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MLC Series Datasheet

Bourns Inc.

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Datasheet

Features
n RoHS compliant*
n ESD protection >25 kV
n Low capacitance <0.5 pF
n Low leakage current <50 nA
Applications
n HDMI 1.4
n Digital Visual Interface (DVI)
n USB 3.0 / USB OTG
n Memory protection
n SIM card ports
ChipGuard® MLC Series - ESD Protectors
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
General Information
Electrical Characteristics @ 25 °C (unless otherwise noted)
Parameter Symbol CG0402MLC- Unit
3.3LG 05LG 12LG 24LG 3.3LGA 05LGA 12LGA 24LGA
Typical Continuous Operating Voltage VDC 3.3 5 12 24 3.3 5 12 24 V
Typical Clamping Voltage (Note 1) VC25 V
Maximum Capacitance @ 1 VRMS 1 MHz CO 0.5 pF
Maximum Leakage Current @ Max. VDC IL5 nA
Typical Trigger Voltage (Note 2) VT250 V
Maximum Response Time RT1 ns
ESD Protection:
Per IEC 61000-4-2 Level 4
Min. Contact Discharge
Min. Air Discharge
Min. Air Discharge
±8
±15 (Note 3)
±25
kV
kV
kV
Operating Temperature TOPR -40 to +85 -40 to +125 ˚C
Storage Temperature TSTG -55 to +150 ˚C
The ChipGuard® MLC Series has been specifically designed to protect sensitive
electronic components from electrostatic discharge damage. The MLC family has been
designed to protect equipment to IEC61000-4-2, Level 4 (±8 kV Contact / ±15 kV Air
Discharge) ESD specifications targeted for high speed USB 3.0/USB OTG, HDMI 1.4,
DVI or IEEE1394 applications.
The ChipGuard® MLC Series has been manufactured to provide low 0.5 pF capacitance
and leakage currents less than 5 nA with excellent clamp qualities, making the family
almost transparent under normal working conditions.
Device Symbol
V
Notes: 1. Per IEC 61000-4-2, Level 4 8 kV Contact Discharge. Measurement 30 ns after initiation of pulse.
2. Per IEC 61000-4-2, Level 4 8 kV Contact Discharge. Measurement at maximum pulse voltage.
3. IEC 61000-4-2 ESD Performance will meet minimum 1000 reps without degradation in performance.
Parameter Symbol CG0603MLC- Unit
3.3LE 05LE 12LE 24LE 3.3LEA 05LEA 12LEA 24LEA
Typical Continuous Operating Voltage VDC 3.3 5 12 24 3.3 5 12 24 V
Typical Clamping Voltage (Note 1) VC25 25 25 V
Maximum Capacitance @ 1 VRMS 1 MHz CO 0.5 pF
Maximum Leakage Current @ Max. VDC IL5 5 5 nA
Typical Trigger Voltage (Note 2) VT250 250 250 V
Maximum Response Time RT1 ns
ESD Protection:
Per IEC 61000-4-2 Level 4
Min. Contact Discharge
Min. Air Discharge
Min. Air Discharge
±8
±15 (Note 3)
±25
kV
kV
kV
Operating Temperature TOPR -40 to +85 -40 to +125 ˚C
Storage Temperature TSTG -55 to +150 ˚C
*RoHS COMPLIANT
*RoHS COMPLIANT
& AEC APPROVED
*RoHS COMPLIANT
AEC APPROVED (Select Models)
LEAD FREE
*RoHS COMPLIANT
VERSIONS
AVAILABLE
LEAD FREE
VERSIONS ARE
RoHS COMPLIANT*
ChipGuard® MLC Series - ESD Protectors
Product Dimensions
CG0402 CG0603
Dimension Series Series
L 1.00 ± 0.15 1.60 ± 0.20
(0.04 ± 0.006) (0.064 ± 0.008)
W 0.50 ± 0.10 0.80 ± 0.20
(0.02 ± 0.004) (0.032 ± 0.008)
A 0.36 ± 0.05 0.45 ± 0.10
(0.014 ± 0.002) (0.018 ± 0.004)
B 0.25 ± 0.15 0.30 ± 0.20
(0.10 ± 0.006) (0.012 ± 0.008)
DIMENSIONS: MM
(INCHES)
Recommended Pad Layout
Solder Reflow Recommendations
110 sec. (min.)
300
250
200
150
100
50
0
30-70
sec.
Temperature (ϒC)
120 sec. (min.)
Preheat Stages 1-3 Soldering Cooling
Time (seconds)
This product can be damaged by rapid heating, cooling or localized heating.
Heat shocks should be avoided. Preheating and gradual cooling recommended.
Excessive solder can damage the device. Print solder thickness of 150 to 200 um recommended.
Solder gun tip temperature should be kept below 280 °C and should not touch the device directly. Contact should be less than 3 seconds.
A solder gun under 30 watts is recommended.
A Stage 1 Preheat Ambient to Preheating 30 s to 60 s
Temperature
B Stage 2 Preheat 140 °C to 160 °C 60 s to 120 s
C Stage 3 Preheat Preheat to 200 °C 20 s to 40 s
D Main Heating 200 °C 60 s to 70 s
210 °C 55 s to 65 s
220 °C 50 s to 60 s
230 °C 40 s to 50 s
240 °C 30 s to 40 s
250 °C to 255 °C 5 s
E Cooling 200 °C to 100 °C 1 °C/s to 4 °C/s
CG0402 CG0603
Dim. Series Series
A 0.51 0.76
(0.020) (0.030)
B 0.61 1.02
(0.024) (0.040)
C 0.51 0.50
(0.020) (0.020)
D 1.70 2.54
(0.067) (0.100)
L
B
A
W
A
CB
D
L
B
A
W
A
CB
D
L
B
A
W
A
CB
D
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
ChipGuard® MLC Series - ESD Protectors
Packaging Dimensions
TOP
TAPE
NOTES: TAPE MATERIAL IS PAPER.
COVER TAPE ADHESION IS 40 ± 15 GRAMS.
TAPE THICKNESS IS
4.00 ± 0.10
(0.16 ± 0.004)
DG
8.00 ± 0.30
(0.32 ± 0.012)
0.48 ± 0.03
(0.019 ± 0.0012)
3.50 ± 0.05
(0.14 ± 0.002)
C
L
W
1.50 ± 0.10
(0.06 ± 0.004) 2.0 ± 0.50
(0.08 ± 0.02)
180.8 ± 2.0
(7.12 ± 0.08)
9.0 ± 0.50
(0.36 ± 0.02)
13.0 ± 1.0
(0.52 ± 0.04)
13.0 ± 0.50
(0.52 ± 0.02)
62.0 ± 1.50
(2.48 ± 0.06)
21.0 ± 0.80
(0.84 ± 0.032)
DIMENSIONS: MM
(INCHES)
How to Order
CG 0n0n MLC - n.n x x x
ChipGuard®
Product Designator
Package Option
0402 = 0402 Package
0603 = 0603 Package
Multilayer Series Designator
Operating Voltage**
3.3 = 3.3 V
05 = 5 V
12 = 12 V
24 = 24 V
Low Leakage Current Option
L = Low Leakage Current
Blank = Standard Product
Tape & Reel Packaging
E = 5,000 pcs. per reel (0603 Package)
G = 10,000 pcs. per reel (0402 Package)
Operating Temperature Option
A = Higher +125 °C Operating Temperature
Blank = Standard Product
** Only models lower than 10 volts require
decimal point.
REV. T 01/17
CG0402 CG0603
Dimension Series Series
C 1.75 ± 0.05 1.75 ± 0.10
(0.04 ± 0.002) (0.04 ± 0.004)
D 2.00 ± 0.02 2.00 ± 0.05
(0.08 ± 0.0008) (0.08 ± 0.002)
L 1.12 ± 0.03 1.80 ± 0.20
(0.045 ± 0.0012) (0.072 ± 0.008)
W 0.62 ± 0.03 0.90 ± 0.20
(0.025 ± 0.0012) (0.036 ± 0.008)
G 2.0 ± 0.05 4.0 ± 0.05
(0.08 ± 0.002) (0.16 ± 0.002)
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
Asia-Pacific: Tel: +886-2 2562-4117 • Email: asiacus@bourns.com
EMEA: Tel: +36 88 520 390 • Email: eurocus@bourns.com
The Americas: Tel: +1-951 781-5500 • Email: americus@bourns.com
www.bourns.com

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