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This part is RoHS non-compliant. | Image | Digi-Key Part Number | Manufacturer Part Number | Manufacturer | Description | Quantity Available | Unit Price CAD | Minimum Quantity | Series | Process | Type | Flux Type | Composition | Wire Gauge | Diameter | Core Size | Form |
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|  | 82-105-ND | 389261 | Multicore | 60/40 370 3% .015DIA./28SWG | 228 - Immediate | 25.08000 | 1 | 370 | Leaded | Wire Solder | Rosin Activated (RA) | Sn60Pb40 (60/40) | 28 | 0.015" (0.39mm) | 3% | Spool, 227g (1/2 lb) |
 | 82-139-ND | 554889 | Multicore | 63/37 BAR SOLDER - 1LB BARS | 1,008 - Immediate | 25.22000 | 1 | - | Leaded | Bar Solder | - | Sn63Pb37 (63/37) | - | - | - | Bar, 454g (1 lb) | |
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|  | 82-117-ND | 386844 | Multicore | 63/37 CRYSL 400 2% .015DIA/28SWG | 166 - Immediate | 25.54000 | 1 | C400™ | Leaded | Wire Solder | No-Clean | Sn63Pb37 (63/37) | 28 | 0.015" (0.39mm) | 2% | Spool, 227g (1/2 lb) |
 | 82-137-ND  | 981501 | Multicore | SAC305 TRI BAR SOLDER - 1LB BARS | 761 - Immediate | 62.48000 | 1 | 97SC | Lead Free | Bar Solder | - | Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) | - | - | - | Bar, 454g (1 lb) | |
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|  | SMD291AX-ND | SMD291AX | Chip Quik Inc | SOLDER PASTE NO-CLEAN 63/37 5CC | 142 - Immediate | 15.17000 | 1 | CHIPQUIK® | Leaded | Solder Paste | No-Clean | Sn63Pb37 (63/37) | - | - | - | Syringe, 15g (0.5 oz) |
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|  | SMDLTLFP-ND | SMDLTLFP | Chip Quik Inc | SOLDER PASTE LOW TEMP 5CC W/TIP | 105 - Immediate | 17.31000 | 1 | CHIPQUIK® | Lead Free | Solder Paste | - | Sn42Bi58 (42/58) | - | - | - | Syringe, 15g (0.5 oz) |
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|  | SMD291AX10-ND | SMD291AX10 | Chip Quik Inc | SOLDER PASTE NO-CLEAN 63/37 10CC | 177 - Immediate | 22.63000 | 1 | CHIPQUIK® | Leaded | Solder Paste | No-Clean | Sn63Pb37 (63/37) | - | - | - | Syringe, 35g (1.2 oz) |
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|  | SMD291SNL10-ND | SMD291SNL10 | Chip Quik Inc | SOLDER PASTE NO-CLEAN 10CC SYR | 170 - Immediate | 24.93000 | 1 | CHIPQUIK® | Lead Free | Solder Paste | No-Clean | Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) | - | - | - | Syringe, 35g (1.2 oz) |
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|  | KE1507-ND | 7016070520 | Kester Solder | SOLDERPASTE NO CLEAN 63/37 35GM | 345 - Immediate | 40.18000 | 1 | R276 | Leaded | Solder Paste | No-Clean | Sn63Pb37 (63/37) | - | - | - | Syringe, 35g (1.2 oz) |
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| | KE1512-ND | 7017080520 | Kester Solder | SOLDERPASTE WATER SOL SYR 35GM | 147 - Immediate | 40.18000 | 1 | R500 | Leaded | Solder Paste | Water Soluble | Sn63Pb37 (63/37) | - | - | - | Syringe, 35g (1.2 oz) |
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|  | KE1602-ND | 04-6337-0050 | Kester Solder | SOLDR BAR ULTRAPURE 63/37 1.66LB | 422 - Immediate | 48.82000 | 1 | ULTRAPURE® | Leaded | Bar Solder | - | Sn63Pb37 (63/37) | - | - | - | Bar, 750g (1 2/3 lbs) |
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|  | KE1106-ND | 24-6040-0027 | Kester Solder | SOLDER RA 60/40 21AWG 1LB | 253 - Immediate | 55.60000 | 1 | 44 | Leaded | Wire Solder | Rosin Activated (RA) | Sn60Pb40 (60/40) | 21 | 0.031" (0.79mm) | 3.3% | Spool, 454g (1 lb) |
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|  | KE1102-ND | 24-6337-0027 | Kester Solder | SOLDER RA 21AWG 63/37 1LB | 297 - Immediate | 57.05000 | 1 | 44 | Leaded | Wire Solder | Rosin Activated (RA) | Sn63Pb37 (63/37) | 21 | 0.031" (0.79mm) | 3.3% | Spool, 454g (1 lb) |
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|  | KE1408-ND | 24-6337-8801 | Kester Solder | SOLDER NO-CLEAN 21AWG 63/37 1LB | 237 - Immediate | 57.05000 | 1 | 245 | Leaded | Wire Solder | No-Clean | Sn63Pb37 (63/37) | 21 | 0.031" (0.79mm) | 2.2% | Spool, 454g (1 lb) |
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|  | KE1400-ND | 24-6337-8800 | Kester Solder | SOLDER NO-CLEAN 21AWG 1LB | 178 - Immediate | 57.05000 | 1 | 245 | Leaded | Wire Solder | No-Clean | Sn63Pb37 (63/37) | 21 | 0.031" (0.79mm) | 1.1% | Spool, 454g (1 lb) |
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|  | KE1103-ND | 24-6337-0010 | Kester Solder | SOLDER RA 25AWG 63/37 1LB | 176 - Immediate | 73.23000 | 1 | 44 | Leaded | Wire Solder | Rosin Activated (RA) | Sn63Pb37 (63/37) | 25 | 0.02" (0.51mm) | 3.3% | Spool, 454g (1 lb) |
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|  | KE1125-ND | 24-7068-1400 | Kester Solder | SOLDER RA .062" 16AWG 1LB | 61 - Immediate | 128.13000 | 1 | 48 | Lead Free | Wire Solder | Rosin Activated (RA) | Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) | 16 | 0.062" (1.57mm) | 3.3% | Spool, 454g (1 lb) |
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|  | KE1133-ND | 24-7068-7606 | Kester Solder | SOLDER NO-CLEAN .050" 18AWG 1LB | 26 - Immediate | 129.02000 | 1 | 275 | Lead Free | Wire Solder | No-Clean | Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) | 18 | 0.05" (1.27mm) | 2.2% | Spool, 454g (1 lb) |
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|  | KE1137-ND | 24-7068-7601 | Kester Solder | SOLDER NO-CLEAN .031" 21 AWG 1LB | 183 - Immediate | 133.80000 | 1 | 275 | Lead Free | Wire Solder | No-Clean | Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) | 21 | 0.031" (0.79mm) | 2.2% | Spool, 454g (1 lb) |
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|  | KE1123-ND | 24-7068-1402 | Kester Solder | SOLDER RA .031" 21AWG 1LB | 57 - Immediate | 133.80000 | 1 | 48 | Lead Free | Wire Solder | Rosin Activated (RA) | Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) | 21 | 0.031" (0.79mm) | 3.3% | Spool, 454g (1 lb) |
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|  | KE1132-ND | 24-7068-7617 | Kester Solder | SOLDER NO-CLEAN .025" 23AWG 1LB | 42 - Immediate | 135.14000 | 1 | 275 | Lead Free | Wire Solder | No-Clean | Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) | 23 | 0.025" (0.64mm) | 2.2% | Spool, 454g (1 lb) |
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|  | KE1131-ND | 24-7068-7603 | Kester Solder | SOLDER NO-CLEAN .020" 25AWG 1LB | 77 - Immediate | 147.66000 | 1 | 275 | Lead Free | Wire Solder | No-Clean | Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) | 25 | 0.02" (0.51mm) | 2.2% | Spool, 454g (1 lb) |
 | 82-143-ND | 583489 | Multicore | 63/37 MP200 SOLDER FLUX 25GM | 65 - Immediate | 12.71000 | 1 | MP200 | Leaded | Solder Paste | No-Clean | Sn63Pb37 (63/37) | - | - | - | Cartridge, 25g (0.9oz) | |
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|  | 82-134-ND | 386820 | Multicore | 63/37 HYDRO-X 2% .022DIA/24SWG | 28 - Immediate | 25.42000 | 1 | Hydro-X | Leaded | Wire Solder | Water Soluble | Sn63Pb37 (63/37) | 24 | 0.022" (0.56mm) | 2% | Spool, 227g (1/2 lb) |
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|  | 82-131-ND | 397982 | Multicore | 63/37 CRYSL 502 3% .015DIA/28SWG | 70 - Immediate | 25.91000 | 1 | C502 | Leaded | Wire Solder | No-Clean | Sn63Pb37 (63/37) | 28 | 0.015" (0.39mm) | 3% | Spool, 227g (1/2 lb) |
20:38:06 5/22/2013
