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ADM2682E,87E Datasheet

Analog Devices Inc.

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Datasheet

5 kV rms Signal and Power Isolated
RS-485 Transceiver with ±15 kV ESD Protection
Data Sheet
ADM2682E/ADM2687E
Rev. C Document Feedback
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FEATURES
5 kV rms isolated RS-485/RS-422 transceiver, configurable as
half or full duplex
isoPower integrated isolated dc-to-dc converter
±15 kV ESD protection on RS-485 input/output pins
Complies with ANSI/TIA/EIA-485-A-98 and ISO 8482:1987(E)
Data rate: 16 Mbps (ADM2682E), 500 kbps (ADM2687E)
5 V or 3.3 V operation
Connect up to 256 nodes on one bus
Open- and short-circuit, fail-safe receiver inputs
High common-mode transient immunity: >25 kV/µs
Thermal shutdown protection
Safety and regulatory approvals
UL recognition
5000 V rms for 1 minute per UL 1577
CSA Component Acceptance Notice #5A (pending)
IEC 60601-1: 400 V rms (basic), 250 V rms (reinforced)
IEC 60950-1: 600 V rms (basic), 380 V rms (reinforced)
VDE Certificates of Conformity
DIN V VDE V 0884-10 (VDE V 0884-10): 2006-12
VIORM = 846 V peak
Operating temperature range: 40°C to +85°C
16-lead wide-body SOIC with >8 mm creepage and clearance
APPLICATIONS
Isolated RS-485/RS-422 interfaces
Industrial field networks
Multipoint data transmission systems
FUNCTIONAL BLOCK DIAGRAM
09927-001
ADM2682E/ADM2687E
TxD
A
B
Y
Z
DE
V
CC
V
CC
RxD
RE
GND
1
GND
2
DECODE D
R
DECODE
ENCODE
OSCILLATOR RECTIFIER
REGULATOR
V
ISOOUT
isoPower DC-TO-DC CONVERTER
V
ISOIN
DIGITAL ISOLATION iCoupler
ENCODE
ENCODE
DECODE
TRANSCEIVER
ISOLATION
BARRIER
Figure 1.
GENERAL DESCRIPTION
The ADM2682E/ADM2687E are fully integrated 5 kV rms
signal and power isolated data transceivers with ±15 kV ESD
protection and are suitable for high speed communication on
multipoint transmission lines. The ADM2682E/ADM2687E
include an integrated 5 kV rms isolated dc-to-dc power supply
that eliminates the need for an external dc-to-dc isolation block.
They are designed for balanced transmission lines and comply
with ANSI/TIA/EIA-485-A-98 and ISO 8482:1987(E).
The devices integrate Analog Devices, Inc., iCoupler® technology to
combine a 3-channel isolator, a three-state differential line driver, a
differential input receiver, and Analog Devices isoPower® dc-to-dc
converter into a single package. The devices are powered by a
single 5 V or 3.3 V supply, realizing a fully integrated signal and
power isolated RS-485 solution.
The ADM2682E/ADM2687E drivers have an active high enable.
An active low receiver enable is also provided, which causes the
receiver output to enter a high impedance state when disabled.
The devices have current limiting and thermal shutdown
features to protect against output short circuits and situations
where bus contention may cause excessive power dissipation.
The parts are fully specified over the industrial temperature
range and are available in a highly integrated, 16-lead, wide-
body SOIC package with >8 mm creepage and clearance.
The ADM2682E/ADM2687E contain isoPower technology that
uses high frequency switching elements to transfer power through
the transformer. Special care must be taken during printed circuit
board (PCB) layout to meet emissions standards. Refer to
AN-0971 Application Note, Recommendations for Control of
Radiated Emissions with isoPower Devices, for details on board
layout considerations.
ADM2682E/ADM2687E Data Sheet
Rev. C | Page 2 of 24
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications ....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description ......................................................................... 1
Revision History ............................................................................... 2
Specifications ..................................................................................... 3
ADM2682E Timing Specifications ............................................ 4
ADM2687E Timing Specifications ............................................ 4
Package Characteristics ............................................................... 4
Regulatory Information ............................................................... 5
Insulation and Safety-Related Specifications ............................ 5
VDE 0884-10 Insulation Characteristics ................................... 6
Absolute Maximum Ratings ............................................................ 7
ESD Caution .................................................................................. 7
Pin Configuration and Function Descriptions ............................. 8
Typical Performance Characteristics ............................................. 9
Test Circuits ..................................................................................... 14
Switching Characteristics .............................................................. 15
Circuit Description......................................................................... 16
Signal Isolation ........................................................................... 16
Power Isolation ........................................................................... 16
Truth Tables................................................................................. 16
Thermal Shutdown .................................................................... 16
Open- and Short-Circuit, Fail-Safe Receiver Inputs.............. 16
DC Correctness and Magnetic Field Immunity........................... 16
Applications Information .............................................................. 18
PCB Layout ................................................................................. 18
EMI Considerations ................................................................... 18
Insulation Lifetime ..................................................................... 19
Isolated Supply Considerations ................................................ 19
Typical Applications ................................................................... 20
Outline Dimensions ....................................................................... 22
Ordering Guide .......................................................................... 22
REVISION HISTORY
6/15Rev. B to Rev. C
Changes to Figure 1 .......................................................................... 1
11/13Rev. A to Rev. B
Change to Features Section ............................................................. 1
Change to Table 5 ............................................................................. 5
Changes to VDE 0884-10 Insulation Characteristics Section .... 6
6/13Rev. 0 to Rev. A
Updated UL and VDE Certification (Throughout) ..................... 1
Updated Outline Dimensions ....................................................... 22
Changes to Ordering Guide .......................................................... 22
7/11Revision 0: Initial Version
Data Sheet ADM2682E/ADM2687E
Rev. C | Page 3 of 24
SPECIFICATIONS
All voltages are relative to their respective ground; 3.0 ≤ VCC ≤ 5.5 V. All minimum/maximum specifications apply over the entire
recommended operation range, unless otherwise noted. All typical specifications are at TA = 25°C, VCC = 5 V unless otherwise noted.
Table 1.
Parameter Symbol Min Typ Max Unit Test Conditions/Comments
ADM2687E SUPPLY CURRENT
I
CC
Data Rate ≤ 500 kbps 90 mA VCC = 3.3 V, 100 Ω load between Y and Z
72 mA VCC = 5 V, 100 Ω load between Y and Z
125 mA VCC = 3.3 V, 54 Ω load between Y and Z
98 mA VCC = 5 V, 54 Ω load between Y and Z
140
mA
120 Ω load between Y and Z
ADM2682E SUPPLY CURRENT ICC
Data Rate = 16 Mbps 175 mA 120 Ω load between Y and Z
260 mA 54 Ω load between Y and Z
Data Rate = 16 Mbps, 4.5 ≤ VCC 5.5 V 130 mA 120 Ω load between Y and Z
200 mA 54 Ω load between Y and Z
ISOLATED SUPPLY VOLTAGE
V
ISOOUT
V
DRIVER
Differential Outputs
Differential Output Voltage, Loaded |VOD2| 2.0 3.6 V RL = 100 Ω (RS-422), see Figure 29
1.5 3.6 V RL = 54 Ω (RS-485), see Figure 29
|VOD3| 1.5 3.6 V 7 V VTEST1 12 V, see Figure 30
Δ|VOD| for Complementary Output States Δ|VOD| 0.2 V RL = 54 Ω or 100 Ω, see Figure 29
Common-Mode Output Voltage VOC 3.0 V RL = 54 Ω or 100 , see Figure 29
Δ|VOC| for Complementary Output States Δ|VOC| 0.2 V RL = 54 Ω or 100 , see Figure 29
Short-Circuit Output Current IOS 200 mA
Output Leakage Current (Y, Z) IO 30 µA DE = 0 V, RE = 0 V, VCC = 0 V or 3.6 V,
VIN = 12 V
30 µA DE = 0 V, RE = 0 V, VCC = 0 V or 3.6 V,
VIN = −7 V
Logic Inputs DE,
RE
, TxD
Input Threshold Low VIL 0.27 VCC V DE, RE, TxD
Input Threshold High VIH 0.7 VCC V DE, RE, TxD
Input Current II 10 0.01 10 µA DE, RE, TxD
RECEIVER
Differential Inputs
Differential Input Threshold Voltage VTH 200 125 30 mV 7 V < VCM < +12 V
Input Voltage Hysteresis VHYS 15 mV VOC = 0 V
Input Current (A, B)
I
I
125
µA
DE = 0 V, V
CC
= 0 V or 3.6 V, V
IN
= 12 V
100 µA DE = 0 V, VCC = 0 V or 3.6 V, VIN = 7 V
Line Input Resistance RIN 96 kΩ 7 V < VCM < +12 V
Logic Outputs
Output Voltage Low VOL 0.2 0.4 V IO = 1.5 mA, VA VB = −0.2 V
Output Voltage High VOH VCC 0.3 VCC 0.2 V IO = −1.5 mA, VA − VB = 0.2 V
Short-Circuit Current 100 mA
COMMON-MODE TRANSIENT IMMUNITY1 25 kV/µs VCM = 1 kV, transient magnitude = 800 V
1 CM is the maximum common-mode voltage slew rate that can be sustained while maintaining specification-compliant operation. VCM is the common-mode potential
difference between the logic and bus sides. The transient magnitude is the range over which the common-mode is slewed. The common-mode voltage slew rates
apply to both rising and falling common-mode voltage edges.
ADM2682E/ADM2687E Data Sheet
Rev. C | Page 4 of 24
ADM2682E TIMING SPECIFICATIONS
TA = −40°C to +85°C.
Table 2.
Parameter Symbol Min Typ Max Unit Test Conditions/Comments
DRIVER
Maximum Data Rate 16 Mbps
Propagation Delay, Low to High tDPLH 63 100 ns RL = 54 Ω, CL1 = CL2 = 100 pF, see Figure 31 and Figure 35
Propagation Delay, High to Low tDPHL 64 100 ns RL = 54 Ω, CL1 = CL2 = 100 pF, see Figure 31 and Figure 35
Output Skew tSKEW 1 8 ns RL = 54 Ω, CL1 = CL2 = 100 pF, see Figure 31 and Figure 35
Rise Time/Fall Time tDR, tDF 15 ns RL = 54 Ω, CL1 = CL2 = 100 pF, see Figure 31 and Figure 35
Enable Time tZL, tZH 120 ns RL = 110 Ω, CL = 50 pF, see Figure 32 and Figure 37
Disable Time tLZ, tHZ 150 ns RL = 110 Ω, CL = 50 pF, see Figure 32 and Figure 37
RECEIVER
Propagation Delay, Low to High tRPLH 94 110 ns CL = 15 pF, see Figure 33 and Figure 36
Propagation Delay, High to Low tRPHL 95 110 ns CL = 15 pF, see Figure 33 and Figure 36
Output Skew1 t
SKEW 1 12 ns CL = 15 pF, see Figure 33 and Figure 36
Enable Time tZL, tZH 15 ns RL = 1 kΩ, CL = 15 pF, see Figure 34 and Figure 38
Disable Time tLZ, tHZ 15 ns RL = 1 kΩ, CL = 15 pF, see Figure 34 and Figure 38
1 Guaranteed by design.
ADM2687E TIMING SPECIFICATIONS
TA = −40°C to +85°C.
Table 3.
Parameter Symbol Min Typ Max Unit Test Conditions/Comments
DRIVER
Maximum Data Rate 500 kbps
Propagation Delay, Low to High tDPLH 250 503 700 ns RL = 54 Ω, CL1 = CL2 = 100 pF, see Figure 31 and Figure 35
Propagation Delay, High to Low tDPHL 250 510 700 ns RL = 54 Ω, CL1 = CL2 = 100 pF, see Figure 31 and Figure 35
Output Skew tSKEW 7 100 ns RL = 54 Ω, CL1 = CL2 = 100 pF, see Figure 31 and Figure 35
Rise Time/Fall Time tDR, tDF 200 1100 ns RL = 54 Ω, CL1 = CL2 = 100 pF, see Figure 31 and Figure 35
Enable Time tZL, tZH 2.5 μs RL = 110 Ω, CL = 50 pF, see Figure 32 and Figure 37
Disable Time tLZ, tHZ 200 ns RL = 110 Ω, CL = 50 pF, see Figure 32 and Figure 37
RECEIVER
Propagation Delay, Low to High tRPLH 91 200 ns CL = 15 pF, see Figure 33 and Figure 36
Propagation Delay, High to Low tRPHL 95 200 ns CL = 15 pF, see Figure 33 and Figure 36
Output Skew tSKEW 4 30 ns CL = 15 pF, see Figure 33 and Figure 36
Enable Time tZL, tZH 15 ns RL = 1 kΩ, CL = 15 pF, see Figure 34 and Figure 38
Disable Time tLZ, tHZ 15 ns RL = 1 kΩ, CL = 15 pF, see Figure 34 and Figure 38
PACKAGE CHARACTERISTICS
Table 4.
Parameter Symbol Min Typ Max Unit Test Conditions/Comments
Resistance (Input-to-Output)1 R
I-O 1012 Ω
Capacitance (Input-to-Output)1 C
I-O 3 pF f = 1 MHz
Input Capacitance2 C
I 4 pF
1 Device considered a 2-terminal device: short together Pin 1 to Pin 8 and short together Pin 9 to Pin 16.
2 Input capacitance is from any input data pin to ground.
Data Sheet ADM2682E/ADM2687E
Rev. C | Page 5 of 24
REGULATORY INFORMATION
Table 5. ADM2682E/ADM2687E Approvals
Organization Approval Type
UL
To be recognized under the UL 1577 Component Recognition Program of Underwriters Laboratories, Inc.
Single protection, 5000 V rms isolation voltage.
In accordance with UL 1577, each ADM2682E/ADM2687E is proof tested by applying an insulation test voltage
6000 V rms for 1 second.
CSA (Pending) To be approved under CSA Component Acceptance Notice #5A.
Reinforced insulation per IEC 60601-1, 250 V rms (353 V peak) maximum working voltage.
Basic insulation per IEC 60601-1, 400 V rms (566 V peak) maximum working voltage.
Reinforced insulation per CSA 60950-1-07 and IEC 60950-1, 380 V rms (537 V peak) maximum working voltage.
Basic insulation per CSA 60950-1-07 and IEC 60950-1, 600 V rms (848 V peak) maximum working voltage.
VDE Certified according to DIN V VDE V 0884-10 (VDE 0884-10): 2006-12.
In accordance with DIN EN 60747-5-2, each ADM2682E/ADM2687E is proof tested by applying an insulation test voltage
≥1590 V peak for 1 second.
INSULATION AND SAFETY-RELATED SPECIFICATIONS
Table 6.
Parameter Symbol Value Unit Test Conditions/Comments
Rated Dielectric Insulation Voltage 5000 V rms 1-minute duration
Minimum External Air Gap (Clearance) L(I01) >8.0 mm Measured from input terminals to output terminals,
shortest distance through air
Minimum External Tracking (Creepage) L(I02) >8.0 mm Measured from input terminals to output terminals,
shortest distance along body
Minimum Internal Gap (Internal Clearance) 0.017 min mm Insulation distance through insulation
Tracking Resistance (Comparative Tracking Index) CTI >175 V DIN IEC 112/VDE 0303-1
Isolation Group IIIa Material Group (DIN VDE 0110:1989-01, Table 1)
ADM2682E/ADM2687E Data Sheet
Rev. C | Page 6 of 24
VDE 0884-10 INSULATION CHARACTERISTICS
This isolator is suitable for reinforced electrical isolation only within the safety limit data. Maintenance of the safety data must be ensured
by means of protective circuits.
Table 7.
Description Test Conditions/Comments Symbol Characteristic Unit
CLASSIFICATIONS
Installation Classification per DIN VDE 0110 for
Rated Mains Voltage
300 V rms I to IV
450 V rms
I to III
≤600 V rms I to II
Climatic Classification 40/85/21
Pollution Degree Table 1 of DIN VDE 0110 2
VOLTAGE
Maximum Working Insulation Voltage VIORM 846 V peak
Input-to-Output Test Voltage VPR
Method b1 VIORM × 1.875 = VPR, 100% production tested,
tm = 1 sec, partial discharge < 5 pC
1590 V peak
Method a
After Environmental Tests, Subgroup 1 VIORM × 1.6 = VPR, tm = 60 sec, partial discharge < 5 pC 1375 V peak
After Input and/or Safety Test,
Subgroup 2/Subgroup 3
VIORM × 1.2 = VPR, tm = 60 sec, partial discharge < 5 pC 1018 V peak
Highest Allowable Overvoltage Transient overvoltage, tTR = 10 sec VTR 6000 V peak
SAFETY-LIMITING VALUES Maximum value allowed in the event of a failure
Case Temperature TS 150 °C
Input Current IS, INPUT 265 mA
Output Current
I
S, OUTPUT
335
mA
Insulation Resistance at TS VIO = 500 V RS >109
Data Sheet ADM2682E/ADM2687E
Rev. C | Page 7 of 24
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted. All voltages are relative to
their respective ground.
Table 8.
Parameter Rating
VCC 0.5 V to +7 V
Digital Input Voltage (DE, RE, TxD) 0.5 V to VDD + 0.5 V
Digital Output Voltage (RxD) 0.5 V to VDD + 0.5 V
Driver Output/Receiver Input Voltage 9 V to +14 V
Operating Temperature Range 40°C to +85°C
Storage Temperature Range 55°C to +150°C
ESD (Human Body Model) on
A, B, Y, and Z pins
±15 kV
ESD (Human Body Model) on Other Pins ±2 kV
Thermal Resistance θJA 52°C/W
Lead Temperature
Soldering (10 sec) 260°C
Vapor Phase (60 sec) 215°C
Infrared (15 sec) 220°C
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
Table 9. Maximum Continuous Working Voltage1
Parameter Max Unit Reference Standard
AC Voltage
Bipolar Waveform
424
V peak
All certifications,
50-year minimum
lifetime
Unipolar Waveform
Basic Insulation 600 V peak
Reinforced Insulation 537 V peak Maximum approved
working voltage per
IEC 60950-1
DC Voltage
Basic Insulation 600 V peak
Reinforced Insulation 537 V peak Maximum approved
working voltage per
IEC 60950-1
1 Refers to continuous voltage magnitude imposed across the isolation
barrier. See the Insulation Lifetime section for more details.
ESD CAUTION
ADM2682E/ADM2687E Data Sheet
Rev. C | Page 8 of 24
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
GND
11
V
CC 2
RxD
3
RE
4
GND
2
16
V
ISOIN
15
A
14
B
13
DE
5
Z
12
TxD
6
Y
11
V
CC 7
V
ISOOUT
10
GND
18
GND
2
9
NOTES
1. PIN 10 AND PIN 15 MUST BE
CONNECTED EXTERNALLY.
09927-002
ADM2682E/
ADM2687E
TOP VIEW
(Not to Scale)
Figure 2. Pin Configuration
Table 10. Pin Function Descriptions
Pin No. Mnemonic Description
1 GND1 Ground, Logic Side.
2 VCC Logic Side Power Supply. It is recommended that a 0.1 µF and a 0.01 µF decoupling capacitor be fitted between
Pin 2 and Pin 1.
3 RxD Receiver Output Data. This output is high when (A − B) −30 mV and low when (A − B) ≤ 200 mV. The output is
tristated when the receiver is disabled, that is, when RE is driven high.
4 RE Receiver Enable Input. This is an active-
low input. Driving this input low enables the receiver, while driving it high
disables the receiver.
5 DE Driver Enable Input. Driving this input high enables the driver, while driving it low disables the driver.
6
TxD
Driver Input. Data to be transmitted by the driver is applied to this input.
7 VCC Logic Side Power Supply. It is recommended that a 0.1 µF and a 10 µF decoupling capacitor be fitted between
Pin 7 and Pin 8.
8 GND1 Ground, Logic Side.
9 GND2 Ground, Bus Side.
10 VISOOUT Isolated Power Supply Output. This pin must be connected externally to VISOIN. It is recommended that a reservoir
capacitor of 10 µF and a decoupling capacitor of 0.1 µF be fitted between Pin 10 and Pin 9.
11 Y Driver Noninverting Output
12 Z Driver Inverting Output
13 B Receiver Inverting Input.
14
A
Receiver Noninverting Input.
15
V
ISOIN
Isolated Power Supply Input. This pin must be connected externally to V
ISOOUT
. It is recommended that a 0.1 µF
and a 0.01 µF decoupling capacitor be fitted between Pin 15 and Pin 16.
16 GND2 Ground, Bus Side.
Data Sheet ADM2682E/ADM2687E
Rev. C | Page 9 of 24
TYPICAL PERFORMANCE CHARACTERISTICS
200
0
20
40
60
80
100
120
140
160
180
–40 –15 10 35 60 85
TEMPERATURE (°C)
SUPPLY CURRENT, I
CC
(mA)
NO LOAD
R
L
= 54Ω
R
L
= 120Ω
09927-203
Figure 3. ADM2682E Supply Current (ICC) vs. Temperature
(Data Rate = 16 Mbps, DE = 3.3 V, VCC = 3.3 V)
160
0
20
40
60
80
100
120
140
–40 –15 10 35 60 85
TEMPERATURE (°C)
SUPPLY CURRENT, I
CC
(mA)
NO LOAD
R
L
= 54Ω
R
L
= 120Ω
09927-204
Figure 4. ADM2682E Supply Current (ICC) vs. Temperature
(Data Rate = 16 Mbps, DE = 5 V, VCC = 5 V)
180
160
0
20
40
60
80
100
120
140
1 4 7 10 13 16
DATA RATE (Mbps)
SUPPLY CURRENT, I
CC
(mA)
NO LOAD
R
L
= 54Ω
R
L
= 120Ω
09927-205
Figure 5. ADM2682E Supply Current (ICC) vs. Data Rate
(TA = 25°C, DE = 3.3 V, VCC = 3.3 V)
140
0
20
40
60
80
100
120
1 4 7 10 13 16
DATA RATE (Mbps)
SUPPLY CURRENT, I
CC
(mA)
NO LOAD
R
L
= 54Ω
R
L
= 120Ω
09927-206
Figure 6. ADM2682E Supply Current (ICC) vs. Data Rate
(TA = 25°C, DE = 5 V, VCC = 5 V)
120
0
20
40
60
80
100
–40 –15 10 35 60 85
TEMPERATURE (°C)
SUPPLY CURRENT, I
CC
(mA)
NO LOAD
R
L
= 54Ω
R
L
= 120Ω
09927-207
Figure 7. ADM2687E Supply Current (ICC) vs. Temperature
(Data Rate = 500 kbps, DE = 5 V, VCC = 5 V)
160
0
20
40
60
80
100
120
140
–40 –15 10 35 60 85
TEMPERATURE (°C)
SUPPLY CURRENT, I
CC
(mA)
NO LOAD
R
L
= 5
R
L
= 12
09927-208
Figure 8. ADM2687E Supply Current (ICC) vs. Temperature
(Data Rate = 500 kbps, DE = 3.3 V, VCC = 3.3 V)
ADM2682E/ADM2687E Data Sheet
Rev. C | Page 10 of 24
140
120
100
80
60
40
20
050 200
125 275 350 425 500
DATA RATE (kbps)
SUPPLY CURRENT, I
CC
(mA)
NO LOAD
R
L
= 54Ω
R
L
= 120Ω
09927-209
Figure 9. ADM2687E Supply Current (ICC) vs. Data Rate
(TA = 25°C, DE = 3.3 V, VCC = 3.3 V)
120
100
80
60
40
20
050 200125 275 350 425 500
DATA RATE (kbps)
SUPPLY CURRENT, I
CC
(mA)
NO LOAD
R
L
= 54Ω
R
L
= 120Ω
09927-210
Figure 10. ADM2687E Supply Current (ICC) vs. Data Rate
(TA = 25°C, DE = 5 V, VCC = 5 V)
50
52
54
56
58
60
62
64
66
68
70
72
DRIVER PROPAGATION DELAY (ns)
TEMPERATURE (°C)
t
DPHL
t
DPLH
–40 –15 10 35 60 85
09927-107
Figure 11. ADM2682E Differential Driver Propagation Delay vs. Temperature
400
420
440
460
480
500
520
540
560
580
600
DRIVER PROPAGATION DELAY (ns)
TEMPERATURE (°C)
t
DPHL
t
DPLH
–40 –15 10 35 60 85
09927-108
Figure 12. ADM2687E Differential Driver Propagation Delay vs. Temperature
CH1 2.0V
CH3 2.0V CH2 2.0V
TxD
Z
Y
M10.00ns A CH1 1.28V
1
3
09927-109
Figure 13. ADM2682E Driver Propagation Delay
CH1 2.0V
CH3 2.0V CH2 2.0V M200ns A CH1 2.56V
1
3
TxD
Y
Z
09927-110
Figure 14. ADM2687E Driver Propagation Delay
Data Sheet ADM2682E/ADM2687E
Rev. C | Page 11 of 24
–70
–60
–50
–40
–30
–20
–10
0
012 3 4 5
OUTPUT CURRENT (mA)
OUTPUT HIGH VOLTAGE (V)
09927-111
Figure 15. Receiver Output Current vs. Receiver Output High Voltage
0
10
20
30
40
50
60
012345
OUTPUT CURRENT (mA)
OUTPUT LOW VOLTAGE (V)
09927-112
Figure 16. Receiver Output Current vs. Receiver Output Low Voltage
4.65
4.66
4.67
4.68
4.69
4.70
4.71
4.72
4.73
4.74
4.75
OUTPUT HIGH VOLTAGE (V)
TEMPERATURE (°C)
–40 –15 10 35 60 85
09927-113
Figure 17. Receiver Output High Voltage vs. Temperature
0.20
0.22
0.24
0.26
0.28
0.30
0.32
OUTPUT LOW VOLTAGE (V)
TEMPERATURE (°C)
–40 –15 10 35 60 85
09927-114
Figure 18. Receiver Output Low Voltage vs. Temperature
B
A
RxD
CH1 2.0V
CH3 2.0V CH2 2.0V M10.00ns A CH1 2.56V
1
3
09927-115
Figure 19. ADM2682E Receiver Propagation Delay
CH1 2.0V
CH3 2.0V CH2 2.0V M10.00ns A CH1 2.56V
1
3
B
A
RxD
09927-116
Figure 20. ADM2687E Receiver Propagation Delay
ADM2682E/ADM2687E Data Sheet
Rev. C | Page 12 of 24
93
92
94
95
96
97
98
–40 –15 10 35 60 85
RECEIVER PROPAGATION DELAY (ns)
TEMPERATURE (°C)
t
RPHL
t
RPLH
09927-117
Figure 21. ADM2682E Receiver Propagation Delay vs. Temperature
90
91
92
93
94
95
96
97
98
99
100
RECEIVER PROPAGATION DELAY (ns)
TEMPERATURE (°C)
t
RPHL
t
RPLH
–40 –15 10 35 60 85
09927-118
Figure 22. ADM2687E Receiver Propagation Delay vs. Temperature
3.39
3.38
3.37
3.36
3.35
3.34
3.33
–40 10–15 35 60 85
TEMPERATURE (°C)
ISOLATED SUPPLY VOLTAGE (V)
NO LOAD
R
L
= 5
R
L
= 120Ω
09927-223
Figure 23. ADM2682E Isolated Supply Voltage vs. Temperature
(VCC = 3.3 V, Data Rate = 16 Mbps)
3.44
3.38
3.39
3.40
3.41
3.42
3.43
3.37
3.36
3.35
3.34
–40 10–15 35 60 85
TEMPERATURE (°C)
ISOLATED SUPPLY VOLTAGE (V)
NO LOAD
R
L
= 5
R
L
= 120Ω
09927-224
Figure 24. ADM2682E Isolated Supply Voltage vs. Temperature
(VCC = 5 V, Data Rate = 16 Mbps)
3.37
3.34
3.35
3.36
3.33
3.32
3.31
3.30
–40 10–15 35 60 85
TEMPERATURE (°C)
ISOLATED SUPPLY VOLTAGE (V)
NO LOAD
R
L
= 5
R
L
= 120Ω
09927-225
Figure 25. ADM2687E Isolated Supply Voltage vs. Temperature
(VCC = 3.3 V, Data Rate = 500 kbps)
3.39
3.38
3.35
3.36
3.37
3.34
3.33
3.32
3.31
–40 10–15 35 60 85
TEMPERATURE (°C)
ISOLATED SUPPLY VOLTAGE (V)
NO LOAD
R
L
= 5
R
L
= 120Ω
09927-226
Figure 26. ADM2687E Isolated Supply Voltage vs. Temperature
(VCC = 5 V, Data Rate = 500 kbps)
Data Sheet ADM2682E/ADM2687E
Rev. C | Page 13 of 24
60
0
10
20
30
40
50
–40 –15 10 35 60 85
TEMPERATURE (°C)
ISOLATED SUPPLY CURRENT (mA)
NO LOAD
R
L
= 54Ω
R
L
= 120Ω
09927-227
Figure 27. ADM2682E Isolated Supply Current vs. Temperature
(VCC = 3.3 V, Data Rate = 16 Mbps)
40
0
5
10
15
20
30
35
25
–40 –15 10 35 60 85
TEMPERATURE (°C)
ISOLATED SUPPLY CURRENT (mA)
NO LOAD
R
L
= 54Ω
R
L
= 120Ω
09927-228
Figure 28. ADM2687E Isolated Supply Current vs. Temperature
(VCC = 3.3 V, Data Rate = 500 kbps)
ADM2682E/ADM2687E Data Sheet
Rev. C | Page 14 of 24
TEST CIRCUITS
Y
Z
T
xD V
OD2
V
OC
R
L
R
L
2
2
09927-003
Figure 29. Driver Voltage Measurement
Y
Z
T
xD V
OD3
V
TEST
375
60
375
09927-004
Figure 30. Driver Voltage Measurement over Common Mode
Y
Z
T
xD
C
L
C
L
R
L
09927-005
Figure 31. Driver Propagation Delay
Y
Z
T
xD
DE
S1 S2
V
CC
R
L
110
V
OUT
C
L
50pF
09927-006
Figure 32. Driver Enable/Disable
C
L
V
OUT
RE
A
B
09927-007
RxD
Figure 33. Receiver Propagation Delay
C
L
R
L
V
OUT
V
CC
RE
S1
S2
+1.5V
1.5V
RE IN
09927-008
RxD
Figure 34. Receiver Enable/Disable
Data Sheet ADM2682E/ADM2687E
Rev. C | Page 15 of 24
SWITCHING CHARACTERISTICS
Z
Y
t
DPLH
t
DR
t
DPHL
t
DF
1/2V
O
V
O
90% POINT
10% POINT
90% POINT
10% POINT
V
DIFF
= V
(Y)
– V
(Z)
–V
O
V
DIFF
t
SKEW
= │t
DPHL
– t
DPLH
+V
O
0V
V
CC
V
CC
/2 V
CC
/2
09927-009
Figure 35. Driver Propagation Delay, Rise/Fall Timing
A – B
RxD
0V
1.5V 1.5V
V
OL
V
OH
t
RPLH
0V
t
RPHL
t
SKEW
= |
t
RPLH
t
RPHL
|
09927-010
Figure 36. Receiver Propagation Delay
DE
Y, Z
Y, Z
V
CC
0V
V
OL
V
OH
0.5V
CC
0.5V
CC
t
ZL
t
ZH
t
LZ
t
HZ
V
OH
– 0.5V
V
OL
+ 0.5V
2.3V
2.3V
09927-011
Figure 37. Driver Enable/Disable Timing
OUTPUT LOW
OUTPUT HIGH
1.5V
1.5V
RxD
RxD
RE
0V
V
IH
V
IL
t
ZL
t
ZH
t
LZ
t
HZ
V
OH
– 0.5V
V
OL
+ 0.5V V
OL
V
OH
0.5V
CC
0.5V
CC
09927-012
Figure 38. Receiver Enable/Disable Timing
ADM2682E/ADM2687E Data Sheet
Rev. C | Page 16 of 24
CIRCUIT DESCRIPTION
SIGNAL ISOLATION
The ADM2682E/ADM2687E signal isolation of 5 kV rms is
implemented on the logic side of the interface. The part achieves
signal isolation by having a digital isolation section and a trans-
ceiver section (see Figure 1). Data applied to the TxD and DE
pins and referenced to logic ground (GND1) are coupled across
an isolation barrier to appear at the transceiver section referenced
to isolated ground (GND2). Similarly, the single-ended receiver
output signal, referenced to isolated ground in the transceiver
section, is coupled across the isolation barrier to appear at the
RxD pin referenced to logic ground.
POWER ISOLATION
The ADM2682E/ADM2687E power isolation of 5 kV rms is
implemented using an isoPower integrated isolated dc-to-dc
converter. The dc-to-dc converter section of the ADM2682E/
ADM2687E works on principles that are common to most
modern power supplies. It is a secondary side controller
architecture with isolated pulse-width modulation (PWM)
feedback. VCC power is supplied to an oscillating circuit that
switches current into a chip-scale air core transformer. Power
transferred to the secondary side is rectified and regulated to
3.3 V. The secondary (VISO) side controller regulates the output
by creating a PWM control signal that is sent to the primary
(VCC) side by a dedicated iCoupler (5 kV rms signal isolated)
data channel. The PWM modulates the oscillator circuit to
control the power being sent to the secondary side. Feedback
allows for significantly higher power and efficiency.
TRUTH TABLES
The truth tables in this section use the abbreviations found in
Table 11.
Table 11. Truth Table Abbreviations
Letter Description
H High level
L Low level
X
Don’t care
I
Indeterminate
Z High impedance (off)
NC Disconnected
Table 12. Transmitting (see Table 11 for Abbreviations)
Inputs Outputs
DE TxD Y Z
H H H L
H L L H
L X Z Z
X X Z Z
Table 13. Receiving (see Table 11 for Abbreviations)
Inputs Output
A − B RE RxD
≥ −0.03 V L or NC H
≤ −0.2 V L or NC L
0.2 V < A − B < −0.03 V
L or NC
I
Inputs open L or NC
H
X H
Z
THERMAL SHUTDOWN
The ADM2682E/ADM2687E contain thermal shutdown circuitry
that protects the parts from excessive power dissipation during
fault conditions. Shorting the driver outputs to a low impedance
source can result in high driver currents. The thermal sensing
circuitry detects the increase in die temperature under this
condition and disables the driver outputs. This circuitry is
designed to disable the driver outputs when a die temperature
of 150°C is reached. As the device cools, the drivers are reenabled
at a temperature of 140°C.
OPEN- AND SHORT-CIRCUIT, FAIL-SAFE RECEIVER
INPUTS
The receiver inputs have open- and short-circuit, fail-safe features
that ensure that the receiver output is high when the inputs are
open or shorted. During line-idle conditions, when no driver on
the bus is enabled, the voltage across a terminating resistance at
the receiver input decays to 0 V. With traditional transceivers,
receiver input thresholds specified between 200 mV and
+200 mV mean that external bias resistors are required on the
A and B pins to ensure that the receiver outputs are in a known
state. The short-circuit, fail-safe receiver input feature eliminates
the need for bias resistors by specifying the receiver input threshold
between 30 mV and 200 mV. The guaranteed negative threshold
means that when the voltage between A and B decays to 0 V, t h e
receiver output is guaranteed to be high.
DC CORRECTNESS AND MAGNETIC FIELD IMMUNITY
The digital signals transmit across the isolation barrier using
iCoupler technology. This technique uses chip-scale transformer
windings to couple the digital signals magnetically from one
side of the barrier to the other. Digital inputs are encoded into
waveforms that are capable of exciting the primary transformer
winding. At the secondary winding, the induced waveforms are
decoded into the binary value that was originally transmitted.
Positive and negative logic transitions at the isolator input cause
narrow (~1 ns) pulses to be sent to the decoder via the transformer.
The decoder is bistable and is, therefore, either set or reset by
the pulses, indicating input logic transitions. In the absence of
logic transitions at the input for more than 1 µs, periodic sets of
refresh pulses indicative of the correct input state are sent to
ensure dc correctness at the output. If the decoder receives no
internal pulses of more than approximately 5 µs, the input side
Data Sheet ADM2682E/ADM2687E
Rev. C | Page 17 of 24
is assumed to be unpowered or nonfunctional, in which case,
the isolator output is forced to a default state by the watchdog
timer circuit.
This situation should occur in the ADM2682E/ADM2687E devices
only during power-up and power-down operations. The limitation
on the ADM2682E/ADM2687E magnetic field immunity is set
by the condition in which induced voltage in the transformer
receiving coil is sufficiently large to either falsely set or reset the
decoder. The following analysis defines the conditions under
which this can occur.
The 3.3 V operating condition of the ADM2682E/ADM2687E
is examined because it represents the most susceptible mode of
operation. The pulses at the transformer output have an amplitude
of >1.0 V. The decoder has a sensing threshold of about 0.5 V,
thus establishing a 0.5 V margin in which induced voltages can
be tolerated. The voltage induced across the receiving coil is
given by
V = (−dβ/dt)Σπrn2; n = 1, 2, … , N
where:
β is magnetic flux density (gauss).
N is the number of turns in the receiving coil.
rn is the radius of the nth turn in the receiving coil (cm).
Given the geometry of the receiving coil in the ADM2682E/
ADM2687E and an imposed requirement that the induced
voltage be, at most, 50% of the 0.5 V margin at the decoder, a
maximum allowable magnetic field is calculated as shown in
Figure 39.
MAGNETIC FIELD FREQUENCY (Hz)
100
MAXIMUM ALLOWABLE MAGNETIC FLUX
DENSITY (kgauss)
0.001 1M
10
0.01
1k 10k 10M
0.1
1
100M100k
09927-019
Figure 39. Maximum Allowable External Magnetic Flux Density
For example, at a magnetic field frequency of 1 MHz, the
maximum allowable magnetic field of 0.2 kgauss induces a
voltage of 0.25 V at the receiving coil. This is about 50% of the
sensing threshold and does not cause a faulty output transition.
Similarly, if such an event occurs during a transmitted pulse
(and is of the worst-case polarity), it reduces the received pulse
from >1.0 V to 0.75 V, which is still well above the 0.5 V sensing
threshold of the decoder.
The preceding magnetic flux density values correspond to specific
current magnitudes at given distances from the ADM2682E/
ADM2687E transformers. Figure 40 expresses these allowable
current magnitudes as a function of frequency for selected
distances. As shown in Figure 40, the ADM2682E/ADM2687E
are extremely immune and can be affected only by extremely
large currents operated at high frequency very close to the
component. For the 1 MHz example, a 0.5 kA current must be
placed 5 mm away from the ADM2682E/ADM2687E to affect
component operation.
MAGNETIC FIELD FREQUENCY (Hz)
MAXIMUM ALLOWABLE CURRENT (kA)
1k
100
10
1
0.1
0.011k 10k 100M
100k 1M 10M
DISTANCE = 5mm
DISTANCE = 1m
DISTANCE = 100mm
09927-020
Figure 40. Maximum Allowable Current for Various Current-to-
ADM2682E/ADM2687E Spacings
Note that in combinations of strong magnetic field and high
frequency, any loops formed by PCB traces can induce error
voltages sufficiently large to trigger the thresholds of succeeding
circuitry. Take care in the layout of such traces to avoid this
possibility.
ADM2682E/ADM2687E Data Sheet
Rev. C | Page 18 of 24
APPLICATIONS INFORMATION
PCB LAYOUT
The ADM2682E/ADM2687E isolated RS-422/RS-485 transceiver
contains an isoPower integrated dc-to-dc converter, requiring
no external interface circuitry for the logic interfaces. Power
supply bypassing is required at the input and output supply pins
(see Figure 41). The power supply section of the ADM2682E/
ADM2687E uses an 180 MHz oscillator frequency to pass power
efficiently through its chip-scale transformers. In addition, the
normal operation of the data section of the iCoupler introduces
switching transients on the power supply pins.
Bypass capacitors are required for several operating frequencies.
Noise suppression requires a low inductance, high frequency
capacitor, whereas ripple suppression and proper regulation
require a large value capacitor. These capacitors are connected
between Pin 1 (GND1) and Pin 2 (VCC) and Pin 7 (VCC) and
Pin 8 (GND1) for VCC. The VISOIN and VISOOUT capacitors are
connected between Pin 9 (GND2) and Pin 10 (VISOOUT) and
Pin 15 (VISOIN) and Pin 16 (GND2). To suppress noise and reduce
ripple, a parallel combination of at least two capacitors is required
with the smaller of the two capacitors located closest to the device.
The recommended capacitor values are 0.1 µF and 10 µF for
VISOOUT at Pin 9 and Pin 10 and VCC at Pin 7 and Pin 8. Capacitor
values of 0.01 µF and 0.1 µF are recommended for VISOIN at Pin 15
and Pin 16 and VCC at Pin 1 and Pin 2. The recommended best
practice is to use a very low inductance ceramic capacitor, or its
equivalent, for the smaller value capacitors. The total lead length
between both ends of the capacitor and the input power supply
pin should not exceed 10 mm.
09927-125
GND
1
V
CC
RxD
RE
GND
2
V
ISOIN
A
B
DE Z
TxD Y
V
CC
V
ISOOUT
GND
1
GND
2
1
2
3
16
15
14
413
5 12
611
710
8 9
ADM2682E/
ADM2687E
10nF 10nF
10µF 10µF
100nF 100nF
100nF 100nF
Figure 41. Recommended PCB Layout
In applications involving high common-mode transients, ensure
that board coupling across the isolation barrier is minimized.
Furthermore, design the board layout such that any coupling
that does occur equally affects all pins on a given component
side. Failure to ensure this can cause voltage differentials between
pins exceeding the absolute maximum ratings for the device,
thereby leading to latch-up and/or permanent damage.
The ADM2682E/ADM2687E dissipate approximately 675 mW
of power when fully loaded. Because it is not possible to apply
a heat sink to an isolation device, the devices primarily depend
on heat dissipation into the PCB through the GND pins. If the
devices are used at high ambient temperatures, provide a thermal
path from the GND pins to the PCB ground plane. The board
layout in Figure 41 shows enlarged pads for Pin 1, Pin 8, Pin 9,
and Pin 16. Implement multiple vias from the pad to the ground
plane to reduce the temperature inside the chip significantly. The
dimensions of the expanded pads are at the discretion of the
designer and dependent on the available board space.
EMI CONSIDERATIONS
The dc-to-dc converter section of the ADM2682E/ADM2687E
components must, of necessity, operate at very high frequency
to allow efficient power transfer through the small transformers.
This creates high frequency currents that can propagate in circuit
board ground and power planes, causing edge and dipole radiation.
Grounded enclosures are recommended for applications that
use these devices. If grounded enclosures are not possible, good
RF design practices should be followed in the layout of the PCB.
See the AN-0971 Application Note, Recommendations for Control
of Radiated Emissions with isoPower Devices, for more information.
Data Sheet ADM2682E/ADM2687E
Rev. C | Page 19 of 24
INSULATION LIFETIME
All insulation structures eventually break down when subjected to
voltage stress over a sufficiently long period. The rate of insulation
degradation is dependent on the characteristics of the voltage
waveform applied across the insulation. Analog Devices conducts
an extensive set of evaluations to determine the lifetime of the
insulation structure within the ADM2682E/ADM2687E.
Accelerated life testing is performed using voltage levels higher
than the rated continuous working voltage. Acceleration factors for
several operating conditions are determined, allowing calculation
of the time to failure at the working voltage of interest. The values
shown in Table 9 summarize the peak voltages for 50 years of
service life in several operating conditions. In many cases, the
working voltage approved by agency testing is higher than the
50-year service life voltage. Operation at working voltages higher
than the service life voltage listed leads to premature insulation
failure.
The insulation lifetime of the ADM2682E/ADM2687E depends
on the voltage waveform type imposed across the isolation barrier.
The iCoupler insulation structure degrades at different rates,
depending on whether the waveform is bipolar ac, unipolar ac,
or dc. Figure 42, Figure 43, and Figure 44 illustrate these different
isolation voltage waveforms.
Bipolar ac voltage is the most stringent environment. A 50-year
operating lifetime under the bipolar ac condition determines
the Analog Devices recommended maximum working voltage.
In the case of unipolar ac or dc voltage, the stress on the insulation
is significantly lower. This allows operation at higher working
voltages while still achieving a 50-year service life. The working
voltages listed in Table 9 can be applied while maintaining the
50-year minimum lifetime, provided the voltage conforms to either
the unipolar ac or dc voltage cases. Any cross-insulation voltage
waveform that does not conform to Figure 43 or Figure 44 should
be treated as a bipolar ac waveform, and its peak voltage should
be limited to the 50-year lifetime voltage value listed in Table 9.
0V
RATED PEAK VOLTAGE
09927-021
Figure 42. Bipolar AC Waveform
0V
RATED PEAK VOLTAGE
09927-023
Figure 43. DC Waveform
0V
RATED PEAK VOLTAGE
NOTES
1. THE VOLTAGE IS SHOWN AS SINUSODIAL FOR ILLUSTRATION
PURPOSES ONLY. IT IS MEANT TO REPRESENT ANY VOLTAGE
WAVEFORM VARYING BETWEEN 0 AND SOME LIMITING VALUE.
THE LIMITING VALUE CAN BE POSITIVE OR NEGATIVE, BUT THE
VOLTAGE CANNOT CROSS 0V.
09927-022
Figure 44. Unipolar AC Waveform
ISOLATED SUPPLY CONSIDERATIONS
The typical output voltage of the integrated isoPower dc-to-dc
isolated supply is 3.3 V. The isolated supply in the ADM2682E/
ADM2687E is typically capable of supplying a current of 55 mA
when the junction temperature of the device is kept below 130°C.
This includes the current required by the internal RS-485 circuitry,
and typically, no additional current is available on VISOOUT for
external applications.
ADM2682E/ADM2687E Data Sheet
Rev. C | Page 20 of 24
TYPICAL APPLICATIONS
An example application of the ADM2682E/ADM2687E for a full-
duplex RS-485 node is shown in the circuit diagram of Figure 45.
Refer to the PCB Layout section for the recommended placement
of the capacitors shown in this circuit diagram. Placement of
the RT termination resistors depends on the location of the node
and the network configuration. Refer to AN-960 Application Note,
RS-485/RS-422 Circuit Implementation Guide, for guidance on
termination.
Figure 46 and Figure 47 show typical applications of the
ADM2682E/ADM2687E in half duplex and full duplex RS-485
network configurations. Up to 256 transceivers can be connected to
the RS-485 bus. To minimize reflections, terminate the line at
the receiving end in its characteristic impedance and keep stub
lengths off the main line as short as possible. For half-duplex
operation, this means that both ends of the line must be terminated
because either end can be the receiving end.
ADM2682E/ADM2687E
TxD
A
B
Y
Z
DE
RxD
RE
ISOLATION
BARRIER
TRANSCEIVER
GND
1
GND
1
GND
2
ENCODE
ENCODE
ENCODE
DECODE
DECODE
DECODE D
R
OSCILLATOR RECTIFIER
REGULATOR
V
ISOOUT
V
CC
V
CC
V
ISOIN
MICROCONTROLLER
AND UART
R
T
3.3V/5V POWER
SUPPLY
100nF 10µF 100nF 10nF
100nF 10µF
100nF 10nF
DIGITAL ISOLATION
i
Coupler
iso
Power DC-TO-DC CONVERTER
09927-124
Figure 45. Example Circuit Diagram Using the ADM2682E/ADM2687E
Data Sheet ADM2682E/ADM2687E
Rev. C | Page 21 of 24
NOTES
1. R
T
IS EQUAL TO THE CHARACTERISTIC IMPEDANCE OF THE CABLE.
2
. ISOLATION NOT SHOWN.
ABZYABZY
A
B
Z
Y
A
B
Z
Y
RDRD
R
D
R
D
ADM2682E/
ADM2687E
ADM2682E/
ADM2687E
ADM2582E/
ADM2587E
RxD RE DE TxDRxD RE DE TxD
R
T
R
T
RxD
RE
DE
TxD
RxD
RE
DE
TxD
ADM2682E/
ADM2687E
MAXIMUM NUMBER OF TRANSCEIVERS ON BUS = 256
09927-027
Figure 46. ADM2682E/ADM2687E Typical Half Duplex RS-485 Network
NOTES
1. R
T
IS EQUAL TO THE CHARACTERISTIC IMPEDANCE OF THE CABLE.
2. ISOLATION NOT SHOWN.
R
D
A
B
Z
Y
RD
A B Z Y
R
D
A
B
Z
Y
RD
A B Z Y
R
T
TxD
DE
RxD
RE
ADM2682E/
ADM2687E
ADM2682E/
ADM2687E
ADM2682E/
ADM2687E
SLAVE
RxD
RE
DE
TxD
ADM2682E/
ADM2687E
MASTER
SLAVESLAVE
RxD RE DE TxD
RxD RE DE TxD
R
T
MAXIMUM NUMBER OF NODES = 256
09927-028
Figure 47. ADM2682E/ADM2687E Typical Full Duplex RS-485 Network
ADM2682E/ADM2687E Data Sheet
Rev. C | Page 22 of 24
OUTLINE DIMENSIONS
11-15-2011-A
16 9
81
SEATING
PLANE
COPLANARITY
0.1
1.27 BSC
12.85
12.75
12.65
7.60
7.50
7.40
2.64
2.54
2.44
1.01
0.76
0.51
0.30
0.20
0.10
10.51
10.31
10.11
0.46
0.36
2.44
2.24
PIN 1
MARK
1.93 REF
0.32
0.23
0.71
0.50
0.31 45°
0.25 BSC
GAGE
PLANE
COMPLIANT TO JEDEC STANDARDS MS-013-AC
Figure 48. 16-Lead Standard Small Outline Package with Increased Creepage [SOIC_IC]
Wide Body,
(RI-16-2)
Dimensions shown in millimeters
ORDERING GUIDE
Model1 Data Rate (Mbps) Temperature Range Package Description Package Option
ADM2682EBRIZ 16 −40°C to +85°C 16-Lead SOIC_IC RI-16-2
ADM2682EBRIZ-RL7 16 −40°C to +85°C 16-Lead SOIC_IC RI-16-2
ADM2687EBRIZ 0.5 −40°C to +85°C 16-Lead SOIC_IC RI-16-2
ADM2687EBRIZ-RL7 0.5 −40°C to +85°C 16-Lead SOIC_IC RI-16-2
EVAL-ADM2682EEBZ ADM2682E Evaluation Board
EVAL-ADM2687EEBZ ADM2687E Evaluation Board
1 Z = RoHS Compliant Part.
Data Sheet ADM2682E/ADM2687E
Rev. C | Page 23 of 24
NOTES
ADM2682E/ADM2687E Data Sheet
Rev. C | Page 24 of 24
NOTES
©20112015 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D09927-0-6/15(C)

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