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Hi-Flow 115-AC Datasheet

Bergquist

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Datasheet

www.bergquistcompany.com
All statements, technical information and recommendations herein are based on tests we believe to be reliable, and
THE FOLLOWING IS MADE IN LIEU OF ALL WARRANTIES, EXPRESSED OR IMPLIED, INCLUDING THE IMPLIED
WARRANTIES OF MARKETABILITY AND FITNESS FOR PURPOSE. Sellers’ and manufacturers’ only obligation shall be to
replace such quantity of the product proved to be defective. Before using, user shall determine the suitability of the product
for its intended use, and the user assumes all risks and liability whatsoever in connection therewith. NEITHER SELLER NOR
MANUFACTURER SHALL BE LIABLE EITHER IN TORT OR IN CONTRACT FOR ANY LOSS OR DAMAGE, DIRECT,
INCIDENTAL, OR CONSEQUENTIAL, INCLUDING LOSS OF PROFITS OR REVENUE ARISING OUT OF THE USE OR
THE INABILITY TO USE A PRODUCT. No statement, purchase order or recommendations by seller or purchaser not
contained herein shall have any force or effect unless in an agreement signed by the officers of the seller and manufacturer.
PDS_10084_HF_115AC_0305
The Bergquist Company -
North American Headquarters
18930 West 78th Street
Chanhassen, MN 55317
Phone: 800-347-4572
Fax: 952-835-0430
The Bergquist Company - Europe
Bramenberg 9a, 3755 BT Eemnes
Netherlands
Phone: 31-35-5380684
Fax: 31-35-5380295
The Bergquist Company - China
Rm. 7C, Aihe Mansion
No. 629 Ling Ling Road
Shanghai, China 200030
Ph: 86-21-6464-2206
Fax: 86-21-6464-2209
Hi-Flow
®
115-AC
Fiberglass-Reinforced, Phase Change Thermal Interface Material
Features and Benefits
• Thermal impedance:
0.37°C-in2/W (@25 psi)
• Can be applied directly to a cold heat sink
• One side adhesive-coated to aid
in positioning
• Fiberglass reinforced
Bergquist Hi-Flow 115-AC is a thermally
conductive fiber reinforced phase change
material.The product consists of a thermally
conductive 65°C phase change compound
coated on a fiberglass web, and an adhesive
coating on one side for attachment to a cold
heat sink.There is no need to preheat the
heat sink to apply the Hi-Flow 115-AC.
Hi-Flow 115-AC is designed as a thermal
interface material between a computer
processor and a heat sink.The pressure
sensitive adhesive makes it simple to apply in
high volume to heat sinks and the 65°C phase
change temperature eliminates shipping and
handling problems.
Hi-Flow 115-AC requires no protective liner
for shipping or handling.The Hi-Flow coating
has excellent handling characteristics at room
temperature, and can withstand the handling
and shipping process without protection.
Hi-Flow 115-AC handles like a Sil Pad at
room temperature and flows like high-quality
grease at elevated temperatures.
Typical Applications Include:
• Computer and peripherals
As a thermal interface where bare die is exposed and needs to be heat sinked
Configurations Available:
• Sheet form, die-cut parts, and roll form
With pressure sensitive adhesive
Building a Part Number Standard Options
Hi- Flow®:U.S. Patents 6,197,859 and 5,950,066.
Section A
Section B
Section C
Section D
Section E
NA = Selected standard option. If not selecting a standard
option, insert company name, drawing number, and
revision level.
HF115AC = Hi-Flow 115-AC Phase Change Material
HF115AC 0.0055 AC 12/250 NA
Note: To build a part number, visit our website at www.bergquistcompany.com.
Standard thicknesses available: 0.0055"
AC = Adhesive, one side
00 = No adhesive
_ _ _ = Standard configuration dash number,
1212 = 12" x 12" sheets, 12/250 = 12" x 250' rolls, or
00 = custom configuration
––
TYPICAL PROPERTIES OF HI-FLOW 115-AC
PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD
Color Gray Gray Visual
Reinforcement Carrier Fiberglass Fiberglass
Thickness (inch) / (mm) 0.0055 0.139 ASTM D374
Elongation (%45° to Warp and Fill) 40 40 ASTM D882A
Tensile Strength (psi) / (MPa) 900 6 ASTM D882A
Continuous Use Temp (°F) / (°C) 302 150
Phase Change Temp (°F) / (°C) 149 65 ASTM D3418
ELECTRICAL
Dielectric Breakdown Voltage (Vac) 300 300 ASTM D149
Dielectric Constant (1000 Hz) 3.5 3.5 ASTM D150
Volume Resistivity (Ohm-meter) 1010 1010 ASTM D257
Flame Rating V-O V-O U.L. 94
THERMAL
Thermal Conductivity (W/m-K) (1) 0.8 0.8 ASTM D5470
THERMAL PERFORMANCE vs PRESSURE
Pressure (psi) 10 25 50 100 200
TO-220 Thermal Performance (°C/W) 1.28 1.16 1.04 0.94 0.85
Thermal Impedance (°C-in2/W) (2) 0.44 0.37 0.35 0.27 0.15
1) This is the measured thermal conductivity of the Hi-Flow coating. It represents one conducting layer in a three-layer laminate.The
Hi-Flow coatings are phase change compounds.These layers will respond to heat and pressure induced stresses.The overall conductivity
of the material in post-phase change, thin film products is highly dependent upon the heat and pressure applied.This characteristic is
not accounted for in ASTM D5470. Please contact Bergquist Product Management if additional specifications are required.
2) The ASTM D5470 (Bergquist modified) test fixture was used and the test sample was conditioned at 70°C prior to test.The
recorded value includes interfacial thermal resistance.These values are provided for reference only. Actual application performance is
directly related to the surface roughness, flatness and pressure applied.

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