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Product Overview
Digi-Key Part Number BER168-ND
Quantity Available 14,448
Can ship immediately
Manufacturer

Manufacturer Part Number

HF115AC-0.0055-AC-58

Description Thermal Pad Gray 19.05mm x 12.70mm Rectangle Adhesive - One Side
Lead Free Status / RoHS Status Lead free / RoHS Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Manufacturer Standard Lead Time 2 Weeks
Documents & Media
Datasheets Hi-Flow 115-AC
Other Related Documents Sil-Pad Metric Configurations
RoHS Information Hi-Flow 115-AC Material Report
PCN Packaging Henkel/Berquist Revised Brands 10/May/2016
Catalog Page 2590 (CA2011 PDF)
Product Attributes Select All
Category

Fans, Thermal Management

Family

Thermal - Pads, Sheets

Manufacturer

Bergquist

Series Hi-Flow® 115-AC
Part Status Active
Usage TO-220
Shape Rectangle
Outline 19.05mm x 12.70mm
Thickness 0.0055" (0.140mm)
Material Phase Change Compound
Adhesive Adhesive - One Side
Backing, Carrier Fiberglass
Color Gray
Thermal Resistivity 0.35°C/W
Thermal Conductivity 0.8 W/m-K
 
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Additional Resources
Standard Package ? 100
Other Names BER168
BG426642
HF115AC-58
HF115AC00055AC58
HF115TAAC-58

08:55:27 12/8/2016

Price & Procurement
 

Quantity
All prices are in CAD.
Price Break Unit Price Extended Price
1 0.14000 0.14
10 0.12300 1.23
50 0.11080 5.54
100 0.09800 9.80
500 0.08524 42.62
1,000 0.06392 63.92
5,000 0.05540 277.00

Submit a request for quotation on quantities greater than those displayed.

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