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Product Index > Fans, Thermal Management > Thermal - Heat Sinks > BDN09-3CB/A01

All prices are in Canadian dollars.
Digi-Key Part Number294-1097-ND
Price BreakUnit PriceExtended Price
12.980002.98
102.6570026.57
252.3912059.78
502.25820112.91
1002.12530212.53
2501.99244498.11
5001.92604963.02
1,0001.726781,726.78
5,0001.693578,467.85
Quantity Available Digi-Key Stock: 11,031
Can ship immediately
Manufacturer

Manufacturer Part Number

BDN09-3CB/A01

DescriptionHEATSINK CPU W/ADHESIVE .91"SQ
Lead Free Status / RoHS StatusLead free / RoHS Compliant
 

QuantityItem Number Customer Reference
HEATSINK CPU W/ADHESIVE .91"SQ | BDN09-3CB/A01 | 294-1097-ND | Digi-Key Corp.
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Datasheets Various Semiconductor Heat Sink
BDN Series Peel-Stick Heat Dissipators
Product Photos BDN09-3CB/A01 Heat Sink
Product Training Modules FPGAs Spartan3
Catalog Drawings BDN09-3CB(^A01)
Standard Package300
CategoryFans, Thermal Management
FamilyThermal - Heat Sinks
SeriesBDN
TypeTop Mount
Package CooledAssorted (BGA, LGA, CPU, ASIC...)
Attachment MethodThermal Tape, Adhesive (Included)
ShapeSquare, Pin Fins
Length0.910" (23.11mm)
Width0.910" (23.11mm)
Diameter-
Height Off Base (Height of Fin)0.355" (9.02mm)
Power Dissipation @ Temperature Rise-
Thermal Resistance @ Forced Air Flow9.6°C/W @ 400 LFM
Thermal Resistance @ Natural26.9°C/W
MaterialAluminum
Material FinishBlack Anodized
Catalog Page2592 (CA2011 PDF)
Other Names294-1097
BDN093CB/A01

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