Document number: DS36765 Rev. 1 - 2
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© Diodes Incorporated
NEW PRODUCT
ZXBM5210
Thermal Performance
(1) Package Type: SO-8
MSOP8-EP Power Dissipation De-rating Curve (Note 11)
TA (°C) -40 0 25 50 60 70 80 85 90 95 100 105 110 120 125 130 140 150
PD (mW) 1043 1043 1043 835 751 668 584 543 501 459 417 376 334 250 209 167 83 0
Note: 11. SO-8 soldered to minimum recommended landing pads (see Package Outline Dimension section) on a 1”x1” two-layer 2oz.copper FR4 PCB
(1.6mm thickness) without any via or copper flood on the bottom layer.
(2) Package Type: SO-8EP
SO-8EP Power Dissipation De-rating Curve (Note 12)
TA (°C) -40 0 25 50 60 70 80 85 90 95 100 105 110 120 125 130 140 150
PD (mW) 2980 29080 2980 2384 2146 1907 1669 1550 1430 1430 1192 1073 954 715 596 477 238 0
Note: 12. SO-8EP exposed pad soldered to minimum recommended landing pads (see Package Outline Dimension section) on a 2”x2” two-layer
2oz.copper FR4 PCB (1.6mm thickness) with four thermal vias in the exposed PAD to the copper flood on the bottom layer
0
200
400
600
800
1000
1200
-40 -20 0 20 40 60 80 100 120 140 160
Power Dissipation (mW)
Temperature (°C)
SO-8 Thermal Derating Curve
Rthja = 120
o
C/W;
Rthjc=19.9
o
C/W
0
250
500
750
1000
1250
1500
1750
2000
2250
2500
2750
3000
3250
3500
-40 -20 0 20 40 60 80 100 120 140 160
Power Dissipation (mW)
Temperature (°C)
SO-8EP Thermal Derating Curve
Rthja = 42.1
o
C/W; Rthjc = 8.5
o
C/W
ZXBM5210
Document number: DS36765 Rev. 1 - 2
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© Diodes Incorporated
NEW PRODUCT
ZXBM5210
Ordering Information
Part Number Package Code Packaging 13” Tape and Reel
Quantity Part Number Suffix
ZXBM5210-S-13 S SO-8 2500/Tape & Reel -13
ZXBM5210-SP-13 SP SO-8EP 2500/Tape & Reel -13
Marking Information
(1) Package type: SO-8
Part Number Package Identification Code
ZXBM5210-S-13 SO-8 BM5210
YY WW XX
(2) Package type: SO-8EP
Part Number Package Identification Code
ZXBM5210-SP-13 SO-8EP BM5210
YY WW XX E
ZXBM5210
Document number: DS36765 Rev. 1 - 2
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© Diodes Incorporated
NEW PRODUCT
ZXBM5210
Package Outline Dimensions (All dimensions in mm.)
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
(1) Package Type: SO-8
(2) Package Type: SO-8EP
SO-8
Dim Min Max
A - 1.75
A1 0.10 0.20
A2 1.30 1.50
A3 0.15 0.25
b 0.3 0.5
D 4.85 4.95
E 5.90 6.10
E1 3.85 3.95
e 1.27 Typ
h - 0.35
L 0.62 0.82
θ 0° 8°
All Dimensions in mm
SO-8EP (SOP-8L-EP)
Dim Min Max Typ
A 1.40 1.50 1.45
A1 0.00 0.13 -
b 0.30 0.50 0.40
C 0.15 0.25 0.20
D 4.85 4.95 4.90
E 3.80 3.90 3.85
E0 3.85 3.95 3.90
E1 5.90 6.10 6.00
e - - 1.27
F 2.75 3.35 3.05
H 2.11 2.71 2.41
L 0.62 0.82 0.72
N - - 0.35
Q 0.60 0.70 0.65
All Dimensions in mm
Gauge Plane
Seating Plane
Detail ‘A
Detail ‘A
E
E1
h
L
D
eb
A2
A1
A
45
°
7
°~
9
°
A3
0.254
Gauge Plane
Seating Plane
E1
E
N
e
b
A
45
°
E0
H
F
Exposed Pad
Bottom View
L
Q
C
7
°
4° ± 3°
9° (All sides)
A1
D
14
85
ZXBM5210
Document number: DS36765 Rev. 1 - 2
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© Diodes Incorporated
NEW PRODUCT
ZXBM5210
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
(1) Package Type: SO-8
(2) Package Type: SO-8EP
Dimensions Value (in mm)
X 0.60
Y 1.55
C1 5.4
C2 1.27
Dimensions Value (in mm)
C 1.270
X 0.802
X1 3.502
X2 4.612
Y 1.505
Y1 2.613
Y2 6.500
X
C1
C2
Y
C
Y1
X1
X
Y
Y2
X2
ZXBM5210
Document number: DS36765 Rev. 1 - 2
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© Diodes Incorporated
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ZXBM5210
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2013, Diodes Incorporated
www.diodes.com

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